JPS59196119A - Flash removing device - Google Patents
Flash removing deviceInfo
- Publication number
- JPS59196119A JPS59196119A JP7064583A JP7064583A JPS59196119A JP S59196119 A JPS59196119 A JP S59196119A JP 7064583 A JP7064583 A JP 7064583A JP 7064583 A JP7064583 A JP 7064583A JP S59196119 A JPS59196119 A JP S59196119A
- Authority
- JP
- Japan
- Prior art keywords
- scraper
- flash
- scrapers
- semiconductor device
- boss
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims abstract description 5
- 238000007790 scraping Methods 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 abstract description 19
- 229920005989 resin Polymers 0.000 abstract description 19
- 239000004065 semiconductor Substances 0.000 abstract description 12
- 229910000639 Spring steel Inorganic materials 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 240000007049 Juglans regia Species 0.000 description 1
- 235000009496 Juglans regia Nutrition 0.000 description 1
- 235000010582 Pisum sativum Nutrition 0.000 description 1
- 240000004713 Pisum sativum Species 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 235000020234 walnut Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/02—Deburring or deflashing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4835—Cleaning, e.g. removing of solder
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Milling, Broaching, Filing, Reaming, And Others (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はぼり取り装置、さらには、たとえばレジンモー
ルド型半導体装置の如き成形品のぼりを除去するために
特に有効なぼり取り装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a scraping device, and more particularly to a scraping device particularly effective for removing scraps from a molded product such as a resin-molded semiconductor device.
一般に、たとえばレジンモールド型半導体装置の製造過
程においてリードフレームのペレ・ノド取り付は部をレ
ジンモールドパターンで封止する場合、レジンの注入圧
力によりレジンが上下の金型間からはみ出してパターン
外のダムバーの方向にぼり （フラッシュ）が形成され
てしまう。このようなばりが形成されると、外観不良と
なる。Generally, in the manufacturing process of resin mold type semiconductor devices, when the lead frame is sealed with a resin mold pattern, the injection pressure of the resin causes the resin to protrude from between the upper and lower molds, causing the resin to leak outside the pattern. A flash will form in the direction of the dam bar. If such burrs are formed, the appearance will be poor.
そこで、このぼりを取り除くために、ガラスピーズやク
ルミ粉をエアブラストで吹き付ける方式あるいは水とア
ルミナ粉を吹き付ける方式の他に、ワイヤまたは砥粒入
りナイロン等のブラシをｂｉりと接触させて回転させる
ことによりばりを掻き取る方式が使用されている。Therefore, in order to remove the burrs, in addition to the method of air blasting glass peas or walnut powder, or the method of spraying water and alumina powder, there is also a method of rotating a wire or nylon brush containing abrasive grains in contact with the burrs. In some cases, a method of scraping off burrs is used.
しかしながら、従来の回転ブラシによるぼり取り方式で
は、ブラシを構成するワイヤやナイロンの線材が曲がり
易く、十分なぼり取りが困難である上に、ブラシの寿命
が短く、またブラシの曲がった先端がパンケージのレジ
ンまでブラッシングして外観不良を生じる等の問題があ
る。However, with the conventional deburring method using a rotating brush, the wire and nylon wire that make up the brush are easily bent, making it difficult to remove the deburring sufficiently. There are problems such as brushing down to the resin, resulting in poor appearance.
本発明の目的は、成形品のぼりを確実に除去でき、しか
も必要箇所のみを有効にぼり取りできるぼり取り装置を
提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a scraping device that can reliably remove scraps from a molded product and can effectively scrape off only necessary parts.
この目的を達成するため、本発明のぼり取り装置は、ぼ
り取り手段として薄板状のスクレーパを使用することを
特徴とするものである。In order to achieve this object, the scraping device of the present invention is characterized in that a thin plate-like scraper is used as scraping means.
以下、本発明を図面に示す実施例にしたがって詳細に説
明する。Hereinafter, the present invention will be explained in detail according to embodiments shown in the drawings.
