JPS5965548U - Semiconductor device forced cooling equipment - Google Patents

Semiconductor device forced cooling equipment

Info

Publication number
JPS5965548U
JPS5965548U JP16197182U JP16197182U JPS5965548U JP S5965548 U JPS5965548 U JP S5965548U JP 16197182 U JP16197182 U JP 16197182U JP 16197182 U JP16197182 U JP 16197182U JP S5965548 U JPS5965548 U JP S5965548U
Authority
JP
Japan
Prior art keywords
semiconductor device
forced cooling
cooling equipment
device forced
large number
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16197182U
Other languages
Japanese (ja)
Inventor
勝 清水
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP16197182U priority Critical patent/JPS5965548U/en
Publication of JPS5965548U publication Critical patent/JPS5965548U/en
Pending legal-status Critical Current

Links

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は在来の半導体強制冷却装置の概略斜視図、第2
図は本考案の半導体強制冷却装置の概略斜視図をそれぞ
れ表わす。 1、  la:放熱板、−2:覆板、3:電動ファン、
4:半導体素子、5:ダクト、6:放熱板に設けた穴。
Figure 1 is a schematic perspective view of a conventional semiconductor forced cooling system, Figure 2
The figures each represent a schematic perspective view of the semiconductor forced cooling device of the present invention. 1, la: heat sink, -2: cover plate, 3: electric fan,
4: Semiconductor element, 5: Duct, 6: Hole provided in heat sink.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 多数の放熱板を平行に配列し、それらの両端を覆板によ
り閉鎖して形成された冷却空気の流路としての多数のダ
クトを内蔵する箱状の冷却体の一端に電動ファンを附設
してなる半導体素子の強制冷却装置において、前記冷却
体を形成する前記放熱板のうち両端に位置する放熱板を
除き他の全ての放熱板に適当な寸法の穴を適当な個数だ
け適当な間隔で全面に分布して設けてなることを特徴と
する半導体素子強制冷却装置。
An electric fan is attached to one end of a box-shaped cooling body that is formed by arranging a large number of heat sinks in parallel and closing both ends with cover plates to form a large number of ducts that serve as cooling air flow paths. In a forced cooling device for a semiconductor device, an appropriate number of holes of an appropriate size are formed on the entire surface of the heat sink forming the cooling body, except for the heat sinks located at both ends. 1. A forced cooling device for a semiconductor device, characterized in that the devices are distributed over the entire area.
JP16197182U 1982-10-26 1982-10-26 Semiconductor device forced cooling equipment Pending JPS5965548U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16197182U JPS5965548U (en) 1982-10-26 1982-10-26 Semiconductor device forced cooling equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16197182U JPS5965548U (en) 1982-10-26 1982-10-26 Semiconductor device forced cooling equipment

Publications (1)

Publication Number Publication Date
JPS5965548U true JPS5965548U (en) 1984-05-01

Family

ID=30355808

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16197182U Pending JPS5965548U (en) 1982-10-26 1982-10-26 Semiconductor device forced cooling equipment

Country Status (1)

Country Link
JP (1) JPS5965548U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012231017A (en) * 2011-04-26 2012-11-22 Sumitomo Precision Prod Co Ltd Heat sink
JP2017034046A (en) * 2015-07-31 2017-02-09 古河電気工業株式会社 heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012231017A (en) * 2011-04-26 2012-11-22 Sumitomo Precision Prod Co Ltd Heat sink
JP2017034046A (en) * 2015-07-31 2017-02-09 古河電気工業株式会社 heat sink

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