JPS5945098B2 - Thermal resistance measuring device - Google Patents
Thermal resistance measuring deviceInfo
- Publication number
- JPS5945098B2 JPS5945098B2 JP9696878A JP9696878A JPS5945098B2 JP S5945098 B2 JPS5945098 B2 JP S5945098B2 JP 9696878 A JP9696878 A JP 9696878A JP 9696878 A JP9696878 A JP 9696878A JP S5945098 B2 JPS5945098 B2 JP S5945098B2
- Authority
- JP
- Japan
- Prior art keywords
- thermal resistance
- measured
- temperature
- measuring device
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Description
【発明の詳細な説明】
この発明は、人工衛星などのようなシステムに、組み込
まれた状況下でも、衛星内各機器の熱抵抗値が測定でき
る新規な熱抵抗測定装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a novel thermal resistance measuring device that can measure the thermal resistance value of each device in a satellite even when it is incorporated into a system such as an artificial satellite.
一般に電子機器の熱抵抗値はシステムの熱設計において
、非常に重要なパラメータであるが、現在のところ、こ
の値を直接測定する測定器がないため、実験室段階での
・熱の伝導状況
・材料の物性定数
などの解析により算定された値を使用している。Generally, the thermal resistance value of electronic equipment is a very important parameter in the thermal design of the system, but at present there is no measuring device that directly measures this value. Values calculated by analysis of the physical property constants of the material are used.
一方、熱抵抗の構成要素は・熱伝導抵抗、および
・熱放射抵抗
であるが、人工衛星などのシステムとして組み込まれた
状況下での電子機器の熱抵抗値は・熱放射抵抗は各機器
間の放射結合度に依存する。On the other hand, the components of thermal resistance are thermal conduction resistance and thermal radiation resistance, but the thermal resistance value of electronic equipment when installed as a system such as an artificial satellite is thermal radiation resistance between each device. depends on the degree of radiative coupling.
・熱伝導抵抗は機器と機器パネルの取り付け状態に依存
する。・Thermal conduction resistance depends on the mounting condition of the equipment and equipment panel.
などの理由により、上記に示された方法で算定された値
を、直接使用することができない。For these reasons, the values calculated by the method shown above cannot be used directly.
この発明は上記に述べた欠点を解決するためになされた
熱抵抗測定装置に関するものである。The present invention relates to a thermal resistance measuring device designed to solve the above-mentioned drawbacks.
以下図面によりこの発明の一実施例について説明する。
第１図において、熱抵抗測定装置は、ヒータなどの発熱
体１、サーミスタなどの温度感知器２、制御部３、デー
タ記憶部４、演算部５、出力部６、アナログ・ディジタ
ル変換部Ｔ）タイマー部８より構成されている。また、
９は衛星塔載用電子機器などの被測定体を示す。被測定
体９の熱抵抗値は、以下の原理で測定される。An embodiment of the present invention will be described below with reference to the drawings.
In FIG. 1, the thermal resistance measuring device includes a heating element 1 such as a heater, a temperature sensor 2 such as a thermistor, a control section 3, a data storage section 4, an arithmetic section 5, an output section 6, and an analog/digital conversion section T). It is composed of a timer section 8. Also,
Reference numeral 9 indicates an object to be measured such as an electronic device mounted on a satellite tower. The thermal resistance value of the object to be measured 9 is measured according to the following principle.
すなわち発熱体１にて、被測定体９を温め温度が定常に
達した段階で被測定体近傍に設けた温度感知器２の出力
をデータ記憶部４を通じて制御部３にフィード・バック
し、制御部３の制御により発熱を中止すれば、温度感知
器２を通じ、データ記憶部４には、制御部３により制御
されるタイマー部８の時刻に対応して、第２図に示すよ
うな温度変化特性が得られる。ここで、第２図の縦軸は
絶対温度、横軸は時刻である。That is, when the heating element 1 heats the object 9 to be measured and the temperature reaches a steady state, the output of the temperature sensor 2 provided near the object to be measured is fed back to the control section 3 through the data storage section 4, and the control is performed. When the heat generation is stopped under the control of the control section 3, the data storage section 4 records a temperature change as shown in FIG. characteristics are obtained. Here, the vertical axis in FIG. 2 is absolute temperature, and the horizontal axis is time.
また、時刻を。の温度をＴ。、時刻ｔｌの温度をＴｉ、
時刻を２の温度をＴ２、時刻を３の温度をＴ３とし、Ｔ
ｏは初期温度であり、時刻ｔｌおよび時刻を２の間隔と
時刻を２および時刻を３の間隔は等間隔とする。ここで
、第２図に示す温度変化特性は、熱回路を定電流源を有
するＣ−Ｒ回路の類似として、真空中では、取り扱うこ
とができるため、発熱体１、温度感知器２、および、被
測定体９をスペース・チエンバなどの真空装置内に設置
すれば、（１）式で表現することができる。Also, the time. The temperature of T. , the temperature at time tl is Ti,
The temperature at time 2 is T2, the temperature at time 3 is T3, and T
o is the initial temperature, and the interval between time tl and time 2 and the interval between time 2 and time 3 are equally spaced. Here, the temperature change characteristics shown in FIG. 2 can be treated as a thermal circuit similar to a C-R circuit having a constant current source in a vacuum, so the heating element 1, the temperature sensor 2, and If the object to be measured 9 is installed in a vacuum device such as a space chamber, it can be expressed by equation (1).
