JPS5959871A - Electroless copper plating solution - Google Patents
Electroless copper plating solutionInfo
- Publication number
- JPS5959871A JPS5959871A JP16925182A JP16925182A JPS5959871A JP S5959871 A JPS5959871 A JP S5959871A JP 16925182 A JP16925182 A JP 16925182A JP 16925182 A JP16925182 A JP 16925182A JP S5959871 A JPS5959871 A JP S5959871A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- electroless copper
- cyanide
- copper plating
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Abstract
Description
【発明の詳細な説明】
本発明は、尚い伸び率紫もつめっき皮膜υ侍らｆＬる無
電解鋼めっ＠液に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electroless steel plating solution which also has a high elongation rate and a plating film.
プリント配＃＋！孜υ製造に於て、絶縁泰仮に回路形成
ケ竹９ために無電解銅めっき液が使用さｎている。無電
解鋼めっき液を１史用して絶縁基８１にＬｏｌ路形酸形
成う方法として、王に次の２つの方法か行なわｆしてい
る〇
丁ｌわち、絶縁ｉｈ＆の回路とならない部分にめっきレ
ジストを塗布し、絶Ｒ基板を無電解鋼めっき液に浸漬し
１、めっきレジストか塗布さＩしていない部分ｖＬ焦亀
暦鋼めっき皮膜の回路を形成ち一＋！：る方法（フルア
デイテイブ法）と、絶縁基板ケ無電解銅めっき液に浸漬
して、全面に薄い無１！１．解銅めっき皮膜を形成し、
回路とならない部分にめりきレジストγ塗布し、電気銅
めりき全行いめ−）＠レジストか塗布さｆしていない部
分に電気銅めつさ皮膜ケ形成させ、め−）きレジストを
除去し、更にクイックエツチングによりｔ気銅めっき皮
膜炉形成さｒｌ、ていない部分の薄い無を解剖めっき皮
膜ケ除去して回路ケ形成させる方法（セミアディティブ
ｆｈ）とでめる。Print distribution #+! In the manufacturing process, an electroless copper plating solution is used for insulation and circuit formation. As a method of forming a LOL circuit on the insulating base 81 using an electroless steel plating solution, the following two methods are used. In other words, the parts that do not become the insulation IH & circuit. Apply a plating resist to the plated resist, immerse the board in an electroless steel plating solution, and form a circuit of the vL Kokireki steel plating film on the parts that have not been coated with the plating resist. : The insulating substrate is immersed in an electroless copper plating solution, and a thin layer of copper is coated on the entire surface. Forms a copper-plated film,
Apply a plated resist γ to the parts that will not form a circuit, perform all electrolytic copper plating, form an electrolytic copper film on the parts that have not been coated with resist, and then remove the plated resist. Furthermore, a method (semi-additive fh) is used in which a thin copper plating film is formed in a furnace by quick etching, and a circuit is formed by removing the thin plating film on the parts that have not been formed.
無電解鋼めりき液に、硫酸第２鋼などの２価の銅塊、エ
ナレ／ジアミン四酢鍍など２１曲鋼イオンリアルカリ司
溶性錯化剤、ホルマリンｚとの還元剤および水酸化アル
カリり田調整剤から成っている。こｊ′１．から得らｎ
、 ｂ Ｆ＋つき皮膜は−・般Ｖ−脆いので、こＴＬケ
改曽゛Ｔるために、α、α′−ジピリジル、１．１０オ
ルト２エナンスロリン、無械シアン化物、ポリアルキレ
／クリコールなど各柚り物η會際加丁ゐことか提業さＩ
しているか殆んどＱノものに壕だ十分子（改督さＩＩゐ
に至っていない。In the electroless steel polishing solution, divalent copper ingots such as sulfuric acid II steel, 21 curved steel ion real alkali-soluble complexing agents such as Enare/diaminetetravinegar, reducing agent with formalin Z, and hydroxide alkali solution are added. It consists of field conditioner. This j′1. obtained from n
, b Since the film with F+ is brittle, in order to improve this TL, various substances such as α, α'-dipyridyl, 1.10 ortho2 enanthroline, amorphous cyanide, polyalkylene/glycol, etc. Rimono η Meeting Kachoi or business I
Almost all of them are in the trenches with Q's (they haven't reached reform II).
