JPS5940239B2 - How to adjust the pH of an electroplating bath - Google Patents
How to adjust the pH of an electroplating bathInfo
- Publication number
- JPS5940239B2 JPS5940239B2 JP10291480A JP10291480A JPS5940239B2 JP S5940239 B2 JPS5940239 B2 JP S5940239B2 JP 10291480 A JP10291480 A JP 10291480A JP 10291480 A JP10291480 A JP 10291480A JP S5940239 B2 JPS5940239 B2 JP S5940239B2
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- JP
- Japan
- Prior art keywords
- plating
- tank
- circulation tank
- bath
- dialysis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
【発明の詳細な説明】
本発明はメッキ槽の陽極に不溶性電極を用いる電気メッ
キにおいて、拡散透析を利用してメッキ浴の遊離酸を除
去する電気メッキ浴のｐＨ調整方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for adjusting the pH of an electroplating bath in which free acid in the plating bath is removed using diffusion dialysis in electroplating using an insoluble electrode as the anode of the plating bath.
近年道路の凍結防止等のために散布される各種薬剤に基
づく自動車の足まわり鋼材の腐食の防止対策として、自
動車用鋼板に耐食性にすぐれた電気Ｚｎメッキ鋼板、特
にＺｎとＮｉ、Ｓｎ等とを組合せてメッキする電気合金
メッキ鋼板の使用が増加している。In recent years, as a measure to prevent corrosion of automobile suspension steel materials caused by various agents sprayed to prevent roads from freezing, electrolytic Zn-plated steel sheets with excellent corrosion resistance, especially Zn, Ni, Sn, etc., have been added to automobile steel sheets. The use of combination plated electroalloy plated steel sheets is increasing.
例えば電気亜鉛メッキ鋼板の如き単一メッキ金属の電気
メッキはこれまで一般に、陽極自体にＺｎを用いメッキ
浴中のＺｎイオンが被メッキ物へ析出するに伴いその析
出量に見合うＺｎが陽極から溶け出すようにした溶解性
の陽極が用いられているが、電気合金メッキについては
被メッキ物への析出に伴う陽極からのメッキ金属のイオ
ン化で浴中のメッキ合金成分の各イオン濃度のバランス
を保つことが不可能であるところから、メッキ金属を塩
の形で浴に添加し陽極を不溶性電極で形成する電気合金
メッキ方法が採用され既に実用化の段階に至つている。For example, in electroplating of a single plated metal such as electrogalvanized steel sheet, Zn was generally used as the anode itself, and as Zn ions in the plating bath precipitated onto the object to be plated, Zn corresponding to the amount of precipitation was dissolved from the anode. A soluble anode is used, but in the case of electroalloy plating, the concentration of each ion in the plating alloy components in the bath is maintained by ionizing the plating metal from the anode as it is deposited onto the object to be plated. Since this is impossible, an electroalloy plating method has been adopted in which the plating metal is added to the bath in the form of a salt and the anode is formed from an insoluble electrode, and has already reached the stage of practical use.
しかし上記不溶性電極を用いた電気合金メッキにおいて
、例えばＺｎの補給を硫酸亜鉛で行う場合における、陰
極の鋼板にＺｎが電着する反応は次式Ｚｎｓｏ４＋Ｈ２
Ｏ→Ｚｎ（電着）＋Ｈ２ＳＯ４＋ｎ０２・・・１にて示
され遊離硫酸Ｈ２Ｓ０ｌが生成するためメッキ浴のｐＨ
が管理範囲外に低下する欠点がある。However, in electroalloy plating using the above-mentioned insoluble electrode, for example, when Zn is supplemented with zinc sulfate, the reaction in which Zn is electrodeposited on the steel plate of the cathode is expressed by the following formula: Znso4+H2
O → Zn (electrodeposition) + H2SO4 + n02...1, and free sulfuric acid H2S0l is generated, so the pH of the plating bath is
The disadvantage is that the value falls outside the control range.
