JPS5930520Y2 - Through-layer porcelain capacitor - Google Patents
Through-layer porcelain capacitorInfo
- Publication number
- JPS5930520Y2 JPS5930520Y2 JP12758479U JP12758479U JPS5930520Y2 JP S5930520 Y2 JPS5930520 Y2 JP S5930520Y2 JP 12758479 U JP12758479 U JP 12758479U JP 12758479 U JP12758479 U JP 12758479U JP S5930520 Y2 JPS5930520 Y2 JP S5930520Y2
- Authority
- JP
- Japan
- Prior art keywords
- common electrode
- individual
- electrodes
- holes
- dielectric sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Description
【考案の詳細な説明】
本考案は電極金属層を設けた複数の未焼結磁器シートを
重ねて焼結する形式の積層貫通型磁器コンデンサに関す
るものである。[Detailed Description of the Invention] The present invention relates to a laminated through-type porcelain capacitor in which a plurality of unsintered porcelain sheets provided with electrode metal layers are stacked and sintered.
小形で大容量を得るための積層型磁器コンテ゛ンサ、及
び積層コンデンサに貫通孔を設けた積層貫通型磁器コン
デンサは既に実用化されている。Multilayer ceramic capacitors for obtaining large capacitance in a small size and multilayer ceramic capacitors in which through holes are provided in the multilayer capacitor have already been put into practical use.
しかし、更に小形化、及び高信頼性化が要求されている
。However, further miniaturization and higher reliability are required.
そこで、本考案の目的は小形で且つ高信頼性の積層貫通
型磁器コンテ゛ンサを提供することにある。Therefore, an object of the present invention is to provide a small, highly reliable laminated through-type ceramic container.
上記目的を遠戚するための本考案は、複数の貫通孔が所
定間隔を有して列状に配置され且つ前記複数の貫通孔を
とり囲むように複数の個別電極が一生面に設けられた個
別電極用誘電体シートと、前記個別電極用誘電体シート
の貫通孔に対応する位置に貫通孔がそれぞれ設けられ且
つ前記複数の個別電極に対向する部分を有する共通電極
が一生面に設けられた共通電極用誘電体シートとを交互
に積み重ねて一体化し、複数の前記個別電極用誘電体シ
ートにおける同一貫通孔位置のそれぞれの個別電極を共
通に接続し且つ複数の前記共通電極用誘電体シートのそ
れぞれの共通電極を共通に接続した構成の積層貫通型コ
ンテ゛ンサにおいて、前記個別電極用誘電体シートの端
縁に達する導出部を有するように前記複数の個別電極を
それぞれ形成し、前記個別電極の導出部を設けた端縁に
対して直交する方向の前記共通電極用誘電体シートの端
縁に達する共通電極導出部を有し且つ前記共通電極用誘
電体シートにおける前記複数の貫通孔を個々に又は共通
に取り囲むパターンを有するように前記共通電極を形成
したことを特徴とする積層貫通型磁器コンデンサに係わ
るものである。The present invention, which is a distant relative of the above object, has a plurality of through-holes arranged in a row at predetermined intervals, and a plurality of individual electrodes provided on one surface so as to surround the plurality of through-holes. A dielectric sheet for individual electrodes and a common electrode each having through holes at positions corresponding to the through holes of the dielectric sheet for individual electrodes and having a portion facing the plurality of individual electrodes are provided on one surface. The dielectric sheets for common electrodes are alternately stacked and integrated, the individual electrodes at the same through hole position in the plurality of dielectric sheets for individual electrodes are connected in common, and the dielectric sheets for common electrodes are In a laminated through-type capacitor having a configuration in which common electrodes are connected in common, each of the plurality of individual electrodes is formed so as to have a lead-out portion reaching an edge of the individual electrode dielectric sheet, and the lead-out portion of the individual electrode is The plurality of through holes in the common electrode dielectric sheet are individually or The present invention relates to a through-layer ceramic capacitor characterized in that the common electrode is formed to have a common surrounding pattern.
上記本考案によれば、共通電極が一つの貫通孔又は複数
の貫通孔をとり囲むように形成されているので、貫通孔
に挿通される金属ピン等に対するシールド効果が得られ
る。According to the present invention, since the common electrode is formed to surround one through hole or a plurality of through holes, it is possible to obtain a shielding effect against metal pins and the like inserted through the through holes.
