JPS5953526A - Latent curing agent for epoxy resin - Google Patents

Latent curing agent for epoxy resin

Info

Publication number
JPS5953526A
JPS5953526A JP16455782A JP16455782A JPS5953526A JP S5953526 A JPS5953526 A JP S5953526A JP 16455782 A JP16455782 A JP 16455782A JP 16455782 A JP16455782 A JP 16455782A JP S5953526 A JPS5953526 A JP S5953526A
Authority
JP
Japan
Prior art keywords
component
phenol
epoxy
curing agent
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16455782A
Other languages
Japanese (ja)
Other versions
JPH0160164B2 (en
Inventor
Koji Takeuchi
光二 竹内
Masahiro Abe
正博 阿部
Nobuo Ito
伊藤 信男
Kiyomiki Hirai
平井 清幹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Priority to JP16455782A priority Critical patent/JPS5953526A/en
Priority to EP93109367A priority patent/EP0569044B1/en
Priority to DE3382819T priority patent/DE3382819T2/en
Priority to EP83305398A priority patent/EP0104837B1/en
Priority to DE3382736T priority patent/DE3382736T2/en
Priority to US06/532,901 priority patent/US4542202A/en
Publication of JPS5953526A publication Critical patent/JPS5953526A/en
Publication of JPH0160164B2 publication Critical patent/JPH0160164B2/ja
Granted legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE:To provide titled agent of rapid curability at low temperatures having high storage stability at room temperature, comprising an addition reaction product prepared from a multifunctional epoxy compound, phenol (or alcohol) having tertiary amino group, etc. CONSTITUTION:(A) a mltifunctional epoxy compound (e.g.,bisphenol A type epoxy resin), (B) a tertiary amino group-contg. phenol or alcohol (e.g., 2-dimethyl quinoethanol), and, preferably, (C) a polyhydric phenol (e.g., bosphenol A) are subjected to addition reaction to obtain the objective curing agent with a curing temperature of pref. 60-180 deg.C. The amount ratio of the component (A) to (B) is pref. such that the epoxy equivalent of the component (A) is 0.9-1.5 per equivalent of the OH group in te component (B). The interrelation of the amounts between the components (A), (B), and (C) is pref. such that the epoxy equivalent of the component (A) is 0.9-1.5 times the sum of the OH-equivalents of the components (B) and (c) the component (C) being equal to or less than the component (B) in mole number.

Description

【発明の詳細な説明】 本発明はエポキシ制脂用メ畝在性イ斐化剤に関する。[Detailed description of the invention] TECHNICAL FIELD The present invention relates to a furrowing agent for epoxy fat control.

さらに評しくけ低温速硬化性をゼし、且つ室温での貯蔵
安定性に優れたエポキシ樹脂用潜在性硬化剤に関する。
The present invention further relates to a latent curing agent for epoxy resins that exhibits low-temperature, rapid curing properties and excellent storage stability at room temperature.

エポキシ樹脂は酸無水物系硬化剤あるいは、アミン系硬
化剤零ケ用いて硬化させることによシ、機械的、電気的
」?よび化学的性質の1愛れた硬化物を与えるため、電
気絶縁拐料、各(■成形品、接着剤あるいは塗料などと
して悩めて広軛囲に亘って賞月されている。ところが、
アミン化合物を配合したエポキシ樹脂組成物は貯蔵安定
性が乏しく、また酸無水物イ紀化7i11を配合したエ
ポキシ(、?iJ脂組成物は常温−〇は比IIス的ゾ尾
であるか、その反面、硬化に1県してかなp商τ!1A
1 長時間の加熱を必要とする欠点がある。
Epoxy resins can be cured mechanically or electrically using an acid anhydride curing agent or an amine curing agent. Electrical insulating materials, molded products, adhesives, paints, etc., have been extensively praised in order to provide cured products with desirable chemical properties.However,
An epoxy resin composition containing an amine compound has poor storage stability, and an epoxy resin composition containing an acid anhydride 7i11 is not suitable for use at room temperature. On the other hand, it takes one prefecture for hardening, p quotient τ! 1A
1. It has the disadvantage of requiring long heating time.