このｐＨの低下はアルカリ添加に基づくメッキ浴の中和
により解消されることは可能であるが、メッキ浴へのア
ルカリ添加は塊状の金属水酸物ドロスの生成、不要の塩
の濃度の増加及びメッキ液の保持容量の増加によるメッ
キ成分の濃度低下等を惹起してメッキ性状に悪影響を与
えるために好ましくないので、メッキ浴を全量新しく取
替えるような甚だ面倒な対策を講じなければならず、不
溶性電極を陽極とする電気合金メッキを効率よく行う技
術は未だ確立されていないのが現状である。上記に鑑み
、本発明者らは不溶性電極を陽極として用いメッキ金属
を塩の形で浴に添加する電気合金メッキにおいて、アル
カリ中和の方法によらないでメッキ浴のｐＨ低下を防止
する方法について鋭意実験研究の結果、電気合金メッキ
のために新ししく浴中に生成した遊離酸を拡散透析を利
用してメツキ浴外に排除する方法によつてメツキ浴のＰ
Ｈの低下を防止してＰＨ値を管理範囲内に保持すること
に成功した。以下本発明方法を詳細に説明する。This decrease in pH can be overcome by neutralizing the plating bath based on the addition of alkali, but adding alkali to the plating bath may result in the formation of lumpy metal hydroxide dross, an increase in the concentration of unnecessary salts, and This is undesirable because it causes a decrease in the concentration of plating components due to an increase in the holding capacity of the plating solution, which adversely affects the plating properties. At present, a technology for efficiently performing electroalloy plating using an electrode as an anode has not yet been established. In view of the above, the present inventors have proposed a method for preventing a decrease in the pH of a plating bath without using an alkali neutralization method in electroalloy plating in which an insoluble electrode is used as an anode and a plating metal is added to the bath in the form of a salt. As a result of extensive experimental research, we have found that the P of the plating bath can be reduced by using diffusion dialysis to remove the free acid newly generated in the bath from electroalloy plating.
We succeeded in preventing the decrease in H and keeping the PH value within the control range. The method of the present invention will be explained in detail below.
まず本発明方法の一例を第１図に示す。First, an example of the method of the present invention is shown in FIG.
図において、１はストリツプ、２はメツキ槽、３はメツ
キ浴、４は不溶性電極（例えば鉛合金）からなる陽極で
、ストリツプ１は陰極として浴３に浸漬され陽極４，４
間を矢引ａ方行に進行して電気合金メツキされる。５は
拡散透析装置で、メツキ液循環槽６と拡散透析槽７と透
析液循環槽８及びメツキ槽２とメツキ液循環槽６との間
をポンプＰ１によりメツキ液を循環せしめる管路９，９
′とメツキ液循環槽６と拡散透析槽７との間をポンプＰ
２によりメツキ液を循環せしめる管路１０，１０′と拡
散透析槽７と透析液循環槽８との間をポンプＰ３により
循環液を循環せしめる管路１１，１１′とから形成され
ている。In the figure, 1 is a strip, 2 is a plating bath, 3 is a plating bath, 4 is an anode made of an insoluble electrode (for example, a lead alloy), and the strip 1 is immersed in the bath 3 as a cathode.
Electric alloy plating progresses in the direction of arrow a between the two. Reference numeral 5 designates a diffusion dialysis device, which includes pipes 9 and 9 for circulating the plating solution between the plating solution circulation tank 6, the diffusion dialysis tank 7, the dialysing solution circulation tank 8, and the plating solution circulation tank 2 and the plating solution circulation tank 6 by means of a pump P1.
', the pump P between the liquid circulation tank 6 and the diffusion dialysis tank 7.
It is formed of pipes 10 and 10' for circulating the plating solution by means of P2 and pipes 11 and 11' for circulating the circulating fluid between the diffusion dialysis tank 7 and the dialysate circulation tank 8 by means of a pump P3.
１２は透析液循環槽８に必要に応じＮａＯＨ等をポンプ
Ｐ４により送るための貯液槽であり、管路９に設けた１
３はメツキ槽２から引出したメツキ液中の異物を取除い
てメツキ液を清浄化するフイルタ一である。12 is a liquid storage tank for sending NaOH etc. to the dialysate circulation tank 8 as needed by a pump P4;
Reference numeral 3 denotes a filter 1 for cleaning the plating liquid by removing foreign matter from the plating liquid drawn out from the plating tank 2.
