JPS60125741U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS60125741U
JPS60125741U JP1348484U JP1348484U JPS60125741U JP S60125741 U JPS60125741 U JP S60125741U JP 1348484 U JP1348484 U JP 1348484U JP 1348484 U JP1348484 U JP 1348484U JP S60125741 U JPS60125741 U JP S60125741U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
sunrise
pellet
bump electrode
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1348484U
Other languages
Japanese (ja)
Inventor
五郎 池上
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1348484U priority Critical patent/JPS60125741U/en
Publication of JPS60125741U publication Critical patent/JPS60125741U/en
Pending legal-status Critical Current

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  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、従来の一般的なりＨＤ型ダイオード、　の断
面図、第２図及び第３図はそのペレットマウント一作業
中の断面図、第４図は、この考案の第１実施例を示すＤ
ＨＤ型ダイオードの断面図、第５図はその円Ａ部におけ
る要部拡大断面図、第６図及び第７図はそのペレットマ
ウンチ作業中の断面図、第８図はこの考案の第２実施例
に関するペレット仮固定構体の断面図である。 ３．４・・・口出電極、７・・・外囲器（ガラスバルブ
）、９・・・ペレット、１３・・・押圧面、１４，１４
、・・・突起、１７・・・突起。Figure 1 is a sectional view of a conventional general HD type diode, Figures 2 and 3 are sectional views of the pellet mount during operation, and Figure 4 shows the first embodiment of this invention. D
A cross-sectional view of an HD type diode. Figure 5 is an enlarged cross-sectional view of the main part at circle A, Figures 6 and 7 are cross-sectional views during pellet mounting work, and Figure 8 is a second implementation of this invention. FIG. 3 is a cross-sectional view of a pellet temporary fixing structure according to an example. 3.4... Exit electrode, 7... Envelope (glass bulb), 9... Pellet, 13... Pressing surface, 14, 14
,... protrusion, 17... protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] バンプ電極を有するペレットを、外囲器内で一組の日出
電極にて挾持して封止したものにおいて、前記日出電極
のバンプ電極押圧面を凸凹に形成したことを特徴とする
半導体装置。A semiconductor device in which a pellet having a bump electrode is sandwiched and sealed by a set of sunrise electrodes in an envelope, wherein the bump electrode pressing surface of the sunrise electrode is formed to be uneven. .
JP1348484U 1984-01-31 1984-01-31 semiconductor equipment Pending JPS60125741U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1348484U JPS60125741U (en) 1984-01-31 1984-01-31 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1348484U JPS60125741U (en) 1984-01-31 1984-01-31 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS60125741U true JPS60125741U (en) 1985-08-24

Family

ID=30497535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1348484U Pending JPS60125741U (en) 1984-01-31 1984-01-31 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS60125741U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4315736Y1 (en) * 1964-08-04 1968-07-01
JPS53118370A (en) * 1977-03-25 1978-10-16 Nec Corp Semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4315736Y1 (en) * 1964-08-04 1968-07-01
JPS53118370A (en) * 1977-03-25 1978-10-16 Nec Corp Semiconductor device

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