従って、特別にシールド金属ケースを設けないで使用す
ることも可能となる。Therefore, it is also possible to use the device without providing a special shield metal case.
また共通電極を個別電極に直交する方向に導出するので
、個別電極を対向する２つの端縁に導出することが可能
になり、小形化が可能になる。Further, since the common electrode is led out in a direction perpendicular to the individual electrodes, it becomes possible to lead out the individual electrodes to two opposing edges, and miniaturization becomes possible.
以下、図面を参照して本考案の実施例について述べる。Embodiments of the present invention will be described below with reference to the drawings.
本考案の実施例に係わる積層貫通型磁器コンデンサを製
作するに当っては、まず、第１図に示す個別電極用誘電
体シート１と、第２図に示す共通電極用誘電体シート２
とを用意する。In manufacturing the through-layer ceramic capacitor according to the embodiment of the present invention, first, a dielectric sheet 1 for individual electrodes shown in FIG. 1 and a dielectric sheet 2 for common electrodes shown in FIG.
Prepare.
個別電極用誘電体シート１には、８個の貫通孔３が２つ
の列に分割されて一定間隔で配置されている。In the dielectric sheet 1 for individual electrodes, eight through holes 3 are divided into two rows and arranged at regular intervals.
そして、８個の貫通孔３をとり囲むように８個の個別電
極４が設けられている。Eight individual electrodes 4 are provided to surround the eight through holes 3.
夫々の個別電極４は夫々の貫通孔３を囲む部分４ａを有
すると共に、シート１の上下の端縁１ａ、ｌｂに達する
導出部４ｂを有する。Each individual electrode 4 has a portion 4a surrounding the respective through hole 3, and has a lead-out portion 4b that reaches the upper and lower edges 1a, 1b of the sheet 1.
尚このシート１の裏面には電極が形成されていない。Note that no electrodes are formed on the back surface of this sheet 1.
第２図の共通電極用誘電体シート２は、個別電極用誘電
体シート１と略同−形状に形成され且つ個別電極用誘電
体シート１の貫通孔３に対応する位置に８個の貫通孔５
を有している。The dielectric sheet 2 for common electrodes shown in FIG. 2 is formed in approximately the same shape as the dielectric sheet 1 for individual electrodes, and has eight through holes at positions corresponding to the through holes 3 of the dielectric sheet 1 for individual electrodes. 5
have.
そして、個別電極４に対向する部分６ａを有するように
共通電極６が形成されている。A common electrode 6 is formed to have a portion 6a facing the individual electrodes 4.
この共通電極６は、列単位に分割された貫通孔５のグル
ープをとり囲むように形成されている。This common electrode 6 is formed so as to surround a group of through holes 5 divided into columns.
また貫通孔５をとり囲む近傍部分７及び上下の端縁２ａ
、２ｂの近傍部分８には電極が形成されていないが、こ
のシート２の左右の端縁２ Ｃ，２ｄが至るように導出
部６ｂが設けられている。Also, the vicinity portion 7 surrounding the through hole 5 and the upper and lower edges 2a
, 2b are not provided with electrodes, but a lead-out portion 6b is provided so as to reach the left and right edges 2C, 2d of the sheet 2.
即ちこのシート２における共通電極導出部６ｂは、個別
電極用誘電体シート１の導出部４ｂの導出方向と直交す
る方向に導出されている。That is, the common electrode lead-out portion 6b in this sheet 2 is led out in a direction perpendicular to the lead-out direction of the lead-out portion 4b of the individual electrode dielectric sheet 1.
尚夫々のシート１，２は、積層コンデンサの製作に一般
的に使用される未焼結の生の磁器シート（生シート）で
あり、夫々の電極４，６は、銀又は銀パラジウム又は白
金又はパラジウム等のペーストを塗布したものである。Note that the respective sheets 1 and 2 are unsintered raw porcelain sheets (raw sheets) commonly used in the production of multilayer capacitors, and the respective electrodes 4 and 6 are made of silver, silver palladium, platinum or It is coated with a paste such as palladium.
次に第３図に示す如く、個別電極用誘電体シート１、共
通電極用誘電体シート２の順に、複数のシートを順次に
積み重ねて焼結し、一体化する。Next, as shown in FIG. 3, a plurality of sheets are stacked one after another in the order of the dielectric sheet 1 for individual electrodes and the dielectric sheet 2 for common electrodes, and are sintered and integrated.