また前記拡散透析槽７は内部に設けたアニオン交換膜か
らなる拡散透析膜（図示せず）にてメツキ液を拡散透析
するよう構成した公知の拡散透析槽である。次に第１図
に基いて本発明方法を説明する。The diffusion dialysis tank 7 is a known diffusion dialysis tank configured to perform diffusion dialysis on the plating solution using a diffusion dialysis membrane (not shown) comprising an anion exchange membrane provided inside. Next, the method of the present invention will be explained based on FIG.
メツキ槽２の浴３内にて電気メツキにより遊離酸が生成
してＰＨが低下したメツキ液は、管路９によりメツキ槽
２から引出されてフイルタ一１３にて清浄化されてメツ
キ液循環槽６に送給される。前記循環槽６内のメツキ液
はポンプＰ２で管路１０により拡散透析槽７内部の拡散
透析膜（図示せず）内に送給されメツキ液中の遊離酸が
透析作用により透析膜外に除去され、膜内に残留しＰＨ
が上昇したメツキ液が管路１０／を経て再び循環槽６に
戻り更にポンプＰ１により管路９′を経て循環してメツ
キ槽２に戻される。このようにメツキ槽２のメツキ液が
メツキ液循環槽６を経て拡散透析槽７に至り拡散透析さ
れて再び循環槽６を経てメツキ槽２に戻る循環処理が繰
返し行われて、この間にメツキ槽２内の浴３中に電気メ
ツキにより生成した遊離酸は略々メツキ液外に除去され
てメツキ浴３のＰＨの低下は防止される。なお前記拡散
透析槽７において透析膜外に透析された遊離酸は、拡散
透析槽７の透析膜外と透析液循環槽８との間を管路１１
，１１′を通つてポンプＰ３により循環する透析側循環
槽内循環液（通常上水を使用）内に拡散混入して循環液
と共に透析液循環槽８に送給され適宜槽外に排出される
。The plating liquid whose pH has been lowered due to generation of free acid by electroplating in the bath 3 of the plating tank 2 is drawn out from the plating tank 2 through a pipe 9 and purified by a filter 13 to a plating liquid circulation tank. 6. The plating solution in the circulation tank 6 is fed by a pump P2 through a pipe line 10 into a diffusion dialysis membrane (not shown) inside the diffusion dialysis tank 7, and the free acid in the plating solution is removed from the dialysis membrane by the dialysis action. remains in the membrane and the PH
The plating liquid with the increased temperature returns to the circulation tank 6 again through the pipe 10/, and is further circulated by the pump P1 through the pipe 9' and returned to the plating tank 2. In this way, the plating liquid in the plating tank 2 passes through the plating liquid circulation tank 6, reaches the diffusion dialysis tank 7, undergoes diffusion dialysis, and returns to the plating tank 2 via the circulation tank 6. The circulation process is repeated, and during this period, the plating solution in the plating tank The free acid generated in the bath 3 in the plating bath 2 by electroplating is substantially removed to the outside of the plating solution, and a decrease in the pH of the plating bath 3 is prevented. The free acid dialyzed to the outside of the dialysis membrane in the diffusion dialysis tank 7 is passed through a pipe 11 between the outside of the dialysis membrane of the diffusion dialysis tank 7 and the dialysate circulation tank 8.
, 11', into the dialysis-side circulating fluid (usually tap water is used) in the dialysis-side circulating tank, which is circulated by the pump P3, and is sent to the dialysing fluid circulating tank 8 together with the circulating fluid, where it is appropriately discharged from the tank. .
本発明のメツキ液の拡散透析処理においては、メツキ液
と前記透析液循環槽内循環液との塩濃度の差に基く浸透
圧に起因して、拡散透析膜を介して透析側からメツキ液
側に透析液循環槽内循環液の上水が移行するためメツキ
液循環槽の保持容量が増加する現象が見られ、この上水
の移行量が大なるとメツキ液の成分濃度が希釈されメツ
キの性状が損われるおそれがあるので、上水の移行は可
及的に抑制されることが好ましい。前記上水の移行の抑
制について種々実験研究した結果、透析側からメツキ液
側への上水の移行の抑制に対しては透析液循環槽内循環
液に塩を適当量添加することによつて透析液循環槽内循
環液の上水のメツキ液側への移行速度を低下せしめる方
法が最も効果的で簡便であることを知見した。In the diffusion dialysis treatment of the plating solution of the present invention, due to the osmotic pressure based on the difference in salt concentration between the plating solution and the circulating fluid in the dialysate circulation tank, the dialysis side passes from the dialysis side to the plating solution through the diffusion dialysis membrane. A phenomenon has been observed in which the retention capacity of the plating solution circulation tank increases due to the migration of the clean water from the circulating fluid in the dialysate circulation tank, and as the amount of water transferred increases, the component concentration of the plating solution is diluted and the properties of the plating solution increase. Therefore, it is preferable to suppress migration of clean water as much as possible. As a result of various experimental studies on suppressing the transfer of clean water, we found that the transfer of clean water from the dialysis side to the dialysis side can be suppressed by adding an appropriate amount of salt to the circulating fluid in the dialysate circulation tank. It has been found that the most effective and simplest method is to reduce the rate of transfer of the circulating fluid in the dialysate circulation tank to the clean water side.
