JPS5926604Y2 - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5926604Y2 JPS5926604Y2 JP7217579U JP7217579U JPS5926604Y2 JP S5926604 Y2 JPS5926604 Y2 JP S5926604Y2 JP 7217579 U JP7217579 U JP 7217579U JP 7217579 U JP7217579 U JP 7217579U JP S5926604 Y2 JPS5926604 Y2 JP S5926604Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- resin
- mounting hole
- resin material
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
本考案はねじ締付用取付部を有する樹脂モールド形半導
体装置の改良に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a resin molded semiconductor device having a mounting portion for screw tightening.
一般にこの種半導体装置は、例えば第１図〜第３図に示
すように、取付孔１を有する放熱板２に半導体素子３を
半田部材を用いて固定すると共に、半導体素子３の電極
とり一ド４とを金属細線５にて接続し、然る後半導体素
子３を含む主要部分を樹脂材６にて取付孔１に連通ずる
取付部７が形成されるようにモールド被覆して構成され
ている。In general, in this type of semiconductor device, as shown in FIGS. 1 to 3, a semiconductor element 3 is fixed to a heat sink 2 having a mounting hole 1 using a solder member, and one electrode and a 4 are connected with a thin metal wire 5, and then the main part including the semiconductor element 3 is molded and covered with a resin material 6 so as to form a mounting part 7 communicating with the mounting hole 1. .
ところで、この半導体装置は組立に際し、例えば第４図
に示すように、放熱板２とリード４とを同一金属部材よ
り打抜き加工してなるリードフレーが使用されているの
であるが、特に放熱板２はその一端がリード４によって
のみ支持されている関係で、組立工程においてピッチ乱
れを起し易い傾向にある。By the way, when assembling this semiconductor device, for example, as shown in FIG. 4, a lead frame is used in which the heat sink 2 and the leads 4 are punched out of the same metal member. Since one end of the lead 4 is supported only by the lead 4, pitch disturbance tends to occur during the assembly process.
従って、例えば樹脂材６によるモールド被覆工程におい
て、リードフレームをモールド金型にセットする際に、
放熱板２の取付孔１に位置決め及びフレーム固定用ピン
を挿入して行うようにしている。Therefore, for example, when setting the lead frame in the mold in the mold coating process with the resin material 6,
This is done by inserting positioning and frame fixing pins into the mounting holes 1 of the heat sink 2.
又モールド樹脂被覆時相脂材６が放熱板２の裏面に回り
込まないように押圧固定する必要がある。Further, it is necessary to press and fix the molded resin-coated resin material 6 so that it does not wrap around the back surface of the heat dissipation plate 2.
第５図はモールド樹脂材の被覆時に於ける上記ピンと放
熱板２との位置関係を第３図に対応した位置から見た図
である。FIG. 5 is a diagram showing the positional relationship between the pin and the heat sink 2 when covered with the molding resin material, viewed from a position corresponding to FIG. 3.
即ち、図に於いて８は下部金型、９は上部金型である。That is, in the figure, 8 is a lower mold, and 9 is an upper mold.
放熱板２は図示しないが上部金型９と下部金型８によっ
てそのリード部４が挟持されている。Although not shown in the drawings, the heat dissipating plate 2 has its lead portion 4 held between an upper mold 9 and a lower mold 8.
ピン１０は上部金型９を貫通していて、放熱板２の取付
孔１に挿入され放熱板２の位置決めに用いられる下端部
分の位置決め部１１と下端より放熱板２の厚み分だけ上
方の部分より放射状（同図では２方向）に延び放熱板２
を押圧固定する押圧部１２が一体に形成されている。The pin 10 passes through the upper mold 9, is inserted into the mounting hole 1 of the heat sink 2, and has a positioning portion 11 at the lower end used for positioning the heat sink 2, and a portion above the lower end by the thickness of the heat sink 2. The heat sink 2 extends radially (in two directions in the figure).
A pressing part 12 that presses and fixes is integrally formed.
しかしながら、このように構成された従来構造のピン１
０を用いて製造されるねじ締付孔を有する樹脂封止半導
体装置は、ねじの挿入される放熱板２の取付孔１の周辺
部分が露出した構造となり、この部分に金属屑やちり等
が付着して、ねじに触れる等して、放熱板２のシャッタ
ーなどの取付体への絶縁性を保つことが出来なくなると
いう欠点があった。However, the pin 1 of the conventional structure configured in this way
A resin-sealed semiconductor device having a screw tightening hole manufactured using 0 has a structure in which the peripheral part of the mounting hole 1 of the heat sink 2 into which the screw is inserted is exposed, and metal scraps, dust, etc. are exposed in this part. There was a drawback that the heat dissipating plate 2 could not maintain its insulation properties to the mounting body such as the shutter due to adhesion and touching the screws.
