JPS5979547A - Sucker for minute part - Google Patents
Sucker for minute partInfo
- Publication number
- JPS5979547A JPS5979547A JP57191510A JP19151082A JPS5979547A JP S5979547 A JPS5979547 A JP S5979547A JP 57191510 A JP57191510 A JP 57191510A JP 19151082 A JP19151082 A JP 19151082A JP S5979547 A JPS5979547 A JP S5979547A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- negative pressure
- outer nozzle
- suction
- collar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
- Manipulator (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、微小部品、特にICチップ、コンデンサ等の
微小サイズの電子部品に用いるのに好適な微小部品設着
装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a microcomponent mounting apparatus suitable for use in microcomponents, particularly microsized electronic components such as IC chips and capacitors.
ICチップ等の゛電子部品は一般に基板上に多数配列さ
れ、所定の電子回路を形成するものであるが、このよう
な電子部品を基板上の所定の個所に位置決めする作業は
、作業の高速性、信頼性の向上及び費用の低減等の要求
から自動化が(1ト進されている。Generally, a large number of electronic components such as IC chips are arranged on a board to form a predetermined electronic circuit, but the work of positioning such electronic components at predetermined locations on the board requires high speed work. Automation is being promoted due to demands for improved reliability and reduced costs.
ところで、自動機においてこの種の部品を位置決めする
場合には、先ず当該部品を保持する必要があるが、微小
寸法の部品を保持する場合はいわゆるツメ式の保持(把
持)機構を用いることは困難であり、そのため真空吸着
方式が一般に利用されている。この場合において、吸着
装置側の吸着面は、相手部品の保持される面に対して適
合した適切な形状及び面積を有していなければ充分な吸
着力、即ち保持力を生ずることができないものである。By the way, when positioning this type of part in an automatic machine, it is first necessary to hold the part, but when holding parts with minute dimensions, it is difficult to use a so-called claw-type holding (gripping) mechanism. Therefore, the vacuum adsorption method is generally used. In this case, unless the suction surface of the suction device has an appropriate shape and area that matches the surface on which the mating part is held, it will not be possible to generate sufficient suction force, that is, holding force. be.
一方、電子回路を形成するICチップ、コンデンサ等は
部品毎に異なる物理的形状5寸法を有するのが常態であ
り、特に電子回路が高機能化すると、多種の部品が用い
られるためこの傾向が著しいものとなる。On the other hand, it is normal for IC chips, capacitors, etc. that form electronic circuits to have different physical shapes and dimensions for each component, and this tendency is particularly noticeable as electronic circuits become more sophisticated, as a wide variety of components are used. Become something.
以上のような事情から、従来のこの種の目的に用いる吸
着装置では、単一の吸着面形状ではカバーしきれない場
合は、対象となる部品の形状1寸法に応じてそれに適合
した吸着面を有する吸着装置を複数台用意し、これを位
置決めを為す所定の駆動軸系に連結された移動要素(以
下ヘッド部と称する)にまとめて装置するか、あるいは
各吸着装置どとに当該ヘッド部を設けて実用に供してい
た。Due to the above-mentioned circumstances, with conventional suction devices used for this type of purpose, if a single suction surface shape cannot cover the entire area, a suction surface that matches the shape and dimension of the target part can be created. Either prepare a plurality of suction devices and install them together on a moving element (hereinafter referred to as a head section) connected to a predetermined drive shaft system for positioning, or install the head section on each suction device. It was set up and put into practical use.
しかし、従来の装置によると前者の場合、ヘッド部の負
荷となる重量、特に慣性負荷が増加するため、この負荷
の増加が位置決め動作の畠速化に悪影竹を及ぼしていた
。また後者の場合には、駆動784Mがそれたり増加、
複雑化する等の不都合があった。また、このいずれの方
法によっても吸着装置が複数ある場合には、対象部品に
対して吸着装置の基準中心を位id決めする機構が吸着
装置dの数だけ必要となり、これは微小部品故に要求さ
れる位置決め精度が相対的に制くすることにも関連して
安価なNUを提供することが困難となる原因とtJっで
いた。However, according to conventional devices, in the former case, the weight acting as a load on the head section, especially the inertial load, increases, and this increase in load has a negative effect on increasing the positioning speed. In the latter case, the drive 784M may deviate or increase,
There were inconveniences such as complication. In addition, if there are multiple suction devices using either of these methods, a mechanism for positioning the reference center of the suction device with respect to the target part will be required for the number of suction devices d, which is required because the parts are small. This is also related to the relatively limited positioning accuracy, which makes it difficult to provide inexpensive NUs.
