JPS5996264A - Continuous vacuum deposition device - Google Patents

Abstract

PURPOSE:To enable continuous and satisfactory plating on one side of a steel strip by disposing a deposition preventive plate which is heated to the reevaporation temp. of a plating metal or above on the non-plating side of the steel strip in a vacuum deposition chamber in parallel in proximity to the steel strip. CONSTITUTION:A deposition preventive plate 110 having the width equal to the width of a steel strip 102 or below is installed as near the strip 102 as possible in parallel therewith on the non-plating side of the strip 102 without contact therewith. The plate 110 is heated by a heater 111 to the reevaporation temp. of a molten metal 106 for plating or above and vapor deposition is performed in this state. Then the vapor, which spreads upward without causing deposition on the bottom surface of the strip 102, of the part of the vapor 112 generated from a crucible 105 for evaporation is blocked by the plate 110 and is prevented from deposition to the top surface of the strip 102. Since the plate 110 is heated, the trouble such as the contact of the plating metal with the top surface of the strip 102 owing to the deposition thereof is prevented.

Description

【発明の詳細な説明】 本発明は、例えば銅帯の片面に亜鉛メッキを施すための
連続真空蒸着装置に関し、特に亜鉛蒸気がメッキを必要
としない面に付着することを防止する上記装置に関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a continuous vacuum deposition apparatus for galvanizing one side of a copper strip, for example, and more particularly to such an apparatus for preventing zinc vapor from adhering to surfaces not requiring plating.

銅帯に連続的に亜鉛メッキ皮膜を形成する方法として、
従来の溶融亜鉛浸漬法や電気メツキ法の他に、片面のみ
のメッキに対する有利性から真空蒸着メッキ法が最近研
究されている。As a method of continuously forming a galvanized film on a copper strip,
In addition to the conventional hot-dip zinc immersion method and electroplating method, a vacuum evaporation plating method has recently been studied due to its advantages over plating only one side.

第１図は従来の蒸着装置を示す図である。図に、おいて
、ｉｏｉは蒸ノ５室、１０２（は鉛；；１ｔで、蒸着室
１０１に入る前に表面を活性化されている。１０３．１
０３′はシール装置、１０４は真空ポンプへの連結口で
、図示されていない真空ポンプによシ室内圧力は１〜１
０　’　Ｔｏｒｒ　　の真空に保持されている。１０５
は蒸発ルツボ、１０６はメッキ用溶融金属である。１０
７は加熱用ヒータ、１０８は電源への端子である。FIG. 1 is a diagram showing a conventional vapor deposition apparatus. In the figure, ioi is evaporation chamber 5, 102 (lead;; 1t, whose surface is activated before entering the evaporation chamber 101. 103.1
03' is a sealing device, and 104 is a connection port to a vacuum pump.
It is maintained at a vacuum of 0' Torr. 105
1 is an evaporation crucible, and 106 is molten metal for plating. 10
7 is a heater, and 108 is a terminal to a power source.

第２図は第１図の■−■矢視断面図である。FIG. 2 is a sectional view taken along the line ■-■ in FIG. 1.

該図に示すように、蒸発ルツボ１０５の液面よシ蒸発し
た亜鉛蒸気は大部分は鋼帯１０２の下面に付着して凝固
するが、一部は無効蒸気として蒸着室１０１の壁面に付
着し、捷た一部は鋼帯１０２の上面に付着する。As shown in the figure, most of the zinc vapor evaporated from the liquid surface of the evaporation crucible 105 adheres to the lower surface of the steel strip 102 and solidifies, but some of it adheres to the wall surface of the evaporation chamber 101 as ineffective vapor. , a part of the twisted part adheres to the upper surface of the steel strip 102.

このため鋼帯１０２の上面に付着すること（いわゆる裏
廻シ）によシ商品価値を低くするという欠点があった。For this reason, there is a drawback that adhesion to the upper surface of the steel strip 102 (so-called backing) lowers the commercial value.

本発明は前記従来装置の欠点を改良するためになさｎた
もので、鋼帯のメッキを必要としない血（すなわち裏面
）への無効蒸気の付着を防止するために、蒸発ルツボの
蒸気出口部において、銅帯の裏面側に鋼・おと同等ある
いはそれ以下の幅を有し、メッキ金属の再蒸発温度以上
に加熱された付着防止板を設置することを特徴とする連
続真空蒸着装置に関するものである。The present invention has been made in order to improve the drawbacks of the conventional apparatus, and in order to prevent the adhesion of ineffective steam to the blood (i.e., the back surface) that does not require plating of the steel strip, it is necessary to , relating to a continuous vacuum evaporation device characterized by installing on the back side of the copper strip an adhesion prevention plate having a width equal to or less than that of steel and heated to a temperature higher than the re-evaporation temperature of the plated metal. It is.

第３図は本発明装置の一実施態様例を示す図である。FIG. 3 is a diagram showing an embodiment of the apparatus of the present invention.