そのためs >Ill’畠は第3アミン、第4アンモニ
ウム化合q′//Jη)るいはイ」伝金編垣などの硬化
促進剤を併用して硬化時間を短縮することが広く行なわ
れている。しかし、硬化促進剤を添加すると硬化性は向
上するが、貯蔵安定性が著しく損なわれるという欠点が
生じてしまう。そこで比奴的低温では安定で、ゲル化せ
ず加熱時には速やかに(yi化するといわゆる潜在性硬
化剤が強く望まtしている。
Therefore, it is widely practiced to shorten the curing time by using a curing accelerator such as a tertiary amine or quaternary ammonium compound q'//Jη) or I' . However, although the addition of a curing accelerator improves curability, it has the drawback of significantly impairing storage stability. Therefore, a so-called latent curing agent is strongly desired, which is stable at relatively low temperatures, does not gel, and quickly converts into yi when heated.

ところで、潜在性硬化剤としてこれまでいくつか提案式
れ−Cおシ、その代表的化合物としではジシアンジアミ
ド、二塩基酸ジヒドラジド、三7ツ化ホウ、ぐb−アミ
ンアダクト、グアオミンス1(、メラミン勢か孕げられ
る。しかし、ジシアンジアミド、二基=Wジヒドラジド
、グアナミン類は貯臓安矩注に紫れ−(いるが、150
υ以上の高1.ハ長11仔間幌化葡必保とする欠点があ
り、又、三フッ化ホウ素−アミンアダクトは吸湿i1大
きく、硬化物の属性性にも悪影蓄を与え、睨在互で低温
、速硬化性で丘つ)Ifk、安矩性に後tした化イ讐物
は殆んど知られていない。
By the way, several latent curing agents have been proposed so far, such as dicyandiamide, dibasic acid dihydrazide, boron trisulfide, gb-amine adduct, guaomince 1 (melamine compound), etc. However, dicyandiamide, di-W dihydrazide, and guanamines can be used to help the body store.
Height greater than υ1. In addition, the boron trifluoride-amine adduct has a high moisture absorption i1, which has a negative impact on the properties of the cured product. Ifk, which has hardening properties and is difficult to cure, very few chemical compounds are known which have less stability.

本発明省は低温速硬化性を有し、且つ貯威安定註にしれ
た壱仕件裳化剤をlノii 516すべく鍋忌・)、9
討した結果、(a)夛′自龍仁エポキシ化合物と(b)
分子中に三級アミン基を有するフェノール又はアルコー
ルとを反応させて侍られる付加化イ)物あるいは上記(
al、(b)の2成分の他に更に(cl多餉フェノール
化仕′mを加え、反応させて侮られる4ζJ加化合物が
不目的に合致した優れた潜在性仙化A11であることを
見出し、本冗明を兄成した。
The Ministry of the Invention intends to develop a 100% storage agent that has low-temperature, fast-curing properties and is stable in shelf life.
As a result of the investigation, we found that (a) the epoxy compound and (b)
Addition products (a) or the above (a) which can be prepared by reacting with phenol or alcohol having a tertiary amine group in the molecule
In addition to the two components (al and (b)), we added (cl) multi-phenolization agent and reacted, and found that the 4ζJ addition compound, which is neglected, is an excellent latent phenol A11 that meets the undesirable purpose. , became a brother of Honjomei.

特に、(a)、(b)2成分系より(a)(b)(c)
 3成分系の方が一敗に保存女に性か良好であり、潜仕
性硬化剤として優れている。
In particular, (a), (b) (c) from two-component systems (a) and (b)
The three-component system has better properties in terms of preservation and is superior as a latent curing agent.

以下に木兄1力に係る潜在性硬化剤について詳細に説明
する。
The latent curing agent related to Kinei Ichiriki will be explained in detail below.