即ち、第２図は例えば透析液循環槽、メツキ液循環槽の
保持容量をそれぞれ各３１とし、拡散透析膜面積を４０
ｄｄとした拡散透析装置を使用しＰＨ２の電気合金メツ
キ液を循環処理した場合における透析液循環槽からメツ
キ液循環槽への水の移行速度と透析液循環槽の塩濃度と
の関係を特性曲線Ｐにより示した図表である。図示の如
く透析液循環槽からメツキ液循環槽への水の移行速度を
僅少とするためには透析液循環槽内循環液の塩濃度を１
０〜８０９／ｌとすることが好ましいことが判明した。That is, in FIG. 2, for example, the holding capacity of the dialysate circulation tank and the coating liquid circulation tank are each 31, and the diffusion dialysis membrane area is 40.
A characteristic curve shows the relationship between the water transfer rate from the dialysate circulation tank to the plating liquid circulation tank and the salt concentration in the dialysate circulation tank when an electric alloy plating solution of PH2 is circulated using a diffusion dialysis device with the DD method. This is a chart shown by P. As shown in the figure, in order to minimize the transfer rate of water from the dialysate circulation tank to the dialysis liquid circulation tank, the salt concentration of the circulating fluid in the dialysate circulation tank should be reduced to 1.
It has been found that a range of 0 to 809/l is preferable.
上記透析液循環槽内循環液の塩濃度の制御は拡散透析膜
を介してメツキ液側から透析液循環槽に透析してきた遊
離硫酸とＮａＯＨとの次式Ｈ２ＳＯ４＋２Ｎａ０Ｈ→Ｎ
ａＳＯ４＋２Ｈ２０・・・・・・２に示される中和処理
によつて行われ、この場合透析液循環槽内循環液の塩濃
度（％）は次式透析液の塩濃度（％）＝ＮａＯＨ濃度（
％）×了・・・３により求められるので、所望の透析液
循環槽内循環液の塩濃度とするためのＮａＯＨ濃度は上
式３により算出され、前記算出結果に基く必要量のＮａ
ＯＨを透析液循環槽内循環液に添加することによつて行
われる。The salt concentration of the circulating fluid in the dialysate circulation tank is controlled by the following formula between free sulfuric acid and NaOH, which have been dialyzed from the dialysis fluid side to the dialysate circulation tank via the diffusion dialysis membrane: H2SO4+2Na0H→N
aSO4+2H20...2 This is carried out by the neutralization treatment shown in 2. In this case, the salt concentration (%) of the circulating fluid in the dialysate circulation tank is calculated by the following formula: Salt concentration (%) of dialysate = NaOH concentration (
%) × Completion... 3. Therefore, the NaOH concentration to achieve the desired salt concentration of the circulating fluid in the dialysate circulation tank is calculated by the above formula 3, and the necessary amount of Na based on the above calculation result is calculated.
This is done by adding OH to the circulating fluid in the dialysate circulating tank.
また上記により透析液循環槽内循環液の塩濃度が高くな
ると一般にメツキ液内の遊離酸の拡散透析膜での透析速
度が低下する現象が生じるが、この遊離酸の透析速度の
低下が大なるとメツキ液のＰＨ制御に悪影響を与えるお
それがあるので前記透析速度の低下は適当範囲に抑制さ
れることが好ましい。Furthermore, due to the above, when the salt concentration of the circulating fluid in the dialysing fluid circulation tank increases, a phenomenon generally occurs in which the dialysis rate of the free acid in the dialysis membrane decreases. Since it may adversely affect the pH control of the plating solution, it is preferable that the decrease in the dialysis rate be suppressed within an appropriate range.
