JPS5936126A - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JPS5936126A JPS5936126A JP14807482A JP14807482A JPS5936126A JP S5936126 A JPS5936126 A JP S5936126A JP 14807482 A JP14807482 A JP 14807482A JP 14807482 A JP14807482 A JP 14807482A JP S5936126 A JPS5936126 A JP S5936126A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- solid
- resin composition
- curing agent
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、加熱することによってエナメル電線に塗布し
た接着剤が融解反応して接着する自己融着接着剤の樹脂
組成物に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a resin composition of a self-fusing adhesive that causes an adhesive applied to an enameled electric wire to adhere by melting reaction when heated.
自己融着接着剤はすでに、服地の芯、鉄芯、その他の工
業用材料などに広く利用されている。工業用材料の１つ
であるエナメル電線にも自己融着接着剤が使用されてい
ることは公知であり、種々の接着剤が提案されている。Self-bonding adhesives are already widely used in fabric cores, iron cores, and other industrial materials. It is well known that self-bonding adhesives are used in enameled electric wires, which are one of the industrial materials, and various adhesives have been proposed.
それらの自己融着接着剤はエナメル電線用エナメルとし
ての要求特性である伸び１曲げ、摩耗などと同様の特性
が要求される。このような要求特性から、従来のエナメ
ル電線用接着剤は柔軟性に富んだブチラール系、ポリエ
ステル系、ポリアミド系１フエノキシ系などの樹脂が用
いられてきた。これらの接着剤は、いわゆる熱可塑性樹
脂（二次元高分子）であり１電線と電線の接触している
最外層の・熱可塑性樹脂が加熱によって互いに融着し）
っぎに温度を下げると固着し１電線の一体化が図られて
いる。その加熱温度は１通常、機器の使用温度よりはる
かに高い１５０〜２００’Ｏのような高温が採用されて
いる。These self-fusing adhesives are required to have the same properties as elongation, bending, wear, etc., which are required for enamel for enameled electric wires. Due to these required characteristics, conventional adhesives for enameled electric wires have been made of highly flexible resins such as butyral, polyester, polyamide, and phenoxy. These adhesives are so-called thermoplastic resins (two-dimensional polymers), and the thermoplastic resin in the outermost layer of the wires that are in contact with each other fuses together when heated.
When the temperature is lowered, it solidifies and becomes one wire. The heating temperature is usually a high temperature of 150-200'O, which is much higher than the operating temperature of the equipment.
接着強度は樹脂の熱軟化温度を超えると急激に低下する
。しかも、接着温度に相当する熱融解温度が１５０〜２
００８０程度の樹脂の熱軟化温度は、通常、常温もしく
はせいぜい７ｏｏａとがなり低い。そのたメ、接着温度
が１５０〜２００００程度の接着剤では、１００°０前
後の温度における接着強度が常温またはせいぜい７０°
０のばあいと比較してきわめて劣る。Adhesive strength rapidly decreases when the temperature exceeds the thermal softening temperature of the resin. Moreover, the thermal melting temperature, which corresponds to the bonding temperature, is 150 to 2
The thermal softening temperature of a resin of about 0080 is usually low, at room temperature or at most 7 ooa. On the other hand, for adhesives with a bonding temperature of about 150 to 20,000, the bond strength at a temperature of around 100° is at room temperature or at most 70°.
This is extremely inferior to the case of 0.
高温時の接着強度を改善するため、いわゆる熱硬化性樹
脂（三次元高分子）の使用が考えられてきた。このばあ
いには、−分子中に２以上の反応基をもつ主剤と硬化剤
とを用いることになる。それら主剤と硬化剤は、一般に
、固形ではあるが低分子量のものが用いられ、１００〜
１５０°Ｃ程度で融解させ、反応させ三次元高分子とし
て固着させる。In order to improve adhesive strength at high temperatures, the use of so-called thermosetting resins (three-dimensional polymers) has been considered. In this case, a main agent and a curing agent having two or more reactive groups in the molecule are used. The base agent and curing agent are generally solid but have a low molecular weight, and have a molecular weight of 100 to
It is melted at about 150°C, reacted and fixed as a three-dimensional polymer.
