JPS59195552A - Glass composition for coating and glass paste for coating - Google Patents
Glass composition for coating and glass paste for coatingInfo
- Publication number
- JPS59195552A JPS59195552A JP6826783A JP6826783A JPS59195552A JP S59195552 A JPS59195552 A JP S59195552A JP 6826783 A JP6826783 A JP 6826783A JP 6826783 A JP6826783 A JP 6826783A JP S59195552 A JPS59195552 A JP S59195552A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- coating
- weight
- resistor
- ruo2
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は被覆用ガラス組成物及び被覆用ガラスペースト
に関するものであり、更に詳しくはセラミック基板上の
Ｒｕ ０２ 、Ａｇ−Ｐｄ等の厚膜回路を被覆しこれら
を保護するためのガラス組成物及び保護被膜を形成する
ために材料として用いるガラスペーストに関するもので
争る。Detailed Description of the Invention [Industrial Application Field] The present invention relates to a coating glass composition and a coating glass paste, and more particularly to a thick film circuit of Ru 02, Ag-Pd, etc. on a ceramic substrate. The dispute concerns a glass composition for coating and protecting these materials, and a glass paste used as a material for forming a protective film.
［従来例の構成とその問題点］
アルミナ等のセラミック基板上の厚膜回路は、導電体部
をＡｏ’−Ｐｄ、へ〇等の導電ペーストを印刷後焼き付
けし、抵抗体、コンデンサ、コイルなど電子部品をハン
ダ付けして作られている。従来の被覆用ガラスは、この
導電体部だけを保護するために°用いられて来た。しか
しながら近年、回路の高密度化を図るために、Ａ＋Ｊ
−Ｐｄ 、Ａｇ等の導電体部と同じように、基板上にＲ
１１０２を印刷後焼き付けして抵抗体が形成されるよう
になり、この抵抗体を−し含めＣ保護被膜を形成りるこ
とが望まれている。しかし、従来の被覆用ガラスでは、
これを印刷、焼ぎイ１けしだ場合、この抵抗体の抵抗値
が大きく変化してしまい回路の形成が不能となっＣしよ
うのぐ、ＲＵＯ２抵抗体を含む厚ｌ’！回路の被覆保護
には使用出来なかった。[Conventional structure and its problems] Thick film circuits on ceramic substrates such as alumina are printed with a conductive paste such as Ao'-Pd or 〇 for the conductive parts, and then baked to form resistors, capacitors, coils, etc. It is made by soldering electronic components. Conventional covering glasses have been used to protect only this conductor portion. However, in recent years, in order to increase the density of circuits, A+J
- Just like conductor parts such as Pd and Ag, R
1102 is printed and then baked to form a resistor, and it is desired to form a C protective film including this resistor. However, with conventional coating glass,
If this is printed and baked, the resistance value of this resistor changes greatly, making it impossible to form a circuit. It could not be used to protect circuit sheathing.
被覆用ガラスはレーザ−１〜リミング時、被覆膜下の回
路の位置を正確に確認できなければならず、また、ある
稈痩の美観を早する必要もあるので、焼き付り後の透明
性をも満足づるものでなければなら４にい。When coating glass is laser-1~rimmed, it is necessary to be able to accurately confirm the position of the circuit under the coating film, and it is also necessary to improve the aesthetic appearance of certain culms. If it's something that also satisfies sex, then it's 4.
１発明の目的１
本発明の目的は、アルミナ等のセラミック基板上に形成
されたＲｕ ０２抵抗体を含む厚膜回路中のＲＵＯ２抵
抗体の抵抗値変化が少なく、透明性を有し美しい外観を
呈するガラス被成を提供することにより、この秤の厚膜
回路の被覆保護を可能にづることである。1 Object of the Invention 1 The object of the present invention is to provide a RUO2 resistor in a thick film circuit formed on a ceramic substrate such as alumina with little change in resistance value, transparency, and a beautiful appearance. By providing a glass coating that exhibits the same properties as above, it is possible to protect the thick film circuitry of the scale.
