JPS59218291A - Laser working device - Google Patents

Laser working device

Info

Publication number
JPS59218291A
JPS59218291A JP58091864A JP9186483A JPS59218291A JP S59218291 A JPS59218291 A JP S59218291A JP 58091864 A JP58091864 A JP 58091864A JP 9186483 A JP9186483 A JP 9186483A JP S59218291 A JPS59218291 A JP S59218291A
Authority
JP
Japan
Prior art keywords
laser beam
laser
reflecting mirror
brightness
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58091864A
Other languages
Japanese (ja)
Inventor
Hisayuki Sakuma
佐久間　久幸
Toshiyuki Kobayashi
利行 小林
Susumu Hoshinouchi
星之内　進
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58091864A priority Critical patent/JPS59218291A/en
Publication of JPS59218291A publication Critical patent/JPS59218291A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To perform easily laser welding with high accuracy by measuring the luminance of the plasma generated when a laser beam is irradiated to the surface of an object to be worked and matching automatically the positions of the joint part of the object and the laser beam then performing welding. CONSTITUTION:The greater part of a laser beam 2 from an oscillator 1 is irradiated via a partially reflecting mirror 13, a totally reflecting mirror 3 and a condenser lens 4 to the joint part of an object 6 to be worked by which the work is welded. On the other hand, the laser beam 2 of a low output passed partly through the mirror 13 is irradiated via a totally a by reflecting mirror 14, a condenser lens 15 and a totally reflecting mirror 16 to the surface of the object 6. The plasma having the luminance proportional to the output density of the beam 2 is generated in this stage. the luminanace of the plasma is electrically measured with a photosensor 18 and a luminance measuring device 17 and is compared with a set value by a control device 19. The extent of the movement of a scanning base 9 is operated in accordance with the signal for said difference and a motor 10 is operated to move the base 9 thereby setting automatically the irradiating position of the beam 2 for welding to the joint part of the object 6.

Description

【発明の詳細な説明】 この発明は、２個の被加工物の端面を突き合わせた継手
部のレーザ溶接において、被加工物の溶接線を自動調整
して検出する装置を有するレーザ加工装置に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a laser processing device having a device that automatically adjusts and detects the weld line of the workpieces during laser welding of a joint where the end surfaces of two workpieces butt each other. It is.

従来この種のレーザ加工装置としては、第１図に示すも
のがあった。第１図は従来のレーザ加工装置を示す一部
断面構成図である。図において、１はレーザビーム２を
発生するレーザ発振器、２はレーザ発振器１より出力さ
れたレーザビーム、３はレーザビーム２の方向を変える
全反射鏡、４はレーザビーム２を集束する集光レンズ、
５は加工ヘッド、６は被加工物、７は被加工物６を支持
する加工台、８は加工台７を移動する駆動モータである
。A conventional laser processing apparatus of this type is shown in FIG. FIG. 1 is a partial cross-sectional configuration diagram showing a conventional laser processing apparatus. In the figure, 1 is a laser oscillator that generates a laser beam 2, 2 is a laser beam output from the laser oscillator 1, 3 is a total reflection mirror that changes the direction of the laser beam 2, and 4 is a condenser lens that focuses the laser beam 2. ,
5 is a processing head, 6 is a workpiece, 7 is a processing table that supports the workpiece 6, and 8 is a drive motor that moves the processing table 7.

次に１上記第１図の動作について説明する。レーザ発振
器１から放出されたレーザビーム２は、被加工物６に対
して垂直に照射されるべく全反射鏡３により折曲される
。その後、レーザビーム２け、集光レンズ４にょル小さ
なスポット径に集束され、加工ヘッド５を通過して被加
工物６の継手部に照射されることにより溶接に供せられ
る。加工ヘッド５には必要に応じてシールドガスが導入
され、被加工物６へ噴射される。ここで、被加工物６の
継手部と集束されたレーザビーム２とを一致させるため
に、低出方のレーザビーム２を被加工物６に照射して、
その溶融した痕跡によシ継手部とレーザビーム２との位
置関係を確認し、その都度、継手部とレーザビーム２と
を一致させるべく加工台７を移動させていた。Next, the operation shown in FIG. 1 above will be explained. A laser beam 2 emitted from a laser oscillator 1 is bent by a total reflection mirror 3 so as to irradiate the workpiece 6 perpendicularly. Thereafter, two laser beams are focused into a small spot diameter by a condenser lens 4, pass through a processing head 5, and are irradiated onto a joint portion of a workpiece 6 for welding. A shielding gas is introduced into the processing head 5 as needed, and is injected onto the workpiece 6. Here, in order to match the joint part of the workpiece 6 with the focused laser beam 2, the workpiece 6 is irradiated with a low output laser beam 2,
The positional relationship between the joint part and the laser beam 2 was confirmed based on the melted traces, and the processing table 7 was moved each time to bring the joint part and the laser beam 2 into alignment.