次に第４図〜第１０図に示す様に、焼結体９の対向する
一対の側面１０．１１に接続電極１３を導電ペイント塗
布で形成する。Next, as shown in FIGS. 4 to 10, connection electrodes 13 are formed on a pair of opposing side surfaces 10 and 11 of the sintered body 9 by applying conductive paint.
この際、接続電極１３が個別電極４に接続されるように
、夫々の接続電極１３を形成する。At this time, each connection electrode 13 is formed so that it is connected to the individual electrode 4.
また、側面１０．１１に直交する位置の一対の側面１４
．１５及び下面１６に接地用接続電極 を導電ペイント
の塗布によって形成する。In addition, a pair of side surfaces 14 at positions orthogonal to the side surfaces 10.11
．． A grounding connection electrode is formed on 15 and the lower surface 16 by applying conductive paint.
尚下面の接続電極１７はコンデンサ電極としても利用す
るため、第２図のシート２における共通電極６と同様に
個別電極４に対向する部分を有するように形成する。Since the connecting electrode 17 on the lower surface is also used as a capacitor electrode, it is formed to have a portion facing the individual electrodes 4, similar to the common electrode 6 in the sheet 2 in FIG.
次に第８図に拡大図示するように、上面１２の貫通孔１
９の近傍の電気的接続部分を除く部分に半田レジスト絶
縁層１８をシリコーン系樹脂等で形成する。Next, as shown in an enlarged view in FIG.
A solder resist insulating layer 18 is formed of silicone resin or the like on a portion other than the electrical connection portion near 9.
また下面１６の貫通孔１９の囲り及び一対の側面１０．
１１との境界近傍にガラス絶縁被覆層２０を形成する。Also, the area surrounding the through hole 19 on the lower surface 16 and the pair of side surfaces 10.
A glass insulating coating layer 20 is formed near the boundary with 11.
しかる後、上面の個別電極４の露出部分及び下面の接地
用接続電極１７の露出部分に予備半田層２１を設ける。Thereafter, a preliminary solder layer 21 is provided on the exposed portions of the individual electrodes 4 on the upper surface and the exposed portions of the ground connection electrodes 17 on the lower surface.
この際、側面に露出している個別及び接地用接続電極１
３．１７にも予備半田層を設けても差支えない。At this time, the individual and ground connection electrodes 1 exposed on the side
3.17 may also be provided with a preliminary solder layer.
また側面に半田レジスト絶縁層又はガラス絶縁被覆層を
設けてもよい。Further, a solder resist insulating layer or a glass insulating coating layer may be provided on the side surface.
上述の如く構成されたコンデンサ素子は、例えば第１０
図に示す如く、貫通孔１９に金属ピン２２を挿通し、こ
のピン２２の上面の個別電極４を半田２３で電気的及び
機械的に結合し、下面の接地用接続電極１７は半田２４
で接地板２４に結合する。The capacitor element configured as described above is, for example, the 10th
As shown in the figure, a metal pin 22 is inserted into the through hole 19, the individual electrodes 4 on the upper surface of this pin 22 are electrically and mechanically connected with solder 23, and the grounding connection electrode 17 on the lower surface is connected with solder 24.
and connects it to the ground plate 24.
しかし、この使用例に限ることなく、コネクタに内蔵さ
せたり、ピン２２を利用してインダクタンス素子と結合
させてもよい。However, the use is not limited to this example, and it may be built into the connector or coupled to an inductance element using the pin 22.
上述から明らかなように、この実施例の素子には次の利
点がある。As is clear from the above, the device of this embodiment has the following advantages.
（ａ）貫通孔５をとり囲むように共通電極６が形成され
ているので、貫通孔５に挿通されるピン２２に対するシ
ールド効果が得られる。(a) Since the common electrode 6 is formed to surround the through hole 5, a shielding effect against the pin 22 inserted into the through hole 5 can be obtained.
（ｂ）共通電極６を個別電極４の導出方向と直交する方
向に導出するので、対向する一対の側面を個別電極４の
導出に利用することが可能となり、小形化が可能となる
。(b) Since the common electrode 6 is led out in a direction perpendicular to the direction in which the individual electrodes 4 are led out, a pair of opposing side surfaces can be used for leading out the individual electrodes 4, and miniaturization is possible.
