JPS5927230B2 - Rotary coating device - Google Patents
Rotary coating deviceInfo
- Publication number
- JPS5927230B2 JPS5927230B2 JP15891779A JP15891779A JPS5927230B2 JP S5927230 B2 JPS5927230 B2 JP S5927230B2 JP 15891779 A JP15891779 A JP 15891779A JP 15891779 A JP15891779 A JP 15891779A JP S5927230 B2 JPS5927230 B2 JP S5927230B2
- Authority
- JP
- Japan
- Prior art keywords
- turntable
- rotation speed
- substrate
- rotational speed
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
【発明の詳細な説明】
本発明ぱ回転塗布装置の性能の改良に関するものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to improvements in the performance of spin coating equipment.
フォトマスクや半導体装置の製造に於ては、写真蝕刻法
によりガラス基板或るいは半導体基板上に種々のパター
ン形成がなされるが、この写真蝕刻法に於ては各基板上
に形成せしめられるフォトレジスト膜の厚さを所望の値
に一定させることが、形成されるパターン精度の向上或
るいはパターン形成歩留まヤの向上に対して重要な点で
ある。In the production of photomasks and semiconductor devices, various patterns are formed on glass substrates or semiconductor substrates by photolithography. It is important to keep the thickness of the resist film constant at a desired value in order to improve the precision of formed patterns or the yield of pattern formation.
そして上記フォトレジスト膜を基板上に形成せしめるに
はスピンナーと称する回転塗布装置が用いられるが、従
来の回転塗布装置に於ては種類の異なる基板に塗布する
膜厚を一定にするために、塗布装置の到達回転回転数の
設定を変える方法が用いられていた。即ち従来の回転塗
布装置に於ては到達回転数を一定に設定した場合、同一
重量で同一寸法の被処理基板に対しては一定の厚さのフ
ォトレジスト膜を形成することができる。然し実際の製
造工程に於ては種々の重量或るいは種々の寸法を有する
被処理基板を同一回転塗布装置で処理する必要が度々生
ずる。このような際に一定の到達回転数設定で塗布を行
うと、重い被処理基板或るいは大きな被処理基板の場合
回転数の立ち上がヤが緩やかになヤ所望の値より厚い塗
膜が形成され、又軽い被処理基板或るいは小さい被処理
基板の場合は回転数の立ち土が力が速かになわ所望の値
より薄い塗膜が形成される。A rotary coating device called a spinner is used to form the above-mentioned photoresist film on the substrate, but in conventional rotary coating devices, in order to make the film thickness constant on different types of substrates, A method was used in which the setting of the ultimate rotational speed of the device was changed. That is, in a conventional rotary coating apparatus, when the number of revolutions reached is set constant, a photoresist film of a constant thickness can be formed on a substrate to be processed of the same weight and size. However, in actual manufacturing processes, it is often necessary to process substrates of various weights or sizes with the same rotary coating device. In such cases, if coating is performed at a fixed rotation speed setting, the rotation speed will rise slowly in the case of heavy or large substrates, resulting in a coating film that is thicker than the desired value. In addition, in the case of a light or small substrate to be processed, if the rotation speed is too high, a coating film that is thinner than the desired value may be formed.
従つて到達回転数の調節機能のみしか持たない従来の回
転塗布装置に於ては、各種被処理基板に対して回転数の
立ち上がわカーブを一定にして一定の塗布膜厚を得るた
めに、被処理基板の種類毎に一定の回転立ち上がわカー
ブが得られる到達回転数設定値を予備測定により決定し
て置き、実際の製造に際して被処理基板の種類に応じて
回転数の設定値を変えて塗布する方法が行われていた。
然しこのような方法は被処理基板の種類が多′ い場合
に操作が非常に煩雑になヤ、又設定ミスにより被処理基
板毎の塗布膜厚にばらつきを発生させ、フォトマスクや
半導体基板上に形成させるパターンの精度低下やパター
ン形成歩留まルの低下を招くという問題があつた。J
本発明は上記問題点に鑑み、回転数の設定変更を行わず
に種々の重量或るいは寸法を有する被処理基板に対して
一定の膜厚及び一定の表面状態を有する塗膜を形成せし
めることができる回転塗布装置を提供するものである。Therefore, in conventional rotary coating equipment that only has the function of adjusting the final rotational speed, it is necessary to keep the rise curve of the rotational speed constant and obtain a constant coating film thickness for various substrates to be processed. For each type of substrate to be processed, a set value of the rotational speed that can be achieved at a constant rotational rise curve is determined through preliminary measurements, and the set value of the rotational speed is determined according to the type of substrate to be processed during actual manufacturing. The method used was to change the coating method.
