JPS5927079Y2 - wiring board - Google Patents
wiring boardInfo
- Publication number
- JPS5927079Y2 JPS5927079Y2 JP18244379U JP18244379U JPS5927079Y2 JP S5927079 Y2 JPS5927079 Y2 JP S5927079Y2 JP 18244379 U JP18244379 U JP 18244379U JP 18244379 U JP18244379 U JP 18244379U JP S5927079 Y2 JPS5927079 Y2 JP S5927079Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- wiring
- insulated
- holes
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
本考案は配線板に関し、特に絶縁基板上に所望回路パタ
ーンの絶縁被覆導線を布線固着してなる高密度配線板に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a wiring board, and more particularly to a high-density wiring board formed by wiring and fixing insulated conductors in a desired circuit pattern on an insulating substrate.
近年絶縁基板上に必要に応じて銅箔導体パターンを形成
した上に、接着性を有する絶縁体層を介し、絶縁被覆導
線の所望回路パターンを布線固着した後、所望位置に貫
通孔を設け、その貫通孔内面に金属導体層を形成するこ
とにより、電気的に接続を行う配線板が検討されている
。In recent years, a copper foil conductor pattern has been formed on an insulating substrate as necessary, and a desired circuit pattern of insulated conductor wires has been wired and fixed via an adhesive insulator layer, and then through holes have been formed at desired positions. , a wiring board in which electrical connections are made by forming a metal conductor layer on the inner surface of the through hole is being considered.
一般に、この種の配線板には、次の様な特徴がある。Generally, this type of wiring board has the following characteristics.
信号回路として、絶縁被覆導線を使用するため、信号回
路が同一平面で交差することが可能であり、通常の印刷
配線板における表裏2面分のパターンを1面で収容する
ことができ、表裏接続用のスルーホールが不用となる。Since insulated conductors are used as signal circuits, the signal circuits can intersect on the same plane, and patterns for two sides of a normal printed wiring board can be accommodated on one side, making it possible to connect the front and back sides. Through-holes are no longer needed.
さらに、接続用のスルーホールが不用なために、配線径
路の決定に際し、使用可能なチャンネル数が増加し、配
線設計が容易となる。Furthermore, since through-holes for connection are not required, the number of channels that can be used increases when determining wiring routes, and wiring design becomes easier.
また、回路パターンの原画および写真類が不用であり、
ターンアラウンドタイムを短縮できる等である。In addition, original drawings and photographs of circuit patterns are not required.
For example, turnaround time can be shortened.
この種の従来配線板の一例を第1図乃至第2図を参照し
て以下に説明する。An example of this type of conventional wiring board will be described below with reference to FIGS. 1 and 2.
通常この種の配線板の製造は第1図aの如く、ガラス、
エポキシ等の絶縁基板1の上に必要に応じて例えば電源
層、接地層として使用できる様にパターン化した銅箔層
2を片面または両面に形成し、次に第1図すの如く、絶
縁基板1および銅箔層2に接して、接着性を有する絶縁
体層(以下接着性絶縁層と呼ぶ)3を両面に積層その他
の方法で、加圧し接着形成した後、第1図Cの如く、信
号回路として絶縁被覆導線4による所望回路パターンを
例えば数値制御式自動布線により接着性絶縁層3に布線
固着させ、さらに布線固着した絶縁被覆導線による回路
パターンを保護するために、例えば、ガラス、エポキシ
プリプレグを積層、接着することにより、絶縁性のカバ
一層5を形成する(第1図d参照)。Normally, this type of wiring board is manufactured using glass, as shown in Figure 1a.