（Ｃ）上面に半田レジスト絶縁層１８を設けたので、信
頼性が高い。(C) Since the solder resist insulating layer 18 is provided on the upper surface, reliability is high.
（ｄ）下面にガラス絶縁被覆層２０に設けたので、ピン
２２と接地用接続電極１７との間の短絡等の問題が殆ん
ど生じない。(d) Since the glass insulating coating layer 20 is provided on the lower surface, problems such as short circuit between the pin 22 and the grounding connection electrode 17 hardly occur.
（ｅ）予備半田層２１を設けたので、電気回路装置への
装着が容易である。(e) Since the preliminary solder layer 21 is provided, attachment to an electric circuit device is easy.
以上、本考案の実施例について述べたが、本考案は上述
の実施例に限定されるものではなく、更に変形可能なも
のである。Although the embodiments of the present invention have been described above, the present invention is not limited to the above-mentioned embodiments, and can be further modified.
例えば、共通電極用誘電体シート２の共通電極６のパタ
ーンを第１１図に示す如く、夫々の貫通孔５を囲むよう
にしてもよい。For example, the common electrode 6 of the common electrode dielectric sheet 2 may be patterned to surround each through hole 5, as shown in FIG.
また第１２図に示す如く、貫通孔３及び個別電極４を一
列に形成した個別電極用誘電体シート１′と、第１３図
に示す如く、貫通孔５を一列に形成した共通電極用誘電
体シート２とを使用してコンデンサ素子を形成してもよ
い。Further, as shown in FIG. 12, there is a dielectric sheet 1' for individual electrodes in which through holes 3 and individual electrodes 4 are formed in a row, and a dielectric sheet 1' for common electrodes in which through holes 5 are formed in a row as shown in FIG. A capacitor element may be formed using the sheet 2.
この場合、個別電極４はシート１′の対向する一対の端
縁１ａ、ｌｂの両方に導出し、両側面で電気的接続を行
う。In this case, the individual electrodes 4 are led out to both of the pair of opposing edges 1a, lb of the sheet 1', and electrical connections are made on both sides.
これにより、接続の信頼性が高くなる。This increases the reliability of the connection.
またコンデンサの上面の半田レジスト絶縁層１８を個別
電極４以外の部分に限定して被着してもよい。Further, the solder resist insulating layer 18 on the upper surface of the capacitor may be applied only to a portion other than the individual electrodes 4.
第１図は本考案の実施例に係わるコンテ゛ンサの個別電
極用誘電体シートの平面図、第２図は共通電極用誘電体
シートの平面図、第３図は第１図のＩＩＩ−ＩＩＩ線に
相当する部分における個別電極誘電体シートと共通電極
用誘電体シートとの積層を示する断面図、第４図は完成
したコンデンサの説明的斜視図、第５図は第４図のコン
テ゛ンサを裏から見た状態の説明的斜視図、第６図は第
４図のＶＩ−ＶＩ線における断面〜図、第７図は第４図
のＶＩＩ−ＶＩＩ線における断面図、第８図は第７図の
一部を詳しく示す断面図、第９図は第６図の一部を詳し
く示す断面図、第１０図はコンテ゛ンサの使用状態を示
す断面図である。
第１１図は共通電極用誘電体シートの変形例を示す平面
図である。
第１２図は変形例のコンデンサにおける個別電極用誘電
体シートを示す平面図、第１３図は第１２図のシートに
対応する共通電極用誘電体シートを示す平面図である。
尚図面に用いられている符号において、１は個別電極用
誘電体シート、２は共通電極用誘電体シート、３は貫通
孔、４は個別電極、４ｂは導出部、５は貫通孔、６は共
通電極、６ｂは導出部、１８は半田レジスト絶縁層、２
０はガラス絶縁被覆層である。FIG. 1 is a plan view of a dielectric sheet for individual electrodes of a capacitor according to an embodiment of the present invention, FIG. 2 is a plan view of a dielectric sheet for common electrodes, and FIG. 3 is a diagram taken along line III-III in FIG. A cross-sectional view showing the lamination of the individual electrode dielectric sheet and the common electrode dielectric sheet in corresponding parts, FIG. 4 is an explanatory perspective view of the completed capacitor, and FIG. 5 is a view of the capacitor shown in FIG. 4 from the back. 6 is a sectional view taken along line VI-VI in FIG. 4, FIG. 7 is a sectional view taken along line VII-VII in FIG. 4, and FIG. 8 is a sectional view taken along line VI-VI in FIG. FIG. 9 is a cross-sectional view showing a part of FIG. 6 in detail, and FIG. 10 is a cross-sectional view showing the state in which the capacitor is used. FIG. 11 is a plan view showing a modification of the common electrode dielectric sheet. FIG. 12 is a plan view showing a dielectric sheet for individual electrodes in a modified capacitor, and FIG. 13 is a plan view showing a dielectric sheet for common electrodes corresponding to the sheet in FIG. 12. In the symbols used in the drawings, 1 is a dielectric sheet for individual electrodes, 2 is a dielectric sheet for common electrodes, 3 is a through hole, 4 is an individual electrode, 4b is a lead-out portion, 5 is a through hole, and 6 is a dielectric sheet for a common electrode. Common electrode, 6b is a lead-out portion, 18 is a solder resist insulating layer, 2
0 is a glass insulation coating layer.
