JPS5920660U - double sided printed circuit board - Google Patents
double sided printed circuit boardInfo
- Publication number
- JPS5920660U JPS5920660U JP11470382U JP11470382U JPS5920660U JP S5920660 U JPS5920660 U JP S5920660U JP 11470382 U JP11470382 U JP 11470382U JP 11470382 U JP11470382 U JP 11470382U JP S5920660 U JPS5920660 U JP S5920660U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- sided printed
- wiring patterns
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図A、 Bは本考案の一実施例よりなる両面プリン
ト基板の表と裏の平面図、および第2図〜第7図は両面
の配線パターン間の電気的結合をさせる手順を示す側断
面図(第6図のみ斜視図)である。
1・・・両面プリント基板、2・・・配線パターン、3
・・・貫通穴、4・・・フラットジャンパー線、5・・
・心線、6・・・被覆。
第2図
第3図FIGS. 1A and 1B are front and back plan views of a double-sided printed circuit board according to an embodiment of the present invention, and FIGS. 2 to 7 are side views showing the procedure for electrically connecting wiring patterns on both sides. FIG. 6 is a cross-sectional view (only FIG. 6 is a perspective view). 1... Double-sided printed circuit board, 2... Wiring pattern, 3
...Through hole, 4...Flat jumper wire, 5...
- Core wire, 6...coated. Figure 2 Figure 3
Claims (1)
配線パターンを表側と裏側とで電気的に結合させる際、
結合箇所を表側と裏側とで一致させ、−線上に並べるよ
うに配置し、各結合箇所毎に貫通穴をあけ、この−列の
貫通穴に予め半田付けに適した長さに切断しであるフラ
ットジャンパー線を挿入し、まず片面を半田付けし、次
に残った片面のジャンパー線の被覆を取り去った後、こ
の面も半田付けして両面の配線パターンを電気的に結合
させてなることを特徴とする両面プリント基板。A printed circuit board having wiring patterns on both sides, when the wiring patterns are electrically coupled between the front side and the back side,
Align the bonding points on the front and back sides, arrange them on the - line, drill a through hole for each bonding point, and cut the through holes in this - row to a length suitable for soldering in advance. Insert a flat jumper wire, first solder one side, then remove the remaining jumper wire coating on one side, and then solder this side as well to electrically connect the wiring patterns on both sides. Features a double-sided printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11470382U JPS5920660U (en) | 1982-07-30 | 1982-07-30 | double sided printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11470382U JPS5920660U (en) | 1982-07-30 | 1982-07-30 | double sided printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5920660U true JPS5920660U (en) | 1984-02-08 |
Family
ID=30265048
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11470382U Pending JPS5920660U (en) | 1982-07-30 | 1982-07-30 | double sided printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5920660U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61133840A (en) * | 1984-12-03 | 1986-06-21 | ペ−タ−・テミング・アクチエンゲゼルシヤフト | Method of determining fine particle adhering on substance and application thereof |
JPS6444450U (en) * | 1987-09-14 | 1989-03-16 |
-
1982
- 1982-07-30 JP JP11470382U patent/JPS5920660U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61133840A (en) * | 1984-12-03 | 1986-06-21 | ペ−タ−・テミング・アクチエンゲゼルシヤフト | Method of determining fine particle adhering on substance and application thereof |
JPS6444450U (en) * | 1987-09-14 | 1989-03-16 |
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