JPS5994911A - Manufacture of composite type ceramic resonator - Google Patents
Manufacture of composite type ceramic resonatorInfo
- Publication number
- JPS5994911A JPS5994911A JP20409282A JP20409282A JPS5994911A JP S5994911 A JPS5994911 A JP S5994911A JP 20409282 A JP20409282 A JP 20409282A JP 20409282 A JP20409282 A JP 20409282A JP S5994911 A JPS5994911 A JP S5994911A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- ceramic resonator
- covered
- lead terminals
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、フィルタや発振子として機能させることが単
体部品としてできるようにした複合型セラミック共振子
の製造法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a composite ceramic resonator that can function as a filter or an oscillator as a single component.
従来例の構“成とその問題点
従来のセラミック共振子は同一形状にするために、第1
図に示すように外装ケース1内に外部との接続に供され
る入出力リード端子2と電気的に2/゛−ジ
接続される圧電セラミック素子3を入れ、第2図に示す
ようにセラミック素子3の周りに弾性材4を入れるかま
たはセラミック素子3の周りを空間にするために蓋(図
示せず)を設けた後、樹脂6で封止していた。Conventional configuration and its problems In conventional ceramic resonators, in order to have the same shape, the first
As shown in the figure, a piezoelectric ceramic element 3 electrically connected to input/output lead terminals 2 for connection with the outside is placed in an exterior case 1, and After placing an elastic material 4 around the element 3 or providing a lid (not shown) to create a space around the ceramic element 3, the ceramic element 3 was sealed with a resin 6.
この場合、セラミック素子3とケース1との接触を防ぐ
ため、ケース1の形状が大きくなり、密封性が悪くなっ
ていた。また、これを発振子として用いる場合、第3図
に示すように外付は容量C1゜C2が必要となり、回路
部品点数の増加となっていた。第3図で6は上記セラミ
ック共振子、 INは外付けのインバータである。In this case, in order to prevent contact between the ceramic element 3 and the case 1, the shape of the case 1 becomes large, resulting in poor sealing performance. Further, when this is used as an oscillator, external capacitances C1 and C2 are required as shown in FIG. 3, which increases the number of circuit components. In FIG. 3, 6 is the ceramic resonator mentioned above, and IN is an external inverter.
発明の目的
本発明は上記のような従来の欠点を除去すべくなされた
もので、小型化、密封性の向上を図9、かつ周辺回路部
品の削減を図ることができる複合型セラミック共振子の
製造法を提供しようとするものである。Purpose of the Invention The present invention has been made to eliminate the above-mentioned drawbacks of the conventional technology. The aim is to provide a manufacturing method.
発明の構成
この目的を達成するために本発明の複合型セラ31−シ
ミック共振子の製造法は、圧電セラミック素子同志また
は圧電セラミック素子と他の電子部品素子とを入出力リ
ード端子を介して電気的に接続し、それら周囲を弾性材
または空間を形成するようにした蓋で包み、さらに樹脂
で覆ってこの樹脂を加圧成型しながら硬化させるもので
ある。この構成によれば、樹脂を加圧成型しながら硬化
させるため、外観形状が同一のものが容易に得られ、か
つ密閉度も高く、また大きさも小型のものが得られるこ
ととなり、さらに発振子として用いる例では回路部品点
数の削減ができることとなる。Structure of the Invention In order to achieve this object, the method for manufacturing a composite ceramic resonator of the present invention connects piezoelectric ceramic elements or piezoelectric ceramic elements and other electronic component elements via input/output lead terminals. They are connected to each other, wrapped around them with an elastic material or a lid that forms a space, and then covered with resin, and the resin is hardened while being pressure molded. According to this configuration, since the resin is cured while being pressure molded, it is easy to obtain a product with the same external shape, a high degree of sealing, and a small size. In the example used as , the number of circuit components can be reduced.
実施例の説明
以下、本発明の一実施例について第4図〜第7図と共に
説明する。ます、第4図に対向する面に互いに異なる端
部を残して電極が形成された圧電セラミック素子7と一
方の面の中央部と他方の面の中央部を除く部分に合計3
個の電極を有するコンデンサ素子8および3本の入出力
リード端子9の配置を示し1.第6図にこれを組立てワ
イヤボンディング10またはハンダ等で上記圧電セラミ
ック素子7とコンデンサ素子8とを入出力リード端子9
を介して電気的に接続した状態を示している。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. 4 to 7. As shown in FIG. 4, a piezoelectric ceramic element 7 in which electrodes are formed with different end portions left on the opposing surfaces, and a total of 3 electrodes on the central portion of one surface and the portion excluding the central portion of the other surface.