本発明の潜伏性+yb化剤の原料と2よる(a)多゛ビ
龍性エポキシ化合物とは一分子中に2個以上のエポキシ
基t )+’i ”J−るもので例えt」1ビスフエノ
ールA1 ビスフェノールF1 カテコール、レゾルシ
ノールなとの多jailフェノールまた(徒、クリセリ
ンやポリエチレングリコールのような多11山アルコー
ルとエピクロルヒドリンを反応させて伯られるポリグリ
シジルエーテノペP−オキシ冴忌昏m 、β−オキシナ
7)工…、のようなヒドロキンカルボン醒トエビクロル
ヒドリンを反応させて得られるグリシジルエーテルエス
テル、フタル阪、テレフタル酸()ようなポリカルボン
版刀)らイ4tら・力、るボリクリシジルエステル、4
.4’−ジアミノジフェニルメタンやm −アミノフェ
ノールなどから得られるグリシジルアミン化合物、さら
にはエポキシ化ノホラックやエポキシ化ポリオレフィン
等がかけられる。これらの多′目’ Nt41jl:エ
ポキシ化合物と反応させるのに1史用される(b)分子
中に三級アミン基を・rjするフェノール又はアルコー
ルとして例えは、2−ジメチルアミンエタノール、1−
メチル−2−ジメチルアミノエタノール、1−フェノキ
シメチル−2−ジメチルアミノエタノール、2−ジエチ
ルアミノエタノール、1−フ゛l−”、−ジメチル−2
−ジメチルアミノエタノール、1−(2−ヒドロキシ−
3−フェノキシプロピル)−2−メチルイミダノール、
1−(2−ヒドロキシ−3−フェノキシプロピル)−2
−エチル−4メチルイミダノール、ノー(2−ヒドロキ
シ−3−ブトキシグロビル)−2−メチルイミダゾール
、1−(2−ヒドロキシ−3−プトキシグロビル)−2
−エチル−4−メチルイミダゾール、1−(2−ヒドロ
キシ−3−フェノキシプロピル)−2−フェニルイミダ
シリン、1−(2−ヒじロキシー3〜ブトキシグロピル
)−2−メチルイミダシリン、2−(ジメチルアミノメ
チル)フェノール、2,4.6−ドリノ、(ジメチルア
ミノメチル)フェノール々Iかケリられる。具に(c)
JJ/、分でめ。多1曲フェノールとしては例えはビス
フェノール八、ビスフェノールF1 ビスフェノールS
1ハイドロキノン、カテコール、レゾルシノール、ピロ
ガロール、フェノールノボラック4iiJ脂等が4けら
れる。潜在1生硬化剤である付加化合物を製造する除の
(a)、 (b)両成分の反応割合は、(b)成分であ
る分子中に三級アミノ基を有するフェノール又はアルコ
ールのOH基1当鎗に対し、(a)成分である多1“化
性エポキシ化合物のエポキシ−基08〜25物の軟化温
度が低く、粉や?・が困難にな)、且つこれを潜在性硬
化剤としてエポキシ樹脂に配合した場合には十分なる貯
R女足性がイυられない。
According to the raw material of the latent +yb agent of the present invention and 2, (a) multi-functional epoxy compound is one having two or more epoxy groups in one molecule, for example t'1 Bisphenol A1 Bisphenol F1 Multi-jail phenols such as catechol and resorcinol; β-Oxina 7) Glycidyl ether esters obtained by reacting hydroquine carboxylates such as chlorhydrin, phthalates, polycarbonates such as terephthalic acids (4t et al.) , voricricidyl ester, 4
.. Glycidylamine compounds obtained from 4'-diaminodiphenylmethane, m-aminophenol, etc., as well as epoxidized noholac, epoxidized polyolefin, etc. are applied. (b) A phenol or alcohol that has a tertiary amine group in the molecule, for example, 2-dimethylamineethanol, 1-
Methyl-2-dimethylaminoethanol, 1-phenoxymethyl-2-dimethylaminoethanol, 2-diethylaminoethanol, 1-fil-”, -dimethyl-2
-dimethylaminoethanol, 1-(2-hydroxy-
3-phenoxypropyl)-2-methylimidanol,
1-(2-hydroxy-3-phenoxypropyl)-2
-ethyl-4-methylimidanol, no(2-hydroxy-3-butoxyglovir)-2-methylimidazole, 1-(2-hydroxy-3-ptoxyglovir)-2
-ethyl-4-methylimidazole, 1-(2-hydroxy-3-phenoxypropyl)-2-phenylimidacillin, 1-(2-hydyloxy-3-butoxyglopyl)-2-methylimidacillin, 2-(dimethylaminomethyl)phenol, 2,4,6-dolino, (dimethylaminomethyl)phenol, etc. To the ingredients (c)
JJ/, in minutes. Examples of multiple phenols include bisphenol 8, bisphenol F1, and bisphenol S.
1 Hydroquinone, catechol, resorcinol, pyrogallol, phenol novolak 4iiJ fat, etc. The reaction ratio of both components (a) and (b) to produce an addition compound that is a latent biocuring agent is 1. In this case, the softening temperature of the epoxy groups 08 to 25 of the multi-functional epoxy compound, which is component (a), is low, making it difficult to form powder), and this is used as a latent hardening agent. If it is blended with an epoxy resin, sufficient R retention properties cannot be achieved.

