JPS5924538A - Heat pipe and its manufacture - Google Patents

Heat pipe and its manufacture

Info

Publication number
JPS5924538A
JPS5924538A JP57133262A JP13326282A JPS5924538A JP S5924538 A JPS5924538 A JP S5924538A JP 57133262 A JP57133262 A JP 57133262A JP 13326282 A JP13326282 A JP 13326282A JP S5924538 A JPS5924538 A JP S5924538A
Authority
JP
Japan
Prior art keywords
heat pipe
silver
wick
container
oxygen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57133262A
Other languages
Japanese (ja)
Inventor
Kumio Yoshizumi
吉住　久美雄
Isao Totsuka
戸塚　勲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Radio Co Ltd
Nihon Musen KK
Original Assignee
Japan Radio Co Ltd
Nihon Musen KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Radio Co Ltd, Nihon Musen KK filed Critical Japan Radio Co Ltd
Priority to JP57133262A priority Critical patent/JPS5924538A/en
Publication of JPS5924538A publication Critical patent/JPS5924538A/en
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Powder Metallurgy (AREA)

Abstract

PURPOSE:To manufacture a heat pipe low in thermal resistance by performing eutectic alloy brazing between wick materials, and the wick materials and the inner wall of a container by using a metal different from a ground metal. CONSTITUTION:A silver adhesion layer 4 of about 2-3mum thickness is formed on the surface of wicks 2 made of oxygen-free copper grains and on the surface of an oxygen-free copper container 1 on which the wicks 2 are adhered by plating, vapor deposition, etc. By treating this in a furnace of reducing atmosphere at about 900 deg.C, Silver is diffused on the surface of oxygen-free copper, and eutectic alloy layers with silver are formed on the surface of copper grains. Thus, it becomes a sintered wick structure having intervening silver, high in porosity, high in heat conductivity to the container material 1, and a highly efficient heat pipe is obtained.

Description

【発明の詳細な説明】 本発明はヒートパイプとその製造方法に関するゝもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat pipe and a method for manufacturing the same.

従来のヒートパイプの構造は一般に第１図に示すように
コンテナ１の内壁にウィック２を設はスプリング状のウ
ィック押え３によりウィック２をコンテナ１の内壁に押
え伺けた構造であり。The structure of a conventional heat pipe is generally such that a wick 2 is provided on the inner wall of a container 1, and the wick 2 is held against the inner wall of the container 1 by a spring-like wick retainer 3, as shown in FIG.

のコンテナ１内のガスを排出した後、適量の作動流体を
封入したものである。After the gas in the container 1 is discharged, an appropriate amount of working fluid is sealed.

このような構造ではコンテナｌの内壁にウィック層をあ
るピンチ間隔を持ったスプリング状のウィック押え金具
３の内部応力により圧着１２ているので、ウィック押え
金具３の接触している面だけ機械的応力が加わり９局部
的な接触となるためその他の部分は非接触となる。ヒー
トパイプのウィック構造は作動液の環流を毛細管力によ
り移動させる働きと、蒸発部での作動液への熱伝達量を
大きくするために接触面積を大きくする必要があり、ウ
ィック層への伝導による熱の供給がヒートパイプの熱抵
抗特性を左右し例するので従来法においては非常に効率
が悪いという欠点があった。In this structure, the wick layer is crimped 12 on the inner wall of the container l by the internal stress of the spring-like wick retainer 3 with a certain pinch interval, so only the surface in contact with the wick retainer 3 is subjected to mechanical stress. 9 is added, resulting in local contact, and other parts are non-contact. The wick structure of a heat pipe has the function of moving the circulating flow of the working fluid by capillary force, and it is necessary to increase the contact area in order to increase the amount of heat transferred to the working fluid in the evaporation section, and the heat pipe is heated by conduction to the wick layer. Since the supply of heat affects the thermal resistance characteristics of the heat pipe, the conventional method has the drawback of being extremely inefficient.

本発明はこれらの欠点を除去するためにヒートパイプの
コンテナとウィック及びウィックの粒子と粒子を共晶合
金法により溶着固定に、ヒートハイプの熱抵抗を大巾に
減少せしめることを目的としたものである。The present invention aims to eliminate these drawbacks by welding and fixing the container and the wick of the heat pipe and the particles of the wick using a eutectic alloy method, thereby greatly reducing the thermal resistance of the heat pipe. be.

次に本発明によるヒートパイプの製造方法の１例を第２
〜４図を用いて詳細に説明する。Next, a second example of the method for manufacturing a heat pipe according to the present invention will be described.
This will be explained in detail using FIGS.

本発明では一般的なヒートパ・ｒブ構成材料として実績
のある銅と水の糺合わせに於ける〜実施例について説明
する。In the present invention, an example will be described in which copper and water are bonded together, which has been used as a general heat pump/rub component material.

