JPS5983002U - Sealing structure of electronic components - Google Patents
Sealing structure of electronic componentsInfo
- Publication number
- JPS5983002U JPS5983002U JP17823182U JP17823182U JPS5983002U JP S5983002 U JPS5983002 U JP S5983002U JP 17823182 U JP17823182 U JP 17823182U JP 17823182 U JP17823182 U JP 17823182U JP S5983002 U JPS5983002 U JP S5983002U
- Authority
- JP
- Japan
- Prior art keywords
- sealing structure
- electronic components
- case
- abstract
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例に係る電子部品の封止構造を示す説明図
、第2区は本考案に係る電子部品の封止構造を示す説明
図、第3図a、 b及び第4.5図はケースの成形方
法を示す説明図である。
A(t、 l)・・・・・・動作部分、B1・・・・・
・ケース、B2・・・・・・埋込み樹脂。Fig. 1 is an explanatory diagram showing a sealing structure of an electronic component according to a conventional example, Section 2 is an explanatory diagram showing a sealing structure of an electronic component according to the present invention, Figs. 3a and b, and Figs. 4.5. FIG. 2 is an explanatory diagram showing a method of molding the case. A(t, l)...Moving part, B1...
・Case, B2...Embedded resin.
Claims (1)
配置し、そのケース内を樹脂注入で埋込み固着してなる
ことを特徴とする電子部品の封止構造。A sealing structure for an electronic component, characterized in that a working part is fitted into a case of a predetermined shape with one end open, and the inside of the case is embedded and fixed by injection of resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17823182U JPS5983002U (en) | 1982-11-25 | 1982-11-25 | Sealing structure of electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17823182U JPS5983002U (en) | 1982-11-25 | 1982-11-25 | Sealing structure of electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5983002U true JPS5983002U (en) | 1984-06-05 |
Family
ID=30387012
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17823182U Pending JPS5983002U (en) | 1982-11-25 | 1982-11-25 | Sealing structure of electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5983002U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016066729A (en) * | 2014-09-25 | 2016-04-28 | Necネットワークプロダクツ株式会社 | Packaging method of electronic components and electronic components |
-
1982
- 1982-11-25 JP JP17823182U patent/JPS5983002U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016066729A (en) * | 2014-09-25 | 2016-04-28 | Necネットワークプロダクツ株式会社 | Packaging method of electronic components and electronic components |
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