JPS60126842A - Die-bonding method - Google Patents
Die-bonding methodInfo
- Publication number
- JPS60126842A JPS60126842A JP23438483A JP23438483A JPS60126842A JP S60126842 A JPS60126842 A JP S60126842A JP 23438483 A JP23438483 A JP 23438483A JP 23438483 A JP23438483 A JP 23438483A JP S60126842 A JPS60126842 A JP S60126842A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- row
- lead frame
- chip
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はマウント部が二列又はそれ以上の複数列に配列
された多列チップ型のリードフレームにグイボンドする
グイボンディング方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a bonding method for bonding to a multi-row chip type lead frame in which mounting portions are arranged in two or more rows.
第1図及び第2図に示す如く、デュアルチップ型のリー
ドフレーム1は複数個のマウント部2゜3が第1列4及
び第2列5の二つの列をなして配列されている。これら
のマウント部2,3にICチップをグイボンドする場合
には、従来は片側の、例えば第1列4のみのボンディン
グを先ず行ない、次にリードフレーム1を逆転するか、
或いはキャリヤを調整してボンディング位置をずらして
、他の第2列5のボンディングを行なうなど、の方法が
用いられていた。しかしながらこのような従来の方法に
おいては、リードフレーム1の反転装置又はキャリヤの
調整装置を必要とし、反転繰作、調整操作に手間を要す
るものであった。As shown in FIGS. 1 and 2, the dual-chip lead frame 1 has a plurality of mount portions 2.3 arranged in two rows, a first row 4 and a second row 5. As shown in FIGS. When IC chips are to be bonded to these mount parts 2 and 3, conventionally, bonding is first performed on one side, for example, only the first row 4, and then the lead frame 1 is reversed, or
Alternatively, a method has been used in which the carrier is adjusted to shift the bonding position and bonding is performed on another second row 5. However, such conventional methods require a reversing device for the lead frame 1 or an adjusting device for the carrier, and the reversing and adjusting operations are time-consuming.
本発明は、従来における上記の欠点を除外、リードフレ
ームに対し移送行程を一度行なうだけで、多列のマウン
ト部へのボンディングを行なうことがでとるボンディン
グ方法を提供することを目的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a bonding method that eliminates the above-mentioned drawbacks of the conventional method and allows bonding to multiple rows of mount portions by performing a single transfer process on a lead frame. be.
本発明は、長手方向に対して平行な、少なくとも第1列
及び第2列の二つの列を有する複数列をなして配列され
た複数個のマウント部を有する多列チップ型のリードフ
レームを長手方向に移送し、該リードフレームのマうン
ト部に、ICチップの供給部から捕捉した所定のICチ
ップをグイボンドするグイボンディング方法において、
前記リードフレームの移送方向をX方向とし、水平面内
で該X方向と直角をなす方向をY方向とするとぎ、前記
リードフレームをX方向に移送して、所定のマウント部
が前記ICチップの供給基準位置からY方向に延長した
Y軸上に位置した状態で前記リードフレームを停止して
保持し、前記ICチップを捕捉するコレットを、前記I
Cチップ供給位置と前記各列のマウント部との間の往復
運動を、順次行ない、Y軸上の各列のグイボンドが一行
分終了した後前記リードフレームをX方向に移送し、次
の行のグイボンドを行なうことを特徴とするグイボンデ
ィング方法である。The present invention provides a multi-row chip type lead frame having a plurality of mount parts arranged in a plurality of rows having at least two rows, a first row and a second row, parallel to the longitudinal direction. In a guide bonding method, a predetermined IC chip captured from an IC chip supply unit is transferred to a mount part of the lead frame in a guide frame.
Assuming that the direction in which the lead frame is transferred is the X direction, and the direction perpendicular to the X direction in the horizontal plane is the Y direction, the lead frame is transferred in the The lead frame is stopped and held on the Y axis extending in the Y direction from the reference position, and the collet that captures the IC chip is moved to the I
The reciprocating movement between the C chip supply position and the mount section of each column is performed sequentially, and after one row of Guibonds in each column on the Y axis is completed, the lead frame is transferred in the X direction, and the lead frame is transferred to the next row. This is a Gui bonding method characterized by performing Gui bonding.