゛またエポキシ基力rOH基1当■1に対し、25当証
−一11付卵化合吻か一部三次元化し、不融性の固体に
なシ、このもの金沿在住映化印Jとしてエポキシ樹脂に
配合したものは、速段化性が発揮されず月つ、硬化物が
不均一になる欠点かめる。
゛Also, for the epoxy base rOH group 1 part 1, the egg compounding proboscis with 25-111 is partially three-dimensional and becomes an infusible solid. Those blended with epoxy resins do not exhibit speed-up properties, and suffer from the disadvantage that the cured product becomes non-uniform.

又、 (a)、 (b)、 (c)3成分を用いて溜在
住硬化剤を製造する隙は、(b)成分にXt L(c)
成分を等モル以下1更帽部え3 川するのが好ましく、(C)成分が労1モルセツ1場合
?J、、吠化任が111下する入点がある。更に(a5
)、(b)、(C)3成分の反尾、割合は、(b)、(
c)i+ll]成分の水酸赫当血畝り和にxlし、 (
a)ノ戎力・のエポキシ基0.8〜2516当#(%’
141”に0.9〜1.54i当夏が、(a)、(b)
2成分糸と同様の貼!じ」かし好ましい。
In addition, the gap in producing a curing agent using the three components (a), (b), and (c) is that Xt L(c) is added to the component (b).
It is preferable to mix the ingredients in equal moles or less, and if the component (C) is 1 mole or less? J., there is an entry point that is 111 points lower than Hokain. Furthermore (a5
), (b), (C) The ratio of the three components is (b), (
c) i + ll] component hydroxyl and blood ridge sum xl, (
a) Epoxy groups of 0.8 to 2516 #(%')
141” with 0.9 to 1.54i this summer (a), (b)
Paste similar to two-component thread! The same is preferred.

本加明り前仕性級化剤として好ましい(=J加化合吻は
、 15iJ凸已のOHあとエポキシ丞との当−1,I
関保金満足させ、はつ60〜180C位の秋化晶゛1度
を有するものでるる。軟化温度が60r:木イ^では冨
温での貯凧女尾性が悲<、1sot:’を超えるときは
軟化)lクニが劣る。4−、光間の潜在1テ1ミ恢化口
1]は削記の○H基と、エポキシ基との当量関係を満足
させれば、(a)、(b)、(C)谷成分とも人々、2
棟以上の化合物ki)A合して用いてもよく、又、各成
分の化合物のイ中団、混合割谷を友化さぜることにより
、任意の仏化温度孕有する付加化合物を得ることができ
る。
This is preferable as a pre-grading agent (=J addition is 15iJ convex OH followed by contact with epoxy 1, I
There is one that satisfies the Sekiho gold and has a fall crystallization level of 60 to 180C. Softening temperature is 60r: When the temperature of the kite stored at the temperature exceeds 1 sot: ', the kuni is inferior. 4-, the potential between light 1 and 1 and 1 and 1] is the valley component of (a), (b), and (C) if the equivalence relationship between the ○H group and the epoxy group is satisfied. Tomo people, 2
Compounds above ki) A may be used in combination, and addition compounds having an arbitrary temperature of conversion can be obtained by mixing the middle groups of the compounds of each component and the mixed Wariya. I can do it.

これら偕仕性睨化剤は、(a)、(b)又は(a)、(
b)、(c)各1戊分を十分?M、合し、蚕温3こてゲ
ル化さ趣゛、その後80〜150[IMの温度にてノス
応を光結させ冷却、固化1,1◇y砕するか、あるいは
、テトラヒドロフラン、ジオキシ゛ン、メチルエチルケ
トンなどの浴媒中で伺加反LL、させ% 11児俗蛛は
、固形物全初伜することにより容易に侍1りれる。
These stimulants are (a), (b) or (a), (
Is one minute each of b) and (c) enough? M, combine, gelatinize with a 3-trowel, then cool and solidify at a temperature of 80 to 150 [IM], crush to 1,1◇y, or use tetrahydrofuran, dioxygen, In a bath medium such as methyl ethyl ketone, LL, % 11 juvenile spiders can be easily converted into samurai 1 by removing all the solid matter.