例えば、焦慎シアン化物會姉加する勧甘け、めっさ皮膜
り伸ひ率が十分改瞥ち１１ていない。For example, if a cyanide system is not recommended, the elongation rate of the metal film has not been sufficiently reviewed.
無機シアン化物とポリアルキレ／グリコール會添加す、
６壱台も、めっき皮膜の伸び藁が十分改善さｒ＋ておら
ず、ここで用いらｎているポリアルキレンクリコールは
界（ｉｌ活性作用が７１／）ｃｔノで、めりき析出表面
で部分的にめっき液υぬｆＬないｊ＃ハｒり発生するこ
とかあり、そりためにめっき皮膜物性に均一性か欠け０
７′Ｌ會抑１［ｌＪするために、添加諏ケ多くすること
がおこｌわｆているが価格０面から不利にな々０叉、ポ
リアルキレングリコールとして１万〜数百万（ＬＪ１％
分子鎚のもの全使用し、ないと無機シアン化物とり併用
の効果が紹めらＩＬない。Addition of inorganic cyanide and polyalkylene/glycol,
6-1 also did not sufficiently improve the elongation of the plated film, and the polyalkylene glycol used here had an active effect of 71/ct and partially formed on the plated surface. However, if the plating solution is not used properly, cracking may occur, and the physical properties of the plating film may lack uniformity due to warping.
7' In order to suppress LJ, it is necessary to add a large amount of additive, but it is disadvantageous from the price point of 0 to 10,000 to several million (LJ1%) as polyalkylene glycol.
If you don't use all the molecular hammers, you won't be able to see the effect of using them together with inorganic cyanide.
父、めっき皮膜の伸び率（ｔＪ改替さ７’１．るもＶと
して、α、α′−ジヒリジル、ポリアルキレングリコー
ル？添加丁ゐもυが提來さｔしている。（軸開陥５ｌ−
１０５９３２）。Father, the elongation rate of the plating film (tJ revised 7'1. As V, α, α'-dihyridyl, polyalkylene glycol? Also υ is presented. (axial opening) 5l-
105932).
し力・しながら％Ｃ（ｔＪ ＠ ＠ ｒＪ ｓ ホリア
ルキレングリコールを１史用するもりでｌｂゐｆこめ、
上述したように均一なめつき皮膜特性を辿成丁ゐため、
又、良好ｌ伸び李を侍るためｖｃｒｉ、添加、ｊＩｔケ
多くしなり１１はならない。更に１史用てきるめっき液
温か＾＜、ｅ、り田が１２．５〜１３．０と高い順も囲
てないとめつき皮膜υ高い伸ひ率か得らＩＬない０そＬ
ＬＪ丸めに使用できるプリント配線基板に制約かあり、
低価格プリント配紛板処使用δＩしている常崗ヂＪち抜
き加工ｉ」能ｌ厭フェノール絶縁板などか１史用できな
い。%C (tJ @ @ rJ s I was planning to use polyalkylene glycol for a while, and I put lb 2f in it,
As mentioned above, in order to achieve uniform plating film characteristics,
Also, in order to maintain good elongation, VCR, addition, and jIt should not cause much bending. Furthermore, if the temperature of the plating solution for 1st history is 12.5 to 13.0 and it is not in the highest order, the plating film υ will not have a high elongation.
There are restrictions on the printed wiring boards that can be used for LJ rounding.
It is impossible to use phenol insulating boards, etc., which are used in low-cost printed powder boards and are not suitable for punching.