１発明の構成］
本発明の被覆用ガラス組成物は、上記の目的を達成する
ために、５１０２を３〜・７重量％、［３２０３ヲ１８
〜２５重量％、Ａｌ’、２０３を３−（３ｆｆｌｉ％、
１〕ｂＯを６５〜７５重酪％、Ｃｒ２Ｏ３を５用量％以
下の組成範囲に覆ることを特徴とする。1 Structure of the Invention] In order to achieve the above object, the coating glass composition of the present invention contains 3 to 7% by weight of 5102 and 18% by weight of 3203.
~25 wt%, Al', 203 to 3-(3ffli%,
1] It is characterized by covering a composition range of bO of 65 to 75% by weight and Cr2O3 of 5% or less.
また、本発明の被覆用ガラスペース１〜は上記範囲の組
成よりなる粉末状ガラス組成物を、有機溶剤と有機結合
剤にて練り合せたことを特徴としＣいる。Moreover, glass space for coating 1 to C of the present invention is characterized in that a powdered glass composition having a composition within the above range is kneaded with an organic solvent and an organic binder.
上記範囲内の組成であれば、焼き付は後のＲＵＯ２抵抗
体の抵抗値変化が少なく、被覆ガラス膜に亀裂を生じな
いと共に、透明性の良好な被覆ガラス膜が形成され、且
つ目的に応じて被覆ガラス膜の熱膨張係数値を６５ｘｌ
Ｏ−’〜８５ｘ１０−’℃−１の範囲に自由に選択する
ことができる。If the composition is within the above range, there will be little change in the resistance value of the RUO2 resistor after baking, no cracks will occur in the coated glass film, and a coated glass film with good transparency will be formed, depending on the purpose. The thermal expansion coefficient value of the coated glass film was set to 65xl.
It can be freely selected within the range of O-' to 85x10-'C-1.
５ｉ０２を３〜７重量％且つΔＥ２０３を３〜８重量％
添加しないと、Ｒｕ ０２抵抗体の抵抗値変化率が大き
くなる。3-7% by weight of 5i02 and 3-8% by weight of ΔE203
Without addition, the resistance change rate of the Ru 02 resistor will increase.
ＰｂＯが１５重量％を越えると、熱膨張係数が８５ｘｌ
Ｏ−’℃−皿を越えて亀裂が発生し、６５重量％未満と
なると焼き付は不良を起こづ。When PbO exceeds 15% by weight, the thermal expansion coefficient is 85xl.
O-'°C-Cracks occur beyond the plate, and when the amount is less than 65% by weight, seizure failure occurs.
＋３２０３が２５巾量％を越えると焼ぎイ１Ｇノ不良を
起こし、１５重量％未満となると相対的に１）ｂｏの中
小％が増しく熱膨張係数がａｓｘｉｏ−’℃−寡を越え
（亀裂の発生を起こし、また、抵抗値の変化率を８１０
２とへ１１２０３の序で調整できなくなる。If +3203 exceeds 25% by weight, it will cause failure of 1G, and if it becomes less than 15% by weight, 1)bo will increase relatively. It also causes the rate of change in resistance to 810
Adjustment becomes impossible in the order of 2 and 11203.
ＰｂＯが６５へ・７５重間％、 Ｂ’２０３が１５〜２
５重量％の範囲内にないと抵抗値の変化率を５ｉ０２゜
ＡＡ２０３の量Ｃ調整できなくなる。PbO is 65 to 75%, B'203 is 15 to 2
If it is not within the range of 5% by weight, the rate of change in resistance value cannot be adjusted by the amount C of 5i02°AA203.
（／ｒ２０３は０〜５重量％の範囲で添加され、５重惜
％を越えると透明性が悪くなる。(/r203 is added in a range of 0 to 5% by weight, and if it exceeds 5% by weight, transparency deteriorates.
