JPS60121064A - Terminal soldering method of metallic base circuit board - Google Patents
Terminal soldering method of metallic base circuit boardInfo
- Publication number
- JPS60121064A JPS60121064A JP23016183A JP23016183A JPS60121064A JP S60121064 A JPS60121064 A JP S60121064A JP 23016183 A JP23016183 A JP 23016183A JP 23016183 A JP23016183 A JP 23016183A JP S60121064 A JPS60121064 A JP S60121064A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- terminal
- soldering
- blanked
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、金属ベース回路基板の単品回路部品半田付は
方法に関するものであり、特にフラックスをさける必要
のある接点関係を有する端子の半田付けに有効である。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for soldering single circuit components on metal-based circuit boards, and is particularly effective for soldering terminals with contact relationships that require avoiding flux. It is.
従来例の構成とその問題点
近年、効果的な熱拡散、あるいはシールド効果を目的と
して、金属ベース回路基板が電子機器に頻繁に使用され
始めている。この場合、単品回路部品を半田付けしよう
とすると、従来、めんどうな工程が必要であった。2. Description of the Related Art Structures of Conventional Examples and Their Problems In recent years, metal-based circuit boards have begun to be frequently used in electronic devices for the purpose of effective heat diffusion or shielding effects. In this case, conventionally, when attempting to solder single circuit components, a laborious process was required.
以下に従来の金属ベース回路基板の端子半田付は方法を
小型直流モータを例として説明する。第１図は、金属ベ
ース回路基板を小型直流モータに実装したもので、１は
モータフレーム、２は制御回路を構成した金属ベース回
路基板で、単品回路部品３，４を有し、モータフレーム
１に嵌め込まれ、接合部で共銭めされている・
第２図は、単品回路部品である刷子端子板４の半田付は
部近傍を拡大して示したものである。金属ベース６０表
面に絶縁層６が形成され、その上に導体ランド７が形成
されている。刷子端子板４は、半田８によシ導体ランド
７と接合されている。A conventional method for soldering terminals on a metal base circuit board will be described below using a small DC motor as an example. Fig. 1 shows a metal base circuit board mounted on a small DC motor. 1 is a motor frame, 2 is a metal base circuit board that constitutes a control circuit, and has single circuit components 3 and 4. Figure 2 is an enlarged view of the vicinity of the soldering part of the brush terminal plate 4, which is a single circuit component. An insulating layer 6 is formed on the surface of a metal base 60, and a conductive land 7 is formed thereon. The brush terminal plate 4 is joined to the conductor land 7 by solder 8.
このような構成の金属ベース回路基板において、刷子端
子板を半田付けしようとする場合、例えば第３図ａに示
すように、半田メッキ鋼板９を打ち抜いて刷子端子板形
状に成型し、その刷子端子板４を、第３図すに示すごと
くあらかじめ半田付けしようとする導体ランド了に塗布
してあったクリーム半田１ｏに接島させ、これを半田ゴ
テヘッド１１にて加熱することによって両者の半田部け
を行なう方法を採用していた。When attempting to solder a brush terminal plate to a metal base circuit board having such a configuration, for example, as shown in FIG. As shown in Figure 3, the plate 4 is attached to the cream solder 1o that has been applied to the conductor land to be soldered in advance, and the solder parts of both are heated by the soldering iron head 11. A method of doing this was adopted.
しかしながら上記方法では、先妊リフロ一方式、又は、
ディップ方式にて半田付けされていた部品かある場合、
更にクリーム半田を塗布する工程が増えることになりコ
スト高となるばかｐでなく、刷子端子板のような接点関
係を有する部品については、半田フラックスの伺着、ガ
ス化等によシ、接点部分に悪影響を及ぼしその信頼性を
著しく損うといった欠点を持っていた。However, in the above method, the first reflow method or
If there are any parts that were soldered using the dip method,
Furthermore, the process of applying cream solder is increased, which increases the cost.For parts with contact relationships such as brush terminal boards, it is necessary to prevent the solder flux from flowing, gasifying, etc., and the contact area. It had the disadvantage of having a negative impact on the system and significantly impairing its reliability.