A patterned copper foil layer 2 is formed on one or both sides of an insulating substrate 1 made of epoxy or the like so that it can be used, for example, as a power supply layer or a ground layer as required, and then as shown in Figure 1, the insulating substrate 1 and the copper foil layer 2, an insulating layer 3 having adhesive properties (hereinafter referred to as an adhesive insulating layer) 3 is laminated on both sides by laminating or other method to press and bond, as shown in FIG. 1C. A desired circuit pattern of the insulated conductor 4 as a signal circuit is wired and fixed to the adhesive insulating layer 3 by, for example, numerically controlled automatic wiring, and further, in order to protect the wired and fixed circuit pattern of the insulated covered conductor, for example, An insulating cover layer 5 is formed by laminating and bonding glass and epoxy prepreg (see FIG. 1d).
後工程でスルーホールを作る貫通孔内金属導体層を無電
解めっきで形成する場合には、記述した材料すなわち、
絶縁基板1、接着性絶縁層3、カバ一層5は通常無電解
めっきに対して触媒性を有する材料を使用し、更に、第
1図dの如く、カバ一層5の外表面に無電解めっきに対
して非触媒性のめつきマスク(以下めっきマスクと呼ぶ
)6を全面に形成し、第1図eの如く、所定の位置に絶
縁被覆導線4および銅箔層2を横切る様に貫通孔7を穿
設することにより、絶縁被覆導線4および銅箔層2の断
面を、貫通孔7の内面に露出させた後、無電解めっき液
に浸漬することにより、貫通孔7の内面めっき膜を形威
し、金属導体層8を形成してスルーホールとなし、第1
図fの如く、めっきマスク6を除去し、第2図の斜視図
に示す様な配線板とし、電気的接続を達成するものであ
った。When forming a metal conductor layer in a through hole by electroless plating to create a through hole in a later process, the materials described, i.e.,
The insulating substrate 1, the adhesive insulating layer 3, and the cover layer 5 are usually made of materials that have catalytic properties for electroless plating, and as shown in FIG. 1d, the outer surface of the cover layer 5 is coated with electroless plating. On the other hand, a non-catalytic plating mask (hereinafter referred to as a plating mask) 6 is formed on the entire surface, and as shown in FIG. The cross sections of the insulated conductor 4 and the copper foil layer 2 are exposed on the inner surface of the through hole 7 by drilling, and then the inner surface plating film of the through hole 7 is formed by immersing it in an electroless plating solution. Then, a metal conductor layer 8 is formed to form a through hole, and the first
As shown in FIG. f, the plating mask 6 was removed to form a wiring board as shown in the perspective view of FIG. 2, thereby achieving electrical connection.
一方、近年の高密度実装化の進展に伴い、この種の配線
板の配線収容性を更に増すため、配線板上で許容される
絶縁被覆導線の配線径路を細分化し、配線数を増加させ
る高密度配線板が使用されつつある。On the other hand, with the recent progress in high-density packaging, in order to further increase the wiring capacity of this type of wiring board, the wiring route of insulated conductor wires allowed on the wiring board has been subdivided, and the number of wires has increased. Density wiring boards are being used.
第3図は従来のこの種の高密度配線板の一例を示す配線
径路図であり、2.54mmピッチ配線の主格子9の交
点上に設けられた貫通孔7−7′間に絶縁被覆導線4が
2本設けられている。FIG. 3 is a wiring route diagram showing an example of a conventional high-density wiring board of this type, in which an insulated conductor is placed between through holes 7 and 7' provided at the intersection of the main grid 9 of 2.54 mm pitch wiring. Two pieces of 4 are provided.
この従来高密度配線板の配線径路設計の探索には、通常
コンピュータによる自動設計が適用され、第3図におい
ては、2.54mmピッチ配線の主格子9及び主格子9
を例えば5分割した0、508mmの副格子10のうち
、貫通孔7の外周で挾まれた副格子10′が配線チャネ
ルとして許容されている。Automatic design using a computer is usually applied to search for the wiring path design of this conventional high-density wiring board, and in FIG.
For example, among the sub-lattice 10 of 0.508 mm which is divided into five parts, the sub-lattice 10' sandwiched by the outer periphery of the through hole 7 is allowed as a wiring channel.