本考案は以上の点に鑑み提案されたもので、ねじ線用取
付孔周辺部に樹脂材の突起を設は放熱板の取付体への取
付時に於ける絶縁性の低下を防止できる半導体装置を提
供するものである。The present invention was proposed in view of the above points, and it is possible to prevent a semiconductor device from deteriorating insulating properties when installing a heat dissipation plate to a mounting body by providing projections of resin material around the screw wire mounting holes. This is what we provide.
以下本考案の実施例について図面を参照しつつ説明する
。Embodiments of the present invention will be described below with reference to the drawings.
第６図〜第８図において、２１は熱伝導性良好なる金属
部材より打抜き加工によって形成された放熱板であって
、それの一方の端部には取付孔２２が形成されている。In FIGS. 6 to 8, reference numeral 21 denotes a heat sink formed by punching from a metal member with good thermal conductivity, and a mounting hole 22 is formed in one end of the heat sink.
そして、放熱板２１の上面２１ ａには半導体素子２３
が半田部材を用いて固定されている。A semiconductor element 23 is mounted on the upper surface 21a of the heat sink 21.
is fixed using a solder member.
この半導体素子２３の電極は放熱板２１の他方の端部に
配設されたり一ド２４に対し、金属細線２５にて電気的
に接続されている。The electrode of this semiconductor element 23 is arranged at the other end of the heat sink 21 and electrically connected to the lead 24 by a thin metal wire 25.
そして、半導体素子２３を含む主要部分は樹脂材２６に
て、放熱板２１の取付孔２２に連通ずる取付部２７が形
成されるようにモールド被覆されている。The main portion including the semiconductor element 23 is molded and covered with a resin material 26 so that a mounting portion 27 communicating with the mounting hole 22 of the heat sink 21 is formed.
そして、取付部２７には樹脂材２６の上面より放熱板２
１の上面２１ａに達するくぼみ、すなわち放射状のスリ
ット２８が形成されており、取付孔２２の内壁面をモー
ルド被覆している樹脂被覆部分とスリット部分との境界
部分に境界壁として樹脂材２６の突起２９が形成されて
いる。A heat dissipation plate 2 is attached to the mounting portion 27 from the upper surface of the resin material 26.
A recess, that is, a radial slit 28, reaching the upper surface 21a of the mounting hole 22 is formed, and a projection of a resin material 26 is formed as a boundary wall at the boundary between the resin coating part that molds the inner wall surface of the mounting hole 22 and the slit part. 29 is formed.
次にこの半導体装置の樹脂モールド方法について第９図
を参照して説明する。Next, a resin molding method for this semiconductor device will be explained with reference to FIG.
第９図はモールド樹脂被覆時に於けるピンと放熱板２１
との位置関係を第８図に対応した位置から見た図である
。Figure 9 shows the pin and heat sink 21 when covered with molded resin.
FIG. 8 is a diagram showing the positional relationship between the two and the same as seen from a position corresponding to FIG.
先づ下部金型３０に放熱板２１を収納する。First, the heat sink 21 is housed in the lower mold 30.
そして上部金型３１を下降させ図示しないがリード２４
を上部金型３１と下部金型３０によって挾持する。Then, the upper mold 31 is lowered and the leads 24 are lowered (not shown).
is held between an upper mold 31 and a lower mold 30.
次に図示するように上部金型３１を貫通するピン３２を
下降させる。Next, as shown in the figure, the pin 32 passing through the upper mold 31 is lowered.
このピン３２はピン３２の下端に放熱板２１の取付孔２
２より小径の位置決め部３３が形成されており、この下
端より放熱板２１の厚み分だけ上部の部分より放射状（
同図では２方向）に押圧部３４．３４が形成されている
。This pin 32 is attached to the mounting hole 2 of the heat sink 21 at the lower end of the pin 32.
A positioning part 33 having a diameter smaller than 2 is formed, and a positioning part 33 is formed radially from the lower end of the upper part by the thickness of the heat dissipation plate 21 (
Pressing portions 34 and 34 are formed in two directions (in the figure).
押圧部３４の下端外周部には段部３５が形成されており
、さらに位置決め部３３周辺部に凹部３６が形成されて
いる。A step portion 35 is formed on the outer periphery of the lower end of the pressing portion 34, and a recess portion 36 is further formed around the positioning portion 33.
か・る構造のピン３２の下降によって位置決め部３３が
放熱板２１の取付孔２２に挿入される。The positioning portion 33 is inserted into the mounting hole 22 of the heat sink 21 by lowering the pin 32 having such a structure.
そして位置決め部３３の下端が下部金型３０に当接され
ると、押圧部３４の段部３５によって放熱板２１の上面
２１ ａが押圧固定される。When the lower end of the positioning part 33 comes into contact with the lower mold 30, the upper surface 21a of the heat sink 21 is pressed and fixed by the stepped part 35 of the pressing part 34.
この状態に於いて、下部金型３０と上部金型３１とによ
って構成されたキャビティに樹脂材を注入することによ
り第６図〜第８図に示す半導体装置を得る。In this state, a resin material is injected into the cavity formed by the lower mold 30 and the upper mold 31 to obtain the semiconductor device shown in FIGS. 6 to 8.