発明の目的
本発明は上記従来の欠点に鑑みてなされたもので、半田
部けの信頼性を確保したまま工数の削減を図ることを目
的とするものである。OBJECTS OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks of the conventional art, and it is an object of the present invention to reduce the number of man-hours while ensuring the reliability of the soldering parts.
発明の構成
そこで本発明は、半田付は端子の端面部分にも溶融半田
メッキ層が形成されるべく打ち抜かれた端子を使用する
ことによって、加熱、溶融され／こ半田の端子面への半
田まわりを確保し、クリーム半田の再塗布の廃止を実現
させるものである。Structure of the Invention Therefore, in the present invention, soldering is performed by using a punched terminal so that a molten solder plating layer is also formed on the end surface of the terminal, and the solder is heated and melted to form a molten solder plating layer on the terminal surface. This will ensure that the solder cream does not need to be reapplied.
実施例の説明 以下、図面によシ実施例を詳細に説明’ｉｔ−る。Description of examples Hereinafter, embodiments will be described in detail with reference to the drawings.
第４図、第５図ａ、ｂ、ｃは、本発明の実施例を示した
もので、第１．第２図と同一符号のものは同一のものを
示している。いま、半田部端子の端面部分にも半田メッ
キ層が形成されるように、第４図ｄ、第５図ａに示しで
あるごとく部分的に溶融半田メッキ１６を施した鋼板９
，１２を半田メッキ端面部分がそのまま残るような形状
に打ち抜き、これを刷子端子板４として成型する。従来
の打ち抜き工程では、メッキ鋼板を打ち抜いたとしても
端面にはメッキ層が形成されず、そのため、良好な半田
付は性を得る罠は鋼板の原板を打ち抜いて、その後単品
をメッキ処理するといつだものであったが、本発明の打
ち抜き工程では、鋼板の原板をフープ状で溶融メッキ層
を通し部分溶融半田メッキ１６を施し、そのままトラン
スファプレスに移行して打ち抜けるというライン化が可
能とガリ非常に量産性に富んでいる。次に第４図す。4 and 5 a, b, and c show embodiments of the present invention. Components with the same reference numerals as in FIG. 2 indicate the same components. Now, a steel plate 9 is partially coated with molten solder plating 16, as shown in FIGS. 4d and 5a, so that a solder plating layer is also formed on the end face of the solder terminal.
, 12 are punched out into a shape such that the solder-plated end face portions remain as they are, and this is molded into a brush terminal plate 4. In the conventional punching process, even if a plated steel plate is punched out, a plating layer is not formed on the end surface. Therefore, the trick to obtaining good solderability is when the original steel plate is punched out and then the individual parts are plated. However, in the punching process of the present invention, it is possible to create a line in which the original steel plate is passed through the hot-dip plating layer in a hoop shape, partially coated with hot-dip solder plating 16, and then transferred directly to a transfer press for punching. It is suitable for mass production. Next is Figure 4.
第５図すに示すように、この刷子端子板４をすでに半田
リフロー、あるいは、半田ディツプによって半田盛シ１
３が形成されている導体ランド７の半田部分に接触させ
る。この両者に熱圧着用ヘッド１４にて圧力と同時に熱
を加える事によって端子部４を介して半田メッキ１６と
半田盛シ１３とが溶融され、第６図Ｃの如く刷子端子板
端面部分のメッキ層１６に沿って端子板上面にもまわり
こみ、この時点で半田付は部分を冷却してやれば刷子端
子板と導体ランドとの接合が実現される。この場合、半
田付けする端子は打ち抜きにより成形されたもの忙限ら
ず、第１図の３に示すような単品回路部品の半田メッキ
を施されたリードでも同様に半田付けをすることができ
る。また、半田リフロー、半田ディツプに耐え得るなら
ば、金属ベース回路基板に限らず合成樹脂積層板をベー
スとする回路基板にも本発明の半田付は方法は利用でき
る。As shown in FIG.