三次元高分子になるため熱軟化温度は融解温度以上の高
温が期待される。しかし、加熱硬化前は、主剤も硬化剤
も、通常、低分子量のものが使用されるため、それらを
単に混合してエナメル電線に塗布しただけではエナメル
被膜との密着度、曲げ時の亀裂発生などの面で′ａＬ線
塗布接着剤としては不適当である。それゆえ、その解決
策として熱可塑性樹脂である高分子量のポリエステル、
フェノキシ樹脂などを混合することが考えられ、行なわ
れてきたが、これらの添加量が多くなるほど高温時の接
着強度の接着強度の低下が著しくなるという欠点を有し
ていた。Since it is a three-dimensional polymer, the thermal softening temperature is expected to be higher than the melting temperature. However, before heat curing, both the base agent and the curing agent are usually of low molecular weight, so simply mixing them and applying them to the enameled wire will affect the adhesion of the enamel coating and the occurrence of cracks during bending. For these reasons, it is unsuitable as a 'aL line coating adhesive. Therefore, as a solution, high molecular weight polyester, which is a thermoplastic resin,
Mixing phenoxy resins and the like has been considered and practiced, but this has had the drawback that the greater the amount of these added, the more the adhesive strength at high temperatures decreases more significantly.
本発明者らは熱硬化性樹脂をエナメルｉｍｉに塗布した
ばあいのエナメル皮膜との密着度を改善し、曲げ時の亀
裂発生を少なくシ為熱硬化後の熱軟化温度を高くするた
め、鋭意研究した結果、本発明に到達した。The present inventors have conducted extensive research in order to improve the adhesion with the enamel film when a thermosetting resin is applied to the enamel imi, and to increase the heat softening temperature after thermosetting to reduce the occurrence of cracks during bending. As a result, we have arrived at the present invention.
すなわち、本発明は固形のエポキシ樹脂と固形の硬化剤
とからなる組成物に、１〜３．５％（重量％以下同様）
の液状エポキシ樹脂を混入してなることを特徴とする樹
脂組成物、および固形のエポキシ樹脂に、１〜３．５％
の液状硬化剤を混入してなることを特徴とする樹脂組成
物に関する。That is, the present invention provides a composition consisting of a solid epoxy resin and a solid curing agent, with an amount of 1 to 3.5% (the same applies below weight %).
A resin composition characterized by mixing a liquid epoxy resin of 1 to 3.5% to the solid epoxy resin.
The present invention relates to a resin composition characterized in that it contains a liquid curing agent.
本発明に用いる固形のエポキシ樹脂、固形の硬化剤は通
常使用されているもので、たとえば、固形のエポキシ樹
脂としてアラルダイト６０７１Ｘ （チバガイギー社製
）、エピコー）１００１ （ｍ化シェルエポキシ■製）
など、固形の硬化剤として２−フェニル−４，５−ジヒ
ドロキシメチルイミダゾールなどをあげることができる
が、これらのみに限定されるものではない。The solid epoxy resin and solid curing agent used in the present invention are commonly used, such as Araldite 6071X (manufactured by Ciba Geigy) and Epicor 1001 (manufactured by M Shell Epoxy ■).
Examples of solid curing agents include 2-phenyl-4,5-dihydroxymethylimidazole, but are not limited to these.
本発明に用いる液状エポキシ樹脂は公知の一般に用いら
れる液状エポキシ樹脂であり粘度（２５’０）６０〜２
３０ボイズ、エポキシ当量１８０〜２００９／当量のも
のが使用される。好ましくは比較的分子量が大きいエビ
ビスタイプのものが使用される。粘度（２５°りが６０
ボイス未満のものは、固形エポキシ樹脂、固形硬化剤と
混合したあとの保管時と熱硬化時に揮発しやすいなどの
欠点を有している。液状エポキシ樹脂の具体例としては
エビコー） ８２８ 。The liquid epoxy resin used in the present invention is a known and commonly used liquid epoxy resin with a viscosity (25'0) of 60 to 2.