このように上部金型３１を貫通して上下するピン３２に
は、放熱板２１の上面２１ ａを押圧固定する押圧部３
４の段部３５の位置決め部３３周辺部に凹部３６が形成
されているので、ねじ取付部２７に連通する放熱板２１
の取付孔２２の内壁面をモールド被覆している樹脂材と
の境界部分に樹脂材の突起２９が形成される。The pin 32 that passes through the upper mold 31 and moves up and down has a pressing portion 3 that presses and fixes the upper surface 21a of the heat sink 21.
Since the recess 36 is formed around the positioning part 33 of the stepped part 35 of No. 4, the heat dissipation plate 21 communicating with the screw attachment part 27
A resin protrusion 29 is formed at the boundary with the resin material mold-covering the inner wall surface of the mounting hole 22 .
従って、放熱板２１をシャーシ等の取付体に固定する際
に、放熱板２１の露出する放射状のスリット２８に金属
屑やちり等が付着しても挿入されるねじに触れることが
なくなるので放熱板２１のシャーシ等の取付体への絶縁
性を保つことが出来る。Therefore, when fixing the heat sink 21 to a mounting body such as a chassis, even if metal chips or dust adhere to the exposed radial slits 28 of the heat sink 21, they will not come into contact with the screws to be inserted. It is possible to maintain insulation to the mounting body such as the chassis of No. 21.
尚、本考案は上記実施例に制約されることなく例えば、
ピン３２の突出部３４による生ずるくぼみのスリット２
８は二方向に限らず単−又は多数の方向に伸びるスリッ
トでもよく適宜に設定できる。Note that the present invention is not limited to the above-mentioned embodiments, and may include, for example,
Slit 2 of the depression created by the protrusion 34 of the pin 32
The slit 8 is not limited to two directions, but may be a slit extending in a single direction or in multiple directions, and can be set as appropriate.
又取付部は円形の他、角形にも形成することもできる。Further, the mounting portion can be formed not only in a circular shape but also in a rectangular shape.
以上のように本案によれば、放熱板の取付体への取付時
における絶縁性の低下を確実に防止出来る。As described above, according to the present invention, it is possible to reliably prevent the insulation from deteriorating when the heat sink is attached to the mounting body.
第１図は従来例の要部破断平面図、第２図は第１図のＩ
Ｉ −ＩＩ線より見た断面図、第３図は第１図のＩＩＩ
−ＩＩＩ線から見た断面図、第４図はリードフレームの
平面図、第５図は第１図の製造過程で樹脂被覆工程の説
明図、第６図は本考案の一実施例を示す要部破断平面図
、第７図は第６図のＶｌｌ−Ｖｌｌ線より見た断面図、
第８図は第６図の■−■線より見た断面図、及び第９図
は第６図の製造過程で樹脂被覆工程の説明図である。
２１・・・・・・放熱板、２２・・・・・・取付孔、２
３・・・・・・半導体素子、２６・・・・・・樹脂材、
２７・・・・・・取付部、２８・・・・・・スリット、
２つ・・・・・・樹脂材の突起。Figure 1 is a cutaway plan view of the main parts of the conventional example, and Figure 2 is the I of Figure 1.
A cross-sectional view taken along line I-II, Figure 3 is III in Figure 1.
4 is a plan view of the lead frame, FIG. 5 is an explanatory diagram of the resin coating process in the manufacturing process of FIG. 1, and FIG. 6 is a diagram showing an embodiment of the present invention. A partially broken plan view, FIG. 7 is a sectional view taken from the Vll-Vll line in FIG. 6,
FIG. 8 is a sectional view taken along the line ■--■ in FIG. 6, and FIG. 9 is an explanatory diagram of the resin coating step in the manufacturing process of FIG. 6. 21... Heat sink, 22... Mounting hole, 2
3... Semiconductor element, 26... Resin material,
27...Mounting part, 28...Slit,
Two...Protrusions of resin material.
Claims (1)
周辺の樹脂材に放射状のスリット及びこのスリットに境
界部分を形成する突起を設けたことを特徴とする樹脂封
止形半導体装置。1. A resin-sealed semiconductor device characterized in that the periphery of a mounting hole of a heat dissipation plate is covered with a resin, and the resin material surrounding the mounting hole is provided with radial slits and projections forming boundaries between the slits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7217579U JPS5926604Y2 (en) | 1979-05-28 | 1979-05-28 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7217579U JPS5926604Y2 (en) | 1979-05-28 | 1979-05-28 | semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55173146U JPS55173146U (en) | 1980-12-12 |
| JPS5926604Y2 true JPS5926604Y2 (en) | 1984-08-02 |
Family
ID=29305844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7217579U Expired JPS5926604Y2 (en) | 1979-05-28 | 1979-05-28 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5926604Y2 (en) |
-
1979
- 1979-05-28 JP JP7217579U patent/JPS5926604Y2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55173146U (en) | 1980-12-12 |
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