However, such a method is very complicated to operate when there are many types of substrates to be processed, and setting errors can cause variations in coating film thickness for each substrate to be processed, resulting in poor coating on photomasks and semiconductor substrates. There have been problems in that the accuracy of patterns formed during the process is lowered and the pattern formation yield is lowered. J
In view of the above problems, the present invention forms a coating film having a constant thickness and a constant surface condition on substrates to be treated having various weights or dimensions without changing the rotation speed setting. The present invention provides a spin coating device that can perform the following steps.
即ち本発明は回転塗布装置に於て、少なくともターンテ
ーブルと、直流電動機よ幻なる該ターンテーブルの駆動
手段と、該ターンテーブルの回転数を経時的に検出する
手段と、該ターンテーブルの回転数を標準回転数と比較
する手段と、該ターンテーブルの回転数の標準回転数に
対する正又は負の差を負又は正の直流電圧に変換して該
直流電動機の駆動電圧に付加する手段とを具備し、該タ
ーンテーブル上に搭載される被処理基板の重量、大きさ
、形状に関係なく該ターンテーブルの回転数の立上b特
性を自動的に一定の傾斜に保持する機能を有してなるこ
とを特徴とする。That is, the present invention provides a rotary coating apparatus that includes at least a turntable, a means for driving the turntable which is a DC motor, a means for detecting the number of rotations of the turntable over time, and a means for detecting the number of rotations of the turntable over time. means for comparing the rotation speed of the turntable with a standard rotation speed, and means for converting a positive or negative difference between the rotation speed of the turntable and the standard rotation speed into a negative or positive DC voltage and adding it to the drive voltage of the DC motor. and has a function of automatically maintaining the start-up b characteristic of the rotational speed of the turntable at a constant slope regardless of the weight, size, and shape of the substrate to be processed mounted on the turntable. It is characterized by
以下本発明を図示実施例により詳細に説明する。The present invention will be explained in detail below with reference to illustrated embodiments.
第1図は本発明の回転塗布装置に於ける一実施例のプロ
ツク図、第2図は本発明の回転塗布装置に於ける一実施
例の回転数立ち上が)カーブ図である。フオトマスク或
るいは半導体装置等の製造に於ける写真蝕刻工程に於て
、被処理基板上に塗布するフオトレジスト膜の厚さを各
基板に対して一定にそろえることは、フオトマスク或る
いは半導体装置に形成させるパターンの精度及びパター
ン形成歩留ま)を向上せしめる上に極めて重要なことで
ある。FIG. 1 is a block diagram of an embodiment of the rotary coating apparatus of the present invention, and FIG. 2 is a rotation speed rise curve diagram of an embodiment of the rotary coating apparatus of the present invention. In the photolithography process in the production of photomasks or semiconductor devices, it is important to make the thickness of the photoresist film applied to each substrate uniform on each substrate. This is extremely important for improving the precision of patterns formed and the pattern formation yield.
何故かなら例えばハードマスクを写真蝕刻によ)形成す
る際には、ブランク板上に通常5000X前後の厚さの
フオトレジスト膜を塗布形成し、露光現像を行つてブラ
ンク板土にフオトレジストによるエツチング用マスクパ
ターンを形成し、次いでエツチングを行つてブランク板
上の蔽光膜にマスクパターンを形成せしめるが、量産工
程に於ては同時に多数枚のブランク板をまとめて現像及
びエツチング処理しなければならない。このような場合
ブランク板毎にフオトレジスト膜厚の相異があると、フ
オトレジスト膜の薄いものにはハードマスクの遮光パタ
ーンにピンホール欠陥を生じ易く、又フオトレジスト膜
の厚いものにはハードマスクに遮光膜残査障害を発生し
勝ちなためである。然してブランク板等の被処理基板に
フオトレジスト膜を形成せしめる際には通常30C秒〕
程度の時間回転塗布がなされるが、膜厚及び表面状態は
回転数が立ち上がb状態を示している始動時から2〜3
〔秒〕程度の間に決定され、以後の時間はフオトレジス
ト膜に含まれる溶剤等の蒸発除去及び塗膜の安定化に使
われる。従つて重量及び寸法の異なる被処理基板に対し
ても同じ様な短時間内に塗膜の厚さを規定することが必
要であり、そのためには回転数の立ち上がジカープの傾
斜を一定にしなければならないことが実験的に確認され
ている。そこで本発明は被処理基板の種類に関係なく回
転塗布装置の設定回転数を標準回転数例えば3000C
r,p,m〕程度に一定して置き、回転数の立ち上がシ
の傾斜を標準の傾斜角度に制御する機能を具備せしめた
例えば第1図に示すような回転塗布装置を提供するもの
である。This is because, for example, when forming a hard mask by photolithography, a photoresist film with a thickness of about 5000X is usually coated on a blank board, exposed and developed, and the blank board is used for etching with the photoresist. A mask pattern is formed and then etched to form the mask pattern on the light-shielding film on the blank plate. However, in a mass production process, a large number of blank plates must be developed and etched at the same time. In such a case, if there is a difference in photoresist film thickness for each blank board, thin photoresist films are likely to cause pinhole defects in the light-shielding pattern of the hard mask, and thick photoresist films are likely to have hard mask defects. This is because the light-shielding film residue on the mask tends to cause problems. However, when forming a photoresist film on a substrate to be processed such as a blank board, it is usually 30 C seconds]
The coating is applied by rotation for about 2 to 3 hours, but the film thickness and surface condition change from the time of startup when the rotation speed rises and shows state b.