本発明は斯る事情に鏝みてなされたものであり、即ち微
小部品設着装置〆における部品吸着部分を、共通の部品
吸着用真空吸引経路を有する同軸上に配設された内ノズ
ルと外ノズルとによって構成し、内ノズルを外ノズル内
側で軸方向に摺動用11しにして、内ノズルを利用する
場合には内ノズル上端面に所定の圧力をかけて内ノズル
を突出させると共に一定の緩衝伎能を具備せしめる一方
、外ノズルを利用する場合には逆に内ノズル上端面を真
空吸引して内ノズルを外ノズルの内側上方に格納するも
のとし、これらによって装置の軽量化と位置決め礪4付
の簡易化とを図りつつ、対象部品の形状。The present invention has been made in view of the above circumstances, and specifically, the component suction portion of the micro component mounting device is constructed using an inner nozzle and an outer nozzle that are coaxially arranged and have a common vacuum suction path for component suction. The inner nozzle is made to slide in the axial direction inside the outer nozzle, and when the inner nozzle is used, a predetermined pressure is applied to the upper end surface of the inner nozzle to cause the inner nozzle to protrude, and a certain amount of buffering is applied. On the other hand, when using the outer nozzle, the upper end surface of the inner nozzle is vacuum-suctioned and the inner nozzle is housed above the outer nozzle, thereby reducing the weight of the device and positioning. While trying to simplify the attachment, the shape of the target part.
寸法の相違に対して広い範囲で対処しつる微小部品吸呑
装置を提供リーることを目的とするものである。It is an object of the present invention to provide a suction device for minute parts that can deal with a wide range of differences in size.
以下、本発明の実施例を図に基ついて詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
第1図は、この発明の一実施例である微小部品吸A’l
’A直及び周辺装置を含めた説明図である。図におい
て、(1)は微小部品吸々装置をホし、説明の都合」二
その主要部を断面して内部構造によって表わしている。FIG. 1 shows a micro parts suction A'l which is an embodiment of the present invention.
' It is an explanatory diagram including the A direct and peripheral devices. In the figure, (1) shows a micro-component suction device, and for the sake of explanation, its main part is shown in cross section to show its internal structure.
(2)は吸着保持の対象である微小部品(以下単に部品
という)である。(3)及び(4)は夫々内ノズル、外
ノズルであって、その先端部のノズルチップ部(3a)
、 (4a)の形状1寸法は部品の形、ノズルチップ
部(3a)に接合され、上端は摺動枠(6)によってそ
の開口部が完全に閉基されている。(2) is a microcomponent (hereinafter simply referred to as a component) that is the target of suction and holding. (3) and (4) are an inner nozzle and an outer nozzle, respectively, and the nozzle tip portion (3a) at the tip thereof.
The shape 1 dimension of (4a) is the shape of the part, and is joined to the nozzle tip part (3a), and the opening at the upper end is completely closed by the sliding frame (6).
また中空S ’tj4’ (5)の中途側部には負圧2
rt入管(7)が中空導管(5)の中空部に開口して取
付けられ、さらに中空導管(5)の中途外周部にはカラ
ー(8)が固着されている。また(9)はバネ座であり
、該バネ威(9)はノマネ(10)によって前記外ノズ
ル(4)の」二端面に押当てられており、該バネ(10
)は外ノズル(4)の軸方向上方への運動を規制するよ
うになっている。(11)は圧力室形成孔であって、前
記摺動枠(6)と摺動可能に嵌合すると共に、その側方
には圧力47人管(121が接続されている。ここで(
13)はハウジングであり、RiJ記圧力室形成孔(1
1)を形成rると共に圧力尋人性’ f12)を保持す
る一方、外ノズル(4)の外周面を(A動向としてこれ
と嵌合し、また負圧等入管(7)の上下方向移動を妨げ
ぬよう切欠部u4)を有して成るものである。In addition, negative pressure 2 is applied to the midway side of the hollow S 'tj4' (5).
An rt entry pipe (7) is attached to the hollow conduit (5) by opening into the hollow part thereof, and a collar (8) is fixed to the midway outer circumference of the hollow conduit (5). Further, (9) is a spring seat, and the spring force (9) is pressed against the two end surfaces of the outer nozzle (4) by a countermane (10).
) is adapted to restrict the upward movement of the outer nozzle (4) in the axial direction. (11) is a pressure chamber forming hole, which is slidably fitted into the sliding frame (6), and a pressure pipe (121) is connected to the side thereof.Here, (
13) is a housing, and RiJ pressure chamber forming hole (1
While forming 1) and maintaining the pressure level 12), fit the outer circumferential surface of the outer nozzle (4) with it as (A movement), and also prevent vertical movement of the inlet pipe (7) such as negative pressure. It has a notch U4) so as not to interfere with the operation.
