JPS5989573U - Lead wire forming equipment for electronic components - Google Patents
Lead wire forming equipment for electronic componentsInfo
- Publication number
- JPS5989573U JPS5989573U JP18368882U JP18368882U JPS5989573U JP S5989573 U JPS5989573 U JP S5989573U JP 18368882 U JP18368882 U JP 18368882U JP 18368882 U JP18368882 U JP 18368882U JP S5989573 U JPS5989573 U JP S5989573U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- forming equipment
- wire forming
- electronic components
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の電子部品リード線の修正方法を示す斜視
図、第２図は従来の電子部品実装方法を 。
示す斜視図、第３図は本考案の一実施例の平面図、第４
図は第３図のＢ矢印方向から見た側面図、第５図は本考
案の一実施例の可動金型の刃部を示す断面図、第６図は
本考案のフォーミング装置を使用して、リード線をフォ
ーミングした後の電子部品の斜視図である。
１・・・電子部品、３・・・リード線、１０・・・ベー
ス、１２・・・固定金型、１３・・・挿入ガイド、１６
・・・可動金型、１７・・・シリンダ。Fig. 1 is a perspective view showing a conventional method for modifying electronic component lead wires, and Fig. 2 shows a conventional method for mounting electronic components. Fig. 3 is a plan view of an embodiment of the present invention;
The figure is a side view seen from the direction of arrow B in Fig. 3, Fig. 5 is a sectional view showing the blade part of a movable mold according to an embodiment of the present invention, and Fig. 6 is a side view of the forming device according to the present invention. FIG. 2 is a perspective view of the electronic component after forming the lead wire. DESCRIPTION OF SYMBOLS 1... Electronic component, 3... Lead wire, 10... Base, 12... Fixed mold, 13... Insertion guide, 16
...Movable mold, 17...Cylinder.
Claims (1)
入穴を設けた第１の金型と、この第１の金型と対向して
配置され、駆動源に連結されて、前後進自在とした第２
の金型と、前記第１の金型の前記挿入穴の位置に載置さ
れ、上部が切断された゛円錐状をなして、この円錐面に
前記リード線の挿入溝を設けたガイドから成る電子部品
のリード線フォーミング装置。A base, a first mold fixed to the base and provided with an insertion hole for an electronic component glue wire, and placed opposite to the first mold, connected to a drive source, and movable back and forth. The second
and a guide which is placed in the position of the insertion hole of the first mold, has a conical shape with a cut off top, and has an insertion groove for the lead wire in the conical surface. Parts lead wire forming equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18368882U JPS5989573U (en) | 1982-12-06 | 1982-12-06 | Lead wire forming equipment for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18368882U JPS5989573U (en) | 1982-12-06 | 1982-12-06 | Lead wire forming equipment for electronic components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5989573U true JPS5989573U (en) | 1984-06-18 |
Family
ID=30397485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18368882U Pending JPS5989573U (en) | 1982-12-06 | 1982-12-06 | Lead wire forming equipment for electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5989573U (en) |
-
1982
- 1982-12-06 JP JP18368882U patent/JPS5989573U/en active Pending
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