JPS60126842A - Die-bonding method - Google Patents

Die-bonding method

Info

Publication number
JPS60126842A
JPS60126842A JP23438483A JP23438483A JPS60126842A JP S60126842 A JPS60126842 A JP S60126842A JP 23438483 A JP23438483 A JP 23438483A JP 23438483 A JP23438483 A JP 23438483A JP S60126842 A JPS60126842 A JP S60126842A
Authority
JP
Japan
Prior art keywords
bonding
row
lead frame
chip
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23438483A
Other languages
Japanese (ja)
Inventor
Iwami Uramoto
浦元　岩実
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd, Marine Instr Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP23438483A priority Critical patent/JPS60126842A/en
Publication of JPS60126842A publication Critical patent/JPS60126842A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To perform a die-bonding higher efficiently in a multirow chip-type lead frame having plural mounting parts arrayed in plural rows by a method wherein, after a die-bonding of each row was finished with a die-bonding for one line, a die-bonding of the following line is performed. CONSTITUTION:The centers of the mounting parts 2A and 3A of the first line 24 of a lead frame 1 are placed on the Y-axis passing through a bonding reference cenral position 23 by a move of a carrier 17. A collet 16 gets to a B point by a move of a Y-table 7, is made to descend, grasps a prescribed IC chip having been previously placed on a supply reference position 21 and ascends up to the B point. Then, by opeating the Y-table 7 and a slide frame 12, the collect 16 gets to an C point, is made to descend and performs a bonding of the IC chip on the mounting part 2A of the first row 4 of the lead frame 1 at a D point. In the similar way, a bonding of an IC chip is performed on the mounting part 3A of the second row 5. The lead frame 1 is advanced by one pitch (p) by a move of the carrier 17 and the mounting parts 2B and 3B of the second line 25 are performed a die-bonding in the similar cycle as that above-mentioned. A dei-bonding of each line is successively performed hereinafter.

Description

【発明の詳細な説明】 本発明はマウント部が二列又はそれ以上の複数列に配列
された多列チップ型のリードフレームにグイボンドする
グイボンディング方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a bonding method for bonding to a multi-row chip type lead frame in which mounting portions are arranged in two or more rows.

第１図及び第２図に示す如く、デュアルチップ型のリー
ドフレーム１は複数個のマウント部２゜３が第１列４及
び第２列５の二つの列をなして配列されている。これら
のマウント部２，３にＩＣチップをグイボンドする場合
には、従来は片側の、例えば第１列４のみのボンディン
グを先ず行ない、次にリードフレーム１を逆転するか、
或いはキャリヤを調整してボンディング位置をずらして
、他の第２列５のボンディングを行なうなど、の方法が
用いられていた。しかしながらこのような従来の方法に
おいては、リードフレーム１の反転装置又はキャリヤの
調整装置を必要とし、反転繰作、調整操作に手間を要す
るものであった。As shown in FIGS. 1 and 2, the dual-chip lead frame 1 has a plurality of mount portions 2.3 arranged in two rows, a first row 4 and a second row 5. As shown in FIGS. When IC chips are to be bonded to these mount parts 2 and 3, conventionally, bonding is first performed on one side, for example, only the first row 4, and then the lead frame 1 is reversed, or
Alternatively, a method has been used in which the carrier is adjusted to shift the bonding position and bonding is performed on another second row 5. However, such conventional methods require a reversing device for the lead frame 1 or an adjusting device for the carrier, and the reversing and adjusting operations are time-consuming.

本発明は、従来における上記の欠点を除外、リードフレ
ームに対し移送行程を一度行なうだけで、多列のマウン
ト部へのボンディングを行なうことがでとるボンディン
グ方法を提供することを目的とするものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a bonding method that eliminates the above-mentioned drawbacks of the conventional method and allows bonding to multiple rows of mount portions by performing a single transfer process on a lead frame. be.