ど−のように構成された微小部品吸看歿ul Lllは
、前述したヘッド部(I5)に取付けられ、当該ヘッド
部(15)を駆動装置(図示せず)によって移動せしめ
ることによって、微小部品吸着A置(1)は位両決めさ
れることとなる。一般には、ヘッド部(15)を図示直
交するXYZ方向へ移動することを要する。ここにおい
て、部品(2)の方向性が問題になる場合は、微小H1
≦品吸着装置(1)の上部端を回転軸(1G)として、
これをヘッド部(15)が軸支する構成とすれは、図示
するθ方向に部品吸将装置(1)を回転運動することに
よって対処することができるものである。The micro-component suction/monitoring device configured in this way is attached to the aforementioned head portion (I5), and is moved by a drive device (not shown) to remove the micro-components. The suction A position (1) will be positioned. Generally, it is necessary to move the head section (15) in the XYZ directions orthogonal to the drawing. Here, if the directionality of component (2) is a problem, the minute H1
≦With the upper end of the product suction device (1) as the rotation axis (1G),
If the head part (15) is configured to pivotally support this, this problem can be handled by rotating the parts suction device (1) in the θ direction shown in the figure.
次に、本発明に付随する空圧系について説明すれば、先
ず負圧導入管(7)は、パイプあるいはチューブなどを
用いて形成された連通管(1ηに接続され、当該連通管
(17)は電磁弁(18)の−のポートに接続され、こ
れにより該連通管dηは通常の状態(無励磁)では排気
口i1!])に、励磁状態では真空発生器t20+に各
々至るようになっている。一方、前記圧力導入管02は
連通管(17)′によって先ず流量調節弁t211に接
続され、そののち゛硫磁弁+22)の−のポートに接続
されている。Next, to explain the pneumatic system associated with the present invention, first, the negative pressure introduction pipe (7) is connected to the communication pipe (1η) formed using a pipe or tube, and the communication pipe (17) is connected to the communication pipe (1η) formed using a pipe or tube. is connected to the negative port of the solenoid valve (18), so that the communication pipe dη is connected to the exhaust port i1!] in the normal state (not energized) and to the vacuum generator t20+ in the energized state. ing. On the other hand, the pressure introduction pipe 02 is first connected to the flow control valve t211 through a communication pipe (17)', and then to the - port of the sulfur valve +22).
この電磁弁(22)のポートの接続状態は、無励磁状態
では圧力発生器(23)に、励磁状態では前記真空発生
器(20)に上記連通管(17)が至るようになってい
る。The connection state of the port of this solenoid valve (22) is such that the communication pipe (17) leads to the pressure generator (23) in the non-energized state, and to the vacuum generator (20) in the energized state.
第2図(a)(b)は、上記実施例の微小部品吸着装置
(1)のより詳しい内部(再造を示r tJ FJi面
図及びそのC−C線描断面図である。図において、ハウ
ジング(13)は組立等の都合上、下部ハウジング(1
3a)と上部ハウジング(13b) &に分けられてい
る。また中空等管(5)は、外ノズル(4)の内聞に商
合し、かつ軸方向に摺動自在となっている。また他の構
成は第1図と同様である。FIGS. 2(a) and 2(b) are a more detailed internal (reconstruction) side view and a cross-sectional view drawn along the line C-C of the micro-component suction device (1) of the above embodiment. (13) is the lower housing (1) for convenience of assembly etc.
3a) and an upper housing (13b) &. Further, the hollow tube (5) is fitted into the inner wall of the outer nozzle (4) and is slidable in the axial direction. The other configurations are the same as in FIG. 1.
次に、以上のように構成した微小部品吸着′!Ahlの
動作を以下に説明する。Next, the micro parts suction configured as above! The operation of Ahl will be explained below.
先ず、比較的小なる部品(2a)を吸着保持する場合を
想定する。この場合には第2図に示す矢印P1の方向に
圧力導入管(12)を通じて圧力室(lla)に圧力P
1の空気が加えられる。斯る空気比P1は、第1図に示
した圧力発生器(23)によって供綺されるものであり
、(fit励磁状態の電磁弁122)及び流量調節弁(
2])を介してもたらさ、れる。この結果、圧力室形成
孔(1旧°こ嵌合す′る摺動粉(6)は空気圧1゛1の
作用によって下方へ摺動し、これにより該摺動粉(6)
と−イ本番こ構成されている中空導管(5)、ノズルチ
・ンプ部(3a)。First, assume that a relatively small component (2a) is to be held by suction. In this case, pressure P is introduced into the pressure chamber (lla) through the pressure introduction pipe (12) in the direction of arrow P1 shown in FIG.
1 air is added. Such air ratio P1 is provided by the pressure generator (23) shown in FIG.
2]). As a result, the sliding powder (6) that fits into the pressure chamber forming hole (1) slides downward under the action of the air pressure 1.
A hollow conduit (5) and a nozzle tip part (3a) that are actually constructed.
