JPS5928998B2 - How to attach electrical components without lead wires to a circuit board - Google Patents
How to attach electrical components without lead wires to a circuit boardInfo
- Publication number
- JPS5928998B2 JPS5928998B2 JP51088580A JP8858076A JPS5928998B2 JP S5928998 B2 JPS5928998 B2 JP S5928998B2 JP 51088580 A JP51088580 A JP 51088580A JP 8858076 A JP8858076 A JP 8858076A JP S5928998 B2 JPS5928998 B2 JP S5928998B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- silver
- solder
- electrode
- electrical components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、電気部品、特にリード線を有しない電気部品
の回路基板への取付方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for attaching electrical components, particularly electrical components without lead wires, to a circuit board.
従来例の構成とその問題点
従来からリード線を有しない電気部品は、その部品本体
の端面およびその端面近傍の上面、下面に銀や銀一パラ
ジウム等の銀系導体からなる電極部が設けられており、
その電極部が半田付けのためにコーティングされること
なく露出されたままの状態にある。Conventional Structure and Problems Traditionally, electrical components without lead wires have electrode portions made of a silver-based conductor such as silver or silver-palladium on the end surface of the component body and on the upper and lower surfaces near the end surface. and
The electrode portion remains exposed without being coated for soldering.
一般に、このようなリード線を有しない電気部品を回路
基板に取付ける場合、回路基板上に設けた導体箔にリー
ド線を有しない電気部品の電極部を対向せしめ、その導
体箔部と電極部とを半田付けによつて接合する。この時
、電極部を導体箔部に接触させその後上記電極部に半田
を盛り上がるように付着させるのが普通である。ところ
で、この場合、電極部はそのはとんどが半田によつて覆
われるが、半田の流れの関係で導体箔部との接触部やそ
の周辺はほとんど半田によつて覆われないことになる。
したがつて、電極部に銀または銀一パラジウム等の銀系
導体材料を用いたリード線を有しない電気部品を使用し
た場合には、電界をかけたとき回路基板の吸湿等によつ
て近隣する導体箔部との間で銀の移行現象が起り、電極
間の絶縁が著しく低下したりショートしたりすることが
あるなど多くの問題を有していた。すなわち、銀の移行
現象は銀系導体よりなる電極部が空気中にさらされて吸
湿し、その電極部に近隣する導体箔部との間に電位差が
あるときに発生し、電極部を構成する銀系導体中の銀が
近隣する導体箔部に向けて結晶成長して行き、この成長
した銀により近隣する導体箔部との間の絶縁低下やショ
ートを起こすのである。発明の目的
本発明の目的は、回路基板上に設けた導体箔に対してリ
ード線を有しない電気部品の電極部を対応せしめ、その
箇所における半田による接合を良好に行なうようにする
と共に上記電極部に銀、銀一パラジウム等の銀系導体を
用いた場合でも銀の移行現象によつて電極間の絶縁が低
下したりショートしたりすることがないようにすること
ができる電気部品の回路基板への取付方法を提供するこ
とにある。Generally, when attaching such an electrical component without lead wires to a circuit board, the electrode portion of the electrical component without lead wires is placed opposite to the conductor foil provided on the circuit board, and the conductor foil portion and the electrode portion are connected to each other. are joined by soldering. At this time, it is common to bring the electrode portion into contact with the conductive foil portion, and then apply solder to the electrode portion in a bulging manner. By the way, in this case, most of the electrode part is covered with solder, but due to the flow of solder, the contact part with the conductor foil part and its surroundings are hardly covered with solder. .