3 is brought into contact with the solder portion of the conductor land 7 on which the conductor land 7 is formed. By applying pressure and heat to both using the thermocompression head 14, the solder plating 16 and the solder sheath 13 are melted through the terminal portion 4, and the end surface of the brush terminal plate is plated as shown in FIG. 6C. The brush terminal board and the conductor land can be joined together by wrapping around the top surface of the terminal board along the layer 16 and cooling the soldering part at this point. In this case, the terminals to be soldered are not limited to those formed by punching, but solder-plated leads of a single circuit component as shown in 3 in FIG. 1 can also be soldered in the same manner. Furthermore, the soldering method of the present invention can be used not only for metal-based circuit boards but also for circuit boards based on synthetic resin laminates, as long as they can withstand solder reflow and solder dip.
発明の詳細
な説明したように、本発明（／Ｃよれば、従来のような
りリーム半田の再塗布をすることなく、単品部品、特に
、打ち抜き端子をそのま丑半田付けすることが可能とな
り、半田部けの信頼性を確保したま丑工数を削減するこ
とができる。丑だ、半田リフロー、あるいは半田ディノ
ブ後、通常行在われる金属ベース回路基板の洗浄工程を
行ない、付着している半田フラックスを洗い落とし、本
発明の半田付は方法を採用することによって、フラーノ
クスの影響を無視することができるため、接点関係を有
する単品部品の半田付けに非常に有効である。As described in detail, the present invention (/C) makes it possible to directly solder single components, especially punched terminals, without reapplying ream solder as in the conventional method. It is possible to reduce the number of man-hours required while ensuring the reliability of the solder parts. After solder reflow or solder debobbing, the usual cleaning process for metal-based circuit boards is performed to remove adhering solder flux. By using the soldering method of the present invention, the influence of Fullernox can be ignored, making it very effective for soldering single components that have contact relationships.
【図面の簡単な説明】
第１図は金属ベース回路基板を小型直流モータに実装し
た従来例の断面図、第２図は刷子端子板の半田付は部の
拡大断面図、第３図ａ、ｂはそれぞれ従来の端子半田付
は方法の端子板の打ち抜き要領図とその半田付は要領を
示す要部断面図、第・ρへ図ａ、ｂ、ｃはそれぞれ、本
発明の一実施例の端子板打ち抜き要領図とその半田付は
要領を示す要部断面図である。
４・・・・刷子端子板、５・・・・・・金属ベース、６
・・・・・絶縁層、７・・・・・・導体ランド、１２・
・・・・・部分半田メッキ鋼板、１３・・・・・・盛り
半田部、１４・・・・・熱圧着用ヘッド、１５・・・・
・・端子板の溶融半田メッキ層、１６・・・・・・端子
板の端部半田メッギ部。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第２
図
第３図
第４図
ユ圧■■■１[Brief explanation of the drawings] Fig. 1 is a sectional view of a conventional example in which a metal base circuit board is mounted on a small DC motor, Fig. 2 is an enlarged sectional view of the soldering part of a brush terminal board, Fig. 3 a, Figures a, b, and c are respectively a diagram of a conventional terminal soldering method for punching out a terminal board and a cross-sectional view of a main part showing the soldering procedure. A terminal board punching procedure diagram and its soldering procedure are main part sectional views showing the procedure. 4...Brush terminal board, 5...Metal base, 6
...Insulating layer, 7...Conductor land, 12.
... Partial solder plated steel plate, 13 ... Solder buildup, 14 ... Heat compression head, 15 ...