本発明の実施例を図面を用いて説明する。Embodiments of the present invention will be described using the drawings.
第3図において、ベースフレーム6にはYテーブル7の
」二にXテーブル8がY方向に移動可能に支えられ、X
テーブル8上にボンディングヘッド10がX方向(水平
面内でY方向9に直角方向、即ち紙面に垂直方向)に移
動可能に支えられている。Yテーブル7の駆動及びXテ
ーブル8の駆動はそれぞれ別個のパル又モータにより行
なわれる。In FIG. 3, an X table 8 is supported on the base frame 6 so as to be movable in the Y direction on the second side of a Y table 7.
A bonding head 10 is supported on a table 8 so as to be movable in the X direction (in a horizontal plane, perpendicular to the Y direction 9, that is, in a direction perpendicular to the plane of the paper). The Y table 7 and the X table 8 are driven by separate pulses or motors, respectively.
ボンディングヘッド10のメインフレーム11には、ス
ライドフレーム12がY方向9に沿って往復可能に設け
られ、パルスモータ13によりネジ14を介して駆動さ
れるようになっている。スライドフレーム12には、
ボンディングアーム15によりコレラNBが上下に揺動
可能に支えられ、パルスモータにより駆動されるように
なっている。A slide frame 12 is provided on the main frame 11 of the bonding head 10 so as to be able to reciprocate along the Y direction 9, and is driven by a pulse motor 13 via a screw 14. The slide frame 12 has
The cholera NB is supported by the bonding arm 15 so as to be able to swing up and down, and is driven by a pulse motor.
17はキャリヤであり、その上に保持したリードフレー
ム1を、X方向に、マウント部2,3の長手方向のピッ
チ p ごとに間欠移送するようになっている。Reference numeral 17 denotes a carrier, on which the lead frame 1 held is intermittently transferred in the X direction at every pitch p in the longitudinal direction of the mounts 2 and 3.
18は、ICチップ供給部であり、Xテーブル1日、Y
テーブル20によ1)その上に載置された複数個のIC
チップのうち所定のICチップを、供給基準位置21に
位置せしめるようになっている。供給基準位置21から
Y方向に延長されたY軸と’J −1’ 7レーム1の
中心線22との交点23をボンディング基準中心位置と
する。中心線22と第1列4又は第2列5との距離をρ
とし、供給基準位置21とボンディング基準中心位置2
3との距離をLとする。Lの勤評をYテーブル7が操作
し、±ρの勤評をスライドフレーム12が操作する。18 is an IC chip supply unit, where X table 1 day, Y
1) Multiple ICs placed on the table 20
A predetermined IC chip among the chips is positioned at a supply reference position 21. The intersection point 23 between the Y axis extending in the Y direction from the supply reference position 21 and the center line 22 of the 'J-1' 7 frame 1 is defined as the bonding reference center position. The distance between the center line 22 and the first row 4 or the second row 5 is ρ
and the supply reference position 21 and the bonding reference center position 2
Let the distance from 3 be L. The Y table 7 operates the performance review of L, and the slide frame 12 operates the performance review of ±ρ.
作用につぎ説明する。The action will be explained next.
キャリヤ17の動%により、リードフレーム1の第1行
24のマウント部2A、3Aの中心がボンディング基準
中心位置23を通るY軸上に置かれる。第3図及び第4
図において、当初コレット16の先端はA点にあったと
する。先ずYテーブル7の動とによりフレット16はB
点に至り、下降せしめられ、予め供給基準位置21に置
かれた所定のICチップを捕捉し、B点まで上昇する。Due to the movement of the carrier 17, the centers of the mount portions 2A, 3A of the first row 24 of the lead frame 1 are placed on the Y axis passing through the bonding reference center position 23. Figures 3 and 4
In the figure, it is assumed that the tip of the collet 16 is initially at point A. First, fret 16 is set to B due to the movement of Y table 7.
It reaches a point, is lowered, captures a predetermined IC chip placed in advance at the supply reference position 21, and rises to a point B.
