JPS5976687U - precast gutter - Google Patents
precast gutterInfo
- Publication number
- JPS5976687U JPS5976687U JP17288282U JP17288282U JPS5976687U JP S5976687 U JPS5976687 U JP S5976687U JP 17288282 U JP17288282 U JP 17288282U JP 17288282 U JP17288282 U JP 17288282U JP S5976687 U JPS5976687 U JP S5976687U
- Authority
- JP
- Japan
- Prior art keywords
- side wall
- stepped surface
- gutter
- stepped
- precast
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Sewage (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の一実施例に係るプレキャスト側溝の部
分切欠正面図、第2図は該側溝に装着した金属板の斜視
図である。第3図、第4図及び第5図は、本考案のそれ
ぞれ別の実施例に係るプレキャスト側溝の要部縦断正面
図である。
1・・・側壁部、2・・・側壁部の上端面、3・・・段
面、4・・・立上り面、5・・・内側面上部、6・・・
金属板、7・・・溝蓋。、FIG. 1 is a partially cutaway front view of a precast gutter according to an embodiment of the present invention, and FIG. 2 is a perspective view of a metal plate attached to the gutter. 3, 4, and 5 are longitudinal sectional front views of main parts of precast gutters according to different embodiments of the present invention. DESCRIPTION OF SYMBOLS 1... Side wall part, 2... Upper end surface of side wall part, 3... Step surface, 4... Rising surface, 5... Upper part of inner surface, 6...
Metal plate, 7... groove lid. ,
Claims (1)
段面3を設け、該段面3と、段面3及び上端面2間の立
上り面4と、段面3に会合する側壁部1の内側面上部5
と、前記側壁部上端面2との囲者を、側壁部1に一体的
に接合した金属板6によって被覆し、左右の金属板6.
6の立上り面被覆部分5a、$a間に溝蓋7を嵌入れ、
左右金属板6.6の段面被覆部分6b、6b上に前記溝
蓋7を載置するようにしたプレキャスト側溝。A stepped surface 3 depressed from the upper end surface 2 is provided inside the upper part of the left and right side wall parts 1, and the stepped surface 3, a rising surface 4 between the stepped surface 3 and the upper end surface 2, and a side wall that meets the stepped surface 3. Upper inner surface of section 1 5
and the upper end surface 2 of the side wall portion are covered by a metal plate 6 integrally joined to the side wall portion 1, and the left and right metal plates 6.
Insert the groove cover 7 between the rising surface covering portion 5a and $a of 6,
A precast side gutter in which the gutter cover 7 is placed on the stepped surface covering portions 6b, 6b of the left and right metal plates 6.6.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17288282U JPS5976687U (en) | 1982-11-17 | 1982-11-17 | precast gutter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17288282U JPS5976687U (en) | 1982-11-17 | 1982-11-17 | precast gutter |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5976687U true JPS5976687U (en) | 1984-05-24 |
Family
ID=30376742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17288282U Pending JPS5976687U (en) | 1982-11-17 | 1982-11-17 | precast gutter |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5976687U (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8927900B2 (en) | 2000-09-13 | 2015-01-06 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |
US9142458B2 (en) | 2002-03-12 | 2015-09-22 | Hamamatsu Photonics K.K. | Substrate dividing method |
-
1982
- 1982-11-17 JP JP17288282U patent/JPS5976687U/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8927900B2 (en) | 2000-09-13 | 2015-01-06 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device |
US8933369B2 (en) | 2000-09-13 | 2015-01-13 | Hamamatsu Photonics K.K. | Method of cutting a substrate and method of manufacturing a semiconductor device |
US8946589B2 (en) | 2000-09-13 | 2015-02-03 | Hamamatsu Photonics K.K. | Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device |
US8969761B2 (en) | 2000-09-13 | 2015-03-03 | Hamamatsu Photonics K.K. | Method of cutting a wafer-like object and semiconductor chip |
US9142458B2 (en) | 2002-03-12 | 2015-09-22 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9287177B2 (en) | 2002-03-12 | 2016-03-15 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9543207B2 (en) | 2002-03-12 | 2017-01-10 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9543256B2 (en) | 2002-03-12 | 2017-01-10 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9548246B2 (en) | 2002-03-12 | 2017-01-17 | Hamamatsu Photonics K.K. | Substrate dividing method |
US9553023B2 (en) | 2002-03-12 | 2017-01-24 | Hamamatsu Photonics K.K. | Substrate dividing method |
US8969752B2 (en) | 2003-03-12 | 2015-03-03 | Hamamatsu Photonics K.K. | Laser processing method |
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