本発明は、長手方向に対して平行な、少なくとも第１列
及び第２列の二つの列を有する複数列をなして配列され
た複数個のマウント部を有する多列チップ型のリードフ
レームを長手方向に移送し、該リードフレームのマうン
ト部に、ＩＣチップの供給部から捕捉した所定のＩＣチ
ップをグイボンドするグイボンディング方法において、
前記リードフレームの移送方向をＸ方向とし、水平面内
で該Ｘ方向と直角をなす方向をＹ方向とするとぎ、前記
リードフレームをＸ方向に移送して、所定のマウント部
が前記ＩＣチップの供給基準位置からＹ方向に延長した
Ｙ軸上に位置した状態で前記リードフレームを停止して
保持し、前記ＩＣチップを捕捉するコレットを、前記Ｉ
Ｃチップ供給位置と前記各列のマウント部との間の往復
運動を、順次行ない、Ｙ軸上の各列のグイボンドが一行
分終了した後前記リードフレームをＸ方向に移送し、次
の行のグイボンドを行なうことを特徴とするグイボンデ
ィング方法である。The present invention provides a multi-row chip type lead frame having a plurality of mount parts arranged in a plurality of rows having at least two rows, a first row and a second row, parallel to the longitudinal direction. In a guide bonding method, a predetermined IC chip captured from an IC chip supply unit is transferred to a mount part of the lead frame in a guide frame.
Assuming that the direction in which the lead frame is transferred is the X direction, and the direction perpendicular to the X direction in the horizontal plane is the Y direction, the lead frame is transferred in the The lead frame is stopped and held on the Y axis extending in the Y direction from the reference position, and the collet that captures the IC chip is moved to the I
The reciprocating movement between the C chip supply position and the mount section of each column is performed sequentially, and after one row of Guibonds in each column on the Y axis is completed, the lead frame is transferred in the X direction, and the lead frame is transferred to the next row. This is a Gui bonding method characterized by performing Gui bonding.

本発明の実施例を図面を用いて説明する。Embodiments of the present invention will be described using the drawings.

第３図において、ベースフレーム６にはＹテーブル７の
」二にＸテーブル８がＹ方向に移動可能に支えられ、Ｘ
テーブル８上にボンディングヘッド１０がＸ方向（水平
面内でＹ方向９に直角方向、即ち紙面に垂直方向）に移
動可能に支えられている。Ｙテーブル７の駆動及びＸテ
ーブル８の駆動はそれぞれ別個のパル又モータにより行
なわれる。In FIG. 3, an X table 8 is supported on the base frame 6 so as to be movable in the Y direction on the second side of a Y table 7.
A bonding head 10 is supported on a table 8 so as to be movable in the X direction (in a horizontal plane, perpendicular to the Y direction 9, that is, in a direction perpendicular to the plane of the paper). The Y table 7 and the X table 8 are driven by separate pulses or motors, respectively.

ボンディングヘッド１０のメインフレーム１１には、ス
ライドフレーム１２がＹ方向９に沿って往復可能に設け
られ、パルスモータ１３によりネジ１４を介して駆動さ
れるようになっている。スライドフレーム１２には、　
ボンディングアーム１５によりコレラＮＢが上下に揺動
可能に支えられ、パルスモータにより駆動されるように
なっている。A slide frame 12 is provided on the main frame 11 of the bonding head 10 so as to be able to reciprocate along the Y direction 9, and is driven by a pulse motor 13 via a screw 14. The slide frame 12 has
The cholera NB is supported by the bonding arm 15 so as to be able to swing up and down, and is driven by a pulse motor.

１７はキャリヤであり、その上に保持したリードフレー
ム１を、Ｘ方向に、マウント部２，３の長手方向のピッ
チ　ｐ　ごとに間欠移送するようになっている。Reference numeral 17 denotes a carrier, on which the lead frame 1 held is intermittently transferred in the X direction at every pitch p in the longitudinal direction of the mounts 2 and 3.

１８は、ＩＣチップ供給部であり、Ｘテーブル１日、Ｙ
テーブル２０によ１）その上に載置された複数個のＩＣ
チップのうち所定のＩＣチップを、供給基準位置２１に
位置せしめるようになっている。供給基準位置２１から
Ｙ方向に延長されたＹ軸と’Ｊ　−１’　７レーム１の
中心線２２との交点２３をボンディング基準中心位置と
する。中心線２２と第１列４又は第２列５との距離をρ
とし、供給基準位置２１とボンディング基準中心位置２
３との距離をＬとする。Ｌの勤評をＹテーブル７が操作
し、±ρの勤評をスライドフレーム１２が操作する。18 is an IC chip supply unit, where X table 1 day, Y
1) Multiple ICs placed on the table 20
A predetermined IC chip among the chips is positioned at a supply reference position 21. The intersection point 23 between the Y axis extending in the Y direction from the supply reference position 21 and the center line 22 of the 'J-1' 7 frame 1 is defined as the bonding reference center position. The distance between the center line 22 and the first row 4 or the second row 5 is ρ
and the supply reference position 21 and the bonding reference center position 2
Let the distance from 3 be L. The Y table 7 operates the performance review of L, and the slide frame 12 operates the performance review of ±ρ.

作用につぎ説明する。The action will be explained next.