本発明の板面用ガラス組成物は通當１０〜５０μｍの膜
厚で゛用いられる。膜厚が５０μｍを越えると透視ぐき
なくなり、１０μｍより薄い膜厚では保護被膜の強度上
問題がある。The glass composition for plate surfaces of the present invention is generally used in a film thickness of 10 to 50 μm. If the film thickness exceeds 50 μm, there will be no transparency, and if the film thickness is less than 10 μm, there will be problems in terms of strength of the protective film.
本発明の被覆用ガラスペーストはセラミック基板上のＲ
１１０２、Ａ（１−Ｐｄ等の厚膜回路上に印刷され、４
６０へ・５６０°０で焼きイ１（ノられて被覆ガラス膜
を形成づる。これに用いる粉末状ガラス組成物の粉末粒
子の平均粒径は、表面の滑らかな保護被膜を形成するた
めに５〜３０μｍの範囲にづることが好ましい。The glass paste for coating of the present invention has R on a ceramic substrate.
1102, A (1-Printed on thick film circuit such as Pd, 4
The average particle size of the powder particles of the powdered glass composition used for this is set at 5 to 560° to form a protective film with a smooth surface. It is preferable to fall within the range of ~30 μm.
有機溶剤及び有機結合剤はガラス組成物をペースト状態
にするためのもので、いずれも空気中での焼ぎ付は処理
によって飛散しＣしまうものである。従って、有機溶剤
は焼き付は温度以下で飛散し得るものでガラス組成物と
反応しないものであれば特に限定されず、一般的にはα
テルピネオール、ブチルカルピトール
ート等が用いられる。有機結合剤は、従来セルロース系
樹脂が用いられて来たが、セルロース系樹脂は多量にガ
ラスペーストに入れて用いると、融着温度が５６０℃以
下のガラスの場合、残炭を起こし透明性を低減すると共
に色調の変化を起こし美観を損なうという欠点を有して
いる。また、セルロース系樹脂結合剤の世を減らすと、
ガラスペーストの印刷性並びに印刷後の強度を著しく損
うという欠点を有している。そこで、種々の結合剤を検
問した結果、アクリル系樹脂結合剤、または、アクリル
系樹脂とセルロース系樹脂との混合結合剤を用いた有機
ビヒクルを使用りることにより、透明ｆ１の高い無（Ｌ
または緑色を１１１ ｉＪイ）美り、 ｕＮ ／Ｊシラ
ス覆膜の形成が可能となった。アク１ノル系樹月旨結合
剤としではポリメタクリル酸メチル、［ステル。The organic solvent and the organic binder are used to make the glass composition into a paste state, and both of them scatter in the process when burned in the air, resulting in carbon. Therefore, the organic solvent is not particularly limited as long as it can scatter at temperatures below the baking temperature and does not react with the glass composition, and generally α
Terpineol, butyl carpitol, etc. are used. Conventionally, cellulose resin has been used as an organic binder, but if a large amount of cellulose resin is used in a glass paste, it will cause residual carbon and reduce transparency if the glass has a fusing temperature of 560°C or less. However, it has the disadvantage that it causes a change in color tone and impairs the aesthetic appearance. Also, if you reduce the use of cellulose resin binders,
It has the disadvantage that it significantly impairs the printability of glass paste and the strength after printing. Therefore, as a result of examining various binders, we found that by using an organic vehicle using an acrylic resin binder or a mixed binder of acrylic resin and cellulose resin, we could achieve a high transparency f1 (L).
In addition, the green color was improved to 111 iJ), making it possible to form a uN/J shirasu coating. Polymethyl methacrylate, [Stell.
