JPS5965548U - Semiconductor device forced cooling equipment - Google Patents
Semiconductor device forced cooling equipmentInfo
- Publication number
- JPS5965548U JPS5965548U JP16197182U JP16197182U JPS5965548U JP S5965548 U JPS5965548 U JP S5965548U JP 16197182 U JP16197182 U JP 16197182U JP 16197182 U JP16197182 U JP 16197182U JP S5965548 U JPS5965548 U JP S5965548U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- forced cooling
- cooling equipment
- device forced
- large number
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は在来の半導体強制冷却装置の概略斜視図、第2
図は本考案の半導体強制冷却装置の概略斜視図をそれぞ
れ表わす。
1、 la:放熱板、−2:覆板、3:電動ファン、
4:半導体素子、5:ダクト、6:放熱板に設けた穴。Figure 1 is a schematic perspective view of a conventional semiconductor forced cooling system, Figure 2
The figures each represent a schematic perspective view of the semiconductor forced cooling device of the present invention. 1, la: heat sink, -2: cover plate, 3: electric fan,
4: Semiconductor element, 5: Duct, 6: Hole provided in heat sink.
Claims (1)
り閉鎖して形成された冷却空気の流路としての多数のダ
クトを内蔵する箱状の冷却体の一端に電動ファンを附設
してなる半導体素子の強制冷却装置において、前記冷却
体を形成する前記放熱板のうち両端に位置する放熱板を
除き他の全ての放熱板に適当な寸法の穴を適当な個数だ
け適当な間隔で全面に分布して設けてなることを特徴と
する半導体素子強制冷却装置。An electric fan is attached to one end of a box-shaped cooling body that is formed by arranging a large number of heat sinks in parallel and closing both ends with cover plates to form a large number of ducts that serve as cooling air flow paths. In a forced cooling device for a semiconductor device, an appropriate number of holes of an appropriate size are formed on the entire surface of the heat sink forming the cooling body, except for the heat sinks located at both ends. 1. A forced cooling device for a semiconductor device, characterized in that the devices are distributed over the entire area.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16197182U JPS5965548U (en) | 1982-10-26 | 1982-10-26 | Semiconductor device forced cooling equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16197182U JPS5965548U (en) | 1982-10-26 | 1982-10-26 | Semiconductor device forced cooling equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5965548U true JPS5965548U (en) | 1984-05-01 |
Family
ID=30355808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16197182U Pending JPS5965548U (en) | 1982-10-26 | 1982-10-26 | Semiconductor device forced cooling equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5965548U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012231017A (en) * | 2011-04-26 | 2012-11-22 | Sumitomo Precision Prod Co Ltd | Heat sink |
JP2017034046A (en) * | 2015-07-31 | 2017-02-09 | 古河電気工業株式会社 | heat sink |
-
1982
- 1982-10-26 JP JP16197182U patent/JPS5965548U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012231017A (en) * | 2011-04-26 | 2012-11-22 | Sumitomo Precision Prod Co Ltd | Heat sink |
JP2017034046A (en) * | 2015-07-31 | 2017-02-09 | 古河電気工業株式会社 | heat sink |
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