負圧導入管(7)及びカラー(8)も押し下げらオt、
カラー(8)が外ノズル(4)の内側面役付部に当ると
イ亭止し、吸着可能/、(状態となる。然る後、前記へ
・ノド部151が移動して、微小部品吸看装置(1)に
おけるビ」ノズル(3)のノズルチップ部(3a)が部
品(2a)近傍の所定の位置まで接近する。ここで、部
品(2a)の形状r ’A Itr及び真空吸着力等に
もよるh(、部品(2a)を確実に保持する必要上、一
般(こ(ま内ノズル(3)のノズルチ・ンプ部(3a)
先端と部品(2λ)とがわずかに接触した状態で俺止す
ることカ(望ましい。しかし、接触時に何んらの緩衝作
用もf:Ir)とすれは、部品(2a)の損傷を来たす
虞れbiあり、このことは微小部品を取扱う場合には特
に留意しなければlSらない点である。本実用例(こお
し)で(ま、I′i11記圧力室(lla)の空気圧P
、が損傷を有効ζこ防止する。即ち、これらが空気バネ
の機能を果たす力)らである。従って、この空気/<不
としての緩衝力を調整したい場合には、第1図に示した
流量調節弁+21)を調整することによって容易に行な
いつるものである。但し、流量調節弁(21)は本発明
の構成上必要不可欠なものではなく、部品によっては、
圧力発生器03)の圧力をそのまま利用しても不都合を
生じない。Negative pressure introduction pipe (7) and collar (8) are also pushed down,
When the collar (8) hits the inner surface working part of the outer nozzle (4), it stops and the suction becomes possible. After that, the nozzle part 151 moves to the above position and the small parts are sucked. The nozzle tip (3a) of the nozzle (3) in the monitoring device (1) approaches a predetermined position near the component (2a). Due to the need to securely hold the part (2a), the nozzle tip part (3a) of the inner nozzle (3)
It is desirable to stop the tip and the component (2λ) in a state where they are in slight contact (this is desirable, but if there is no cushioning effect f:Ir) at the time of contact, there is a risk of damage to the component (2a). This is a point that must be paid special attention to when handling minute parts. In this practical example, the air pressure P of the pressure chamber (lla) in I'i11 is
, effectively prevents damage. That is, these are the forces that perform the function of an air spring. Therefore, if it is desired to adjust the buffering force between air and air, this can be easily done by adjusting the flow rate control valve +21) shown in FIG. However, the flow rate control valve (21) is not essential to the structure of the present invention, and depending on the parts,
There is no problem even if the pressure from the pressure generator 03) is used as it is.
次に、吸着動作を行l工うときには、第1図における屯
イ誠弁(j8)に励(cA電圧EV+が加えられる。こ
れは一般には外部シーケンス制御′AM(図示せず)に
よってもたらされるものである。電磁弁(18)が励磁
されると、その作用によって負圧導入管(7)と真空発
生数置(填が連通状態となり、微小部品吸着装置’f
(11の中空導管(5)内ではiJ 2図に示す矢印P
2の方向に吸引負圧P2が発生する。即ち中空導管(5
)は摺動粉(6)によってその上端を完全に閉塞されて
いるため、ノズルチップ部(3a)、中空導管(5)、
及び負圧導入管(7)の内部が真空状態となり、閂ノズ
ル(3)のノズルチップ部(3a)先端面に接触してい
る部品(2a)はノズルチップ部(3a)の先端面に吸
着、即ち保持されることとなる。Next, when carrying out the suction operation, an excitation (cA voltage EV+) is applied to the control valve (j8) in FIG. 1. This is generally provided by an external sequence control 'AM (not shown). When the solenoid valve (18) is excited, its action brings the negative pressure introduction pipe (7) into communication with the vacuum generating position, and the micro parts suction device'f
(Inside the hollow conduit (5) of 11, iJ
A suction negative pressure P2 is generated in the direction No.2. That is, the hollow conduit (5
) has its upper end completely blocked by the sliding powder (6), so the nozzle tip (3a), the hollow conduit (5),
The inside of the negative pressure introduction pipe (7) becomes a vacuum state, and the part (2a) that is in contact with the tip surface of the nozzle tip portion (3a) of the bar nozzle (3) is attracted to the tip surface of the nozzle tip portion (3a). , that is, it will be retained.
次にこの吸゛着状態を維持してへ・ノド部(15)を再
び移動し、所定の位置、例えば基板上の部品配設位置で
第1図に示す電磁弁叩を無励磁状態にすれば、自iI記
の真空状態が開放され部品(2a)の位置決めプレース
作業が完了することとなる。Next, while maintaining this suction state, move the head throat section (15) again, and place the solenoid valve tap shown in Figure 1 in a non-energized state at a predetermined position, for example, a component placement position on the board. For example, the vacuum state described in section ii is released, and the positioning and placing work of the part (2a) is completed.