ポリメタクリル酸エチル１ステル、ポリ７り１ノル酸メ
ヂルー１ステル、ポリアクリルＭ ：ｌＬ １ル土ステ
ル雪を用いることが（゛きるがこのうら、ポリメタクリ
ル酸メチルニスデル、ポリアクリル酸メブルコースｊル
が好ましい。セルロース系樹脂結合剤としてはメブルレ
ルロース、王プルセルロース、二１−ロセルロース等を
用いることができるがこのうち、−［ヂルレルロースが
好ましい。1 ester of polyethyl methacrylate, 1 ester of poly(7-di-1-noryl) acid, 1 liter of polyacrylic M Preferred. As the cellulose-based resin binder, mebrululose, king pulcellulose, 21-locellulose, etc. can be used, but among these, -[dilerulose is preferred.
１実施例の説明］ 以下に本発明の一実施例を説明−りる。Description of 1 embodiment] An embodiment of the present invention will be described below.
［実施例１］
試料の作成は先ず、■集用１ｊｕｌ”ｌ（Ｎ度（＋９．
９％以上） ｌ’あるＳ！ ０２．８２０３、ＰｂＯ１
ＡＱ２０３ 、Ｃｒ ２０３を、第１表に承り組成比に
なるように調合しく、アルミナボットミルを用０て乾式
混合を行なった。これを白金るつぼに入れ−Ｃ電気炉中
で８００〜１０００℃の温度で溶融し、その後ン令ｆＪ
Ｉカラス化を？ｊなった。これをクラツシｉ・−ミルで
破砕後、アルミナポットミルで粉砕し、平均粒径を５〜
３０μｍにそろえた。次に、このガラス粉末５０ｇに対
し有機溶剤としＣαテルビネオ−−ルを１０ｇ、有機結
合剤としくポリメタクリル酸メチルニスデル及びエチル
セルロースを０．４ｇづつ加え−（三本ローラーミルで
混合し、ガラスペーストとした。[Example 1] First, a sample was prepared using 1 jul"l (N degree (+9.
9% or more) I'm S! 02.8203, PbO1
AQ203 and Cr203 were mixed according to the composition ratio shown in Table 1 and dry mixed using an alumina bot mill. This is placed in a platinum crucible and melted at a temperature of 800 to 1000°C in an electric furnace.
I turned into a crow? It became j. This was crushed with a Kuratsushi i-mill and then crushed with an alumina pot mill to reduce the average particle size to 5~
The thickness was adjusted to 30 μm. Next, to 50 g of this glass powder, 10 g of Cα tervineol as an organic solvent, and 0.4 g each of polymethyl nisder methacrylate and ethyl cellulose as organic binders were added (mixed with a three-roller mill, and combined with glass paste. did.
試料番号１〜１６まぐは本発明の実施例で、試料番号１
７〜２８までは比較例である。Sample numbers 1 to 16 are examples of the present invention, and sample number 1
Examples 7 to 28 are comparative examples.
第 １ 表 〔単位二手Ｗ％〕熱膨張
係数は、ガラスを２０＋＋＋ｍｘ ３ ｍｍφの内争１
状に形成し、熱膨張測定装置により測定した。Table 1 [Unit of two hands W%] Thermal expansion coefficient of glass is 20 + + + m x 3 mmφ internal conflict 1
It was formed into a shape and measured using a thermal expansion measuring device.
添付図面に示したようにアルミナ等のしラミンク基板上
に上記のガラスペース１−を印刷し、４６０〜５６０℃
の範囲まで昇温しながら焼ぎ付【ノを行なった。添付図
面はセラミック基板上にＲｕ ０２ 。As shown in the attached drawing, the above glass space 1- is printed on a laminated substrate such as alumina, and heated at 460 to 560°C.
Baking was performed while raising the temperature to a range of . The accompanying drawing shows Ru 02 on a ceramic substrate.
Δａ−Ｐｄにて回路形成を行なった厚膜回路の平面図で
１はセラミック基板、２はＲＩＪ ０２抵抗体、３はガ
ラス被覆部、４はＡｇ−Ｐｄ電極部である。In the plan view of a thick film circuit formed using Δa-Pd, 1 is a ceramic substrate, 2 is an RIJ 02 resistor, 3 is a glass covering part, and 4 is an Ag-Pd electrode part.