... Molten solder plating layer of terminal board, 16... End solder mesh part of terminal board. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
Figure 3 Figure 4 U pressure■■■1
Claims (1)
路を形成してなる金属ベース回路基板において、半田付
けすべき導体ランドにあらかじめ半田盛シを施しておき
、これに半田メッキ層が端面部分にも形成されるように
打ち抜かれた半田付は端子を接触させ、両者を熱圧着用
ヘッドにて加圧と同時に加熱し半田付は部分の半田を溶
融、凝固せしめ、その電気的接続を成すことを特徴とす
る金属ベース回路基板の端子半田付は方法。In a metal base circuit board in which the surface of a metal base is insulated and a conductor circuit is formed on the insulator, solder is applied to the conductor land to be soldered in advance, and a solder plating layer is applied to the end surface. The solder is punched out so that the terminals are in contact with each other, and both are pressurized and heated at the same time with a thermocompression head.The solder melts and solidifies the solder on the part, making the electrical connection. A method for soldering terminals on metal-based circuit boards characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58230161A JPH0682912B2 (en) | 1983-12-06 | 1983-12-06 | Method of soldering circuit board and circuit parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58230161A JPH0682912B2 (en) | 1983-12-06 | 1983-12-06 | Method of soldering circuit board and circuit parts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60121064A true JPS60121064A (en) | 1985-06-28 |
| JPH0682912B2 JPH0682912B2 (en) | 1994-10-19 |
Family
ID=16903550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58230161A Expired - Lifetime JPH0682912B2 (en) | 1983-12-06 | 1983-12-06 | Method of soldering circuit board and circuit parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0682912B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6395190U (en) * | 1986-12-11 | 1988-06-20 | ||
| US4891496A (en) * | 1987-07-09 | 1990-01-02 | Productech Reflow Solder Equipment Inc. | Heated tool with multiple heating surfaces |
| US4907991A (en) * | 1987-11-25 | 1990-03-13 | Mitsubishi Denki Kabushiki Kaisha | Connective jumper |
| CN105665864A (en) * | 2016-04-15 | 2016-06-15 | 歌尔声学股份有限公司 | Welding method for FPCB and metal bonding pad |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4313705Y1 (en) * | 1967-08-31 | 1968-06-11 | ||
| JPS5476975A (en) * | 1977-11-30 | 1979-06-20 | Sanyo Electric Co | Soldering method |
| JPS5676594A (en) * | 1979-11-29 | 1981-06-24 | Tokyo Shibaura Electric Co | Method of fabricating hybrid integrated circuit |
| JPS5694796A (en) * | 1979-12-28 | 1981-07-31 | Fujitsu Ltd | Method of soldering electronic part |
-
1983
- 1983-12-06 JP JP58230161A patent/JPH0682912B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4313705Y1 (en) * | 1967-08-31 | 1968-06-11 | ||
| JPS5476975A (en) * | 1977-11-30 | 1979-06-20 | Sanyo Electric Co | Soldering method |
| JPS5676594A (en) * | 1979-11-29 | 1981-06-24 | Tokyo Shibaura Electric Co | Method of fabricating hybrid integrated circuit |
| JPS5694796A (en) * | 1979-12-28 | 1981-07-31 | Fujitsu Ltd | Method of soldering electronic part |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6395190U (en) * | 1986-12-11 | 1988-06-20 | ||
| JPH0215272Y2 (en) * | 1986-12-11 | 1990-04-24 | ||
| US4891496A (en) * | 1987-07-09 | 1990-01-02 | Productech Reflow Solder Equipment Inc. | Heated tool with multiple heating surfaces |
| US4907991A (en) * | 1987-11-25 | 1990-03-13 | Mitsubishi Denki Kabushiki Kaisha | Connective jumper |
| US4962585A (en) * | 1987-11-25 | 1990-10-16 | Mitsubishi Denki Kabushiki Kaisha | Connective jumper and method of manufacturing the same |
| CN105665864A (en) * | 2016-04-15 | 2016-06-15 | 歌尔声学股份有限公司 | Welding method for FPCB and metal bonding pad |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0682912B2 (en) | 1994-10-19 |
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