次にYテーブル7とスライドフレーム12の操作により
0点に至り、下降してD点において第1列4のマウント
部2AにICチップのボンディングを行なう。次に上昇
した後Yテーブル7とスライドフレーム12の操作によ
り再びB点に至り下降して供給基準位置21に置かれた
次のICチップを捕捉し、上昇後Yテーブル7とスライ
ド7レーム12の操作によりE点に達し下降してF点に
おいて第2列5のマウント部3AにICチップのボンデ
ィングを行なう。その後上昇して再びA点に戻る。Next, the Y table 7 and the slide frame 12 are operated to reach the 0 point, and the IC chip is bonded to the mount portion 2A of the first row 4 at the D point. Next, after rising, it reaches point B again by operating the Y table 7 and slide frame 12, descends and captures the next IC chip placed at the supply reference position 21, and after rising, the Y table 7 and slide frame 12 The operation reaches point E and descends, and the IC chip is bonded to the mount portion 3A of the second row 5 at point F. It then rises and returns to point A.
次に、キャリヤ17の動鰺によりリードフレーム1がピ
ッチ p だけ進められて、第2行25のマウント部2
B、 3 Bがボンディング基準中心位置23を通る
Y軸上に位置せしめられ、上述と同様のサイクルで第2
行25のグイボンディングが行なわれ、以下順次各行の
グイボンディングが行なわれる。Next, the lead frame 1 is advanced by a pitch p by the movement of the carrier 17, and the mount portion 2 of the second row 25 is moved forward.
B, 3B is positioned on the Y axis passing through the bonding reference center position 23, and the second
Goui bonding is performed for row 25, and thereafter, goui bonding is performed for each row in sequence.
以上の説明では便宜上第4図に示す如く、コレット16
の軌跡は矩形状としたが、水平方向と垂直方向の動きを
同時に行なわしめて斜に上昇、下降せしめるのがサイク
ル短縮になるため好ましい。In the above explanation, for convenience, the collet 16 is shown in FIG.
Although the locus is rectangular, it is preferable to simultaneously move in the horizontal and vertical directions and ascend and descend diagonally, since this shortens the cycle.
スライドフレーム12を用いずにL±ρの動トをYテー
ブル7のみにより行なうようにしてもよ゛い。供給部1
8にXテーブル19、Yテーブル20を用いずに、ボン
ディングヘッド10側のXテーブル7及びYテーブル2
0或いはスライドフレーム12の動きによりICチップ
の選択を行なってもよい。The movement of L±ρ may be performed only by the Y table 7 without using the slide frame 12. Supply section 1
8, instead of using the X table 19 and Y table 20, the X table 7 and Y table 2 on the bonding head 10 side
The IC chip may be selected by moving the slide frame 12 or by moving the slide frame 12.
マウント部2,3の列数は3列或いはそれ以上の多列に
おいても同時に、−行づつボンディングを行ない、一度
の技手方向の移動行程で全ボンディングを完了せしめる
。Even when the number of rows of the mount parts 2 and 3 is three or more, bonding is performed simultaneously row by row, and all bonding is completed in one movement process in the direction of the operator.
本発明により、リードフレームの移送を一行程行なうだ
けで多列のマウント部を有する多列チップ型のリードフ
レームのグイボンディングを行なうことがでた、リード
フレームの反転装置やキャリヤの調整装置を要さず、ま
た、反転や調整の手間も必要なく、高能率のグイボンデ
ィング方法を提供することかでき、実用上極めて大なる
効果を奏する。According to the present invention, it is possible to perform smooth bonding of a multi-row chip type lead frame having multiple rows of mounting portions by simply transferring the lead frame in one stroke. Moreover, it is possible to provide a highly efficient guide bonding method without the need for reversal or adjustment, which is extremely effective in practice.