The arrangement of a capacitor element 8 having three electrodes and three input/output lead terminals 9 is shown in 1. Assemble this as shown in FIG. 6, and connect the piezoelectric ceramic element 7 and capacitor element 8 to input/output lead terminals 9 using wire bonding 10 or soldering.
This shows a state in which they are electrically connected via.
この場合、セラミック素子7の振動部はリード端子9を
介してコンデンサ素子8と接続されているため、リード
端子9の厚み骨中間があるので振動が抑制されることは
ない。つぎに、第6図に示すように上記画素子7,8の
周囲を弾性材11で包むかまたは空間を形成するように
した蓋で包み、その後リード端子9の一部を含む周囲を
樹脂12で覆って上下より金型13を当て加圧成型しな
がら上記樹脂12を硬化させ、第7図に示すような複合
型セラミック共振子を得るものである。In this case, since the vibrating part of the ceramic element 7 is connected to the capacitor element 8 via the lead terminal 9, the vibration is not suppressed because the lead terminal 9 has a middle thickness. Next, as shown in FIG. 6, the periphery of the pixel elements 7 and 8 is wrapped with an elastic material 11 or a lid that forms a space, and then the periphery including a part of the lead terminal 9 is covered with a resin 12. The resin 12 is hardened while being covered with molds 13 from above and below and pressure molded, thereby obtaining a composite ceramic resonator as shown in FIG.
第8図はこのようにして得られた複合型セラミック共振
子を用いた発振子の回路例を示しておシ、容量C1,C
2を含んだ点線部分が本発明のセラミック共振子であり
、INは外付けのインバータである。Figure 8 shows an example of an oscillator circuit using the composite ceramic resonator obtained in this way.
The dotted line portion including 2 is the ceramic resonator of the present invention, and IN is an external inverter.
ここで、上記の一実施例においては圧電セラミック素子
とコンデンサ素子とをリード端子を介して電気的に接続
した場合について説明したが、こ −6/−ジ
れは圧電セラミック素子同志または圧電セラミック素子
と他の電子部品素子との組合せについても本発明は適用
できるものである。Here, in the above embodiment, a case was explained in which the piezoelectric ceramic element and the capacitor element were electrically connected via lead terminals. The present invention can also be applied to combinations of other electronic component elements.
発明の効果
以上のように構成された本発明の複合型セラミック共振
子の製造法によれば、樹脂を加圧成型しながら硬化させ
るため、外観形状が同一のものが容易に得られ、かつ密
閉度も高く、さらに大きさも小型化が容易に図れるもの
である。また、回路的に見ると例えば容量を含んだ形が
単体部品として得られることとなり、周辺回路部品の点
数が削減できると共にスペース減少にも役立つものであ
る0Effects of the Invention According to the method for manufacturing a composite ceramic resonator of the present invention configured as described above, since the resin is cured while being pressure-molded, products with the same external shape can be easily obtained, and the resonator can be sealed tightly. It has a high degree of strength and can be easily reduced in size. Also, from a circuit perspective, for example, a shape that includes capacitance can be obtained as a single component, which reduces the number of peripheral circuit components and also helps in reducing space.