The time is determined to be approximately [seconds], and the subsequent time is used to evaporate and remove the solvent contained in the photoresist film and to stabilize the coating film. Therefore, it is necessary to specify the thickness of the coating film within a similar short time even for substrates having different weights and dimensions, and to do this, it is necessary to keep the slope of the rising dicarp constant at the rotation speed. It has been experimentally confirmed that this is necessary. Therefore, the present invention sets the rotation speed of the spin coating device to a standard rotation speed of 3000C, for example, regardless of the type of substrate to be processed.
r, p, m] and is equipped with a function of controlling the inclination of the rise of the rotational speed to a standard inclination angle, for example, as shown in Fig. 1. It is.
即本発明の回転塗布装置は発電素子2、時間計測器3、
A−Dコンバータ4、デジタルコンパレータ5、基準デ
ジタル入力装置6及びD−Aコンバータ7を有してなつ
ておジ、ブランク板等の被処理基板がセツトされるター
ンテーブル(回転ステージ)1の軸部に配設された発電
素子2で発生するアナログ電圧を時間計測器3によつて
指示される駆動開始から例えば0.2〔秒〕、0.4〔
秒〕、0.6〔秒〕等の時点で各々A−Dコンバータ4
によジデジタル電圧に変換してデジタルコンパレータ5
に送り込む。そして同じタイミングで基準デジタル入力
装置6からデジタルコンパレータ5に導入される各時点
の標準回転数に対応するデジタル電圧と比較し、差分の
電圧をD−Aコンバータ7によジアナログ電圧に変換し
、ターンテーブル1の回転数の立ち上がvが緩やかな場
合は正電圧を、急峻な場合は負電圧をターンテーブル1
駆動用の直流モータ3に附加する。このような操作が第
2図に示すように5〔吋〕の被処理基板に於ける立ち上
が)カーブBに対してはA,b及びcの3〔点〕程度で
正方向の修正がなされて、標準の4〔吋〕基板における
立ち土が)カーブAと平行せしめられ、又3〔吋〕被処
理基板に於ける立ち上がbカーブCに対してはa′,b
′及びc′の3〔点〕程度で負方向の修正がなされて標
準の立ち上が)カーブAと平行せしめられる。第2図に
於てRは回転数を表わし、tは時間を表わす。上記実施
例に於ては本発明の回転塗布装置を大きさの異なるフオ
トマスク用ブランク板へのフオトレジスト塗布に用いる
場合について説明したが、本発明の回転塗布装置は半導
体基板上への7オトレジスト膜の形成或るいはフオトマ
スク上への保護膜の形成の際にも同様に有効である。That is, the spin coating device of the present invention includes a power generating element 2, a time measuring device 3,
An axis of a turntable (rotary stage) 1, which has an A-D converter 4, a digital comparator 5, a reference digital input device 6, and a D-A converter 7, and on which a substrate to be processed, such as a blank board, is set. For example, the analog voltage generated by the power generating element 2 disposed in the section is 0.2 [seconds], 0.4 [seconds] from the start of driving indicated by the time measuring device 3.
[second], 0.6 [second], etc., the A-D converter 4
Convert to digital voltage and use digital comparator 5
send to. Then, at the same timing, it is compared with the digital voltage corresponding to the standard rotation speed at each point in time introduced from the reference digital input device 6 to the digital comparator 5, and the difference voltage is converted to a digital analog voltage by the D-A converter 7, and the If the rise of the rotation speed v of table 1 is gradual, apply a positive voltage, if it is steep, apply a negative voltage to the turntable 1.
It is attached to the DC motor 3 for driving. As shown in Figure 2, this operation corrects the curve B in the positive direction by about 3 points A, b, and c. The standard 4 [2] substrate is made parallel to the curve A, and the 3 [2] substrate is made parallel to the curve C by a', b.