本発明はこυ工うな点に鑑みてｌさｎｌこもので、
ａ）銅イオン、銅イオンの錯化剤、還元剤および田ｌＩ
Ｉ整剤
ｂ）無機シアン化物
Ｃ）一般式
％式％
（Ｒ＋、Ｒｓｏ水累水子原子素数１〜１８ｕアルキル基
、アルケニル基である。但しＲ＋、Ｒｍυ両方が水素原
子υ楊せは言１１い。）で表わざｆＬるポリオキシエチ
レンモーテルｋＷ肩する無１［麻調めっ＠液である。The present invention has been developed in view of these points, and includes: a) copper ions, copper ion complexing agents, reducing agents and
I adjustment agent b) Inorganic cyanide C) General formula % Formula % (R+, Rso Water atomic number prime number 1 to 18u Alkyl group, alkenyl group. However, R+, Rmυ are both hydrogen atoms υ Yang Sei 11 ), it is expressed as a polyoxyethylene motel kW.
無機シアン化物としては、シアン化ナトリウム（ＮａＣ
Ｎ）、シアン化カリウム（ＫＣＮ入シア７化二ｙ ’ｒ
ｋ （Ｎ ｉ ＣＮ）、 シアン化コバルト（Ｃｏ
（ＣＮ）＊） ”ｌ？の金属シアン化物、フェロシア
ン化ナトリウム（Ｎａ＜（Ｆｅ（ＣＮ）ｓ）） 、
７ Ｓ Ｏシアン化カリウム（Ｒ４（Ｆ ｅ （ＣＮＪ
ｓ ）ハフｓリシアン化ナトリウム（Ｎａ５（Ｆｅ（
ＣＮ）ｓ）、、フェリシアン化カリウム（Ｋｓ（Ｆｅ（
ＣＮＪａ））、７７ ン化ニッケルカリウム（ＫｔＮ
ｉ （ＣＮ） ＠ ）、ニトログルシドナトリウム（Ｎ
ａ−Ｆｅ（ＣＮ）Ｊ（ＮＯ） ）、等ｖシフ錯化せ物が
使用さＩＬる。こｎＧｙｔａ−極又は二種以上の混合物
か使用さｆる。Examples of inorganic cyanide include sodium cyanide (NaC
N), potassium cyanide (KCN), potassium cyanide (KCN)
k (N i CN), cobalt cyanide (Co
(CN)*) “l?” metal cyanide, sodium ferrocyanide (Na<(Fe(CN)s)),
7 SO Potassium cyanide (R4(F e (CNJ)
s) Hough s Sodium lycyanide (Na5(Fe(
CN)s), Potassium ferricyanide (Ks(Fe(
CNJa)), nickel potassium chloride (KtN
i (CN) @ ), sodium nitroglucide (N
Schiff complexes such as a-Fe(CN)J(NO)) are used. Either the Gyta-pole or a mixture of two or more of these can be used.
無機シアン化物の礫層に、５〜＋０００氷／ｌが好’！
Ｆ （、Ｖ’ ｏ ５ ｎｌ／ １未満、又Ｕ１００ｍ
ｇ／Ｊｔ超えると十分篩い１ψひ率υめつき皮ｍ０侍ら
ｆ１７ｊイ。６〜６０ｒＱ／Ｉｆ）ｉＬｔ）好１しく、
１０〜３０■／ｌか最も好ましい。5~+000 ice/l is preferable for the gravel layer of inorganic cyanide!
F (, V' o 5 nl/ less than 1, and U100m
If it exceeds g/Jt, it will be enough to sieve 1ψ ratio υ. 6-60rQ/If) iLt) preferably,
10-30 .mu./l is most preferred.
ポリオキシエチレンエーテルに、一般式％式％
両方が水素原子（／ＪＪ＃甘に言１１い◇）で表わ４１
するポリオキシエチレンモノエーテルるるいにホリオキ
シエチレンジエーテルである。In polyoxyethylene ether, the general formula % formula % both are hydrogen atoms (/JJ#Amazing 11 ◇) 41
It is polyoxyethylene monoether or holoxyethylene diether.