上記透析速度の低下の抑制について種々実験研究の結果
、透析液循環槽内循環液のＰＨの調整によつて透析速度
の低下を抑制する方法が最も簡便で効果的であることを
知見した。即ち第３図はメツキ液のＰＨを２とし、透析
液循環槽内循環液の塩濃度を４０９／ｌとした場合、透
析液循環液のＰＨとメツキ液の遊離酸の透析速度の関係
を曲線Ｑにて示した図表で、図示の如く透析液循環槽内
循環液のＰＨを低下せしめるとメツキ液の遊離酸の透析
速度は低下する。As a result of various experimental studies on suppressing the decrease in the dialysis rate, it has been found that the method of suppressing the decrease in the dialysis rate by adjusting the pH of the circulating fluid in the dialysate circulation tank is the simplest and most effective method. In other words, Fig. 3 shows the relationship between the pH of the dialysate circulating fluid and the dialysis rate of free acid in the dialysate solution when the pH of the dialysate solution is 2 and the salt concentration of the circulating fluid in the dialysate circulation tank is 409/l. In the chart shown in Q, when the pH of the circulating fluid in the dialysing fluid circulation tank is lowered as shown in the diagram, the dialysis rate of free acid in the plating solution is reduced.
そこで透析液循環槽内循環液のＰＨをあまり低くすると
遊離酸の透析が妨げられるため少くとも透析液循環槽内
循環液のＰＨとメツキ循環槽内メツキ液のＰＨ（管理範
囲は１．７５〜２．０）との差が１以上あることが必要
であることと、透析液循環槽内循環液のＰＨを６５以上
とすると金属の水酸化物の沈澱が生成し透析液循環槽の
出入口を閉塞するおそれがあることから透析液循環槽内
循環液のＰＨは３〜６．５とすることが好ましいことが
判明した。次に実施例により本発明の効果を説明する。Therefore, if the pH of the circulating fluid in the dialysing fluid circulation tank is too low, the dialysis of the free acid will be hindered, so at least the pH of the circulating fluid in the dialysing fluid circulating tank and the pH of the plating fluid in the dialysis tank (the control range is 1.75 to 2.0), and if the pH of the circulating fluid in the dialysate circulation tank is set to 65 or higher, metal hydroxide precipitates will form, and the entrance and exit of the dialysate circulation tank will be blocked. It has been found that the pH of the circulating fluid in the dialysing fluid circulation tank is preferably 3 to 6.5 since there is a risk of blockage. Next, the effects of the present invention will be explained with reference to Examples.
実施例 １内容積１ｒｉ？のメツキ槽にＮｉ−Ｚｎメツ
キ浴（硫酸浴）を満たし、Ｐｂ−Ａｇ（１％）の不溶性
電極にて陽極を形成せしめ、巾３００ＴｆＬｍのストリ
ツプを陰極としてライン速度２５ｍ／Ｈｒで浴中を通し
てＮｉ−Ｚｎ合金メツキを施す電気メツキにおいて、メ
ツキ浴から６０ｄの拡散透析膜を備えた拡散透析槽とメ
ツキ液循環槽及び上水を循環液とする透析液循環槽から
なる第１図に示した拡散透析装置に、１．５ｒｒ１′／
Ｈｒの割合でメツキ槽からメツキ液を引き出して拡散透
析により、種々の条件で脱遊離硫酸の処理を施した。Example: 1 internal volume 1ri? A plating tank was filled with a Ni-Zn plating bath (sulfuric acid bath), a Pb-Ag (1%) insoluble electrode was used as an anode, and a strip with a width of 300 TfLm was used as a cathode to pass Ni through the bath at a line speed of 25 m/Hr. - In electroplating for Zn alloy plating, the diffusion method shown in Figure 1 consists of a diffusion dialysis tank equipped with a diffusion dialysis membrane 60 d from the plating bath, a plating liquid circulation tank, and a dialysate circulation tank using tap water as the circulating fluid. For the dialysis machine, 1.5rr1'/
The plating liquid was drawn out from the plating tank at a rate of Hr and treated to remove free sulfuric acid by diffusion dialysis under various conditions.