木兄9」の敲在性恢化h11は公知の帳化plJ 、例
えi:歌無水物、ジンアンジアミド、二塙端岐ヒドラジ
ド、グアナミン類、メラミン青とν(・用することもで
きる。1仔にジンアンジアミド等の7Hイ1三(9E 
+便(ヒ卸]とv1゛用すると貯蔵冥可注ど低−トでせ
ずに、0史イヒ性か大rlJに改善ちれる。本元明の漸
在注恢化剤に適用されるエポキシ樹脂とし又は、1分子
中に211N以」二のエポキシ& ”:r: )+’t
する、削記(a、l成分の多官u比性エポキシ化合物と
してしM示し/こ如く、周昶の4市他な化付物が争けら
れる。木兄明のl銹仇住1使イヒ月11は十分なる級化
性を不さず、40!4λ皿部を超えると硬化物の性能低
下をtイーを来する原因になる。
The existing aggregation h11 of ``Kien 9'' can also be used as a known conversion plJ, such as i: anhydride, diandiamide, hydrazide, guanamines, and melamine blue. One pup was given 7H and 13 (9E
If you use + stool (hi wholesale) and v1゛, it will improve to 0 history or large rlJ without lowering the storage capacity.Applicable to Motomoto Akira's gradual stimulant. Epoxy resin or 211N or more in one molecule
In this way, the four cities of Zhou and other additions are disputed. Ihi month 11 does not impair sufficient grading property, and if it exceeds 40!4λ plate part, it will cause the performance of the cured product to deteriorate.

久に不兄四全イ]成例メひシζ〃己例により具体的に6
兄明する。
[Kunifuenshizenii] Seiru Mehishi ζ〃Specifically 6 according to your own example
I'll tell you my brother.

向、合成)タリ及び呆力山例に用いた原料の1li6杯
は以ドU)雇ジてり。。
1 liter and 6 cups of the raw materials used in the example are used for synthesis). .

(a、)  エポキシ樹11i−t 1−エピコート豐828J  (商品名 シェル化学(
i:d )ビスフェノールA糸エポキシ樹脂 エポキシ当量   185〜190 「エピコート学834J  (商品名 シェル化学(C
13)ビスフェノールA糸エボキソ樹脂 エポキシ当1社   245〜260 [エピコート+1ooxJ  (商品名 シェル化学V
…)ビスフェノールA糸エポキシ構脂 エン」ζキン当j虐   460〜480「エピクロン
+5aoJ  (商品名 犬日木インキ化学(掬)ビス
フェノールに゛糸エポキシ掻1脂 エポキシ当、j4!、   170〜190(1))分
子中eこ三級アミノ基x <= j−るフェノール又は
アルコール 1) IA A E  2−ジメチル゛/″ミノエタノ
ールDMP−302,4,6−トリス(ジメチルアミン
メチル)フェノールDMP−102−(ジメチルアミン
メチル)フェノールPG−MZI−(2−ヒドロキシ−
3−フェノキシプロヒル)−2−メチルイミタゾール PL)−Eλ4z 1−(2−ヒドロキン−3−フェノ
キシプロヒル)−2−エチル−4−メチルイミダゾール po−PZL  1−(2−ヒドロキ’/  37xノ
キシグロビル)−2−フェニルイミタブリン D E A K   ジエチルアミノエタノールLIM
APA   1−メチル−2−ジメチルアミノエタノ二
ル11G−MZ   1−(2−ヒトルキシー3−プト
キシグロビル)−2−メチルイミタゾール (C1多1曲フェノール化合物 LIA     ビスフェノールA )iQ      ハイドロキノン PG     ピロガロール 合成例1.  DMAEと[エピコー)828Jとの付
加物の合成 [エピコート828J  3344I!((1,176
当重)とD M A E  9.C17(0,1ご11
11)と全ビーカーにイ′1)取し、室(晶でよくイ1
和し、4f/、拌しつつ徐々に温度を」二げる。7OC
近辺で一急θ21に反応が)±イーエし、約1ルナ間1
00Cに保つ、反応終了佼、至温まで節動し淡黄色の固
体を侍た。こり刊加物の躯化温ノ及ば100Cでめν、
サンプル燕1とする。
(a,) Epoxy tree 11i-t 1-Epicote 828J (Product name: Shell Chemical (
i:d) Bisphenol A thread epoxy resin Epoxy equivalent weight 185-190 "Epikoat Gaku 834J (Product name: Shell Kagaku (C)
13) Bisphenol A thread Eboxo resin epoxy 1 company 245-260 [Epicoat + 1ooxJ (Product name: Shell Kagaku V
...) Bisphenol A thread epoxy composition 460-480 "Epicron + 5aoJ" (Product name Inuhiki Ink Chemical (Kikki) Bisphenol, 1 thread epoxy 1 fat epoxy, J4!, 170-190 ( 1)) Phenol or alcohol with e and tertiary amino groups 102-(dimethylaminemethyl)phenol PG-MZI-(2-hydroxy-
3-phenoxyproyl)-2-methylimitazolePL)-Eλ4z 1-(2-hydroquine-3-phenoxyproyl)-2-ethyl-4-methylimidazolepo-PZL 1-(2-hydroxyproyl)-2-methylimidazole 37xnoxyglovir)-2-phenylimitabulin D E A K diethylaminoethanol LIM
APA 1-Methyl-2-dimethylaminoethanonyl 11G-MZ 1-(2-hydroxy-3-ptoxyglovir)-2-methylimitazole (C1 polyphenolic compound LIA bisphenol A) iQ Hydroquinone PG Pyrogallol Synthesis Example 1 .. Synthesis of adduct of DMAE and [Epicor] 828J [Epicor 828J 3344I! ((1,176
weight) and D M A E 9. C17 (0,1 go 11
11) and all the beakers, take a
Mix well and gradually lower the temperature to 4f/4F while stirring. 7OC
There was a sudden reaction to θ21 in the vicinity) ± eeee, and about 1 Luna between 1
When the reaction was completed, the temperature was kept at 00C until the temperature was reached, and a pale yellow solid was observed. If the body temperature of the paper is 100C,
Let's use sample swallow 1.