' and c' are corrected in the negative direction by about three points to make them parallel to the standard (rise) curve A. In FIG. 2, R represents the number of revolutions and t represents time. In the above embodiments, the case where the spin coating apparatus of the present invention is used to coat photoresist onto blank plates for photomasks of different sizes has been described. It is similarly effective when forming a protective film on a photomask or forming a protective film on a photomask.
以上説明したように本発明の回転塗布装置に於ては、基
板の種類毎に設定回転数を変更することなく、重量及び
寸法の異る被処理基板に対し一定膜厚及び表面状態を有
する塗膜を形成せしめることができる。As explained above, the spin coating device of the present invention can coat substrates with a constant film thickness and surface condition on substrates of different weights and dimensions without changing the set rotation speed for each type of substrate. A film can be formed.
従つてフオトレジスト膜等の塗布作業が簡単になると共
に厚さの設定ミス等もなくなV1パターン形成精度及び
パターン形成歩留ま勺が向上するので、フオトマスク或
るいは半導体装置等の品質の向上、製造歩留ま幻の向上
に対して有効である。Therefore, the coating work of the photoresist film etc. becomes easier, and there is no error in setting the thickness, etc., and the V1 pattern formation accuracy and pattern formation yield are improved, so the quality of photomasks, semiconductor devices, etc. is improved. , is effective for improving manufacturing yield.
【図面の簡単な説明】
第1図は本発明の回転塗布装置に於ける一実施例のプロ
ツク図、第2図は本発明の回転塗布装置に於ける一実施
例の回転数立ち上がvカーブ図である。
図に於て1はターンテーブル、2は発電素子、3は時間
計測器、4はA−Dコンバータ、5はデジタルコーパレ
ータ、6は基準デジタル入力装置、7はD−Aコンバー
タ、8は直流モータ、Aは4〔吋〕基板の立ち上がりカ
ープ、Bは5〔吋〕基板の立ち上がvカーブ、Cは3〔
吋〕基板の立ち上がジカーブ、A,b,c,a/,b′
,c′は修正点、Rは回転数、tは時間を示す。[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is a block diagram of an embodiment of the spin coating device of the present invention, and Fig. 2 is a diagram showing the rotation speed rise v of an embodiment of the spin coating device of the present invention. It is a curve diagram. In the figure, 1 is a turntable, 2 is a power generating element, 3 is a time measuring device, 4 is an A-D converter, 5 is a digital coparator, 6 is a reference digital input device, 7 is a D-A converter, and 8 is a direct current Motor, A is 4 [inches] board rise curve, B is 5 [inches] board rise v curve, C is 3 [inches]
] Rising dicarb of the substrate, A, b, c, a/, b'
, c' is the correction point, R is the number of rotations, and t is the time.
Claims (1)
該ターンテーブルの駆動手段と、該ターンテーブルの回
転数を経時的に検出する手段と、該ターンテーブルの回
転数を標準回転数と比較する手段と、該ターンテーブル
の回転数の標準回転数に対する正又は負の差を負又は正
の直流電圧に変換して該直流電動機の駆動電圧に付加す
る手段とを具備し、該ターンテーブル上に搭載される被
処理基板の重量、大きさ、形状に関係なく該ターンテー
ブルの回転数の立上り特性を自動的に一定の傾斜に保持
する機能を有してなることを特徴とする回転塗布装置。1 at least a turntable, a drive means for the turntable such as a DC motor, means for detecting the rotational speed of the turntable over time, and means for comparing the rotational speed of the turntable with a standard rotational speed; and means for converting a positive or negative difference between the rotation speed of the turntable and the standard rotation speed into a negative or positive DC voltage and adding it to the drive voltage of the DC motor, and mounted on the turntable. A rotary coating apparatus having a function of automatically maintaining the rise characteristic of the rotational speed of the turntable at a constant slope regardless of the weight, size, and shape of the substrate to be processed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15891779A JPS5927230B2 (en) | 1979-12-07 | 1979-12-07 | Rotary coating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15891779A JPS5927230B2 (en) | 1979-12-07 | 1979-12-07 | Rotary coating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5681159A JPS5681159A (en) | 1981-07-02 |
JPS5927230B2 true JPS5927230B2 (en) | 1984-07-04 |
Family
ID=15682160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15891779A Expired JPS5927230B2 (en) | 1979-12-07 | 1979-12-07 | Rotary coating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5927230B2 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS599919A (en) * | 1982-07-08 | 1984-01-19 | M Setetsuku Kk | Applying method for photo-resist |
JPS5918633A (en) * | 1982-07-22 | 1984-01-31 | Toshiba Corp | Resist applying apparatus |
-
1979
- 1979-12-07 JP JP15891779A patent/JPS5927230B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5681159A (en) | 1981-07-02 |
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