キャリヤ１７の動％により、リードフレーム１の第１行
２４のマウント部２Ａ、３Ａの中心がボンディング基準
中心位置２３を通るＹ軸上に置かれる。第３図及び第４
図において、当初コレット１６の先端はＡ点にあったと
する。先ずＹテーブル７の動とによりフレット１６はＢ
点に至り、下降せしめられ、予め供給基準位置２１に置
かれた所定のＩＣチップを捕捉し、Ｂ点まで上昇する。Due to the movement of the carrier 17, the centers of the mount portions 2A, 3A of the first row 24 of the lead frame 1 are placed on the Y axis passing through the bonding reference center position 23. Figures 3 and 4
In the figure, it is assumed that the tip of the collet 16 is initially at point A. First, fret 16 is set to B due to the movement of Y table 7.
It reaches a point, is lowered, captures a predetermined IC chip placed in advance at the supply reference position 21, and rises to a point B.

次にＹテーブル７とスライドフレーム１２の操作により
０点に至り、下降してＤ点において第１列４のマウント
部２ＡにＩＣチップのボンディングを行なう。次に上昇
した後Ｙテーブル７とスライドフレーム１２の操作によ
り再びＢ点に至り下降して供給基準位置２１に置かれた
次のＩＣチップを捕捉し、上昇後Ｙテーブル７とスライ
ド７レーム１２の操作によりＥ点に達し下降してＦ点に
おいて第２列５のマウント部３ＡにＩＣチップのボンデ
ィングを行なう。その後上昇して再びＡ点に戻る。Next, the Y table 7 and the slide frame 12 are operated to reach the 0 point, and the IC chip is bonded to the mount portion 2A of the first row 4 at the D point. Next, after rising, it reaches point B again by operating the Y table 7 and slide frame 12, descends and captures the next IC chip placed at the supply reference position 21, and after rising, the Y table 7 and slide frame 12 The operation reaches point E and descends, and the IC chip is bonded to the mount portion 3A of the second row 5 at point F. It then rises and returns to point A.

次に、キャリヤ１７の動鰺によりリードフレーム１がピ
ッチ　ｐ　だけ進められて、第２行２５のマウント部２
　Ｂ、　３　Ｂがボンディング基準中心位置２３を通る
Ｙ軸上に位置せしめられ、上述と同様のサイクルで第２
行２５のグイボンディングが行なわれ、以下順次各行の
グイボンディングが行なわれる。Next, the lead frame 1 is advanced by a pitch p by the movement of the carrier 17, and the mount portion 2 of the second row 25 is moved forward.
B, 3B is positioned on the Y axis passing through the bonding reference center position 23, and the second
Goui bonding is performed for row 25, and thereafter, goui bonding is performed for each row in sequence.

以上の説明では便宜上第４図に示す如く、コレット１６
の軌跡は矩形状としたが、水平方向と垂直方向の動きを
同時に行なわしめて斜に上昇、下降せしめるのがサイク
ル短縮になるため好ましい。In the above explanation, for convenience, the collet 16 is shown in FIG.
Although the locus is rectangular, it is preferable to simultaneously move in the horizontal and vertical directions and ascend and descend diagonally, since this shortens the cycle.

スライドフレーム１２を用いずにＬ±ρの動トをＹテー
ブル７のみにより行なうようにしてもよ゛い。供給部１
８にＸテーブル１９、Ｙテーブル２０を用いずに、ボン
ディングヘッド１０側のＸテーブル７及びＹテーブル２
０或いはスライドフレーム１２の動きによりＩＣチップ
の選択を行なってもよい。The movement of L±ρ may be performed only by the Y table 7 without using the slide frame 12. Supply section 1
8, instead of using the X table 19 and Y table 20, the X table 7 and Y table 2 on the bonding head 10 side
The IC chip may be selected by moving the slide frame 12 or by moving the slide frame 12.

マウント部２，３の列数は３列或いはそれ以上の多列に
おいても同時に、−行づつボンディングを行ない、一度
の技手方向の移動行程で全ボンディングを完了せしめる
。Even when the number of rows of the mount parts 2 and 3 is three or more, bonding is performed simultaneously row by row, and all bonding is completed in one movement process in the direction of the operator.