結果を第１表に示す。この表より明らかなように、透析
液のＰＨを４．０と一定にすると共に透析液循環槽内循
環液の塩濃度を０，５，１０，３０，８０，１６０９／
ｌと変化させた場合、透析液循環槽内循環液の塩濃度が
Ｏの場合はメツキ浴のＰＨは１．８に保でたが、メツキ
液循環槽のメツキ液保持容量増加速度が２８５１／Ｈｒ
と増大しでメツキ液の成分濃度に悪影響が生じ、また前
記塩濃度を１６０９／ｌとすると前記メツキ液の保持容
量が逆に低下すると共にメツキ液の透析速度も低下しメ
ツキ浴のＰＨを１．８に保つことができなかつだ。これ
に対し塩濃度を１０９／１，３０９／ｌ及び８０ｇ／ｌ
とした場合はメツキ浴のＰＨをそれぞれ１．８に保つこ
とができると共にメツキ液循環槽のメツキ液保持容量増
加速度も７８１／Ｈｒ，４８！／Ｈｒ，６ｌ／Ｈｒと極
めて僅少であり、メツキ液の成分濃度に悪影響を生じる
ことはなかつた。又透析液循環槽内循環液の塩濃度を４
０９／ｌと一定にし、かつ循環槽内透析液のＰＨを３，
４，５，６，８と変化させた場合、透析液循環槽内循環
液のＰＨを４，５，６とした場合はいづれもメツキ浴の
ＰＨを１．８に保つことができたが、透析液循環槽内循
環液のＰＨが８の場合は透析液循環槽内に金属の水酸化
物の沈澱が生成し、このため透析液循環槽内が閉塞され
て拡散透析処理を行うことが困難となつた〇ＰＨを３．
０にした場合もメツキ浴のＰＨは１．８に保てるが、透
析速度が少し低下する。The results are shown in Table 1. As is clear from this table, the pH of the dialysate is kept constant at 4.0, and the salt concentration of the circulating fluid in the dialysate circulation tank is set to 0, 5, 10, 30, 80, 1609/
When the salt concentration of the circulating fluid in the dialysate circulation tank was O, the pH of the plating bath could be maintained at 1.8, but the rate of increase in the plating solution holding capacity of the plating solution circulation tank was 2851/1. Hr
If the salt concentration increases to 1609/l, the retention capacity of the plating solution decreases, and the dialysis rate of the plating solution also decreases, causing the pH of the plating bath to decrease to 1. I couldn't keep it at .8. In contrast, the salt concentration was 109/1,309/l and 80g/l.
In this case, the pH of the plating bath can be maintained at 1.8, and the plating liquid holding capacity increase rate of the plating liquid circulation tank is also 781/Hr, 48! /Hr, 6l/Hr, which was extremely small, and did not have any adverse effect on the component concentration of the plating solution. In addition, the salt concentration of the circulating fluid in the dialysate circulation tank was set to 4.
09/l, and the pH of the dialysate in the circulation tank was set to 3,
When the pH of the circulating fluid in the dialysate circulation tank was changed to 4, 5, 6, and 8, the pH of the plating bath could be maintained at 1.8 in all cases. If the pH of the circulating fluid in the dialysate circulation tank is 8, metal hydroxide precipitates will form in the dialysate circulation tank, which will block the dialysate circulation tank and make it difficult to perform diffusion dialysis treatment. 3.
Even if it is set to 0, the pH of the plating bath can be maintained at 1.8, but the dialysis rate will decrease a little.
上記した如くに、本発明は不溶性電極を陽極として使用
した電気合金メツキにおいて、メツキ浴を拡散透析によ
り循環処理することによつてメツキ浴のＰＨ低下を防止
できたので、不溶性電極を陽極としメツキ金属を塩の形
で浴に添加して行う電気合金メツキの製造能率の向上に
極めて有効である。As described above, in the present invention, in electric alloy plating using an insoluble electrode as an anode, a decrease in the pH of the plating bath can be prevented by circulating the plating bath by diffusion dialysis. This method is extremely effective in improving the production efficiency of electric alloy plating, which is performed by adding metals in the form of salts to the bath.