Therefore, when using an electrical component that does not have a lead wire and uses silver or silver-based conductor materials such as silver-palladium for the electrode part, when an electric field is applied, the circuit board may absorb moisture, etc. There have been many problems, such as a phenomenon in which silver migrates between the electrodes and the conductor foil, resulting in a significant reduction in the insulation between the electrodes and short circuits. In other words, the silver migration phenomenon occurs when an electrode part made of a silver-based conductor is exposed to the air and absorbs moisture, and when there is a potential difference between the electrode part and the neighboring conductor foil part, which makes up the electrode part. The silver in the silver-based conductor crystallizes toward the adjacent conductor foil portion, and this grown silver causes a decrease in insulation and short circuit between the adjacent conductor foil portions. OBJECTS OF THE INVENTION An object of the present invention is to make the electrode portion of an electrical component having no lead wire correspond to a conductive foil provided on a circuit board, and to perform good solder bonding at that point, and to A circuit board for electrical components that can prevent insulation between electrodes from decreasing or short-circuiting due to silver migration phenomenon even when silver-based conductors such as silver or silver-palladium are used in the parts. The purpose is to provide an installation method for
発明の構成
上記の目的を達成するため、本発明の電気部品の回路基
板への取付方法は、回路基板上の導体箔部に対向させた
リード線を有しない電気部品の電極部に半田が盛り上が
るように半田付けすることにより上記導体箔部と上記電
極部とを接合する前に、上記回路基板の導体箔部にペー
スト状半田層を形成し、このペースト状半田層によつて
上記電気部品の電極部における上記回路基板上の導体箔
部との接触部をも覆うようにしたことを特徴とするもの
である。Structure of the Invention In order to achieve the above object, the method of attaching an electrical component to a circuit board of the present invention is such that solder swells on the electrode portion of the electrical component that does not have a lead wire and is opposed to the conductor foil portion on the circuit board. Before joining the conductor foil part and the electrode part by soldering, a paste-like solder layer is formed on the conductor foil part of the circuit board, and the paste-like solder layer is used to bond the electrical component. The present invention is characterized in that the contact portion of the electrode portion with the conductor foil portion on the circuit board is also covered.
かかる構成によれば、上記電気部品の電極部は半田によ
つてすべてが覆われることになり、空気中にさらされて
吸湿することはなくなる。したがつて、近隣する導体箔
部との間に電位差があろうとも銀の移行現象に起因する
絶縁低下、シヨートが防止できる利点を有する。実施例
の説明
第1図乃至第6図は本発明の一実施例を示しており、第
1図乃至第6図において、1は回路基板、2,2はその
回路基板1の一方の主面側に形成された導体箔、3は前
記導体箔2,2の任意の箇所に印刷塗布されたペースト
状半田、4は前記回路基板1上にあつて前記導体箔2,
2の間隔内に印刷塗布された接着剤であり、たとえばエ
ポキシ系の熱硬化性接着剤を用いると有利である。According to this configuration, the electrode portions of the electrical components are completely covered with solder, and are no longer exposed to the air and absorb moisture. Therefore, even if there is a potential difference between adjacent conductor foil portions, there is an advantage that insulation deterioration and shorting caused by the silver migration phenomenon can be prevented. DESCRIPTION OF EMBODIMENTS FIGS. 1 to 6 show an embodiment of the present invention. In FIGS. 1 to 6, 1 is a circuit board, and 2 and 2 are one main surface of the circuit board 1. 3 is a paste-like solder printed and coated on any part of the conductor foils 2, 2; 4 is a conductor foil formed on the circuit board 1;
Advantageously, a thermosetting adhesive, for example of an epoxy type, is used.
5は前記回路基板1上に設けた導体箔2,2に対応する
ように配設されたリード線を有しない電気部品であり、
その棒状電気部品5の両端に形成した電極部6,6が前
記導体箔2,2に対応するように配設され、かつその導
体箔2,2上に形成したペースト状半田層3,3に対応
するように配設されている。Reference numeral 5 denotes an electrical component having no lead wire, which is arranged to correspond to the conductor foils 2, 2 provided on the circuit board 1,
The electrode portions 6, 6 formed at both ends of the rod-shaped electric component 5 are disposed so as to correspond to the conductor foils 2, 2, and are attached to the paste-like solder layers 3, 3 formed on the conductor foils 2, 2. arranged to correspond.