このように配線チャネル数を細分化し、絶縁被覆導線4
の配線密度を増加させることにより配線収容量を更に増
大させることが期待できる。In this way, the number of wiring channels is subdivided, and the number of insulated conductors is
It is expected that the wiring capacity can be further increased by increasing the wiring density.
しかし、この種の従来高密度配線板は、以下の欠点を有
していた。However, this type of conventional high-density wiring board has the following drawbacks.
即ち、配線チャネルが細分化されたため、第3図に示す
ように、絶縁被覆導線4と貫通孔7,7′同志の間隙が
小さくなり、その結果絶縁被覆導線4と貫通孔7の絶縁
抵抗が劣化し、最悪の場合は、短絡してしまうという現
象が確認された。That is, since the wiring channel is subdivided, the gap between the insulated conductor 4 and the through holes 7, 7' becomes smaller, as shown in FIG. 3, and as a result, the insulation resistance between the insulated conductor 4 and the through holes 7 is It was confirmed that the battery deteriorates, and in the worst case, it causes a short circuit.
この現象を解析した結果、絶縁被覆導線4と貫通孔7と
の間の絶縁抵抗が劣化した配線板では、先に述べた製造
工程中の貫通孔7の形成時の位置ずれ、絶縁被覆導線4
の布線固着時の位置ずれなどによる誤差が累積した結果
、絶縁被覆導線4と貫通孔7の間隙が非常に小さくなり
、貫通孔7の形成後のめつき前処理及びめっき工程など
の化学的な処理工程において、接着性絶縁層3、カバ一
層5を通して、化学薬品がしみこみその結果絶縁性が劣
化していることが確認できた。As a result of analyzing this phenomenon, it was found that in wiring boards where the insulation resistance between the insulated conductor 4 and the through hole 7 has deteriorated, there is a misalignment during the formation of the through hole 7 during the manufacturing process mentioned above, and the insulated conductor 4
As a result of accumulated errors due to misalignment during wiring fixation, the gap between the insulated conductor 4 and the through hole 7 becomes extremely small, and the chemical process such as the plating pretreatment and plating process after the formation of the through hole 7 becomes extremely small. It was confirmed that during the treatment process, chemicals penetrated through the adhesive insulating layer 3 and the cover layer 5, and as a result, the insulation properties deteriorated.
この種の従来配線板の欠点を解消する手段として、絶縁
被覆導線の直径を細くする方法、絶縁被覆導線同志の間
隔をせまくすること即ち、副格子10′のピッチ寸法を
小さくする方法などが考えられたが、前者は、現在、信
頼性が保証された範囲では0゜16mmあるいは0.1
4mm直径の絶縁被覆導線が限界であること。As a means to eliminate the drawbacks of this type of conventional wiring board, methods such as reducing the diameter of the insulated conductor wires, narrowing the distance between the insulated conductor wires, that is, reducing the pitch dimension of the sub-lattice 10' have been considered. However, the former is currently 0°16mm or 0.1mm within the range where reliability is guaranteed.
4mm diameter insulated conductor is the limit.
後者は、絶縁被覆導線の布線する間隔の最小ピッチに制
限があり、いづれも完全な手段ではなかった。In the latter method, there is a limit to the minimum pitch between the insulated conductor wires, and neither method is perfect.
本考案の目的は、この種従来配線板の欠点を解消した新
規な高密度配線に通した配線板を提供することにある。An object of the present invention is to provide a new high-density wiring board that eliminates the drawbacks of conventional wiring boards of this type.
本考案によれば、基板上に絶縁被覆導線を布線固着して
なる配線板において、その配線板上に設けられる絶縁被
覆導線を互に隣接する貫通孔ではさまれた間隙部で交差
配置させたことを特徴とする配線板が得られる。According to the present invention, in a wiring board formed by wiring and fixing insulated conductive wires on a board, the insulated conductive wires provided on the wiring board are arranged to cross each other in a gap between adjacent through holes. A wiring board is obtained.