次に第3図に基づき比較的大なる部品(2b)を吸着保
持づ−る場合について説明する。第3図は、第2図に示
した微小部品吸着装置(1)の縦断面図であり、部品(
2b)を外ノズル(4)で吸着保持する場合を示してい
る。この場合は、内ノズル(3)を外ノズル(4)の内
側」上方に格納することによって吸着保持を行なうもの
である。即ち、図示矢印11+の方向に圧力尋人管(1
りを通じて圧力室(111)を真空吸引ずれは、押し下
げられていた摺動枠(6)は圧力室(lla)内が真空
状態になるため上方へ移動し、この時中空導管(5)、
ノズルチップ部(3a) 、負圧導入管(7)及びカラ
ー(8)も一体となって上方へ引き上げられ、これらは
カラー(8)がバネ座(9)に当ると停止する。11り
記真空吸引に係る吸引圧力P1は、第1図における電磁
弁(221に、励磁′電圧EV2を印加して゛1ホ磁弁
(2りのボートの接続を圧力発生器(23)側から真空
発生器(20)側へ変換することによってもたらされる
ものである。また励磁電圧EV2は外部シーケンス装置
(図示せず)より供給rるのが通常である。Next, referring to FIG. 3, a case will be described in which a relatively large component (2b) is held by suction. FIG. 3 is a longitudinal cross-sectional view of the micro component suction device (1) shown in FIG.
2b) is sucked and held by the outer nozzle (4). In this case, suction and holding is performed by storing the inner nozzle (3) above the outer nozzle (4). That is, the pressure gauge tube (1
The sliding frame (6), which had been pushed down, moves upward as the inside of the pressure chamber (lla) becomes a vacuum state, and at this time, the hollow conduit (5),
The nozzle tip portion (3a), the negative pressure introduction pipe (7), and the collar (8) are also pulled upward together, and they stop when the collar (8) hits the spring seat (9). The suction pressure P1 related to the vacuum suction described in item 11 is determined by applying the excitation voltage EV2 to the solenoid valve (221) in FIG. The excitation voltage EV2 is generated by converting it to the vacuum generator (20) side.Also, the excitation voltage EV2 is usually supplied from an external sequence device (not shown).
ここで、流ft gla1節弁(2I)の戻り側は方向
1も10世弁の非制御側としておけは、前記空気圧PI
の調節時の影響を受けることなく吸引動作を円滑に行な
うのに便利である。Here, if the return side of the flow ft gla1 control valve (2I) is set in direction 1 as the non-control side of the 10th valve, the air pressure PI
This is convenient for performing the suction operation smoothly without being affected by the adjustment.
これらの動作を経て、内ノズル(3)の先端部は外ノズ
ル(4)の先端部より内側上方に引き上げられ、部品(
2b)を外ノズル(4)によって吸引保持することが可
能となる。この部品(2b)の吸着動作等は、11J述
した第2図に示す部品(2a)を吸着する場合と全く同
様である。この場合、吸引圧力P2の空気の空気゛流路
は、ノズルチップ部(3a)のノズル口を経て中空導管
(5)、負圧専入官(7)に至るものである。Through these operations, the tip of the inner nozzle (3) is pulled upward and inward than the tip of the outer nozzle (4), and the part (
2b) can be sucked and held by the outer nozzle (4). The suction operation etc. of this component (2b) are exactly the same as the case of suctioning the component (2a) shown in FIG. 2 described in 11J. In this case, the air flow path of the air having the suction pressure P2 passes through the nozzle opening of the nozzle tip portion (3a), and reaches the hollow conduit (5) and the negative pressure specialist (7).
尚、外ノズル(4)の上部端面は、バネ叱(9)を介し
てバネ1ltl)による弾性力を受けており、これは外
ノズル14)と部品(2b)との接触時における部品(
2b)の損傷を避けるための緩衝作用を果たすものであ
る。この場合一般に外ノズル(4)で吸着する部品は、
内ノズル(3)で吸着する部品よりも大型であるため、
図示のように圧縮コイルバネ等を利用すれば足り、かつ
バネ力を調整する必要はさほど生じない。Note that the upper end surface of the outer nozzle (4) is subjected to an elastic force by a spring 1ltl) via a spring force (9), and this is due to the elastic force of the part (2b) when the outer nozzle 14) and the part (2b) come into contact with each other.
2b) It serves as a buffer to avoid damage. In this case, the parts that are generally picked up by the outer nozzle (4) are:
Because it is larger than the part picked up by the inner nozzle (3),
As shown in the figure, it is sufficient to use a compression coil spring or the like, and there is no need to adjust the spring force.
