JPS59200976A - Method for detecting disconnection of conductive circuit - Google Patents
Method for detecting disconnection of conductive circuitInfo
- Publication number
- JPS59200976A JPS59200976A JP58076384A JP7638483A JPS59200976A JP S59200976 A JPS59200976 A JP S59200976A JP 58076384 A JP58076384 A JP 58076384A JP 7638483 A JP7638483 A JP 7638483A JP S59200976 A JPS59200976 A JP S59200976A
- Authority
- JP
- Japan
- Prior art keywords
- pad
- conductive
- plate
- disconnection
- circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、導体回路の断線検出方法に係り、さらに詳し
くは、導１４回路の一方がパッドで他の一方がスルホー
ルで形成されるパターンの断線検出方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for detecting disconnection in a conductive circuit, and more particularly, to a method for detecting disconnection in a pattern in which one of 14 conductor circuits is a pad and the other is a through hole. .
従来、プリント基板導体回路の断線、短絡検出には、目
視もしくはコンビーータが使用されている。しかしなが
ら、目視では非常に作業効率が悪く、また非常に微細な
回路などの場合、見逃しが多々あシ、断線、短絡の検出
を完全に行なうことができない欠点がある。一方コンピ
ュータを使用した場合、プリント基板導体回路とを電気
的に接触させるために、接触子を用いており、接触子と
しては接触ピン等又は導’ｆＪｌ、ゴム等が使用されて
いる。接触ピンなどを用いた場合、第１図における（５
）のようなパッド部との接触は不安定であり、また近年
パッド部のピンチが短くなり、通常の接触ピンの直径は
、１．５順から２．０がＥ程度であるため、２、□ｇａ
ツ、下の間隔のパッド間の接触は、きわめて困鄭である
。Conventionally, visual inspection or a conbeater has been used to detect disconnections and short circuits in printed circuit board conductor circuits. However, visual inspection is extremely inefficient, and in the case of extremely minute circuits, it is difficult to completely detect holes, disconnections, and short circuits because it is often overlooked. On the other hand, when a computer is used, a contactor is used to make electrical contact with a printed circuit board conductor circuit, and the contactor is a contact pin or the like, a conductor, rubber, or the like. When using a contact pin etc., (5
) is unstable, and the pinch of the pad part has become shorter in recent years, and the diameter of the normal contact pin is about E from 1.5 to 2.0. □ga
However, contact between the lower spaced pads is extremely difficult.
また、接触ピンは、１０〜２０Ｍ程度の厚さの絶縁板に
固定する必要があり、その固定用の絶縁板に接触ピンを
挿入して固定することにより使用されている。そのため
、パッド間が短くなり、挿入する穴の精度も〃・なシ高
くなシ経費も萬くなる。Further, the contact pin needs to be fixed to an insulating plate having a thickness of about 10 to 20 M, and is used by inserting and fixing the contact pin into the insulating plate for fixation. As a result, the distance between the pads becomes shorter, the accuracy of the holes to be inserted is reduced, and the high cost of the pads is also reduced.
また、導電ゴム等を用いた場合加圧に対して不安定であ
り実用的でない。Furthermore, when conductive rubber or the like is used, it is unstable against pressure and is not practical.
上記のように、従来の接触子ではパッド部を有する導体
回路の検査はできないなどの欠点がめる。As mentioned above, conventional contacts have drawbacks such as inability to inspect conductor circuits having pad portions.
本発明は上記従来の欠点を除去し改碧する導体回路の断
線検出方法を提供する毛のである。The present invention provides a method for detecting disconnection in a conductor circuit which eliminates and improves the above-mentioned conventional drawbacks.
以下、本発明を図面を基いて具体的に説明する。Hereinafter, the present invention will be specifically explained based on the drawings.
すなわち、本発明はプリント基板導体回路の断線の検出
を目的としており、その方法は第１図に示すような断線
検出装置の構成でパッド囚上にほぼ等面積の柔軟性のあ
る導電板（Ｂ）を載置し、さらに導電板上にほぼ等面積
の弾性体（０を載置する。そ［２て導″屯板■と弾性体
（０とを一体とし加圧するとパッド囚はすべて短絡し、
パッドと連結する導電回路旧の各２本に通電することに
よりパッド部囚と導ｍ回路σとの間の断線検出は可能に
なる。第２図は加圧状態におけるパッド囚の断面図であ
る。That is, the purpose of the present invention is to detect a disconnection in a printed circuit board conductor circuit, and the method is to use a disconnection detection device configured as shown in FIG. ), and then place an elastic body (0) with an approximately equal area on the conductive plate. Then, when the conductive plate (■) and the elastic body (0) are integrated and pressurized, all the pads are short-circuited. death,
By energizing each of the two conductive circuits connected to the pad, it becomes possible to detect a disconnection between the pad and the conductive circuit σ. FIG. 2 is a sectional view of the pad in a pressurized state.
加圧は、導電板■が４電回路［Ｆ］に密着し導電性を良
好にするもので通常１に’）／ｃ！Ｉ前後位の加圧が必
要である。The pressure is usually 1')/c! because the conductive plate (■) comes into close contact with the 4-electric circuit [F] to improve conductivity. It is necessary to pressurize the front and back of the body.