合成例2.  PG−λIZ、 BA と「エピコート
828」との付加物の合成 還流冷却器および攪拌装置を餉えた200+x/3−’
 IJ 77 スコにPa−MZ 11.6 # (0
,0s幽門)、BA5.7#(0,05当嵐)、f6媒
としてメチルエチルケトン50m/f:加え加熱(覚押
しながら、メチルエチルケトン3oalに溶屏した[エ
ピコー)828J19、r(o、x当w)*mj斗する
(30分)。7F?下21+1了後、攪拌下2時間加熱
還流した。 減圧上溶媒であるメチルエチルケトンを留
去し、耐却すると淡黄色固体の付加物k ”4:Jた。
Synthesis example 2. Synthesis of adduct of PG-λIZ, BA and "Epicote 828"200+x/3-' equipped with reflux condenser and stirring device
IJ 77 Sconi Pa-MZ 11.6 # (0
, 0s pylorus), BA5.7# (0,05 the same), 50 m/f of methyl ethyl ketone as the f6 medium: Added and heated (while pressing, dissolved in 3 oal of methyl ethyl ketone [Epicor) 828J19, r (o, x per w) )* mj doto (30 minutes). 7F? After 21+1 hours, the mixture was heated under reflux for 2 hours with stirring. The solvent methyl ethyl ketone was distilled off under reduced pressure, and the adduct k''4:J was obtained as a pale yellow solid.

この付加物のJ区化rl+A+徒は140Uでめ9、サ
ンフ゛ル扁13とする。
The J section of this adduct rl + A + 140U is 9, and the sample size is 13.

以下に、合成例1tたけ合成例2に墾じて合成した本発
明の潜圧性硬化Δりのサンプル査号と軟化温度を示す。
Below, the sample number and softening temperature of the latent pressure curing Δ of the present invention, which was synthesized by adding Synthesis Example 2 to Synthesis Example 1, are shown.

実施例1 第1表の配合割合にて硬化性、貯蔵安定性及びガラス転
移結反を評価した。
Example 1 Curability, storage stability, and glass transition stiffness were evaluated using the blending ratios shown in Table 1.

1、 評価用試料の作成方法 第1表の配合割合にて各桐材を真空攪拌捕潰磯(■石川
工場製)によシottx圧下脱泡混合を1時間行なった
1. Method for preparing samples for evaluation Each paulownia wood was degassed and mixed at the mixing ratio shown in Table 1 in a vacuum stirring crusher (manufactured by Ishikawa Factory) for 1 hour under Sottx pressure.

2、 硬化性の評価 2−1)示に熱分析によシ硬化開始温度(T1)、ピー
ク温度(Tp)を測定した。
2. Evaluation of curability 2-1) The curing initiation temperature (T1) and peak temperature (Tp) were measured by thermal analysis.

試  料    約101 基準′(勿買    α−アルミブー 昇温速度   5 C/ m1n 2−2)一定温+yのギヤーオープンに試料を入れその
恢化状!虎をml祭した。
Sample Approximately 101 Standard' (No need to buy α-aluminum tube heating rate 5 C/m1n 2-2) Place the sample in the gear open at constant temperature +y and check the result! The tiger was celebrated as ml.