本発明により、リードフレームの移送を一行程行なうだ
けで多列のマウント部を有する多列チップ型のリードフ
レームのグイボンディングを行なうことがでた、リード
フレームの反転装置やキャリヤの調整装置を要さず、ま
た、反転や調整の手間も必要なく、高能率のグイボンデ
ィング方法を提供することかでき、実用上極めて大なる
効果を奏する。According to the present invention, it is possible to perform smooth bonding of a multi-row chip type lead frame having multiple rows of mounting portions by simply transferring the lead frame in one stroke. Moreover, it is possible to provide a highly efficient guide bonding method without the need for reversal or adjustment, which is extremely effective in practice.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はリードフレームの部分拡大図、第２図はリード
フレームの概要図、第３図は本発明の実施例の正面図、
第４図はそのコレットの動きを示す線図である。 １・・リードフレーム、２．２Ａ、２Ｂ、３．３Ａ。 ３Ｂ・・マウンド部、４・・第１列、５・・第２列、６
・・ベースフレーム、７・・Ｙテーブル、８・・Ｘテー
ブル、９・・Ｙ方向、１０・・ボンディングヘッド、１
１・・メインフレーム、１２・・スライドフレーム、１
３・・パルスモータ、１４・・ネジ、１５・・ボンディ
ングアーム、１６・・コレット、１７・・キャリヤ、１
８・・供ｍ部、１９・・Ｘテーブル、２ｏ・・Ｙテーブ
ル、２１・・供給基準位置、２２・・中心線、２３・・
ボンディング基準中心位置、２４・・第１行、２５・・
第２行。 特許出願人　海上電機株式会社 代理人弁理士　高　木　正　行 同　千　１）　捻 回　光重　隆夫 第３図FIG. 1 is a partially enlarged view of a lead frame, FIG. 2 is a schematic diagram of a lead frame, and FIG. 3 is a front view of an embodiment of the present invention.
FIG. 4 is a diagram showing the movement of the collet. 1...Lead frame, 2.2A, 2B, 3.3A. 3B...Mound part, 4...First row, 5...Second row, 6
...Base frame, 7..Y table, 8..X table, 9..Y direction, 10..bonding head, 1
1. Main frame, 12. Slide frame, 1
3...Pulse motor, 14...Screw, 15...Bonding arm, 16...Collet, 17...Carrier, 1
8... Serving m part, 19... X table, 2o... Y table, 21... Supply reference position, 22... Center line, 23...
Bonding reference center position, 24...1st row, 25...
2nd line. Patent Applicant Masashi Takagi, Patent Attorney, Kaiyo Denki Co., Ltd. 1) Twisting Takao Mitsushige Figure 3

Claims (1)

【特許請求の範囲】 １、　長手方向に対して平行な、少なくとも第１列及び
第２列の二つの列を有する複数列をなして配列された複
数個のマウント部を有する多列チップ型のリードフレー
ムを長手方向に移送し、該リードフレームのマウント部
に、ＩＣチップの供給部から捕捉した所定のＩＣチップ
をグイボンドするグイボンディング方法において、前記
リードフレームの移送方向をＸ方向とし、水平面内で該
Ｘ方向と直角をなす方向をＹ方向とするとぎ、 前記リードフレームをＸ方向に移送して、所定のマウン
ト部が前記ＩＣチップの供給基準位置からＹ方向に延長
したＹ軸上に位置した状態で前記リードフレームを停止
して保持し、前記ＩＣチップを捕捉するコレットを、前
記ＩＣチップ供給位置と前記各列のマウント部との間の
往復運動を、順次行ない、Ｙ軸上の各列のグイボンドが
一行分終了した後前記リード７？−ムをＸ方向に移送し
、次の行のグイボンドを行なう ことを特徴とするグイボンディング方法。[Claims] 1. A multi-row chip type having a plurality of mount parts arranged in a plurality of rows having at least two rows, a first row and a second row, parallel to the longitudinal direction. In a guide bonding method in which a lead frame is transferred in the longitudinal direction and a predetermined IC chip captured from an IC chip supply unit is bonded to a mount portion of the lead frame, the transfer direction of the lead frame is the X direction, and the lead frame is transferred in the horizontal plane. Assuming that the direction perpendicular to the X direction is the Y direction, the lead frame is transferred in the X direction, and the predetermined mount section is positioned on the Y axis extending in the Y direction from the reference position for supplying the IC chip. The lead frame is stopped and held in this state, and the collet that captures the IC chip is sequentially reciprocated between the IC chip supply position and the mount section of each row, and After the column Guibond finishes one row, the lead 7? - A gui bonding method characterized by moving the frame in the X direction and performing gui bonding on the next row.
JP23438483A 1983-12-14 1983-12-14 Die-bonding method Pending JPS60126842A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23438483A JPS60126842A (en) 1983-12-14 1983-12-14 Die-bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23438483A JPS60126842A (en) 1983-12-14 1983-12-14 Die-bonding method

Publications (1)

Publication Number Publication Date
JPS60126842A true JPS60126842A (en) 1985-07-06

Family

ID=16970148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23438483A Pending JPS60126842A (en) 1983-12-14 1983-12-14 Die-bonding method

Country Status (1)

Country Link
JP (1) JPS60126842A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6292335A (en) * 1985-10-18 1987-04-27 Toshiba Seiki Kk Loader for pellet

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57124446A (en) * 1981-01-26 1982-08-03 Mitsubishi Electric Corp Die bond apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57124446A (en) * 1981-01-26 1982-08-03 Mitsubishi Electric Corp Die bond apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6292335A (en) * 1985-10-18 1987-04-27 Toshiba Seiki Kk Loader for pellet

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