第１図は本発明を適用できる成形品の一例としてのレジ
ンモールド型半導体装置にばりが形成される状態を示す
部分側面図、第２図は本発明によるぼり取り装置の一実
施例を示す概略的説明図、第３図はそのぼり取り用スク
レーパのポス端面方向から見た図である。FIG. 1 is a partial side view showing a state in which burrs are formed on a resin molded semiconductor device as an example of a molded product to which the present invention can be applied, and FIG. 2 is a schematic diagram showing an embodiment of a deburring device according to the present invention. FIG. 3 is a view of the deburring scraper seen from the end surface direction of the post.
第１図に示すように、レジンモールド型半導体装置１の
製造過程でペレットをレジンモールドパッケージ２を形
成する場合、金型内へのレジンの注入圧力により一部の
レジンが上下の金型とリードフレーム３との間からはみ
出して成形後のパフケージ２の外部にばり（フラッシュ
）４を形成してしまう。As shown in FIG. 1, when a pellet is used to form a resin mold package 2 in the manufacturing process of a resin mold type semiconductor device 1, some of the resin is bonded to the upper and lower molds due to the injection pressure of the resin into the mold. This causes a burr (flash) 4 to protrude from between the puff cage 2 and the frame 3 and form on the outside of the puff cage 2 after molding.
このようなばり４を除去するため、本発明のぼり取り装
置は第２図および第３図に示すように、回転可能なボス
５ （回転体）の周囲にぼり取り用のスクレーパ６を複
数枚有している。このスクレーパ６はたとえばばね鋼の
ような弾性を有する薄板材料よりなる。したがって、ス
クレーパ６はボス５の回転方向には弾性的に弯曲するが
、ボス５の軸方向には弯曲せず、スクレーパ６がレジン
モールド型半導体装置１のリードフレーム３と接触する
軸方向位置はスクレーパ６の弯曲により変動することな
く、精密なぼり取りを行うことができる。In order to remove such burrs 4, the deburring device of the present invention has a plurality of scrapers 6 around a rotatable boss 5 (rotating body) as shown in FIGS. 2 and 3. are doing. The scraper 6 is made of an elastic thin plate material such as spring steel. Therefore, although the scraper 6 elastically curves in the rotational direction of the boss 5, it does not curve in the axial direction of the boss 5, and the axial position where the scraper 6 contacts the lead frame 3 of the resin molded semiconductor device 1 is limited. Accurate scraping can be performed without fluctuations due to the curvature of the scraper 6.
スクレーパ６の各々の先端は基端部に比べて先細のテー
バ形状に形成されており、リードフレーム３の表面に凹
凸があっても有効なぼり取りを１〒うことかできるよう
になっている。The tip of each scraper 6 is formed into a tapered shape that is tapered compared to the base end, so that even if the surface of the lead frame 3 has unevenness, it can be scraped effectively. .
各スクレーパ６の先端のテーノ々形状はボス５の軸方向
に対して互いに食い違い状に形成され、全体としてリー
ドフレーム３のばり４の形成範囲の全部をカバーできる
ようになっている。The tip shapes of the scrapers 6 are formed to be staggered with respect to the axial direction of the boss 5, so that the entire range in which the burrs 4 of the lead frame 3 are formed can be covered as a whole.
このようなスクレーパ６の先端の食む１違し）状のテー
パ形状としては、たとえば第４図（，１１〜＋ｅｌ ＆
こ示すようなものを用いることができる。この例でしま
、スクレーパ６は６ａ〜６ｅで示す如く互シ１番こ異な
る先端テーバ形状を有するよう形成されてし）る。For example, the tapered shape of the tip of the scraper 6 is shown in FIG. 4 (,11~+el &
Something like this can be used. In this example, the scrapers 6 are formed to have different tapered tip shapes as shown by 6a to 6e.
これらのスクレーパ６の基端部はボス５の円周方向に所
定間隔で同一の軸方向位置に固設される。The base ends of these scrapers 6 are fixed at the same axial position at predetermined intervals in the circumferential direction of the boss 5.
なお、前記ボス５は支持体７で支持された回転軸８の先
端に取り付けられ、この回転軸８番まモータ９によって
ボス５とスクレーパ６を回転させ、該スクレーパ６の゛
先端でばり４を掻き取って除去する。The boss 5 is attached to the tip of a rotating shaft 8 supported by a support 7, and a motor 9 rotates the boss 5 and the scraper 6, and the tip of the scraper 6 scrapes the burr 4. Scrape and remove.