以下、本考案を第4図を参照して説明する。The present invention will be explained below with reference to FIG.
第4図は、本考案の一実施例を示した平面図であり、基
板上に配置された絶縁被覆導線4,4′は互に隣接する
貫通孔7,7′ではさまれた間隙部で交差配置される。FIG. 4 is a plan view showing an embodiment of the present invention, in which insulated conductors 4 and 4' arranged on a substrate are arranged in a gap between adjacent through holes 7 and 7'. Cross-arranged.
基板上で貫通孔7,7′が設けられてない領域では、副
格子10′上に互に平行して配置された絶縁被覆導線4
,4′は、互に隣接配置された貫通7L7,7’の領域
を通過する時、まず屈曲点11で、互に屈曲され、絶縁
被覆導線4,4′の走る方向と垂直な主格子9上の位置
12で交差配置され、次いで主格子9の)ピッチの位置
13で再び屈曲される。In the area where the through holes 7, 7' are not provided on the substrate, the insulated conductive wires 4 are arranged parallel to each other on the sub-grid 10'.
, 4' pass through the area of the through holes 7L7, 7' arranged adjacent to each other, they are first bent to each other at the bending point 11, and the main lattice 9 is perpendicular to the running direction of the insulated conductors 4, 4'. It is crossed at the top position 12 and then bent again at the pitch position 13 (of the main grating 9).
引き続き貫通孔7,7′が存在する場合は、同様に絶縁
被覆導線4,4′を交差配置させる。If the through-holes 7, 7' still exist, the insulated conductive wires 4, 4' are similarly arranged to cross each other.
絶縁被覆導線4,4′の屈曲線11及び13、交差点1
2の位置は、主格子9、副格子9、副格子10′、貫通
孔7,7′の直径および絶縁被覆導線4,4′の直径に
よって最適値を選ぶ必要がある。Bend lines 11 and 13 of insulated conductors 4 and 4', intersection 1
It is necessary to select the optimum value for the position of 2 according to the diameters of the main grid 9, the sub-grid 9, the sub-grid 10', the through holes 7, 7', and the diameters of the insulated conductive wires 4, 4'.
この最適値は、絶縁被覆導線4,4′と貫通孔7,7′
の外周との間隙をなるべく大きくとる様にするが望まし
いことは勿論であるが、実験結果からは、この間隙は最
小値でQ、45mm程度にすればよいことが確認できて
いる。This optimum value is based on the insulated conductors 4, 4' and the through holes 7, 7'.
Of course, it is desirable to have as large a gap as possible between the outer periphery and the outer periphery, but experimental results have confirmed that this gap should be set to a minimum value of Q, about 45 mm.
例えば、実施例として貫通孔7,7′の直径がl、1m
m、主格子のピッチを2.54 mm(100ミル)、
副格子のピッチのうち貫通孔7,7′と絶縁被覆導線4
,4′との間かくを1.016mm(40ミル)、絶縁
被覆導線4,4′同志の間隔を0 、508 mm (
20ミル)絶縁被覆導線4,4′の直径を0.14mm
と、屈曲点11を副格子10′の貫通孔7゜7′に近い
側に一致させ、交差点12は、主格子9の÷ピッチ上に
設ける。For example, as an example, the diameter of the through holes 7, 7' is l, 1 m.
m, main grid pitch 2.54 mm (100 mil),
Among the pitches of the sub-grid, the through holes 7, 7' and the insulated conductor 4
, 4' is 1.016 mm (40 mil), and the distance between the insulated conductors 4 and 4' is 0.508 mm (
20 mil) The diameter of the insulated conductors 4 and 4' is 0.14 mm.
Then, the bending point 11 is made to coincide with the side of the sub-lattice 10' near the through hole 7.degree. 7', and the intersection point 12 is provided on the main grating 9 divided by the pitch.