ポリオキシエチレンエーテルは分子中に％ ＣＨｍＣｆ
イオ０＋ｎ（ｌＪ親水性部分とＲ１た／Ｄ、 ＲｌＲｔ
り両方が上記し几炭巣数の範ｖ５内に２いて程度の差は
あるもりｃｔＪ疎水任を南しているので界面活性作用（
Ｌ）ある物質である。式中りｎは２〜２００か良い。更
に好ましくに、４〜１５０最も好’ｆｕｅｌ’ユ１０〜
１２０である。Polyoxyethylene ether has %CHmCf in the molecule.
Io0+n(lJ hydrophilic part and R1ta/D, RlRt
Both of them are within the range v5 of the number of coal nests mentioned above, and there are differences in degree.
L) It is a certain substance. In the formula, n may be 2 to 200. More preferably, from 4 to 150, most preferably from 10 to 150.
It is 120.
Ｒ＋、Ｒｘの炭素数は、１〜１０りものが、めっき釘出
速匿の抑制作用か少６いので好１しく、１〜４■もυが
更にめっき液υ安定化す坂としてエアレーション會連続
的に竹９〜甘に起泡性か低いのでエリ好ましい。The number of carbon atoms in R+ and Rx is preferably 1 to 10 because it has a suppressing effect on the speed and hardening of the plating nailing, and 1 to 4 is preferable because υ further stabilizes the plating solution υ during continuous aeration sessions. In general, Bamboo 9 to sweet is preferable because it has low foaming properties.
ポリオキ７エナレ／エーテルとしては、例えば、ポリオ
キシエチレンモノメチルエーテルＣＨｓ （ＵＣＨｍ
ＣＭ ｍ ） ｎＯＨり分子軸（数平均分子菖以ト同じ
）９００．２０００．５０００ＱＪもの、ポリオキシエ
チレンジメチルエーテル
Ｃ８ｓ （Ｕ（１１ｍ ＣＩすｎ Ｕｃ）１ｓり分子細
４００（Ｌ）もり、ポリオ中シエナレンメチルアリルエ
ーテル
ＣＨｓ（ＯＣＨｓＣＨ，） −Ｕ＝ＣＨ＊−ＣＭ＝
ＵＨ＊υ分子ｍ８００りもり、ポリオキシエチレンモノ
オレイルニーチル
ＣＭ ｓ （ＣＨｔ ） ｖ ＣＨ＝ ＣＨ（Ｃ）１
ｍ ） ｓ （（）ＣＨｔ ＣＩ（ｔ ） ｎＯＨ０分
子：ｉＮ：８００．１０００りもυ等が使用さ１１る０
ポリオキシエチレンエーテルの市販品としては試楽品会
社１例えば和光純業工★６■、東京化成（掬ンよびアル
ドリッチ社などから販売さ１１．てい、６筐に多くの油
脂メーカーからも市販さＩしてＰ、Ｑ、クリえはポリオ
キシエチレンモノエーテルとして１１日本油脂■装υユ
ニオックスＮ１シ１月−ズ（商品名）１７Ｃホリオキシ
エチレンジエーテルとしては同じく日本油脂（ト１４装
りユニオックスＭＭシリース（商品名）ユニメックスＭ
Ａシリーズ（商品名）ｌとがめる〇
ポリオキシエチレンエーテルＦＪ−Ｉｎ又は−棟以上り
重付物が使用さｆ１６．。Examples of polyoxyethylene monomethyl ether/ether include polyoxyethylene monomethyl ether CHs (UCHm
CM m) nOH molecular axis (same number average molecular axis) 900.2000.5000QJ, polyoxyethylene dimethyl ether C8s (U (11m CI Sun Uc) 1s molecular axis 400 (L), polio medium sienna Ren methyl allyl ether CHs(OCHsCH,) -U=CH*-CM=
UH*υ molecule m800 rimori, polyoxyethylene monooleyl nityl CM s (CHt) v CH= CH(C)1
m) s (()CHt CI(t) nOH0 molecule: iN: 800.1000 Rimoυ etc. are used11ru0 Commercially available products of polyoxyethylene ether include sample products manufactured by Kagakusha Kaisha 1, for example, Wako Pure Industries★6■ It is sold by Tokyo Kasei (Kikunyo and Aldrich Co., Ltd.), and is also commercially available from many oil and fat manufacturers. Uniox N1 Series (product name) 17C phosphoryoxyethylene diether is also Nippon Oil & Fats Co., Ltd. (To14) Uniox MM series (product name) Unimex M
A series (product name) 〇Polyoxyethylene ether FJ-In or more heavy attachments are used f16. .