ここで、第２図に示す温度変化特性を用いれば、熱抵抗
値は（２）式で計算できる。Here, by using the temperature change characteristics shown in FIG. 2, the thermal resistance value can be calculated using equation (2).
一方、機器の熱容量Ｃは、機器の比熱と重量の積で定義
されるため、この値をあらかじめ演算部５に入力してお
けば、データ記憶部４で収集されたデータをアナログ・
デイジタル変換部８によりデイジタル化した後、演算部
５にて熱抵抗を計算し、出力部６に表示することができ
る。On the other hand, the heat capacity C of a device is defined as the product of the specific heat and weight of the device, so if this value is input into the calculation unit 5 in advance, the data collected in the data storage unit 4 can be stored in analog form.
After being digitized by the digital conversion section 8, the thermal resistance can be calculated by the calculation section 5 and displayed on the output section 6.
熱抵抗測定装置の中で、発熱体１および温度感知器２の
部分は小型軽量であり、人工衛星内部の機器などに取り
つけが簡単である。In the thermal resistance measuring device, the heating element 1 and the temperature sensor 2 are small and lightweight, and can be easily attached to equipment inside an artificial satellite.
従つてこの発明の熱抵抗測定器を使用すれば、大きなシ
ステムに組み込まれた機器でも、そのままの状態で、熱
真空試験時などの機会に、容易に熱抵抗値を測定するこ
とができる。Therefore, by using the thermal resistance measuring device of the present invention, even if the device is incorporated into a large system, the thermal resistance value can be easily measured during a thermal vacuum test or the like without any modification.
第１図はこの発明の一実施例を示す概略構成図、第２図
は被測定体近傍の温度変化特性を示す図である。
図において、１は発熱体、２は温度感知器、３は制御部
、４はデータ記憶部、５は演算部、６は出力部、７はア
ナログ・デイジタル変換部、８はタイマー部、９は被測
定体である。FIG. 1 is a schematic configuration diagram showing an embodiment of the present invention, and FIG. 2 is a diagram showing temperature change characteristics in the vicinity of the object to be measured. In the figure, 1 is a heating element, 2 is a temperature sensor, 3 is a control section, 4 is a data storage section, 5 is a calculation section, 6 is an output section, 7 is an analog/digital conversion section, 8 is a timer section, and 9 is a It is the object to be measured.
Claims (1)
体近傍に設けられ、被測定体近傍の温度を計測する温度
計測手段と、上記被測定体近傍の温度が所定の温度に達
したとき上記被測定体への加熱を中止する制御手段と、
この制御手段の出力により被測定体近傍の温度変化を記
録する記録手段と、上記記録手段により記録された温度
変化特性を用いて時刻ｔ＿０、ｔ＿１・・・ｔ＿ｎにお
ける温度の値Ｔ＿０、Ｔ＿１・・・Ｔ＿ｎを求め、これ
より熱抵抗値を演算する演算手段と、上記演算された熱
抵抗値を出力する出力手段とを備えた熱抵抗測定装置。1. An object to be measured that is heated in a vacuum, a temperature measuring means that is installed near the object to be measured and measures the temperature near the object to be measured, and when the temperature near the object to be measured reaches a predetermined temperature. A control means for stopping heating of the object to be measured;
A recording means records temperature changes in the vicinity of the object to be measured based on the output of the control means, and temperature values T_0, T_1, . . . at times t_0, t_1, . - A thermal resistance measuring device comprising a calculation means for determining T_n and calculating a thermal resistance value from this, and an output means for outputting the calculated thermal resistance value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9696878A JPS5945098B2 (en) | 1978-08-09 | 1978-08-09 | Thermal resistance measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9696878A JPS5945098B2 (en) | 1978-08-09 | 1978-08-09 | Thermal resistance measuring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5523477A JPS5523477A (en) | 1980-02-19 |
| JPS5945098B2 true JPS5945098B2 (en) | 1984-11-02 |
Family
ID=14179021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9696878A Expired JPS5945098B2 (en) | 1978-08-09 | 1978-08-09 | Thermal resistance measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5945098B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992010742A1 (en) * | 1990-12-14 | 1992-06-25 | Anritsu Corporation | Sensing system for measuring characteristic value of member to be measured by utilizing changes in thermal resistance |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6266147A (en) * | 1985-09-19 | 1987-03-25 | Agency Of Ind Science & Technol | Measuring method for heat constant by temperature step thin wire heating |
| US6663278B1 (en) * | 2002-07-11 | 2003-12-16 | Industrial Technologies Research Institute | Method for determining the thermal performance of a heat sink |
-
1978
- 1978-08-09 JP JP9696878A patent/JPS5945098B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1992010742A1 (en) * | 1990-12-14 | 1992-06-25 | Anritsu Corporation | Sensing system for measuring characteristic value of member to be measured by utilizing changes in thermal resistance |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5523477A (en) | 1980-02-19 |
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