大間で無酸素銅コンテナ１にウィックを固着する面と１
６〜２０メツシュ粒度の無酸素銅粒２０表面に銀メッキ
や蒸着等により２〜３μｍの銀付着Ｎ４を形成させたも
のである。。The surface of fixing the wick to the oxygen-free copper container 1 in Oma and 1
Silver deposits N4 of 2 to 3 μm are formed on the surface of oxygen-free copper grains 20 with a mesh size of 6 to 20 by silver plating, vapor deposition, or the like. .

一般に銅と銀２系成分の間にはその比率により合金が形
成される温度と、その組成による結晶状態が第５図に示
す如く知られている。従って銅の微少球の表面に薄い銀
層を生成し、これを９００℃の環元雰囲気中に数１０分
間放置すると、無酸素銅表面に銀が拡散していくと同時
に銀との共晶合金層が銅粒の表面に形成され１間に銀を
介した第４図に示す様な気孔率が大きく。In general, the temperature at which an alloy is formed depending on the ratio between copper and silver and the crystalline state depending on the composition are known as shown in FIG. Therefore, if a thin silver layer is formed on the surface of copper microspheres and left in a cyclic atmosphere at 900°C for several tens of minutes, silver will diffuse onto the oxygen-free copper surface and at the same time form a eutectic alloy with silver. A layer is formed on the surface of the copper grains and has a large porosity as shown in FIG. 4 with silver interposed between them.

かつコンテナ拐との熱伝導率の良い焼結ウィック構造が
出来る。In addition, a sintered wick structure with good thermal conductivity with the container can be created.

以上説明したように本発明によれば、熱伝達の良好な共
晶合金ロー伺により、金属同志を融ジによりウィックの
気孔率の増ＪＪ１１１４より毛細管熱輸送量の増加が計
れる。As explained above, according to the present invention, the amount of capillary heat transport can be increased by increasing the porosity of the wick by melting metals together due to the eutectic alloy alloy having good heat transfer.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のヒートパイプの切欠断面図。 第２図は本発明によるヒートパイプの切欠断面図、第３
図および第４図は本発明によるヒートパイプの一部切欠
拡太図を示す。 】・・・・・・コンテナ　２・・・・　ウィック特　許
　出　願　人　日本無線株式会社！量パーセット Ａ９Ｃｕ 照　多量 千にヅじ袖正書 昭和５７年／６月！７日 特Ｆｆｌ−？長′口　　　殿 １事ｆｌの成牛　　昭和５７年　特訂願第１３３Ｚ〆Ｚ
号２発明′の名称　に−トノＶイア１・よびそ０．秋繕
疾方〉大；３袖ＩＴ−８をする者 事件との関係　％許出願人Figure 1 is a cutaway sectional view of a conventional heat pipe. FIG. 2 is a cutaway sectional view of the heat pipe according to the present invention, and FIG.
FIG. 4 shows an enlarged partially cutaway view of a heat pipe according to the present invention. ]... Container 2... Wick patent applicant Japan Radio Co., Ltd.! Quantity Perset A9Cu Teru Quantity Thousand Nizuji Sode Seisho June 1980! 7th special Ffl-? Nagaguchi Tono 1st Fl Adult Cow 1981 Special Edition Request No. 133Z〆Z
Name of invention No. 2 - TonoVia1・Yobiso0. Relationship with the case of the person who wears three-sleeved IT-8 % Applicant

Claims (2)

【特許請求の範囲】[Claims] （１）　　コンテナの内壁にロー付によりウィックを固
着したことを特徴とするヒートパイプ。(1) A heat pipe characterized by having a wick fixed to the inner wall of a container by brazing. （２）　　第１項記載のヒートパイプにおいて、ウィッ
クを構成する材料間およびウィック相とコンテナ拐とを
地金金属と異種の金属層を高温炉に入れ、共晶合金法に
より固着することを特徴とするヒートパイプの製造方法
。(2) The heat pipe described in item 1 is characterized in that the materials constituting the wick and the wick phase and the container layer are bonded together by placing the base metal and different metal layers in a high-temperature furnace and using a eutectic alloy method. A method for manufacturing a heat pipe.
JP57133262A 1982-07-30 1982-07-30 Heat pipe and its manufacture Pending JPS5924538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57133262A JPS5924538A (en) 1982-07-30 1982-07-30 Heat pipe and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57133262A JPS5924538A (en) 1982-07-30 1982-07-30 Heat pipe and its manufacture

Publications (1)

Publication Number Publication Date
JPS5924538A true JPS5924538A (en) 1984-02-08

Family

ID=15100499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57133262A Pending JPS5924538A (en) 1982-07-30 1982-07-30 Heat pipe and its manufacture

Country Status (1)