そして、前記のリード線を有しない電気部品5はその半
田付け以前に予じめ加熱され、熱硬化性の接着剤層4に
よつて回路基板1上に仮固定されている。このようにリ
ード線を有しない電気部品5は回路基板1上に配置され
、その後200数十度の温度で半田7,7付けによつて
電極部6,6が前記導体箔2,2に接合され、前記の回
路基板1上に取付け固定されるものである。The electrical component 5 having no lead wire is heated in advance before soldering and is temporarily fixed onto the circuit board 1 with a thermosetting adhesive layer 4. The electrical component 5 without lead wires is thus placed on the circuit board 1, and then the electrode parts 6, 6 are joined to the conductive foils 2, 2 by soldering 7, 7 at a temperature of 200-odd degrees. and is mounted and fixed on the circuit board 1 described above.
以上のように半田7,7付けによつて電極部6,6の上
方位置における電極部分6−A,6−Aが覆われ、かつ
その半田付け時に電極部6,6の下方位置における電適
部分6−B,6−Bがペースト状半田層3,3によつて
覆われるので、従来のように下方位置における電極部に
半田付けの際に半田が入り込まないという不都合もなく
、確実でかつ強固な半田接合ができるものである。As described above, the electrode parts 6-A, 6-A at the upper position of the electrode parts 6, 6 are covered by the soldering 7, 7, and the electrode parts 6-A, 6-A at the lower position of the electrode parts 6, 6 are covered by the soldering. Since the portions 6-B and 6-B are covered with the paste-like solder layers 3 and 3, there is no inconvenience that the solder does not get into the electrode portion at the lower position unlike the conventional method, and this is reliable and It allows for strong solder joints.
しかも下方位置における電極部分6−B,6−Bにおい
てはペースト状半田3,3層によつて半田ゴテによる半
田付け、あるいは自動半田付け等の半田付けの際に良好
な半田接合層を形成しており、りード線を有しない電気
部品5の電極部6,6が銀または銀−パラジウム等の銀
系電極であつたとしても電界が存在する場合に回路基板
1等の吸湿による銀の移行を防止することができ、電極
間の絶縁低下、シヨート等の不都合を無くすことができ
るものである。発明の効果
以上のように本発明によれば、回路基板の導体箔にペー
スト状半田層を形成しておき、これにリード線を有しな
い電気部品の電極部を対応せしめ、その後半田付けする
ものであるので、回路基板への電気部品の半田による接
合固定を著しく確実にかつ強固にすることができる。Moreover, in the electrode portions 6-B and 6-B at the lower position, the paste-like solder 3, 3 forms a good solder joint layer during soldering with a soldering iron or automatic soldering. Even if the electrode parts 6, 6 of the electrical component 5 without lead wires are silver or silver-based electrodes such as silver-palladium, silver migration due to moisture absorption in the circuit board 1 etc. occurs when an electric field is present. It is possible to prevent problems such as a decrease in insulation between electrodes and shorts. Effects of the Invention As described above, according to the present invention, a paste-like solder layer is formed on the conductor foil of a circuit board, and the electrode portion of an electrical component having no lead wire is made to correspond to this layer, and then soldered. Therefore, the connection and fixation of electrical components to the circuit board by soldering can be made extremely reliable and strong.
そして本発明によれば電気部品の電極部がペースト状半
田層と通常の半田によつて完全に覆われることになるた
め、その電極部が半田によりコーテイングされ、空気中
にさらされたとしても電極部自体が吸湿するようなこと
が少なくなり、もつて電極部を銀、銀パラジウム等の銀
系導体で構成した場合でも銀の移行現象が起らず、実用
上きわめて有利なものである。According to the present invention, the electrode part of the electrical component is completely covered with the paste solder layer and normal solder, so even if the electrode part is coated with solder and exposed to the air, The part itself is less likely to absorb moisture, and even when the electrode part is made of a silver-based conductor such as silver or silver-palladium, no silver migration phenomenon occurs, which is extremely advantageous in practice.