ポリオキシエチレンエーテルυ（／ＨｔｒＩ、 ０．
１ｇ ／ １以上が好！Ｌ＜、０．５ｇ／１以上かよυ
好ましい。Polyoxyethylene ether υ (/HtrI, 0.
1g/1 or more is preferable! L<, 0.5g/1 or more υ
preferable.
更に、１ｇ／６以上刀島最も良い帖来會与えゐ。In addition, 1g/6 or more is given to Katajima's best chapter.
こｆＩμこＶ値以上″ｔ″析出界１＠ ＶＣ２ける磯度
が十分な値になるためと考えらＩＬる０多紮に添加して
も伸び率の向上か紹めらｆＬないので、上限に経隣性υ
点から５ ｇ／Ｉが最も艮いが、浴解度筐で箔加するこ
とも出来る。This is thought to be due to the fact that the degree of hardness at which the precipitation boundary 1@VC2 reaches a sufficient value is greater than or equal to the V value.Since there is no improvement in the elongation rate even if it is added to IL, the upper limit is set. adjacent to υ
From the point of view, 5 g/I is the most convenient, but it is also possible to add foil using a bath melting box.
銅イオ／ｅハ鎗＠′銅、硝ば餉、極化弔２餉。Copper Io/eha spear @' Copper, Niba-koi, Polarization 2-Ko.
臭化＠２＠、酢Ｖ銅等υ有槻ｓ ＃＊＠（Ｕ第２蛸塩エ
ク供縮埒７１々０
鋼イオンり錯化剤に、第２銅イオ／と錯体を形成し、ア
ルカリ水帛液に可溶とするも０で、エチレンジアミン四
酢酸及びそりナトリウム塩、ｏ ７７ ？ ｉし４ ＋
ｔ４Ｎ＋Ｎ’ｔＮ’−ｙ トｙ キス−（２−ヒドロ
キシ１０ヒル）−エチレンシアミン、トリエタノールア
ミン、エチレンニトリロテトラエタノール等が使用ざｆ
Ｌる〇
還元剤としてｒＪ 、ホルムアルテヒド、バラホルムア
ルデヒドが使用さｆＬる。Bromide @ 2 @, Vinegar V Copper, etc. Soluble in aqueous solution is 0, ethylenediaminetetraacetic acid and sodium salt, o 77 ? i 4 +
t4N+N'tN'-y Toy Kis-(2-hydroxy-10H)-ethylenecyamine, triethanolamine, ethylene nitrilotetraethanol, etc. are used.
As a reducing agent, formaldehyde and paraformaldehyde are used.
…調整剤とじては、水酸１ヒナトリウム、水敵化カリウ
ム等υ水酸化アルカリが便用さＩＬる〇無電解銅めっさ
液の基本組成としては、倣敞銅５ｇ／ｌ〜１５ｇ／Ｉｓ
めっき液ＴＭ６０〜８０℃、 ｐＨ１１，６〜１５．０
、錯化剤としてエチレｙ’）７＜７９Ｍ酢酸Ｔ”ｔｕ
１５ ｇ／ｌ〜６０ ｇ／ｌ。...For adjusting agents, alkali hydroxides such as monoarsenium hydroxide and potassium hydroxide are conveniently used.The basic composition of the electroless copper plating solution is 5 g/l to 15 g of imitation copper. /Is
Plating solution TM60~80℃, pH11.6~15.0
, 7<79M acetic acid T”tu as a complexing agent
15 g/l to 60 g/l.