第1図はリードフレームの部分拡大図、第2図はリード
フレームの概要図、第3図は本発明の実施例の正面図、
第4図はそのコレットの動きを示す線図である。
1・・リードフレーム、2.2A、2B、3.3A。
3B・・マウンド部、4・・第1列、5・・第2列、6
・・ベースフレーム、7・・Yテーブル、8・・Xテー
ブル、9・・Y方向、10・・ボンディングヘッド、1
1・・メインフレーム、12・・スライドフレーム、1
3・・パルスモータ、14・・ネジ、15・・ボンディ
ングアーム、16・・コレット、17・・キャリヤ、1
8・・供m部、19・・Xテーブル、2o・・Yテーブ
ル、21・・供給基準位置、22・・中心線、23・・
ボンディング基準中心位置、24・・第1行、25・・
第2行。
特許出願人 海上電機株式会社
代理人弁理士 高 木 正 行
同 千 1) 捻
回 光重 隆夫
第3図FIG. 1 is a partially enlarged view of a lead frame, FIG. 2 is a schematic diagram of a lead frame, and FIG. 3 is a front view of an embodiment of the present invention.
FIG. 4 is a diagram showing the movement of the collet. 1...Lead frame, 2.2A, 2B, 3.3A. 3B...Mound part, 4...First row, 5...Second row, 6
...Base frame, 7..Y table, 8..X table, 9..Y direction, 10..bonding head, 1
1. Main frame, 12. Slide frame, 1
3...Pulse motor, 14...Screw, 15...Bonding arm, 16...Collet, 17...Carrier, 1
8... Serving m part, 19... X table, 2o... Y table, 21... Supply reference position, 22... Center line, 23...
Bonding reference center position, 24...1st row, 25...
2nd line. Patent Applicant Masashi Takagi, Patent Attorney, Kaiyo Denki Co., Ltd. 1) Twisting Takao Mitsushige Figure 3
Claims (1)
第2列の二つの列を有する複数列をなして配列された複
数個のマウント部を有する多列チップ型のリードフレー
ムを長手方向に移送し、該リードフレームのマウント部
に、ICチップの供給部から捕捉した所定のICチップ
をグイボンドするグイボンディング方法において、前記
リードフレームの移送方向をX方向とし、水平面内で該
X方向と直角をなす方向をY方向とするとぎ、 前記リードフレームをX方向に移送して、所定のマウン
ト部が前記ICチップの供給基準位置からY方向に延長
したY軸上に位置した状態で前記リードフレームを停止
して保持し、前記ICチップを捕捉するコレットを、前
記ICチップ供給位置と前記各列のマウント部との間の
往復運動を、順次行ない、Y軸上の各列のグイボンドが
一行分終了した後前記リード7?−ムをX方向に移送し
、次の行のグイボンドを行なう ことを特徴とするグイボンディング方法。[Claims] 1. A multi-row chip type having a plurality of mount parts arranged in a plurality of rows having at least two rows, a first row and a second row, parallel to the longitudinal direction. In a guide bonding method in which a lead frame is transferred in the longitudinal direction and a predetermined IC chip captured from an IC chip supply unit is bonded to a mount portion of the lead frame, the transfer direction of the lead frame is the X direction, and the lead frame is transferred in the horizontal plane. Assuming that the direction perpendicular to the X direction is the Y direction, the lead frame is transferred in the X direction, and the predetermined mount section is positioned on the Y axis extending in the Y direction from the reference position for supplying the IC chip. The lead frame is stopped and held in this state, and the collet that captures the IC chip is sequentially reciprocated between the IC chip supply position and the mount section of each row, and After the column Guibond finishes one row, the lead 7? - A gui bonding method characterized by moving the frame in the X direction and performing gui bonding on the next row.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23438483A JPS60126842A (en) | 1983-12-14 | 1983-12-14 | Die-bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23438483A JPS60126842A (en) | 1983-12-14 | 1983-12-14 | Die-bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60126842A true JPS60126842A (en) | 1985-07-06 |
Family
ID=16970148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23438483A Pending JPS60126842A (en) | 1983-12-14 | 1983-12-14 | Die-bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60126842A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6292335A (en) * | 1985-10-18 | 1987-04-27 | Toshiba Seiki Kk | Loader for pellet |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57124446A (en) * | 1981-01-26 | 1982-08-03 | Mitsubishi Electric Corp | Die bond apparatus |
-
1983
- 1983-12-14 JP JP23438483A patent/JPS60126842A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57124446A (en) * | 1981-01-26 | 1982-08-03 | Mitsubishi Electric Corp | Die bond apparatus |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6292335A (en) * | 1985-10-18 | 1987-04-27 | Toshiba Seiki Kk | Loader for pellet |
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