Claims (1)
記複数の貫通孔を取り囲むように複数の個別電極が一生
面に設けられた個別電極用誘電体シートと、前記個別電
極用誘電体シートの貫通孔に対応する位置に貫通孔がそ
れぞれ設けられ且つ前記複数個の個別電極に対向する部
分を有する共通電極が一生面に設けられた共通電極用誘
電体シートとを交互に積み重ねて一体化し、複数の前記
個別電極用誘電体シートにおける同一貫通孔位置のそれ
ぞれの個別電極を共通に接続し、且つ複数の前記共通電
極用誘電体シートのそれぞれの共通電極を共通に接続し
た構成の積層貫通型コンテ゛ンサにおいて、 前記個別電極用誘電体シートの端縁に達する個別電極導
出部を有するように前記複数の個別電極をそれぞれ形威
し、前記個別電極導出部を設けた端縁に対して直交する
方向の前記共通電極用誘電体シートの端縁に達する共通
電極導出部を有し且つ前記共通電極用誘電体シートにお
ける前記複数の貫通孔を個々に又は共通に取り囲むパタ
ーンを有するように前記共通電極を形成したことを特徴
とする積層貫通型磁器コンテ゛ンサ。[Claims for Utility Model Registration] A dielectric material for individual electrodes, in which a plurality of through holes are arranged in a row at predetermined intervals, and a plurality of individual electrodes are provided on one surface so as to surround the plurality of through holes. A common electrode dielectric comprising: a sheet; and a common electrode provided on its entire surface with through holes provided at positions corresponding to the through holes of the individual electrode dielectric sheet and having a portion facing the plurality of individual electrodes. the individual electrodes at the same through-hole position in the plurality of individual electrode dielectric sheets are connected in common, and each of the plurality of common electrode dielectric sheets is In a laminated through-type capacitor having a configuration in which electrodes are connected in common, each of the plurality of individual electrodes is shaped so as to have an individual electrode lead-out portion that reaches an edge of the individual electrode dielectric sheet, and the individual electrode lead-out portion has a common electrode lead-out portion reaching an edge of the common electrode dielectric sheet in a direction perpendicular to the edge provided with the common electrode dielectric sheet, and the plurality of through holes in the common electrode dielectric sheet are individually or commonly 1. A through-layer ceramic capacitor, characterized in that the common electrode is formed to have a pattern surrounding the common electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12758479U JPS5930520Y2 (en) | 1979-09-14 | 1979-09-14 | Through-layer porcelain capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12758479U JPS5930520Y2 (en) | 1979-09-14 | 1979-09-14 | Through-layer porcelain capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5646245U JPS5646245U (en) | 1981-04-24 |
| JPS5930520Y2 true JPS5930520Y2 (en) | 1984-08-31 |
Family
ID=29359442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12758479U Expired JPS5930520Y2 (en) | 1979-09-14 | 1979-09-14 | Through-layer porcelain capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5930520Y2 (en) |
-
1979
- 1979-09-14 JP JP12758479U patent/JPS5930520Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5646245U (en) | 1981-04-24 |
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