3、貯蔵′ゲ定性 n1定温度(3OC)の恒温榴に試料を入れ、流動性の
なくなるまでの日数を測定した。
3. Storage: A sample was placed in a thermostat at a constant temperature (3OC), and the number of days until fluidity disappeared was measured.

4、 ガラス量1バ・11法11度(TのDr力lのY
都度、時間にて硬化させた試料を熱偵く収音され、χJ
−L/ヒ蒲在性イ便化i’t1であることが了解されよ
う。
4. Glass amount 1 bar 11 method 11 degrees (Y of Dr force l of T
Each time, the sound was collected by heating a sample that had been cured for a certain amount of time, and χJ
It will be understood that -L/hi is in a state of being irritating i't1.

人範例2 本発明の虐在住硬化剤と二塩基酸ヒドラジドとの併用糸
で硬化性及び保存安定性eFlζ価した。配合を第3衣
に示し、結果を第4表に示す。
Human model example 2 The curing properties and storage stability of yarns using the combination of the inventive curing agent and dibasic acid hydrazide were evaluated. The formulation is shown in the third coating, and the results are shown in Table 4.

第3表 エピコート≠828       ’   100−重
量部アジヒン敢ヒドラジド        8ZnO5 第4表 *2)硬化栄1゛;   tooc、6o分(但し、サ
ンプ11/jM2.6.15は150C,60分)第2
衣と第4衣の比IIスよシ、本発明の層性1生硬化剤と
アジピン藏ヒドラジドとは置汎だ(1呆効果を元押し、
イシ化性/バ人11〕lこ改、矛さ11.ていることが
rノjイされよう。
Table 3 Epikote ≠ 828' 100 parts by weight Ajihin hydrazide 8ZnO5 Table 4 *2) Hardening 1゛; Tooc, 60 minutes (However, Sump 11/jM2.6.15 is 150C, 60 minutes) Second
The ratio between the coating and the fourth coating is the same as that of the present invention.
Ishikasei/Bajin 11] lkokai, spear 11. It will be said that what is going on is true.

実施例 本発明の虐在性吠化741Jと既知の潜在性硬化剤との
併用系で貯賊簀定性、l17召ヒ1宇をw’(価した。
EXAMPLE A combination system of the present invention's aggressive hardening agent 741J and a known latent curing agent was evaluated to have a 117-100% anti-fouling property.

第5表にその結果を示す。Table 5 shows the results.

第  5  表 第5表に示した辿シ、既知の潜在・団硬化剤単独では全
く硬化しないが(1ooc  1時間)、本発明の潜在
1・1:硬化ハリと併用すると、100t:’の温度で
先全硬比し、著しく硬化性がUJ、靜されていることが
理1j・ト1きノしよう。
Table 5 The results shown in Table 5 indicate that the known latent/group curing agent alone does not cure at all (1 ooc 1 hour), but when used in combination with the latent 1/1: curing firmness of the present invention, it cures at a temperature of 100 t:'. It is clear that the hardenability of UJ is significantly lower than that of the previous hardened steel.

Claims (1)

【特許請求の範囲】 1、  (a)多官能性エポキシ化合物と(b)分子中
に三級アミノ基を有するフェノール又はアルコールとを
反応させて得られる付加化合物を含有してなるエポキシ
構脂用沼i在性硬化剤。 2、  (a)多官能性エポキシ化合物、(b)分子中
に三級アミノ基を働するフェノール又はアルコール及び
(C)多価フェノール化合物とを反応させて得られる伺
卵化ff物を言回してなるエポキシ樹脂用潜在性硬化剤
[Claims] 1. An epoxy resin composition containing an addition compound obtained by reacting (a) a polyfunctional epoxy compound and (b) a phenol or alcohol having a tertiary amino group in the molecule. A wet hardening agent. 2. A term used to refer to a fertilized FF product obtained by reacting (a) a polyfunctional epoxy compound, (b) a phenol or alcohol having a tertiary amino group in the molecule, and (C) a polyhydric phenol compound. Latent curing agent for epoxy resin.
JP16455782A 1982-09-21 1982-09-21 Latent curing agent for epoxy resin Granted JPS5953526A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP16455782A JPS5953526A (en) 1982-09-21 1982-09-21 Latent curing agent for epoxy resin
EP93109367A EP0569044B1 (en) 1982-09-21 1983-09-15 Latent curing agents for epoxy resins
DE3382819T DE3382819T2 (en) 1982-09-21 1983-09-15 Latent hardener for epoxy resins
EP83305398A EP0104837B1 (en) 1982-09-21 1983-09-15 Latent curing agents for epoxy resins
DE3382736T DE3382736T2 (en) 1982-09-21 1983-09-15 Latent hardener for epoxy resins.
US06/532,901 US4542202A (en) 1982-09-21 1983-09-16 Latent curing agents for epoxy resins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16455782A JPS5953526A (en) 1982-09-21 1982-09-21 Latent curing agent for epoxy resin