30 voids and an epoxy equivalent of 180 to 2009/equivalent are used. Preferably, an Ebis type material having a relatively large molecular weight is used. Viscosity (25° angle is 60
Those with less than voice have the disadvantage that they tend to volatilize during storage and heat curing after being mixed with the solid epoxy resin and solid curing agent. A specific example of the liquid epoxy resin is Ebiko 828.
エビコート８１９ （以上油化シェルエポキシ■製）ア
ラルダイトＧＹ２５０、アルダイトＧＹ２６０ （以上
チバガイギー社製）などがあげられる。Examples include Ebicoat 819 (manufactured by Yuka Shell Epoxy ■), Araldite GY250, and Araldite GY260 (manufactured by Ciba Geigy).
本発明に用いる液状硬化剤は公知の通常用いられる液状
硬化剤であり為アミン系、アミド系１イミダゾール系、
酸無水物系などがあげられ、とくに限定されるものでは
ないが好ましくはイミダゾール系硬化剤、ポリアミン系
硬化剤など具体例としては、１−シアンエチル−２−フ
ェニル−４，５−ジー（シアノエトキシメチル）イミダ
ゾール、Ｉ［ｉＨ−２２０（旭電化工業■製）などのよ
うな高分子量の硬化剤をあげることができる。The liquid curing agent used in the present invention is a known and commonly used liquid curing agent, such as amine type, amide type, imidazole type,
Specific examples include acid anhydride-based curing agents, but are not particularly limited to imidazole-based curing agents, polyamine-based curing agents, and 1-cyanoethyl-2-phenyl-4,5-di(cyanoethyl). High molecular weight curing agents such as ethoxymethyl)imidazole, I[iH-220 (manufactured by Asahi Denka Kogyo ■) and the like can be mentioned.
固形エポキシ樹脂に対し固形の硬化剤を使用するばあい
の使用量は、通常０．５〜５０％であるが、それに限定
されず、所望に応じて適宜選択される。The amount of the solid curing agent used in the solid epoxy resin is usually 0.5 to 50%, but is not limited thereto and may be appropriately selected as desired.
固形エポキシ樹脂と固形硬化剤よりなる組成物に対して
、液状エポキシ樹脂を１〜６．５％加える。液状エポキ
シ樹脂の添加量が６．５％を超えると、エナメル電線皮
膜の曲げ時に亀裂が入りやすくなり、剥離も起りやすく
なる。添加量が１％未満になると亀裂が入りやすくなり
、またＡＯ７ｆｆの耐電圧に対する性能が低下し、いわ
ゆる伴割現象がみられるようになる。1 to 6.5% of liquid epoxy resin is added to the composition consisting of solid epoxy resin and solid curing agent. If the amount of liquid epoxy resin added exceeds 6.5%, the enamel wire coating tends to crack and peel when bent. When the amount added is less than 1%, cracks tend to occur, and the withstand voltage performance of AO7ff deteriorates, and a so-called splitting phenomenon occurs.
固形エポキシ樹脂に対し液状硬化剤を使用するばあいの
使用量は、通常０．５〜５０％であるが、それに限定さ
れず、所望に応じて適宜選択される。The amount of the liquid curing agent used in the solid epoxy resin is usually 0.5 to 50%, but is not limited thereto and can be appropriately selected as desired.
しかし、本発明におけるエナメル電線皮膜の曲げ時の亀
裂、剥離に対し有効であるためには、固形エポキシ樹脂
に対して液状硬化剤を１〜６．５％使用する必要がある
。液状硬化剤の添加量が６．５％を超えるとエナメル電
線皮膜の曲げ時に亀裂と剥離とが入りやすくなる。なお
エナメル電線皮膜の熱硬化後の皮膜物性は、液状硬化剤
の添加量が１％よりは２％、２％よりは６％の方がすぐ
れている。However, in order to be effective against cracking and peeling of the enameled wire coating during bending in the present invention, it is necessary to use the liquid curing agent in an amount of 1 to 6.5% based on the solid epoxy resin. If the amount of the liquid curing agent added exceeds 6.5%, the enameled wire coating tends to crack and peel during bending. The physical properties of the enameled wire coating after heat curing are better when the amount of liquid curing agent added is 2% than 1%, and 6% than 2%.