従来のレーザ加工装置は以上の様に構成されているので
、被加工物６の継手部とレーザビーム２の位置を一致さ
せるための準備に長い時間を費やし、かっこの一致させ
る作業において、被加工物６にレーザビーム２の不要の
痕跡を多量に残すことになシ、溶接後、被加工物６の美
観を損ね、さらＫは、信頼性が乏しいため、しばしば目
的とする溶接線と実際にレーザビーム２によシ溶接され
た部分との不一致を生じ、加工の歩留りを低下させるな
どの欠点があった。Conventional laser processing equipment is configured as described above, so it takes a long time to prepare to match the position of the joint part of the workpiece 6 and the laser beam 2, and in the work of matching the brackets, the workpiece It is important not to leave a large amount of unnecessary traces of the laser beam 2 on the workpiece 6, which will spoil the aesthetic appearance of the workpiece 6 after welding, and because of its poor reliability, it is often difficult to match the intended weld line with the actual one. This has disadvantages such as mismatching with the part welded by the laser beam 2 and lowering the processing yield.

この発明は上記の様な従来のものの欠点を除去するため
になされたもので、２個の被加工物の端面を突き合わせ
た継手部にレーザ溶接を施すレーザ加工装置において、
レーザビームの集光レンズの前記継手部に対する位置を
変化させるレンズ駆動機構と、前記レーザビームの経路
途中に配設され、このレーザビームの一部を透過させる
部分反射鏡を通過して、前記被加工物の表面上に照射さ
れた低出力のレーザビームにより発生するプラズマの輝
度を測定する光センサ及び輝度計測装置と、この輝度計
測装置からの検出信号とあらかじめ設定された前記継手
部に相当する電気信号とに基き、前記輝度が最大となる
様に前記レンズ駆動機構を制御し、前記継手部に対応す
るレーザビーム照射の適正位置を調整する制御装置とを
備えて成る構成を有し、被加工物の継手部とレーザビー
ムの位置を自動的に一致させながら溶接を行うことがで
きるレーザ加工装置を提供することを目的としている。This invention was made in order to eliminate the drawbacks of the conventional ones as described above, and is a laser processing device that performs laser welding on a joint where the end surfaces of two workpieces abut against each other.
A lens drive mechanism that changes the position of the condensing lens of the laser beam with respect to the joint part, and a partial reflection mirror that is disposed in the middle of the path of the laser beam and that transmits a part of the laser beam. An optical sensor and a brightness measuring device that measure the brightness of plasma generated by a low-power laser beam irradiated onto the surface of a workpiece, and a detection signal from the brightness measuring device and a preset joint portion corresponding to the and a control device that controls the lens drive mechanism so that the brightness is maximized based on an electric signal, and adjusts an appropriate position of laser beam irradiation corresponding to the joint portion, It is an object of the present invention to provide a laser processing device that can perform welding while automatically aligning the position of a joint part of a workpiece and a laser beam.