次に、本実施例の作用について説明する。Next, the operation of this embodiment will be explained.
モータ９の回転駆動によりへＪシト１０を介して回転軸
８を回転させると、ボス５およびスクレーパ６の先端が
レジンモールド型半導体装置１のＩノードフレーム３の
ばり４に接触するよう半導体装置１を移送すると、ばり
４はスクレーツマ６の先端によりリードフレーム３０表
面から掻き取られて除去される。When the rotary shaft 8 is rotated by the rotary drive of the motor 9 via the shaft 10, the semiconductor device 1 is moved so that the tips of the boss 5 and the scraper 6 come into contact with the burr 4 of the I-node frame 3 of the resin molded semiconductor device 1. When the burrs 4 are transferred, the burrs 4 are scraped off from the surface of the lead frame 30 by the tip of the scraper 6 and removed.
その場合、スクレーパ６は薄板状の弾性材料で作られて
いるので、ボス５の回転方向Ｇこしま弓１噴生的に弯曲
するが、ボス５の軸方同番こ（太弯曲せず、ムホり取り
が必要な位置のみを精密に）゛う・ノシンク゛でき、レ
ジンモールドパ・ノケージ２をフ゛う・ノシンク゛して
外観不良を引き起こすことがなし）。In that case, since the scraper 6 is made of a thin plate-like elastic material, it is curved in the rotational direction G of the boss 5 in a curved manner, but it is curved in the same direction in the axial direction of the boss 5 (not thickly curved, It is possible to precisely burrow and sink only the locations where dents need to be removed, and there is no need to burrow or sink the resin mold pachinko cage 2, causing poor appearance.
また、各スクレーパ６の先端が食し）進ム）４尺のテー
パ形状に形成されており、各スクレーツマ６の先端とリ
ードフレーム３の表面との接触範囲しよｄ〜さいので、
リードフレーム３の表面Ｇこ凹凸力くあっても確実にぼ
り取りでき、全スクレーノ＜６でばり４の全部を有効に
掻き取ることができる。In addition, the tip of each scraper 6 is formed into a tapered shape of 4 feet, and the contact range between the tip of each scraper 6 and the surface of the lead frame 3 is approximately d~.
Even if the surface G of the lead frame 3 is uneven, the burrs can be reliably scraped off, and the entire burr 4 can be effectively scraped off with a total clearance of less than 6.
第５図（ａ）〜゛（Ｃ）は本発明に用いられるスクレー
ツマの他の実施例を示す。この実施例Ｇこお番するスク
レ−パ６は先端部が互いに異な−る３種類のテーパ形状
に形成されている上に、その先端部には、たとえばダイ
ヤモンド、超硬合金あるいはセラミックの如き硬質物質
の粉末１１がコーティングされている。FIGS. 5(a) to 5(C) show other embodiments of the scraper used in the present invention. The tip of the scraper 6 used in this embodiment G is formed into three different tapered shapes. A powder 11 of material is coated.
したがって、本実施例では、スクレーバ６の寿命がより
長くなる。Therefore, in this embodiment, the life of the scraper 6 becomes longer.
なお、本発明は前記実施例に限定されるものではな（、
他の様々な変形が可能である。Note that the present invention is not limited to the above embodiments (
Various other variations are possible.
たとえば、スクレーバ６の枚数、形状、材料等は他のも
のであってもよく、またその先端部の硬質化処理は硬質
物質の粉末コーティング以外の方法で行ってもよい。さ
らに、本発明は前記以外の様々な成形品のぼり取りに使
用できる。For example, the number, shape, material, etc. of the scraper 6 may be different, and the hardening treatment of the tip portion may be performed by a method other than powder coating with a hard substance. Furthermore, the present invention can be used for removing various molded products other than those described above.
以上説明したように、本発明によれば、薄板状のぼり取
り用のスクレーバを備えていることにより、精密なぼり
取りを確実に行うことができる。As explained above, according to the present invention, by providing a thin plate-shaped scraper for scraping, precise scraping can be reliably performed.
