JPS5950456U - light emitting diode device - Google Patents

light emitting diode device

Info

Publication number
JPS5950456U
JPS5950456U JP14550482U JP14550482U JPS5950456U JP S5950456 U JPS5950456 U JP S5950456U JP 14550482 U JP14550482 U JP 14550482U JP 14550482 U JP14550482 U JP 14550482U JP S5950456 U JPS5950456 U JP S5950456U
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
molded
diode device
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14550482U
Other languages
Japanese (ja)
Inventor
細見　幸弘
野島　正信
Original Assignee
三洋電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三洋電機株式会社 filed Critical 三洋電機株式会社
Priority to JP14550482U priority Critical patent/JPS5950456U/en
Publication of JPS5950456U publication Critical patent/JPS5950456U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来装置を示す断面図、第２図は光指向特性を
示す特性図、第３図は本考案の実施例を示す断面図であ
る。 １１．１２．１３・・・第１〜第３リード、１１ａ。 １２ａ・・・第１、第２反射器、１４．１５・・・第１
、第２発光ダイオードペレット、１６・・・第１モール
ド体、１７・・・第２モールド体、１８・・・第３モー
ルド体。FIG. 1 is a sectional view showing a conventional device, FIG. 2 is a characteristic diagram showing light directivity characteristics, and FIG. 3 is a sectional view showing an embodiment of the present invention. 11.12.13...1st to 3rd leads, 11a. 12a...first, second reflector, 14.15...first
, second light emitting diode pellet, 16... first mold body, 17... second mold body, 18... third mold body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一端に夫々反射器が形成された複数のリード、該リード
の各反射器底面に配された発光ダイオードペレット、上
記各反射器を個々にモールドする第１モールＦ体、該第
１モールド体の各表面に形成された第２モールド体、上
記反射器を一体にモールドする第３モールド体から構成
され、上記第１、第３モールド体は透光性材料から、ま
た上記第２モールド体はフィシ（光散乱材）入りの透光
性材料からなることを特徴とする発光ダイオード装置。A plurality of leads each having a reflector formed at one end, a light emitting diode pellet arranged on the bottom surface of each reflector of the leads, a first molding F body in which each of the reflectors is individually molded, and each of the first molding bodies. It is composed of a second molded body formed on the surface and a third molded body integrally molded with the reflector, the first and third molded bodies being made of a translucent material, and the second molded body being made of fiber ( 1. A light-emitting diode device comprising a light-transmitting material containing a light-scattering material.
JP14550482U 1982-09-24 1982-09-24 light emitting diode device Pending JPS5950456U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14550482U JPS5950456U (en) 1982-09-24 1982-09-24 light emitting diode device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14550482U JPS5950456U (en) 1982-09-24 1982-09-24 light emitting diode device

Publications (1)

Publication Number Publication Date
JPS5950456U true JPS5950456U (en) 1984-04-03

Family

ID=30324156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14550482U Pending JPS5950456U (en) 1982-09-24 1982-09-24 light emitting diode device

Country Status (1)

Country Link
JP (1) JPS5950456U (en)

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