また還元剤としてはホルムアルナヒドＶ、ｒ５７％水溶
液として２１１１１／７ｔ〜２０ｍｎ／ｌのもυが好ま
しい０
以上脱明したＬ９に１本発明の無′ル；麻調めっき液に
、めっき皮層υ尚い伸び率が傅らｆＬをと共に、広い田
＆囲すなわち１１．５〜１６．０υ田範囲においても＾
い伸び率のめっき皮膜が侍らＩＩるので、常崗打ちＶｉ
、き加工用ｎヒな紙フエノール絶縁基板の使用が口」能
と７１６ 。In addition, formalnahyde V is used as a reducing agent, and as a 57% aqueous solution, 21111/7t to 20 mn/l of υ is preferable. The elongation rate is not only the same as fL, but also in the wide range of 11.5 to 16.0 υ.
Samurai II has a plating film with a high elongation rate.
716, the use of a paper phenol insulated substrate for cutting and processing.
実施例
無電解銅めっ＠１ＩＩｋυ丞不組成として、憾敵鋼１０
ｇ／１．エチレンジアミン四酢酸４５ｇ／ｊお工び６
７％ホルマリン３．５ｆｆｌｌ／ｌυもりに、象加剤と
して、無憬シアン化物として、そｆＬぞｆＬシアン化ナ
ナトリウム２０ｍ１／１フェロシアン化ナトリウム５０
Ｑ／１％シアン化ナトリウム２０ｎｔｇ／Ｊ、＆ひポリ
オキシエチレンエーテルとして、ポリオキシエテレンモ
ノメチルエーチル（分子１９００．８不油８ＦＩ−製画
品名ユニオックスＭ９００）２ｇ／１．ポリオキシエチ
レンモノオレイルエーテル１−１ｔ １ｏ ｏｏ。Example Electroless copper plating
g/1. Ethylenediaminetetraacetic acid 45g/j 6
7% formalin 3.5ffll/lυ, as an elephant additive, as a cyanide-free, 20ml sodium cyanide 1/1 sodium ferrocyanide 50
Q/1% sodium cyanide 20 ntg/J, & polyoxyethylene ether, polyoxyethylene monomethyl ethyl (molecule 1900.8 oil-free 8FI - product name Uniox M900) 2 g/1. Polyoxyethylene monooleyl ether 1-1t 1o oo.
東分、化す又工業＠製、試楽）１ｔｔ／１．ホリオキシ
エテレン七ツメナルエーテル（分子嶽２０００、ｌ：１
本油１１＆ ＩＱ袈商品名ユニオックスＭ２０００ ）
２ｇ／ｌ’；ｒ＃”ｉ力１］Ｌ、めりき液ｍｖ２ｏ℃で
そ１１゜−ｆ：′７１．． ＋ ２．０． ＋ ２．
３． ＋ ２．００めっき散音調桧し１ζ０
こ７１．らりめっ＠ａｋｃめっ＠反応開始Ｖためりめり
＠反応触媒処珈’２ｐこなったステンレス伍を反１ＴＪ
ｔＬ、てめっ＠液搗７０℃でめっきｔ何い厚与２５μｍ
〜６５μｘｎ ｖめっき皮膜ケ侍た０めっき析出速度、
めっき皮膜伸び率、めりさ皮膜外観を別表にボす。Toubun, Kasumata Kogyo@, Shiraku) 1tt/1. Pholoxyethylene seven menal ether (Molecular weight 2000, l:1
Genuine oil 11 & IQ kesa Product name Uniox M2000)
2g/l';r#"i force 1] L, plating liquid mv2o℃, 11°-f:'71.. + 2.0. + 2.
3. + 2.00 plated tone tuning cypress 1ζ0 ko71. Rarime @akcme @ reaction start V Tamarime @ reaction catalyst treatment '2P finished stainless steel 1TJ
tL, plated at 70℃, thickness: 25μm
~65μxnv plating film 0 plating deposition rate,
The elongation rate of the plating film and the appearance of the merisa film are listed in a separate table.