Publications (2)

Publication Number Publication Date
JPS5953526A true JPS5953526A (en) 1984-03-28
JPH0160164B2 JPH0160164B2 (en) 1989-12-21

Family

ID=15795422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16455782A Granted JPS5953526A (en) 1982-09-21 1982-09-21 Latent curing agent for epoxy resin

Country Status (1)

Country Link
JP (1) JPS5953526A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0197458A2 (en) 1985-04-01 1986-10-15 Asahi Denka Kogyo Kabushiki Kaisha Curable epoxy resin composition
JPS63183920A (en) * 1987-01-27 1988-07-29 Somar Corp Liquid epoxy resin composition and production thereof
JPS6436672A (en) * 1987-07-31 1989-02-07 Somar Corp Epoxy polymer composition for bonding chip part
US6451931B1 (en) 2000-12-29 2002-09-17 Asahi Denki Kogyo Kabushiki Kaisha Reaction product of primary and tertiary amine-containing compound, dihydrazide an polyisocyanate
US7226976B2 (en) 2001-05-16 2007-06-05 Ajinomoto Co., Inc. Latent curing agent for epoxy resin, and curable epoxy resin composition
JP2007297493A (en) * 2006-04-28 2007-11-15 Adeka Corp Curing agent composition for epoxy resin and curing epoxy resin composition formed by containing the same
US8288447B2 (en) 2006-06-07 2012-10-16 Henkel Ag & Co. Kgaa Foamable compositions based on epoxy resins and polyesters
WO2020110493A1 (en) 2018-11-27 2020-06-04 住友化学株式会社 Epoxy resin composition and cured product thereof
WO2021201060A1 (en) 2020-03-31 2021-10-07 ナミックス株式会社 Epoxy amine adduct, curing catalyst, resin composition, sealing material, adhesive and cured article
WO2021199450A1 (en) 2020-03-31 2021-10-07 ナミックス株式会社 Curing catalyst, resin composition, sealing material, adhesive and cured product
WO2021241286A1 (en) 2020-05-27 2021-12-02 住友化学株式会社 Epoxy resin composition and cured product thereof
WO2022239797A1 (en) 2021-05-14 2022-11-17 住友化学株式会社 Epoxy resin composition and cured product thereof

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0197458A2 (en) 1985-04-01 1986-10-15 Asahi Denka Kogyo Kabushiki Kaisha Curable epoxy resin composition
JPS63183920A (en) * 1987-01-27 1988-07-29 Somar Corp Liquid epoxy resin composition and production thereof
JPS6436672A (en) * 1987-07-31 1989-02-07 Somar Corp Epoxy polymer composition for bonding chip part
US6451931B1 (en) 2000-12-29 2002-09-17 Asahi Denki Kogyo Kabushiki Kaisha Reaction product of primary and tertiary amine-containing compound, dihydrazide an polyisocyanate
US7226976B2 (en) 2001-05-16 2007-06-05 Ajinomoto Co., Inc. Latent curing agent for epoxy resin, and curable epoxy resin composition
JP2007297493A (en) * 2006-04-28 2007-11-15 Adeka Corp Curing agent composition for epoxy resin and curing epoxy resin composition formed by containing the same
US8288447B2 (en) 2006-06-07 2012-10-16 Henkel Ag & Co. Kgaa Foamable compositions based on epoxy resins and polyesters
WO2020110493A1 (en) 2018-11-27 2020-06-04 住友化学株式会社 Epoxy resin composition and cured product thereof
WO2021201060A1 (en) 2020-03-31 2021-10-07 ナミックス株式会社 Epoxy amine adduct, curing catalyst, resin composition, sealing material, adhesive and cured article
WO2021199450A1 (en) 2020-03-31 2021-10-07 ナミックス株式会社 Curing catalyst, resin composition, sealing material, adhesive and cured product
WO2021241286A1 (en) 2020-05-27 2021-12-02 住友化学株式会社 Epoxy resin composition and cured product thereof
WO2022239797A1 (en) 2021-05-14 2022-11-17 住友化学株式会社 Epoxy resin composition and cured product thereof

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