第4図(a) fb)は、本発明の他の実施例に係る微
小部品吸着装置動ltの縦断面図及びそのC−C線描断
面図である。前述の実施例においては吸着時の部品の方
向外については問題にしなかった。しかし、電子部品、
例えばICチップは、その接続端子の配列等の1!11
由から吸着時に部品の方向をMii保する必要イごLが
生ずる。そこで、予め所定の検出f4 伯によって部品
の訳かれている方向を検出した後、微小部品吸、?′f
装置の方向と部品の方向に関する相対関係を1・δに一
定に1♀っで吸着するようにしており、これは、基板上
への部品のプレース時において、部品が斜めに取付りら
れることによって生ずる短絡を防ぐためである。FIGS. 4(a) and 4(fb) are a longitudinal cross-sectional view and a cross-sectional view taken along the line C--C of a micro-component suction device lt according to another embodiment of the present invention. In the above-mentioned embodiments, there was no problem with the direction of the component being picked up. However, electronic components,
For example, an IC chip has a 1!11 arrangement of connection terminals, etc.
For this reason, it is necessary to maintain the direction of the component during suction. Therefore, after detecting in advance the direction in which the part is translated by a predetermined detection f4, the direction in which the part is translated is detected. 'f
The relative relationship between the direction of the device and the direction of the parts is fixed at 1♀. This is to prevent a short circuit from occurring.
このためには、第4図(a) (b)に示すように、負
圧導入管(7)の外周部と切欠部(1滲の側面との間に
案内体・圓を設けて、中空導管(5)の軸回りの回転運
動を阻止する構成とするのが有効である。即ち、このよ
うに構成rるのは中空導管(5)は、部品吸着時に軸方
向上方へ若干の摺動を伴うから、部品の方向性を保つた
めには、その軸回りの回転運動を規制「る必要があるか
らである。尚、4=n体i24+は、例えはころがり軸
受を利用するものとし、これを負圧導入セ(7)に保持
せしめてころがり軸受の外輪が切欠部(14)の側面上
を転動するように戊成すれは、簡易かつ高精度の案内運
動を実現することができる。For this purpose, as shown in FIGS. 4(a) and 4(b), a guide body/circle is provided between the outer periphery of the negative pressure introduction pipe (7) and the side surface of the notch (1), and a hollow It is effective to adopt a configuration that prevents rotational movement of the conduit (5) around the axis.In other words, this configuration prevents the hollow conduit (5) from sliding slightly upward in the axial direction when picking up parts. This is because, in order to maintain the directionality of the component, it is necessary to restrict the rotational movement around the axis.Assume that the 4=n body i24+ uses a rolling bearing, for example. By holding this in the negative pressure introduction chamber (7) and forming it so that the outer ring of the rolling bearing rolls on the side surface of the notch (14), a simple and highly accurate guiding movement can be realized. .
尚、上述の説明において141図〜第4図に示す内ノズ
ル(3)及び外ノズル(4)の下端面は単なる平面とし
たが、対象部品が曲面形状を有する場合(例えば抵抗器
)には、これに対応してノズル先端面を曲面としても何
ら本発明の妨げとはならない。In the above explanation, the lower end surfaces of the inner nozzle (3) and outer nozzle (4) shown in FIGS. Correspondingly, even if the nozzle tip surface is made into a curved surface, this does not impede the present invention in any way.
以上のように、本発明に係る微小部品吸着装置によれば
、ハウジングに外ノズルを所tt k piir上下動
可能に挿入し、該外ノズルを付勢部祠により上記ハウジ
・ングの丁端から突出ぜしめ、上記外ノズルに内ノズル
を所定距離上下動可能に挿入し、該内ノズルの上方の圧
力室に圧力導入管により正圧又は負圧を導入して上記内
ノズルを外ノズル下端面から突出又は没入せしめ、上記
内ノズルに負圧尋人管により負圧を3!φ人して該門ノ
ズルをして微小部品を吸着せしめるようにしたので、下
記のようI’:j 1iti著な効果を得ることができ
る。即ぢ、(イ) 部品の形状9寸法の相違に対して広
い範囲で対処でき、かつ凋精度な吸着保持が可能なrk
小部品吸看装置を提供できる。As described above, according to the micro component suction device according to the present invention, the outer nozzle is inserted into the housing so as to be able to move up and down at a predetermined distance, and the outer nozzle is moved from the opposite end of the housing by the biasing part. An inner nozzle is inserted into the outer nozzle so as to be able to move up and down a predetermined distance, and positive pressure or negative pressure is introduced into the pressure chamber above the inner nozzle through a pressure introduction pipe, so that the inner nozzle is connected to the lower end surface of the outer nozzle. Protrude or retract from the inner nozzle, and apply negative pressure to the inner nozzle using a negative pressure pipe. Since the gate nozzle is used to attract minute parts, the following remarkable effects can be obtained. (a) rk that can deal with a wide range of differences in the shape and dimensions of parts and that can hold the parts with precision suction.
We can provide small parts suction devices.
(ロ) 部品の損傷を有効に防止できる。(b) Damage to parts can be effectively prevented.