本発明に使用する固形のエポキシ樹脂と固形の硬化剤か
らなる組成物あるいは固形のエポキシ樹脂には、熱可塑
性樹脂や界面活性剤などを適宜添加することができる。A thermoplastic resin, a surfactant, and the like can be appropriately added to the composition comprising a solid epoxy resin and a solid curing agent or to the solid epoxy resin used in the present invention.
以下、実施例および比較例によって本発明をさらに具体
的に説明する。Hereinafter, the present invention will be explained in more detail with reference to Examples and Comparative Examples.
試料１〜５および比較試料１〜′５の作製第１表に示す
組成の各組成物１００部（重量部、以下同様）を溶媒セ
ロソルブ２００部に溶解し、厚さ２ｍｍ 、巾６１、長
さ５００ｍｍの平角ホルマール線に約３０μｍ厚になる
ように２回塗布して１２０°ＯＸ１分間乾燥させて、試
料１〜３および比較試料１〜３を作製した。Preparation of Samples 1 to 5 and Comparative Samples 1 to '5 100 parts (parts by weight, the same shall apply hereinafter) of each composition shown in Table 1 were dissolved in 200 parts of the solvent Cellosolve, and a thickness of 2 mm, a width of 61 mm, and a length of 61 mm was prepared. Samples 1 to 3 and comparative samples 1 to 3 were prepared by coating a 500 mm rectangular formal wire twice to a thickness of approximately 30 μm and drying at 120° OX for 1 minute.
試料４〜６および比較試料４の作製
試料１〜６および比較試料１〜６と同様にして、第２表
に示す組成の組成物を用いて試料４〜６、比較試料４を
作製した。Preparation of Samples 4 to 6 and Comparative Sample 4 Samples 4 to 6 and Comparative Sample 4 were prepared in the same manner as Samples 1 to 6 and Comparative Samples 1 to 6 using the compositions shown in Table 2.
実施例１
えられた試料または比較試料を、第１図に示すように曲
げて皮膜の亀裂および剥離を肉眼により観察した。Example 1 The obtained sample or comparative sample was bent as shown in FIG. 1 and cracks and peeling of the film were observed with the naked eye.
その結果をそれぞれ記６表（亀裂）、第４表（剥ＩＩｍ
）に示す。The results are shown in Table 6 (cracks) and Table 4 (peeling IIm).
).
第 ２ 表 とを示す。Table 2 and
実施例２
えられた試料および比較試料を第３図に示すように曲げ
て、一端を裸にし銅（７）を出し、中央部にアルミ薄（
５）をまき、裸銅部とアルミ薄部分にＡＯ７ＫＶ（６）
の電圧のをかけその耐電圧を測定した。Example 2 The obtained sample and comparative sample were bent as shown in Fig. 3, one end was exposed to expose the copper (7), and a thin aluminum (7) was placed in the center.
5) and apply AO7KV (6) to the bare copper and thin aluminum parts.
The withstand voltage was measured by applying a voltage of .
その結果を第５表に示す。The results are shown in Table 5.
表中のＯはＡＯ７ＫＶ以上の耐電圧を示し、ＸはＡＯ７
ＫＶ未満の耐電圧を示す。O in the table indicates a withstand voltage of AO7KV or higher, and X indicates AO7
Shows a withstand voltage of less than KV.