めっさ皮膜伸び４＆１．めっき皮−ケステンレス仮から
剥罰して１勘ＩＱｍｍ、艮ざ１０ Ｑ ＋ｒｎｎり引張
り試験画定用試験体とし東洋ボールドウィン製テンシ０
／引識り試躾装置會彼用し、で、１獣り速ｆｔ１１１１
１１／分、テｆｆ７りｌＶＩＭ １５ ｍｌｌ１”Ｃ（
Ｈｌｌ Ｍ ｋ比叡例１
実施例ど同じ基本ＭｉＲ（ｌＪ＊電解めつ＠液にシアン
什ナトリウム２０ｕＹ／ｌ’！−添加し、めっき故μ（
を２０℃で１２．０υめっき敵を調型し嘔実施例と同様
にしてめりき皮膜？得た０めつさ析出速度、めりき皮膜
伸び率、めっき皮膜外観ケ別表に示す。Messa film elongation 4&1. Plated skin - Peeled from stainless steel and used as a test specimen for tensile test definition with 1 IQ mm and 10 Q + rnn tensile strength manufactured by Toyo Baldwin.
/Hikizoku Trial and Discipline Equipment Association is used for him, and 1 beast speed ft1111
11/min, teff7ri1VIM 15 ml1”C (
Hll Mk Hiei Example 1 The same basic MiR as in the example (lJ
Prepare a 12.0υ plating layer at 20°C and form a plated film in the same manner as in the Example. The obtained zero-metus precipitation rate, plating film elongation rate, and plating film appearance are shown in the attached table.
比較例２
実施例と回じ基本組成の無電解めり＠液にホリオキシエ
チレンモノメナルエーテル（分子蓋２０００、ｌ＝ｉ本
油）１盲■曲品名ユニオックスＭ２０ Ｃ１Ｏ） １
ｇ／ １ｋｌｉｉｊ刀１１Ｌ、 めりき０Ｐ）ｉ’に２
０℃で１２．６のめつき液倉祠聚し、実施例と同様にし
てめっき皮膜？傅た０めつさ析出速度。Comparative Example 2 Electroless milling with the same basic composition as in Example @Liquid with phoroxyethylene monomenal ether (molecular cap 2000, l=i real oil) 1 blind Product name Uniox M20 C1O) 1
g/ 1kliij sword 11L, Meriki 0P) i' to 2
A 12.6 plating liquid was prepared at 0°C and a plating film was prepared in the same manner as in the example. Futa 0 Metsusa precipitation rate.
めっき皮膜伸び率、めっさ皮朕外親會別表に示すＱ 比較例６ 実施例と同じ基本組成り無゛亀解めつ＠液に。Plating film elongation rate, Q shown in the attached table of Messa Peel Co., Ltd. Comparative example 6 The basic composition is the same as in the example.
α、α′−ジヒリジル５０ｎ１ｇ／ｌ及びポリエチレン
グリコール（分子−＠ｌ ６００ ） ｋそ１ｔ、ぞｎ
ａｇ／ｅ、 ｌ ｇ／１．、 Ｉ Ｏｇ／ｌ？ｔＭ
’１）ＪＯＬ、、めっ＠ｐ田ケ２ ａ ”ｃで−ｆ：１
１ぞｒｉ１２．Ｉ］、１２．６．１２．６のめっき液６
神會稠聚し、実施例と同４ｙｐ Ｉ’Ｃしてめっさ反膜
會１０１ζ。めっき析ｔｔｊ速度、めっさ皮膜伸び年、
めっき皮膜外観、ゲ別衣ＶＬボす。α, α′-dihyridyl 50n1g/l and polyethylene glycol (molecules - @l 600) kso1t, zon
ag/e, l g/1. , I Og/l? tM
'1) JOL,,me@ptagake2 a "c in -f:1
1zori12. I], 12.6.12.6 plating solution 6
The meeting was held, and the same 4yp I'C as in the example was performed, and the meeting was 101ζ. Plating analysis ttj speed, plating film growth year,
Appearance of plating film, VL boss.