(ハ) 同軸上にある同ノズル、外ノズルによって吸着
するから、位置決め機構を簡易化できる。(c) The positioning mechanism can be simplified because the same nozzle and outer nozzle located on the same axis perform adsorption.
に) 装置dの軽は化、小型化がV利れる。2) It is advantageous to make the device d lighter and smaller.
09 制御要素を主に空気圧とするから、全体として安
価で堅牢な装置を提供できる。09 Since the control element is mainly pneumatic, it is possible to provide an inexpensive and robust device as a whole.
第1図は、本発明の一実施例による微小部品吸4装置に
ついで周辺装置を含めた概略、構成図、第2図(a)
(b)は、本発明の一実施例における微小部品吸岩装置
dの縦1面図、及びそのC−C線描断面図、第3図は上
記実〃旧例j直における内ノズル格納時を示した縦断面
1図、第4図(a)(b)は本発明の他の実施[ノリに
おりるわf igr面図、及びぞのC−C線描断面図で
あoo
(1)・・・微小部品吸首装置、t2+ (2a) (
2b)・・・微小部品、(3)・・・内ノズル、(4)
・・・外ノズル、(7)・・・負圧尋人管、(11)・
・・圧力室形成孔、(lla)・・・圧力室、(1訃・
・圧力偉人ti・、t13)・・・ハウジング、f14
+・・・切欠部、(24)・・・案内体。
尚図中同−杓号は同−又は相当部分をボ′4゜代理人
葛 野 イ■ −第1図
第2図
(b)
第3図
第4図
(b)
1ノ。FIG. 1 is a schematic and configuration diagram of a micro parts suction device according to an embodiment of the present invention, including peripheral devices, and FIG. 2(a)
(b) is a longitudinal side view of the micro-component rock sucking device d in an embodiment of the present invention, and a sectional view thereof drawn along the line C-C, and FIG. 3 shows the inner nozzle retracted in the above-mentioned old example Figures 1 and 4 (a) and 4 (b) are longitudinal cross-sectional views showing other embodiments of the present invention.・Minute parts neck suction device, t2+ (2a) (
2b)...Minute parts, (3)...Inner nozzle, (4)
・・・Outer nozzle, (7) ・・・Negative pressure pipe, (11)・
...Pressure chamber formation hole, (lla)...Pressure chamber, (1.
・Pressure great man ti・, t13)...Housing, f14
+... Notch, (24)... Guide body. In addition, the same name in the figure is the same or the equivalent part is represented by Bo'4゜ agent.
Kuzuno I - Figure 1 Figure 2 (b) Figure 3 Figure 4 (b) 1.
Claims (2)
る微小部品吸着装置において、外ノズル摺動孔とこれに
続く圧力室形成孔とを有するハウジングと、内ノズル摺
動孔を有し上記ハウジングの外ノズル摺動孔内に所定距
離上下動可能に挿入された外ノズルと、核外ノズルを下
方に付勢し核外ノズルの下端面を上記ハウジングの下端
面から突出せしめる付勢部拐と、上記外ノズルの内ノズ
ル摺動孔内に所定距離上下動可能に挿入され上端が閉塞
された内ノズルと、該内ノズルの上部で上記圧力室形成
孔により形成された圧力室に正圧又は負圧を導入して」
二記内ノズルを上記外ノズル下端面から突出又は没入さ
せる圧力導入雀と、上記ハウジング及び外ノズルに形成
された切欠部を通って上記内ノズル内に負圧を導入して
上記内ノズルをして微小部品を吸着せしめる負圧導入管
とを備えたことを特徴とする微小部品吸着装置。(1) Vacuum suction means holds micro parts by suction.
A micro parts suction device includes a housing having an outer nozzle sliding hole and a pressure chamber forming hole following the outer nozzle sliding hole, and an inner nozzle sliding hole that can be moved up and down a predetermined distance into the outer nozzle sliding hole of the housing. The inserted outer nozzle, a biasing part that urges the outer nozzle downward and causes the lower end surface of the outer nozzle to protrude from the lower end surface of the housing, and the outer nozzle is inserted a predetermined distance into the inner nozzle sliding hole. Introducing positive or negative pressure into a pressure chamber formed by an inner nozzle that is inserted so as to be able to move up and down and whose upper end is closed, and the pressure chamber forming hole above the inner nozzle.