第６図において、１０１は蒸着完、１０２は鋼帯、１０
５は蒸発ルツボ、１０６はメッキ用溶融金属、１１２は
その蒸気、１１０は付着防止板、１１１は付着防止板を
・加熱するヒータである。付着防止板１１０は、銅帯１
０２と同程度あるいはそれ以下の幅を有しておシ、鋼帯
１０２の非メツキ面側に銅帯１０２と平行に、かつ鋼帯
１０２と接触することなく、極力近づけて（例えば１０
論前後）設置されている。In FIG. 6, 101 is a completed vapor deposition, 102 is a steel strip, 10
5 is an evaporation crucible, 106 is a molten metal for plating, 112 is its vapor, 110 is an adhesion prevention plate, and 111 is a heater for heating the adhesion prevention plate. The adhesion prevention plate 110 is a copper strip 1
02 or less, and place it as close as possible to the non-plated side of the steel strip 102 in parallel with the copper strip 102 and without contacting the steel strip 102 (for example, 10
(before and after) has been established.

付着防止板１１０をヒータ１１１によシ再蒸発温度以上
に加熱した状態で蒸着を行うと、蒸発ルツボ１０５より
発生した蒸気１１２のうち鋼帯１０２の下面に付着せず
銅帯１０２の端部分通って鋼帯１０２の上方に廻シ込む
蒸気は、付着防止板１１０にさえぎられて鋼帯１０２の
上面には付着しにくい。さらに、付着防止板１１０は再
蒸発温度以上に加熱さｎているので、長時間運転後の付
着防止板１１０へのメッキ用金屈の堆積による銑帝１０
２の上表面と堆積金属との接触等のトラブルは防止され
ている。When vapor deposition is performed while the adhesion prevention plate 110 is heated to a temperature higher than the re-evaporation temperature by the heater 111, some of the vapor 112 generated from the evaporation crucible 105 does not adhere to the lower surface of the steel strip 102 and passes through the end portion of the copper strip 102. The steam flowing above the steel strip 102 is blocked by the adhesion prevention plate 110 and hardly adheres to the upper surface of the steel strip 102. Furthermore, since the adhesion prevention plate 110 is heated to a temperature higher than the re-evaporation temperature, the deposition of gold for plating on the adhesion prevention plate 110 after long-term operation may cause the metallurgy to deteriorate.
This prevents troubles such as contact between the upper surface of No. 2 and the deposited metal.

付着防止板１１０の幅は銅帯１０２の輻よシ若干小さく
ても良く、実験では２０瓢小さくても付着防止効果が確
認されている。The width of the adhesion prevention plate 110 may be slightly smaller than the radius of the copper strip 102, and experiments have confirmed that the adhesion prevention effect can be achieved even if the width is 20 mm smaller.

なお付着防止板１１０は、望ましくは銅帯１０２の蛇行
に追従するように、図示されていないふ動装置によフ巴
動さｎる。Note that the adhesion prevention plate 110 is preferably moved by a movement device (not shown) so as to follow the meandering of the copper strip 102.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の連続真空蒸着装置を示す図、第２図は第
１図の■−■矢視断面図、第３図は本発明装（１ｔの一
実施態様例を示す図である。 後代ｊ里人　　内　１）　　明 復代理人　　萩　原　亮　− 第１頁の続き ０発　明　者　古用平三部 広島市西区観音新町四丁目６番 ２２号三菱重工業株式会社広島造 船所内 ０発　明　者　和気完治 広島市西区観音新町四丁目６番 ３４３−FIG. 1 is a diagram showing a conventional continuous vacuum evaporation apparatus, FIG. 2 is a cross-sectional view taken along arrows -■ in FIG. 1) Meifuku Agent Ryo Hagiwara - Continued from page 1 0 Inventors Old Heirasanbu Hiroshima Shipyard, Mitsubishi Heavy Industries, Ltd., 4-6-22 Kannon Shinmachi, Nishi-ku, Hiroshima City 0 Inventors Person Wake Kanji 4-6-343 Kannon Shinmachi, Nishi-ku, Hiroshima

Claims (1)

【特許請求の範囲】[Claims] 連続真空蒸着装置において、蒸着室内の蒸発ルツボの蒸
気出口部近傍の銅帯の非メツキ側に、銅帯と同等又はそ
れ以下の幅を有し、メッキ金属の再蒸発温度以上に加熱
された付着防止板を、銅帯と平行に、かつ鉗１帯に近接
して設置すること全特徴とする連続真空蒸着装置。In continuous vacuum evaporation equipment, deposits on the non-plated side of the copper strip near the vapor outlet of the evaporation crucible in the evaporation chamber have a width equal to or less than the copper strip and are heated to a temperature higher than the re-evaporation temperature of the plated metal. A continuous vacuum evaporation apparatus characterized in that a prevention plate is installed parallel to the copper band and close to the forceps band.