第１図は本発明方法を実施するフローチヤートの一例を
示す説明図、第２図はメツキ浴循環槽への水の移行速度
と透析液循環槽内循環液の塩濃度の関係を示した図表、
第３図は透析液循環槽内循環液のＰＨとメツキ液の遊離
酸の透析速度の関係を示した図表である。
１・・・・・・ストリツプ、２・・・・・・メツキ槽、
３・・・・・・メツキ浴、４・・・・・・陽極、５・・
・・・・拡散透析装置、６・・・・・・メツキ液循環槽
、７・・・・・・拡散透析槽、８・・・・・・透析液循
環槽、９，９′，１０，１０′，１１，１１′・・・・
・・管路、１２・・・・・・貯液槽、１３・・・・・・
フイルタ一。Fig. 1 is an explanatory diagram showing an example of a flowchart for carrying out the method of the present invention, and Fig. 2 is a diagram showing the relationship between the transfer rate of water to the bath circulation tank and the salt concentration of the circulating fluid in the dialysate circulation tank. ,
FIG. 3 is a chart showing the relationship between the PH of the circulating fluid in the dialysing fluid circulation tank and the dialysis rate of free acid in the plating solution. 1... Strip, 2... Plating tank,
3...Metallic bath, 4...Anode, 5...
... Diffusion dialysis device, 6 ... Metsuki liquid circulation tank, 7 ... Diffusion dialysis tank, 8 ... Dialysate circulation tank, 9, 9', 10, 10', 11, 11'...
...Pipe line, 12...Liquid storage tank, 13...
Filter one.
Claims (1)
おいて、メッキ槽に使用したメッキ浴を拡散透析により
循環処理してメッキ浴から遊離酸を除去することを特徴
とする電気メッキ浴のｐＨ調整方法。 ２ 拡散透析装置内の透析液循環槽内循環液の塩濃度を
１０〜８０ｇ／ｌとすると共にｐＨ６．５以下とするこ
とを特徴とする特許請求の範囲第１項記載の電気メッキ
浴のｐＨ調整方法。[Claims] 1. Electroplating using an insoluble electrode as the anode of the plating tank, characterized in that the plating bath used in the plating tank is circulated by diffusion dialysis to remove free acid from the plating bath. How to adjust the pH of the bath. 2. The pH of the electroplating bath according to claim 1, wherein the salt concentration of the circulating fluid in the dialysate circulation tank in the diffusion dialysis device is 10 to 80 g/l and the pH is 6.5 or less. Adjustment method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10291480A JPS5940239B2 (en) | 1980-07-26 | 1980-07-26 | How to adjust the pH of an electroplating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10291480A JPS5940239B2 (en) | 1980-07-26 | 1980-07-26 | How to adjust the pH of an electroplating bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5729600A JPS5729600A (en) | 1982-02-17 |
| JPS5940239B2 true JPS5940239B2 (en) | 1984-09-28 |
Family
ID=14340115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10291480A Expired JPS5940239B2 (en) | 1980-07-26 | 1980-07-26 | How to adjust the pH of an electroplating bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5940239B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6160540A (en) * | 1984-08-28 | 1986-03-28 | Fuji Xerox Co Ltd | Cabinet for copying machine |
| CN105149610A (en) * | 2015-09-10 | 2015-12-16 | 苏州联科纳米净化科技有限公司 | Process for treating chemical nickel-plating ageing solution |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2559935B2 (en) * | 1991-12-20 | 1996-12-04 | 日本リーロナール株式会社 | Method and apparatus for tin or tin-lead alloy electroplating using insoluble anode |
| JP5876767B2 (en) * | 2012-05-15 | 2016-03-02 | 株式会社荏原製作所 | Plating apparatus and plating solution management method |
| JP2014034691A (en) * | 2012-08-07 | 2014-02-24 | Mitsubishi Materials Corp | Recycling method and apparatus of plating solution |
-
1980
- 1980-07-26 JP JP10291480A patent/JPS5940239B2/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6160540A (en) * | 1984-08-28 | 1986-03-28 | Fuji Xerox Co Ltd | Cabinet for copying machine |
| CN105149610A (en) * | 2015-09-10 | 2015-12-16 | 苏州联科纳米净化科技有限公司 | Process for treating chemical nickel-plating ageing solution |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5729600A (en) | 1982-02-17 |
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