また、屈曲点13は、主格子9の士ピッチのところで発
生させる。Further, the bending points 13 are generated at the center pitch of the main grating 9.
この様な場合、第3図に示す従来配線板では、絶縁被覆
導線4,4′と貫通孔7.7<の最小間隔は、およそQ
、4mmであり、本考案による実施例の第4図では、最
小間隔は、0.45mm以上にすることができる。In such a case, in the conventional wiring board shown in FIG. 3, the minimum distance between the insulated conductors 4, 4' and the through hole 7.7 is approximately Q
, 4 mm, and in FIG. 4 of the embodiment according to the invention, the minimum spacing can be 0.45 mm or more.
以上、本考案は、絶縁被覆導線の配線径路設計の際に、
コンピュータメモリ容量の増加を必要とすることなく、
かつ極めて簡便な手段で、絶縁特性を改善した高密度配
線を実現することができ、その効果は極めて大である。As described above, the present invention provides the following advantages when designing wiring routes for insulated conductors:
without the need for increased computer memory capacity.
Furthermore, it is possible to realize high-density wiring with improved insulation properties using extremely simple means, and the effect is extremely large.
なお、第4図で示される貫通孔7,7′、絶縁被覆導線
4,4′の直径、主格子9、副格子10.10’等の寸
法は、実施例に示される寸法に限定されるものでないこ
とは勿論である。Note that the dimensions of the through holes 7, 7', the diameters of the insulated conductors 4, 4', the main grid 9, the sub-grids 10, 10', etc. shown in FIG. 4 are limited to the dimensions shown in the examples. Of course, it is nothing.
第1図a−fは従来の配線板の製造工程を示す断面図、
第2図は第1図fの拡大斜視図、第3図は、従来の配線
板の配線径路を示す平面図、第4図は本考案による配線
板の配線径路を示す平面図。
1:基板、2:銅箔層、3:接着性絶縁層、4.4’
:絶縁被覆導線、5:カバ一層、6:めつきマスク、7
゜7′:貫通孔、8:金属導体層、9:主格子、10.
10’:副格子、11.13:(絶縁被覆導線の)屈曲
点、12:(絶縁被覆導線の)交差点。FIGS. 1 a-f are cross-sectional views showing the manufacturing process of a conventional wiring board;
2 is an enlarged perspective view of FIG. 1f, FIG. 3 is a plan view showing the wiring path of a conventional wiring board, and FIG. 4 is a plan view showing the wiring path of the wiring board according to the present invention. 1: Substrate, 2: Copper foil layer, 3: Adhesive insulating layer, 4.4'
: Insulated conductor, 5: Single layer cover, 6: Plating mask, 7
゜7': Through hole, 8: Metal conductor layer, 9: Main lattice, 10.
10': Sub-lattice, 11.13: Bend point (of the insulated conducting wire), 12: Intersection (of the insulated conducting wire).
Claims (1)
隣接する貫通孔で挾まれた間隙部を通過する複数の前記
絶縁被覆導線を交差させた領域を有することを特徴とす
る配線板。In a wiring board formed by wiring insulated conductor wires on a board,
A wiring board characterized by having a region where a plurality of the insulated conductive wires cross each other and pass through a gap between adjacent through holes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18244379U JPS5927079Y2 (en) | 1979-12-27 | 1979-12-27 | wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18244379U JPS5927079Y2 (en) | 1979-12-27 | 1979-12-27 | wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5699871U JPS5699871U (en) | 1981-08-06 |
JPS5927079Y2 true JPS5927079Y2 (en) | 1984-08-06 |
Family
ID=29692776
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18244379U Expired JPS5927079Y2 (en) | 1979-12-27 | 1979-12-27 | wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5927079Y2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0682925B2 (en) * | 1985-03-20 | 1994-10-19 | 株式会社日立製作所 | Printed wiring board |
-
1979
- 1979-12-27 JP JP18244379U patent/JPS5927079Y2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5699871U (en) | 1981-08-06 |
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