ガラス被膜に亀裂があるか否かは、光学顕微鏡にＪ：す
、この基板を観察して行なった。The presence or absence of cracks in the glass coating was determined by observing this substrate using an optical microscope.
ＲＵ ０２抵抗値変化率の測定は、添付図面の回路の各
抵抗を、４端子法により測定して、焼き付り前の抵抗値
と焼き付は後の抵抗値との差を、焼き付は前の抵抗値で
割った値に １００を乗じた値（％〉で示した。この値
が０．３％以下であれば合格とした。To measure the rate of change in resistance value of RU 02, measure each resistance of the circuit shown in the attached drawing using the four-terminal method, and calculate the difference between the resistance value before burn-in and the resistance value after burn-in. The value divided by the previous resistance value and multiplied by 100 is expressed as a value (%). If this value is 0.3% or less, it is considered to have passed.
透明性の判断は、この焼き付けを行なった基板で、厚膜
回路が５０μｍの厚さの被覆ガラス膜を通してはっきり
と見えるか否かで行なった。Transparency was judged based on whether the thick film circuit could be clearly seen through the 50 μm thick coated glass film on the printed board.
これらの結果を第２表に承り。第２表中の透明性の欄Ｃ
１〈−）印のものは、焼ぎ付は不良でガラスが基板上に
融着せず、透明性を判定するに値しないことを意味覆る
。第２表から明らかなように、本発明の実施例ひある試
料番号１〜１６は、４６０〜５６０℃の焼ぎイ」け温度
範囲内で、被覆性も良好で、焼きイ」（）後の亀裂の発
生がなく、透明性もよく、熱膨張係数も６５Ｘ１０’−
７〜８５Ｘ１０−’℃−１の範囲内にあり、抵抗値変化
も少なく、諸特性において優秀な特性を示している。These results are shown in Table 2. Transparency column C in Table 2
A mark of 1<-) means that the printing is poor and the glass is not fused onto the substrate, making it unworthy to judge the transparency. As is clear from Table 2, sample numbers 1 to 16, which are examples of the present invention, had good coverage within the baking temperature range of 460 to 560°C, and after baking No cracks occur, good transparency, and thermal expansion coefficient of 65X10'-
It is within the range of 7 to 85 x 10-'C-1, has little change in resistance value, and exhibits excellent properties in various respects.
これに対し−Ｃ１比較例である試料番号１７〜２６は抵
抗値の変化率が高いか、亀裂の発生が起こるか、若しく
は、４６０〜５６０°０の焼き付り温度範囲外で焼きイ
ζロノ不良を起こすかのいずれかの欠点を有しＣいる。On the other hand, sample numbers 17 to 26, which are comparative examples of -C1, had a high rate of change in resistance, cracks occurred, or were baked outside the baking temperature range of 460 to 560 degrees. It has some drawbacks such as causing defects.
また、試料番５４２７．２８の試料では、被覆カラス膜
の色がｉ＊になりりぎＣ１被覆ガラス欣を通じ（基板上
の厚膜回路を透視できないという欠点がある。In addition, in the sample No. 5427.28, the color of the covered glass film became i*, and there was a drawback that the thick film circuit on the substrate could not be seen through the C1 coated glass plate.
笛 ９ 夷
［実施例２」
本発明の被覆用ガラスペーストに用いる有機結合剤につ
いて検討した。実験条件は有機結合剤の種類を除いて実
施例１と同様である。セルロース系樹脂としてエチルセ
ルロースを用い、アクリル系樹脂としＣポリメタクリル
酸メブルＪ−ステルを用いて実験を行なった。Fue 9 Yoshi [Example 2] The organic binder used in the coating glass paste of the present invention was studied. The experimental conditions were the same as in Example 1 except for the type of organic binder. Experiments were conducted using ethyl cellulose as the cellulose resin and C polymethacrylic acid meblu J-stell as the acrylic resin.