以下、この発明の一実施例を図について説明する。第２
図はこの発明の一実施例であるレーザ加工装置を示す一
部断面構成図で、第１図と同一部分には同一符号を用い
て表示してあり、その詳細な説明は省略する。図におい
て、９は走査台、１゜は走査台９を移動する駆動モータ
、１１は走査台９を支持する取付は台、１２は走査台９
に加工ヘッド５を取付けるための支柱、１３はレーザビ
ーム２を分光する部分反射鏡、１４は部分反射鏡１３を
通過して来た低出力のレーザビームの方向を変える全反
射鏡、１５は低出力のレーザビームを集束する集光レン
ズ、１６は低出力のレーザビームの方向を変える全反射
鏡、１７は被加工物６の表面のレーザビーム照射部処発
生するプラズマの輝度を測定するための輝度計測装置、
１８は輝度計測装置１７に付属し、加工ヘッド５に保持
され、光を電気信号に変換するための光ダイオードなど
よシなる光センサ、１９は輝度計測装置１７からの信号
を、あらかじめ設定された被加工物６の継手部に相当す
る電気信号と比較し、その差の信号に基き、走査台９を
適正位置に移動させる駆動モータ１０を駆動するための
電気信号を出力する制御装置である。An embodiment of the present invention will be described below with reference to the drawings. Second
The figure is a partial cross-sectional configuration diagram showing a laser processing apparatus which is an embodiment of the present invention, and the same parts as in FIG. 1 are designated by the same reference numerals, and detailed explanation thereof will be omitted. In the figure, 9 is a scanning table, 1° is a drive motor that moves the scanning table 9, 11 is a mounting base that supports the scanning table 9, and 12 is a scanning table 9.
13 is a partial reflection mirror that separates the laser beam 2, 14 is a total reflection mirror that changes the direction of the low-power laser beam that has passed through the partial reflection mirror 13, and 15 is a low-power laser beam. A condenser lens for focusing the output laser beam, 16 a total reflection mirror for changing the direction of the low-output laser beam, and 17 for measuring the brightness of the plasma generated at the laser beam irradiation area on the surface of the workpiece 6. brightness measurement device,
Reference numeral 18 is an optical sensor attached to the brightness measuring device 17, held in the processing head 5, and is a photodiode or the like for converting light into an electrical signal; This is a control device that compares the electric signal corresponding to the joint portion of the workpiece 6 and outputs an electric signal for driving the drive motor 10 that moves the scanning table 9 to an appropriate position based on the difference signal.