第 ６ 表 第 ４ 表 第 ５ 表Table 6 Table 4 Table 5
第１図は試料または比較試料の曲げ方を示す説明図、第
２図は試料または比較試料の拡大断面図、第６図は試料
または比較試料の曲げ時の耐電圧を調べるばあいの説明
図である。
（図面の符号）
（１）；試料または比較試料
（２）：接 着 剤
（８）：エナメル
（４）：銅
（５）ニアルミ箔
（６）：ＡＯ電源
（７）：裸 銅 部
代理人 葛 野 信 −（Ｇテ１名）Figure 1 is an explanatory diagram showing how to bend the sample or comparison sample, Figure 2 is an enlarged cross-sectional view of the sample or comparison sample, and Figure 6 is an explanatory diagram for investigating the withstand voltage when bending the sample or comparison sample. be. (Drawing code) (1); Sample or comparison sample (2): Adhesive (8): Enamel (4): Copper (5) Ni-aluminum foil (6): AO power supply (7): Bare copper section agent Shin Kuzuno - (Gte 1 person)
Claims (2)
物に、１〜３．５重量％の液状エポキシ樹脂を混入して
なることを特徴とする樹脂組成物。(1) A resin composition characterized in that it is made by mixing 1 to 3.5% by weight of a liquid epoxy resin into a composition consisting of a solid epoxy resin and a solid curing agent.
硬化剤を混入してなることを特徴とする樹脂組成物。(2) A resin composition comprising a solid epoxy resin mixed with 1 to 3.5% by weight of a liquid curing agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14807482A JPS5936126A (en) | 1982-08-24 | 1982-08-24 | Resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14807482A JPS5936126A (en) | 1982-08-24 | 1982-08-24 | Resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5936126A true JPS5936126A (en) | 1984-02-28 |
| JPH0334487B2 JPH0334487B2 (en) | 1991-05-22 |
Family
ID=15444631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14807482A Granted JPS5936126A (en) | 1982-08-24 | 1982-08-24 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5936126A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61188478A (en) * | 1985-02-18 | 1986-08-22 | Toagosei Chem Ind Co Ltd | Adhesive composition |
| WO2005061575A1 (en) * | 2003-12-08 | 2005-07-07 | Intel Corporation | Encapsulant mixture having a polymer bound catalyst |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5182326A (en) * | 1975-01-17 | 1976-07-19 | Shinto Paint Co Ltd | KINZOKUYO PURAIMAASOSEIBUTSU |
| JPS5359799A (en) * | 1976-11-10 | 1978-05-29 | Matsushita Electric Ind Co Ltd | Epoxy resin varnish |
| JPS54148027A (en) * | 1978-05-12 | 1979-11-19 | Mitsui Toatsu Chem Inc | Powder coating composition |
| JPS55147565A (en) * | 1979-05-04 | 1980-11-17 | Kurimoto Iron Works Ltd | Powdered painting material |
-
1982
- 1982-08-24 JP JP14807482A patent/JPS5936126A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5182326A (en) * | 1975-01-17 | 1976-07-19 | Shinto Paint Co Ltd | KINZOKUYO PURAIMAASOSEIBUTSU |
| JPS5359799A (en) * | 1976-11-10 | 1978-05-29 | Matsushita Electric Ind Co Ltd | Epoxy resin varnish |
| JPS54148027A (en) * | 1978-05-12 | 1979-11-19 | Mitsui Toatsu Chem Inc | Powder coating composition |
| JPS55147565A (en) * | 1979-05-04 | 1980-11-17 | Kurimoto Iron Works Ltd | Powdered painting material |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61188478A (en) * | 1985-02-18 | 1986-08-22 | Toagosei Chem Ind Co Ltd | Adhesive composition |
| JPH039950B2 (en) * | 1985-02-18 | 1991-02-12 | Toa Gosei Chem Ind | |
| WO2005061575A1 (en) * | 2003-12-08 | 2005-07-07 | Intel Corporation | Encapsulant mixture having a polymer bound catalyst |
| US6974728B2 (en) | 2003-12-08 | 2005-12-13 | Intel Corporation | Encapsulant mixture having a polymer bound catalyst |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0334487B2 (en) | 1991-05-22 |
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