第1図は本発明のリード線を有しない電気部品の回路基
板への取付法に使用される回路基板の構成図、第2図は
同回路基板にペースト状半田層を形成した状態を示す図
、第3図は同回路基板に電気部品保持用の接着剤を形成
した状態を示す図、第4図は同回路基板にリード線を有
しない電気部品を仮固定した状態を示す図、第5図は第
4図の断面図、第6図は同回路基板にリード線を有しな
い電気部品を半田付けした状態を示す断面図である。
1・・・・・・回路基板、2・・・・・・導体箔、3・
・・・・・ペースト状半田層、4・・・・・・接着剤層
、5・・・・・・リード線を有しない電気部品、6・・
・・・・電極部、7・・・・・・半田。Fig. 1 is a configuration diagram of a circuit board used in the method of attaching electrical components without lead wires to a circuit board according to the present invention, and Fig. 2 is a diagram showing a state in which a paste-like solder layer is formed on the same circuit board. , FIG. 3 is a diagram showing a state in which an adhesive for holding an electrical component is formed on the same circuit board, FIG. 4 is a diagram showing a state in which an electrical component without a lead wire is temporarily fixed to the same circuit board, and FIG. This figure is a cross-sectional view of FIG. 4, and FIG. 6 is a cross-sectional view showing a state in which electrical components without lead wires are soldered to the same circuit board. 1... Circuit board, 2... Conductor foil, 3.
... Paste solder layer, 4 ... Adhesive layer, 5 ... Electrical component without lead wire, 6 ...
...Electrode part, 7...Solder.
Claims (1)
成し、このペースト状半田層にリード線を有しない電気
部品の電極部が対向するように上記電気部品を配置し、
その後、上記電極部を覆うように上記電極部と上記導体
箔を半田付けすることによつて上記電気部品の電極部を
半田コーティングすると共に上記電気部品を上記回路基
板に接合することを特徴とする電気部品の回路基板への
取付方法。1. Forming a paste-like solder layer on a conductive foil provided on a circuit board, and arranging the above-mentioned electrical component so that the electrode part of the electrical component without a lead wire faces the paste-like solder layer,
Thereafter, the electrode part and the conductive foil are soldered to cover the electrode part, thereby coating the electrode part of the electric component with solder and joining the electric part to the circuit board. How to attach electrical components to a circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51088580A JPS5928998B2 (en) | 1976-07-23 | 1976-07-23 | How to attach electrical components without lead wires to a circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP51088580A JPS5928998B2 (en) | 1976-07-23 | 1976-07-23 | How to attach electrical components without lead wires to a circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5314370A JPS5314370A (en) | 1978-02-08 |
JPS5928998B2 true JPS5928998B2 (en) | 1984-07-17 |
Family
ID=13946775
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51088580A Expired JPS5928998B2 (en) | 1976-07-23 | 1976-07-23 | How to attach electrical components without lead wires to a circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5928998B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54159667A (en) * | 1978-06-07 | 1979-12-17 | Matsushita Electric Ind Co Ltd | Method of mounting chippshaped circuit element |
JPS5552291A (en) * | 1978-10-12 | 1980-04-16 | Matsushita Electric Ind Co Ltd | Method of attaching chip circuit element |
JP2538280Y2 (en) * | 1990-01-30 | 1997-06-11 | フィグラ株式会社 | Writing material |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS496462A (en) * | 1972-05-10 | 1974-01-21 | ||
JPS5132958A (en) * | 1974-09-13 | 1976-03-19 | Sony Corp | FURATSUTOBONDODENSHIBUHIN NO KETSUGOHOHO |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49103543U (en) * | 1972-12-27 | 1974-09-05 |
-
1976
- 1976-07-23 JP JP51088580A patent/JPS5928998B2/en not_active Expired
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS496462A (en) * | 1972-05-10 | 1974-01-21 | ||
JPS5132958A (en) * | 1974-09-13 | 1976-03-19 | Sony Corp | FURATSUTOBONDODENSHIBUHIN NO KETSUGOHOHO |
Also Published As
Publication number | Publication date |
---|---|
JPS5314370A (en) | 1978-02-08 |
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