Country Link
JP (1) JPS5924538A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0806620A2 (en) * 1996-05-03 1997-11-12 Matra Marconi Space Uk Limited Capillary evaporator
WO2005005903A2 (en) * 2003-06-26 2005-01-20 Thermal Corp. Brazed wick for a heat transfer device and method of making same
WO2005006395A3 (en) * 2003-06-26 2005-04-28 Thermal Corp Heat transfer device and method of making same
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
WO2005108897A2 (en) * 2004-04-21 2005-11-17 Thermal Corp Heat transfer device and method of making same
US8356658B2 (en) * 2006-07-27 2013-01-22 General Electric Company Heat transfer enhancing system and method for fabricating heat transfer device
CN103353248A (en) * 2013-07-08 2013-10-16 昆山德泰新材料科技有限公司 Flat type heat pipe and manufacturing method thereof
CN103353249A (en) * 2013-07-08 2013-10-16 昆山德泰新材料科技有限公司 Eccentric metal pipe
CN104930888A (en) * 2014-03-18 2015-09-23 江苏格业新材料科技有限公司 Method for manufacturing miniature heat pipe by employing ultrathin foamed silver as wick

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0806620A3 (en) * 1996-05-03 1998-12-16 Matra Marconi Space Uk Limited Capillary evaporator
US6241008B1 (en) 1996-05-03 2001-06-05 Matra Marconi Space Uk, Ltd. Capillary evaporator
EP0806620A2 (en) * 1996-05-03 1997-11-12 Matra Marconi Space Uk Limited Capillary evaporator
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US7028760B2 (en) * 1999-05-12 2006-04-18 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US7137443B2 (en) 2003-06-26 2006-11-21 Thermal Corp. Brazed wick for a heat transfer device and method of making same
WO2005005903A3 (en) * 2003-06-26 2005-07-28 Thermal Corp Brazed wick for a heat transfer device and method of making same
US6994152B2 (en) * 2003-06-26 2006-02-07 Thermal Corp. Brazed wick for a heat transfer device
US7028759B2 (en) * 2003-06-26 2006-04-18 Thermal Corp. Heat transfer device and method of making same
WO2005006395A3 (en) * 2003-06-26 2005-04-28 Thermal Corp Heat transfer device and method of making same
WO2005005903A2 (en) * 2003-06-26 2005-01-20 Thermal Corp. Brazed wick for a heat transfer device and method of making same
WO2005108897A2 (en) * 2004-04-21 2005-11-17 Thermal Corp Heat transfer device and method of making same
WO2005108897A3 (en) * 2004-04-21 2006-01-05 Thermal Corp Heat transfer device and method of making same
US8356658B2 (en) * 2006-07-27 2013-01-22 General Electric Company Heat transfer enhancing system and method for fabricating heat transfer device
CN103353248A (en) * 2013-07-08 2013-10-16 昆山德泰新材料科技有限公司 Flat type heat pipe and manufacturing method thereof
CN103353249A (en) * 2013-07-08 2013-10-16 昆山德泰新材料科技有限公司 Eccentric metal pipe
CN104930888A (en) * 2014-03-18 2015-09-23 江苏格业新材料科技有限公司 Method for manufacturing miniature heat pipe by employing ultrathin foamed silver as wick

Similar Documents

Publication Publication Date Title
US6896039B2 (en) Integrated circuit heat pipe heat spreader with through mounting holes
US7124809B2 (en) Brazed wick for a heat transfer device
JP2630790B2 (en) Ceramic abrasive particles coated with multiple layers
US7637982B2 (en) Method for making wick structure of heat pipe and powders for making the same
JPS5924538A (en) Heat pipe and its manufacture
RU2004104336A (en) HYDROPROFILE EVAPORATION SURFACE FOR A HEAT EXCHANGER, METHOD FOR PRODUCING A HEAT EXCHANGER AND COMPOSITION FOR FORMING SUCH SURFACE
US3659861A (en) Particulate coating for the rubbing seal of a gas turbine regenerator
US2974404A (en) Heat exchanger matrix
US20100319895A1 (en) Heat spreader structure and method of manufacturing the same
CN101578030B (en) Heat dissipation structure and manufacturing method thereof
JPH02106079A (en) Electricity heat conversion element
JPH1084140A (en) Thermo-electric converter and manufacture thereof
JP3684440B2 (en) Heat sink and manufacturing method thereof
JPS616428A (en) Ceramics slider
CN201499412U (en) Radiating structure
JPS59125396A (en) Heat exchanger
JPS59220350A (en) Porous heat-resisting composite body
JPH09172202A (en) Thermoelectric element
JPS5938509B2 (en) Heat pipe manufacturing method
JPS6010674A (en) Manufacture of semiconductor element
JPH01209730A (en) Electrode structure of semiconductor device
Bogowitz et al. Improved brazing technique for pyrolytic graphite
JPS60125364A (en) Coating method by thermal spraying and meltdiffusion
JPS6353693B2 (en)
JPS55123135A (en) Substrate for semiconductor element