一方、パッド（５）は多小メッキ厚に差があるため平面
ではない。それゆえ、等電板には柔軟性のあるものを使
用して、パッド（４）との接触を安定させる。得１１シ
、板には厚さＱ、１ｆｆｉ程度導電性の良好な金属の平
板状のものたとえば、フレキシブルなプリント基板が好
ましい。また弾性体（Ｏは、導電板（２）を適確に加圧
させるためのものであり、その厚みは１．０〜３．０扉
程度が好ましく、ゴム、プラスチック、布などの６坤の
材料であって、弾性を何するものが使用される。On the other hand, the pad (5) is not flat because there are differences in plating thickness. Therefore, a flexible isoelectric plate is used to stabilize the contact with the pad (4). Preferably, the plate is a flat metal plate having a thickness of Q and good conductivity of about 1 ffi, such as a flexible printed circuit board. In addition, the elastic body (O) is used to properly pressurize the conductive plate (2), and its thickness is preferably about 1.0 to 3.0 mm, and is made of rubber, plastic, cloth, etc. A material with some elasticity is used.
以上本発明によれば第３図に示すように従来断線検出が
されていないパッド部（２）と導体回路（至）との間の
導体回路の断線検出が可能と々る。１だ経費も少なく短
時間にて検出することができる。なお、本発明は多種多
様の広範囲のプリント配線基板の導体回路の断線検出に
利用できるものである。As described above, according to the present invention, as shown in FIG. 3, it is possible to detect a disconnection of the conductor circuit between the pad portion (2) and the conductor circuit (to), which has not been detected conventionally. 1. It costs less and can be detected in a short time. The present invention can be used to detect disconnections in conductor circuits of a wide variety of printed wiring boards.
実施例
柔軟性のあるへ４電板にはフレキシブルであって、板厚
が０．１騎のプリント基板を使用する。この使用する部
分のみをエツチングにより残し、この部分に接触性をよ
くするために、金メッキを行った。Embodiment A flexible printed circuit board with a thickness of 0.1 mm is used for the flexible electric board. Only the part to be used was left by etching, and this part was plated with gold to improve contact.
１だ、弾性体には、３．０πｍのゴム板を切断して使用
した。そして上記ゴム板を金メッキした部分の妥にはり
つけ、それらを１体にして、アクリル板にはりつける。1. For the elastic body, a 3.0πm rubber plate was cut and used. Then, attach the rubber plate to the gold-plated part, and then attach them together to the acrylic plate.
そして、ある位置に合せて、アクリル板とゴム板、導電
板とを１体にし、て加圧板［有］にはりつける。Then, at a certain position, the acrylic plate, rubber plate, and conductive plate are assembled into one body and attached to the pressure plate.
分が簡易迅速に検出できた。minutes could be detected easily and quickly.
第１図は本発明の検出方法における導体回路上の断線検
出装置の一例を示す斜視図、第２図は加圧状態における
導体回路の断線検出装置の断面図、第３図はプリント配
線基板の導体回路部分の一例を示す平面図である。
■・・・・・・・・パッド、［Ｆ］・・・・・・導電板
、Ｏ・・・・・・・・・弾性体、［Ｆ］・・・・・・・
・・導体回路、［Ｆ］・・・・・・・・・加圧板。
特許出願人の名称
イビデン株式会社
代表者多賀潤一部
〆１５７
（
〆２Ｉ ≠３５FIG. 1 is a perspective view showing an example of a disconnection detection device on a conductor circuit in the detection method of the present invention, FIG. 2 is a sectional view of the disconnection detection device on a conductor circuit in a pressurized state, and FIG. FIG. 3 is a plan view showing an example of a conductive circuit portion. ■・・・・・・Pad, [F]・・・Conductive plate, O・・・・・・Elastic body, [F]・・・・・・
...Conductor circuit, [F] ...... Pressure plate. Patent Applicant Name IBIDEN Co., Ltd. Representative Jun Taga Part 157 (2I ≠35
Claims (1)
し、さらに前記帳電板上に弾性体（Ｑを載置し、前記尋
゛市板と弾性体とを一体に加圧した状態で、前記パッド
と連結する導電回路（Ｔ））の夫々の２本に３１ｍ電す
ることを特徴とする導体回路の断線検出方法。1. Place a flexible electric board (1) on the pad (5), place an elastic body (Q) on the electric board, and integrate the electric board and the elastic body. A method for detecting disconnection in a conductive circuit, characterized in that a current of 31 m is applied to each of two conductive circuits (T) connected to the pad while the pad is pressurized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58076384A JPS59200976A (en) | 1983-04-30 | 1983-04-30 | Method for detecting disconnection of conductive circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58076384A JPS59200976A (en) | 1983-04-30 | 1983-04-30 | Method for detecting disconnection of conductive circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59200976A true JPS59200976A (en) | 1984-11-14 |
Family
ID=13603836
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58076384A Pending JPS59200976A (en) | 1983-04-30 | 1983-04-30 | Method for detecting disconnection of conductive circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59200976A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504059A (en) * | 1972-12-19 | 1975-01-16 | ||
| JPS56110060A (en) * | 1980-02-06 | 1981-09-01 | Nec Corp | Inspecting method and device for base plate of circuit |
-
1983
- 1983-04-30 JP JP58076384A patent/JPS59200976A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504059A (en) * | 1972-12-19 | 1975-01-16 | ||
| JPS56110060A (en) * | 1980-02-06 | 1981-09-01 | Nec Corp | Inspecting method and device for base plate of circuit |
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