次に、上記第２図の動作について説明する。レーザ発振
器１から放出されたレーザビーム２は、幾つかの全反射
鏡（図示しない）により折曲された後、部分反射鏡１３
によシ大部分が溶接用のレーザビームとして折曲される
。その後、溶接用のレーザビームは、被加工物６に対し
て垂直に照射されるべく全反射鏡３によシ折曲され、集
光レンズ４によシ小さなスポット径に集束されて加工ヘ
ッド５を通過し、被加工物６の継手部・に照射されるこ
とによシ溶接に供せられる。一方、部分反射鏡１３を一
部通過して来た低出力のレーザビームは、被加工物６の
目的とする溶接線と一致させる信頼度を高めるために、
全反射鏡１４により折曲され、溶接用のレーザビームに
近付けられる。その後、この低出力のレーザビームは集
光レンズ１５を通過した後、被加工物６に対して垂直に
照射されるべく全反射＠１６により折曲され、被加工物
６の表面に照射される。被加工物６の表面ではレーザビ
ーム２が照射されることによシ、照射されるレーザビー
ム２の出力密度に比例した輝度を有するプラズマ（電離
された被加工物６の蒸気）を発生する。レーザビーム２
の出力を一定に保持しておくと、第３図（ａ）　Ｋ示す
様に、レーザビーム２の照射部が被加工物６の継手部か
ら完全に逸脱している場合に、レーザビーム２の出力密
度に応じた輝度を有するプラズマを発生する。ところが
、第３図中）に示す様に、レーザビーム２が被加工物６
の継手部に完全に照射された場合に、レーザビーム２の
出力密度が高められることになシ、このため、発生する
プラズマの輝度を光センサ１８及び輝度計測装置１７に
よシミ気的に計測すると、この時、第４図に示す様に輝
度が最大となる。したがって、制御装置１９において、
最大輝度、すなわち被加工物６の継手部に相当する電気
信号の値をあらかじめ設定しておき、輝度計測装置１７
からの信号と比較し、その差の信号に基き走査台９の移
動量を演算し、駆動モータ１０に信号を出力する。その
結果、駆動モータ１０が作動され、溶接用のレーザビー
ムの照射位置は被加工物６の継手部に自動的に設定され
ることになる。Next, the operation shown in FIG. 2 will be explained. A laser beam 2 emitted from a laser oscillator 1 is bent by several total reflection mirrors (not shown), and then bent by a partial reflection mirror 13.
Most of the beam is then bent into a laser beam for welding. Thereafter, the laser beam for welding is bent by a total reflection mirror 3 so as to be irradiated perpendicularly to the workpiece 6, and is focused into a small spot diameter by a condensing lens 4 to be irradiated to the processing head 5. , and is irradiated onto the joint portion of the workpiece 6 for welding. On the other hand, the low-power laser beam that has partially passed through the partial reflecting mirror 13 is
It is bent by the total reflection mirror 14 and brought close to the welding laser beam. After that, this low-power laser beam passes through the condenser lens 15 and is bent by total reflection @16 so as to be irradiated perpendicularly to the workpiece 6, and then irradiated onto the surface of the workpiece 6. . When the surface of the workpiece 6 is irradiated with the laser beam 2, plasma (ionized vapor of the workpiece 6) having a brightness proportional to the output density of the irradiated laser beam 2 is generated. laser beam 2
If the output of the laser beam 2 is held constant, as shown in FIG. Generates plasma whose brightness corresponds to the power density. However, as shown in Fig. 3), the laser beam 2
If the joint part of the laser beam 2 is completely irradiated, the output density of the laser beam 2 will be increased. Therefore, the brightness of the generated plasma is measured by the optical sensor 18 and the brightness measuring device 17. At this time, the brightness becomes maximum as shown in FIG. Therefore, in the control device 19,
The maximum brightness, that is, the value of the electric signal corresponding to the joint part of the workpiece 6 is set in advance, and the brightness measuring device 17
The amount of movement of the scanning table 9 is calculated based on the difference signal, and a signal is output to the drive motor 10. As a result, the drive motor 10 is activated, and the irradiation position of the welding laser beam is automatically set to the joint portion of the workpiece 6.

なお、上記実施例では、部分反射鏡１３によシ低出力の
レーザビームを通過させる様にした場合について説明し
たが、この代りに溶接用のレーザビームを通過させる様
にしても良い。In the above embodiment, a case has been described in which a low-output laser beam is passed through the partial reflecting mirror 13, but a welding laser beam may be passed instead.

以上の様に、この発明のレーザ加工装置によれば、レー
ザビームを被加工物の表面に照射する際に発生するプラ
ズマの輝度を計測することによシ、被加工物の継手部と
レーザビームの位置を自動的に一致させながら溶接をす
ることができる様に構成したので、連続して被加工物の
継手部の溶接が容易に達成でき、また、極めて高精度の
レーザ溶接が行えるという優れた効果を奏するものであ
る。As described above, according to the laser processing apparatus of the present invention, by measuring the brightness of the plasma generated when the surface of the workpiece is irradiated with the laser beam, the joint part of the workpiece and the laser beam The structure is configured so that welding can be performed while automatically matching the positions of the joints of workpieces, so it is easy to weld the joints of workpieces continuously, and it also has the advantage of being able to perform extremely high-precision laser welding. It has the following effects.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のレーザ加工装置を示す一部断面構成図、
第２図はこの発明の一実施例であるレーザ加工装置を示
す一部断面構成図、第３図（ａ）及びΦ）は、それぞれ
第２図のレーザ加工装置の原理を説明するための図、第
４図は、第２図のレーザ加工装置における被加工物の継
手部からの距離とそれに対応して計測される輝度との関
係を示す特性図である。 図において、１・・・レーザ発振器、２・・・レーザビ
ーム、３，１４．１６・・・全反射鏡、４，１５・・・
集光レンズ、５・・・加工ヘッド、６・・・被加工物、
７・・・加工台、８，１０・・・駆動モータ、９・・・
走査台、１１・・・取付は台、１２・・・支柱、１３・
・・部分反射鏡、１７・・・輝度計測装置、１８・・・
光センサ、１９・・・制御装置である。 なお、図中、同一符号は同一、又は相当部分を示す。 代理人　大岩増雄FIG. 1 is a partial cross-sectional configuration diagram showing a conventional laser processing device.
FIG. 2 is a partial cross-sectional configuration diagram showing a laser processing device which is an embodiment of the present invention, and FIGS. 3(a) and Φ) are diagrams for explaining the principle of the laser processing device shown in FIG. 2, respectively. , FIG. 4 is a characteristic diagram showing the relationship between the distance of the workpiece from the joint part in the laser processing apparatus of FIG. 2 and the brightness measured corresponding thereto. In the figure, 1... Laser oscillator, 2... Laser beam, 3, 14. 16... Total reflection mirror, 4, 15...
Condensing lens, 5... Processing head, 6... Workpiece,
7... Processing table, 8, 10... Drive motor, 9...
Scanning stand, 11... Attachment to stand, 12... Support, 13.
...Partial reflecting mirror, 17...Brightness measuring device, 18...
Optical sensor, 19...control device. In addition, in the figures, the same reference numerals indicate the same or equivalent parts. Agent Masuo Oiwa