比較Ｉｙｌ１４
実施１勿と回し枯木組成の無′市Ａｎめっき液Ｖ仁ンア
ン化ナトリウム３０■／Ｌ ポリエチレングリコール（
分子石６００）１ｇｌｌケ伽加し、めっき赦Ｐｌ（倉２
０℃で１２．０のめっき歳ゲａＩＩ貸し、実施例と１川
様にしてめっさＢＬ膜を侍）こ□めっさ析出速度、めっ
き皮膜伸ひ率、めっき皮８儲外観ケ別表ｒ（示す。Comparison Iyl14 Execution 1 Muse An plating solution with dead wood composition V Sodium anhydride 30 / L Polyethylene glycol (
Molecular stone 600) 1 gll, plated PL (kura 2
The plating age is 12.0 at 0°C. r (show.
以１・１１臼More than 1.11 mills
Claims (1)
１１紙剤。 ｂ）無慎ンアン化物 Ｃ）一般式 ％式％ （ｋ＋、Ｒ第１Ｊ水來原子、仄累舷１〜１８のアルキル
基、アルケニル基である０也しＲ１＋Ｌ （ｌＪ両方が
水素原子ＣｔＪ−甘は言１ない０）′ｔ″表わさ１する
ホリオキシエチレンエーテルを官有する無電ｍ銅めっき
液。 ２、無機シアン化物に５〜１００Ｑ／ｌ、ｙＨ＋）オキ
シエチレンエーテルｖｏ、ｔＪ＠／ｇ以上含有する％訂
、１ｌＪｖ求の範曲第１項配祉の無電解鋼めっき液。[Claims] 1. a) A paper agent containing copper 1 ion, steel ion O complexing agent, and reducing agent Kouhida 11. b) Unscrupulous annide C) General formula % Formula % (k+, R 1st J water atom, 0 or R1+L (lJ both are hydrogen atoms CtJ- Electroless m copper plating solution containing phosphoryoxyethylene ether represented by 0)'t''. 2. Contains 5 to 100Q/l, yH+)oxyethylene ether vo, tJ@/g or more in inorganic cyanide. Electroless steel plating solution according to the first paragraph of the 11Jv request.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16925182A JPS5959871A (en) | 1982-09-28 | 1982-09-28 | Electroless copper plating solution |
| US06/535,057 US4548644A (en) | 1982-09-28 | 1983-09-23 | Electroless copper deposition solution |
| DE8383109644T DE3367940D1 (en) | 1982-09-28 | 1983-09-27 | Electroless copper deposition solution |
| EP83109644A EP0107087B1 (en) | 1982-09-28 | 1983-09-27 | Electroless copper deposition solution |
| KR1019830004572A KR880000471B1 (en) | 1982-09-28 | 1983-09-28 | Electrodysisless copper deposition solution |
| SG49087A SG49087G (en) | 1982-09-28 | 1987-06-03 | Electroless copper deposition solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16925182A JPS5959871A (en) | 1982-09-28 | 1982-09-28 | Electroless copper plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5959871A true JPS5959871A (en) | 1984-04-05 |
| JPS61910B2 JPS61910B2 (en) | 1986-01-11 |
Family
ID=15883043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16925182A Granted JPS5959871A (en) | 1982-09-28 | 1982-09-28 | Electroless copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5959871A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011231382A (en) * | 2010-04-28 | 2011-11-17 | Nagoya Plating Co Ltd | Plating liquid for polymer fiber, method for plating polymer fiber using the same, and method for producing the same |
-
1982
- 1982-09-28 JP JP16925182A patent/JPS5959871A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011231382A (en) * | 2010-04-28 | 2011-11-17 | Nagoya Plating Co Ltd | Plating liquid for polymer fiber, method for plating polymer fiber using the same, and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61910B2 (en) | 1986-01-11 |
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