また、本発明のスクレーバの寿命は長く、特に少な（と
もその先端部に硬質化処理を施せば、寿命をより長（す
ることができる。Further, the life of the scraper of the present invention is long, and the life can be made even longer by applying a hardening treatment to the tip of the scraper.
第１図は本発明を適用できる形成品の一例としてのレジ
ンモールド型半導体装置の部分側面図、第２図は本発明
のぼり取り装置の一実施例を示す概略説明図、第３図は
そのぼり取り用スクレーバをボス端面方向から見た図、
第４図（ａｌ〜（ｅ）はスクレーバのテーバ形状を示す
図、第５図（ａ）〜ｔｃ＋はスクレーバの他の実施例を
示す図である。
１・・・、レジンモールド型半導体装置、２・・・レジ
ンモールドパッケージ、３・・・リードフレーム、４・
・・ぼり、５・・・ボス（回転体）、６・・・スクレー
バ、９・・・モーフ、１１・・・硬質物質の粉末。FIG. 1 is a partial side view of a resin molded semiconductor device as an example of a molded product to which the present invention can be applied, FIG. 2 is a schematic explanatory diagram showing an embodiment of a strip removal device of the present invention, and FIG. A view of the removal scraper viewed from the end of the boss,
4(a) to 4(e) are diagrams showing the tapered shape of the scraper, and FIGS. 5(a) to tc+ are diagrams showing other embodiments of the scraper. 1..., resin mold type semiconductor device, 2... Resin mold package, 3... Lead frame, 4...
...Bori, 5...Boss (rotating body), 6...Scraper, 9...Morph, 11...Hard substance powder.
Claims (5)
、回転体に突設した薄板状の、ぼり取り用のスクレーパ
を備えてなることを特徴とするぼり取り装置。(1) A scraping device for removing scraps from a molded product, characterized by comprising a scraper in the form of a thin plate protruding from a rotating body.
先端の位置が回転体の軸方向にそれぞれ食い違っている
ことを特徴とする特許請求の範囲第１項記載のぼり取り
装置。(2) The scraping device according to claim 1, wherein a plurality of scrapers are temporarily provided, and the positions of the tips of the scrapers are different from each other in the axial direction of the rotating body.
していることを特徴とする特許請求の範囲第１項記載の
ぼり取り装置。(3) The scraping device according to claim 1, wherein the scraper has elasticity only in the direction of rotation of the rotating body.
ることを特徴とする特許請求の範囲第１項記載のぼり取
り装置。(4) The scraping device according to claim 1, wherein the tip of the scraper is hardened.
ーティングされていることを特徴とする特許請求の範囲
第４項記載のぼり取り装置。(5) The scraping device according to claim 4, wherein only the tip of the scraper is coated with hard material powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7064583A JPS59196119A (en) | 1983-04-21 | 1983-04-21 | Flash removing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7064583A JPS59196119A (en) | 1983-04-21 | 1983-04-21 | Flash removing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59196119A true JPS59196119A (en) | 1984-11-07 |
| JPH0425088B2 JPH0425088B2 (en) | 1992-04-28 |
Family
ID=13437589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7064583A Granted JPS59196119A (en) | 1983-04-21 | 1983-04-21 | Flash removing device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59196119A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6629880B1 (en) * | 2000-12-14 | 2003-10-07 | National Semiconductor Corporation | Rotary mechanical buffing method for deflashing of molded integrated circuit packages |
| CN110576225A (en) * | 2019-09-25 | 2019-12-17 | 赣州经纬科技股份有限公司 | Deburring equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5620169U (en) * | 1979-07-24 | 1981-02-23 |
-
1983
- 1983-04-21 JP JP7064583A patent/JPS59196119A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5620169U (en) * | 1979-07-24 | 1981-02-23 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6629880B1 (en) * | 2000-12-14 | 2003-10-07 | National Semiconductor Corporation | Rotary mechanical buffing method for deflashing of molded integrated circuit packages |
| CN110576225A (en) * | 2019-09-25 | 2019-12-17 | 赣州经纬科技股份有限公司 | Deburring equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0425088B2 (en) | 1992-04-28 |
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