第1図は従来のセラミック共振子の作り方を示す斜視図
、第2図は同完成品を示す一部切欠正面図、第3図は゛
従来のセラミック共振子を応用した発振回路例を示す回
路図、第4図および第6図は6ページ
ラミック共振子の斜視図、第8図は本発明の複合型セラ
ミック共振子を応用した発振回路例を示す回路図である
。
7・・・・・・圧電セラミック素子、8・・・・・・電
子部品素子(コンデンサ素子)、9・・・・・・入出力
リード端子、11・・・・・・弾性材、12・・・・・
・樹脂。
代理人の氏名 弁理士 中 尾 敏 男 ほか1名第1
図 第2図
第5図Figure 1 is a perspective view showing how to make a conventional ceramic resonator, Figure 2 is a partially cutaway front view of the finished product, and Figure 3 is a circuit diagram showing an example of an oscillation circuit using a conventional ceramic resonator. , FIG. 4 and FIG. 6 are perspective views of a six-page ceramic resonator, and FIG. 8 is a circuit diagram showing an example of an oscillation circuit to which the composite ceramic resonator of the present invention is applied. 7... Piezoelectric ceramic element, 8... Electronic component element (capacitor element), 9... Input/output lead terminal, 11... Elastic material, 12...・・・・・・
·resin. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 5
Claims (1)
の電子部品素子とを入出力リード端子を介して電気的に
接続し、それらの周囲を弾性材または空間を形成するよ
うにした蓋で包み、さらに樹脂で覆ってこの樹脂を加圧
成型しながら硬化させることを特徴とする複合型セラミ
ック共振子の製造法。The piezoelectric ceramic elements or the piezoelectric ceramic elements and other electronic components are electrically connected via input/output lead terminals, wrapped around them with an elastic material or a lid that forms a space, and then covered with resin. A method for manufacturing a composite ceramic resonator, characterized in that the resin is covered and cured while being pressure molded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20409282A JPS5994911A (en) | 1982-11-19 | 1982-11-19 | Manufacture of composite type ceramic resonator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20409282A JPS5994911A (en) | 1982-11-19 | 1982-11-19 | Manufacture of composite type ceramic resonator |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5994911A true JPS5994911A (en) | 1984-05-31 |
Family
ID=16484649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20409282A Pending JPS5994911A (en) | 1982-11-19 | 1982-11-19 | Manufacture of composite type ceramic resonator |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5994911A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62201522U (en) * | 1986-06-11 | 1987-12-22 | ||
JPS6359012A (en) * | 1986-08-27 | 1988-03-14 | Murata Mfg Co Ltd | Composite electronic component |
JPS6367908A (en) * | 1986-09-10 | 1988-03-26 | Murata Mfg Co Ltd | Electric parts having two-terminal type piezoelectric resonance element and its production |
JPH05167380A (en) * | 1991-12-16 | 1993-07-02 | Murata Mfg Co Ltd | Lamination type piezoelectric component and manufacture thereof |
JPH08316776A (en) * | 1996-03-29 | 1996-11-29 | Murata Mfg Co Ltd | Composite electronic component |
US5894651A (en) * | 1990-10-29 | 1999-04-20 | Trw Inc. | Method for encapsulating a ceramic device for embedding in composite structures |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5513581A (en) * | 1978-07-14 | 1980-01-30 | Matsushita Electric Ind Co Ltd | Production of piezo-electric porcelain filter |
JPS562771A (en) * | 1979-06-22 | 1981-01-13 | Nippon Telegr & Teleph Corp <Ntt> | Dial number automatic transmissin telephone set |
JPS577226B2 (en) * | 1977-08-09 | 1982-02-09 |
-
1982
- 1982-11-19 JP JP20409282A patent/JPS5994911A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS577226B2 (en) * | 1977-08-09 | 1982-02-09 | ||
JPS5513581A (en) * | 1978-07-14 | 1980-01-30 | Matsushita Electric Ind Co Ltd | Production of piezo-electric porcelain filter |
JPS562771A (en) * | 1979-06-22 | 1981-01-13 | Nippon Telegr & Teleph Corp <Ntt> | Dial number automatic transmissin telephone set |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62201522U (en) * | 1986-06-11 | 1987-12-22 | ||
JPS6359012A (en) * | 1986-08-27 | 1988-03-14 | Murata Mfg Co Ltd | Composite electronic component |
JPH052011B2 (en) * | 1986-08-27 | 1993-01-11 | Murata Manufacturing Co | |
JPS6367908A (en) * | 1986-09-10 | 1988-03-26 | Murata Mfg Co Ltd | Electric parts having two-terminal type piezoelectric resonance element and its production |
JPH0533847B2 (en) * | 1986-09-10 | 1993-05-20 | Murata Manufacturing Co | |
US5894651A (en) * | 1990-10-29 | 1999-04-20 | Trw Inc. | Method for encapsulating a ceramic device for embedding in composite structures |
JPH05167380A (en) * | 1991-12-16 | 1993-07-02 | Murata Mfg Co Ltd | Lamination type piezoelectric component and manufacture thereof |
JPH08316776A (en) * | 1996-03-29 | 1996-11-29 | Murata Mfg Co Ltd | Composite electronic component |
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