(ii) a pressure introducing sparrow for causing the inner nozzle to protrude or retract from the lower end surface of the outer nozzle; and a pressure introduction sparrow for introducing negative pressure into the inner nozzle through a notch formed in the housing and the outer nozzle; What is claimed is: 1. A micro component suction device comprising: a negative pressure introduction pipe for sucking micro components;
ングの切欠部との間に介挿され該切欠部に沿って上記負
圧導入管を摺動案内する案内体を備えていることを特徴
とする特許請求の範囲第1項記載の微小部品吸着装置。(2) The negative pressure introduction pipe includes a guide body that is inserted between the negative pressure introduction pipe and the notch of the nozzle and slides and guides the negative pressure introduction pipe along the notch. A micro component suction device according to claim 1, characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57191510A JPS5979547A (en) | 1982-10-28 | 1982-10-28 | Sucker for minute part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57191510A JPS5979547A (en) | 1982-10-28 | 1982-10-28 | Sucker for minute part |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5979547A true JPS5979547A (en) | 1984-05-08 |
JPS635900B2 JPS635900B2 (en) | 1988-02-05 |
Family
ID=16275849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57191510A Granted JPS5979547A (en) | 1982-10-28 | 1982-10-28 | Sucker for minute part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5979547A (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61112830U (en) * | 1984-12-26 | 1986-07-17 | ||
JPS61199697A (en) * | 1985-03-01 | 1986-09-04 | 日本電気株式会社 | Chip part carrying machine |
JPS61267656A (en) * | 1985-05-20 | 1986-11-27 | Matsushita Electric Ind Co Ltd | Pushing up and absorbing device for electron parts |
JPS6215891A (en) * | 1985-07-12 | 1987-01-24 | 松下電器産業株式会社 | Electronic component shifter |
JPS63107544U (en) * | 1986-12-27 | 1988-07-11 | ||
JPH01246899A (en) * | 1988-03-29 | 1989-10-02 | Toshiba Corp | Component mounting device |
JPH0627067U (en) * | 1992-09-05 | 1994-04-12 | 九州コマツ電子株式会社 | Vacuum chuck |
WO2009056468A1 (en) * | 2007-10-31 | 2009-05-07 | Oerlikon Assembly Equipment Ag, Steinhausen | Pick-up tool and method for grasping and mounting small dies |
CN103872191A (en) * | 2014-02-26 | 2014-06-18 | 九江嘉远科技有限公司 | LED (light-emitting diode) series SMT (surface-mount technology) suction nozzle and manufacturing process thereof |
WO2016001720A1 (en) * | 2014-07-03 | 2016-01-07 | Daems Giovanni Bvba | Handling device for picking up a stone from a holder and for setting this stone in a workpiece |
CN110733892A (en) * | 2015-12-01 | 2020-01-31 | 耐克创新有限合伙公司 | Manufactured pick-up tool |
-
1982
- 1982-10-28 JP JP57191510A patent/JPS5979547A/en active Granted
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61112830U (en) * | 1984-12-26 | 1986-07-17 | ||
JPH0417306Y2 (en) * | 1984-12-26 | 1992-04-17 | ||
JPS61199697A (en) * | 1985-03-01 | 1986-09-04 | 日本電気株式会社 | Chip part carrying machine |
JPS61267656A (en) * | 1985-05-20 | 1986-11-27 | Matsushita Electric Ind Co Ltd | Pushing up and absorbing device for electron parts |
JPS6215891A (en) * | 1985-07-12 | 1987-01-24 | 松下電器産業株式会社 | Electronic component shifter |
JPS63107544U (en) * | 1986-12-27 | 1988-07-11 | ||
JPH01246899A (en) * | 1988-03-29 | 1989-10-02 | Toshiba Corp | Component mounting device |
JPH0627067U (en) * | 1992-09-05 | 1994-04-12 | 九州コマツ電子株式会社 | Vacuum chuck |
WO2009056468A1 (en) * | 2007-10-31 | 2009-05-07 | Oerlikon Assembly Equipment Ag, Steinhausen | Pick-up tool and method for grasping and mounting small dies |
CN103872191A (en) * | 2014-02-26 | 2014-06-18 | 九江嘉远科技有限公司 | LED (light-emitting diode) series SMT (surface-mount technology) suction nozzle and manufacturing process thereof |
CN103872191B (en) * | 2014-02-26 | 2017-04-05 | 九江嘉远科技有限公司 | A kind of manufacture method of LED series SMT suction nozzles |
WO2016001720A1 (en) * | 2014-07-03 | 2016-01-07 | Daems Giovanni Bvba | Handling device for picking up a stone from a holder and for setting this stone in a workpiece |
CN110733892A (en) * | 2015-12-01 | 2020-01-31 | 耐克创新有限合伙公司 | Manufactured pick-up tool |
US11078033B2 (en) | 2015-12-01 | 2021-08-03 | Nike, Inc. | Manufacturing pickup tool |
CN110733892B (en) * | 2015-12-01 | 2021-09-03 | 耐克创新有限合伙公司 | Manufactured pick-up tool |
US11884496B2 (en) | 2015-12-01 | 2024-01-30 | Nike, Inc. | Manufacturing pickup tool |
Also Published As
Publication number | Publication date |
---|---|
JPS635900B2 (en) | 1988-02-05 |
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