Claims (2)

【特許請求の範囲】[Claims] （１）　２個の被加工物の端面を突き合わせた継手部に
、レーザ発振器よシ発生したレーザビームを集光させて
照射し、レーザ溶接を施すレーザ加工装置において、前
記レーザビームの集光レンズの前記継手部に対する位置
を変化させるレンズ駆動機構と、前記レーザビームの経
路途中に配設され、該レーザビームの一部を透過させる
部分反射鏡を通過して、前記被加工物の表面上に照射さ
れた低出力のレーザビームによ〕発生するプラズマの輝
度を測定する光センサ及び輝度計測装置と、該輝度計測
装置からの検出信号とあらかじめ設定された前記継手部
に相当する電気信号とに基き、前記輝度が最大となる様
に前記レンズ駆動機構を制御して、−前記継手部に対応
するレーザビーム照射の適正位置を調整する制御装置と
を備えて成ることを特徴とするレーザ加工装置。(1) In a laser processing device that performs laser welding by focusing a laser beam generated by a laser oscillator and irradiating a joint where the end surfaces of two workpieces butt each other, a condensing lens for the laser beam is used. a lens driving mechanism that changes the position of the laser beam with respect to the joint portion; and a partial reflecting mirror that is disposed in the middle of the path of the laser beam and transmits a portion of the laser beam, and the laser beam passes through a partial reflecting mirror that transmits a portion of the laser beam, and the laser beam passes through a partial reflecting mirror that transmits a portion of the laser beam. an optical sensor and a brightness measuring device that measure the brightness of plasma generated by the irradiated low-power laser beam, a detection signal from the brightness measuring device, and an electric signal corresponding to the joint portion set in advance. Based on the above, the laser processing apparatus is characterized by comprising: a control device that controls the lens drive mechanism so that the brightness is maximized, and adjusts an appropriate position of laser beam irradiation corresponding to the joint portion. . （２）　　前記集光レンズは、加工ヘッドに保持されて
いることを特徴とする特許請求の範囲第１項記載のレー
ザ加工装置。(2) The laser processing apparatus according to claim 1, wherein the condenser lens is held by a processing head.
JP58091864A 1983-05-25 1983-05-25 Laser working device Pending JPS59218291A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58091864A JPS59218291A (en) 1983-05-25 1983-05-25 Laser working device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58091864A JPS59218291A (en) 1983-05-25 1983-05-25 Laser working device

Publications (1)

Publication Number Publication Date
JPS59218291A true JPS59218291A (en) 1984-12-08

Family

ID=14038416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58091864A Pending JPS59218291A (en) 1983-05-25 1983-05-25 Laser working device

Country Status (1)

Country Link
JP (1) JPS59218291A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006502410A (en) * 2002-10-11 2006-01-19 イントラレイズ コーポレイション Method and system for determining the position and alignment of an object surface relative to a laser beam

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006502410A (en) * 2002-10-11 2006-01-19 イントラレイズ コーポレイション Method and system for determining the position and alignment of an object surface relative to a laser beam

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