その結果セルロース系樹脂の一部または全部をアクリル
系樹脂に代えることにより、これらを飛散させるための
保持時間を低減させることが可能となり、また、残炭を
起こさないで透明なガラス被膜を形成りることが可能と
なった。As a result, by replacing part or all of the cellulose resin with acrylic resin, it is possible to reduce the retention time required to scatter these resins, and it is also possible to form a transparent glass film without causing residual carbon. It became possible to
アクリル系樹脂とセルロース系樹脂との混合結合剤を用
いた場合は、レル１］−ス系樹脂の重量をアクリル系樹
脂の重量の１．２倍以下にする必要があり、これ以上に
セルロース系樹脂量を増やすと、焼き付は時に、セルロ
ース系樹脂を飛散させるため３００〜４００℃イ］近に
て２時間以上の保持時間が必要Ｃある。これでは、短時
間に焼き付けを完了さＵることが不可能であり、この飛
散のための保持時間を怠るど残炭を起こし、色調の変化
を起こすと共に透明性が著しく低減した。しかし、セル
ロース系樹脂とアクリル系樹脂の重量の比を１．２倍以
下にすると、昇温、焼ぎ付り、冷却の時間を１時間以下
ぐ済ませることが可能となった。また、アクリル系樹脂
のみの場合は約３０分でこの操作が完了した。When using a mixed binder of acrylic resin and cellulose resin, the weight of the 1]-s resin must be 1.2 times or less the weight of the acrylic resin, and the weight of the cellulose resin must be less than 1.2 times the weight of the acrylic resin. When the amount of resin is increased, baking may sometimes occur, requiring a holding time of 2 hours or more at 300 to 400° C. in order to scatter the cellulose resin. In this case, it was impossible to complete baking in a short time, and if the holding time for this scattering was not maintained, residual charcoal was formed, causing a change in color tone and a marked reduction in transparency. However, by setting the weight ratio of cellulose resin to acrylic resin to 1.2 times or less, it became possible to reduce the time required for temperature rise, baking, and cooling to one hour or less. Moreover, in the case of using only acrylic resin, this operation was completed in about 30 minutes.
なお、これらの実施例では、Ｂ２Ｏ３を得る原料として
、無水ホウ酸を用いたが、１１３８０３でモ良り、マｔ
ｃ、Ｐｂ０（７）代用としＴＰｔ） ３０４ ”Ｃもよ
く、その他の原料も、ガラスとして溶解する時に、酸化
して上記のＳｉ ０２ 、Ｂ２０３ 、ＰｂＯ，Ａ９２
０３ 、Ｃｒ ２０３ となるようなシュウ酸塩、炭酸
塩、硝酸塩等のものであっても良好な特性ならびに結果
が得られた。In addition, in these examples, boric anhydride was used as a raw material for obtaining B2O3, but 113803 had poor mosaic properties and matte
c, Pb0 (7) substituted for TPt) 304 ``C is also good, and other raw materials are also oxidized when melted as glass to form the above Si 02 , B203 , PbO, A92
Good properties and results were obtained even with oxalates, carbonates, nitrates, etc., such as Cr 203 and Cr 203 .
［発明の効果］
以上の゛ように、本発明の被覆用ガラス及びガラスペー
ストを用いれば、Ｒ（１０２抵抗体を含む厚膜回路の被
覆保護が、Ｒｕ ０２抵抗体の抵抗値の補正もせずに可
能になるので、回路の集積度を向１さＵたこの秤の厚欣
伺路の信頼ｆ１が維持、保障され、電子回路の小型化が
促進されることとなり、ｆｒ業ト、特に電工回路の分野
で神話するところ多大である。[Effects of the Invention] As described above, by using the coating glass and glass paste of the present invention, the coating protection of a thick film circuit including an R(102 resistor) can be achieved without having to correct the resistance value of the Ru02 resistor. This makes it possible to increase the degree of circuit integration, maintain and guarantee the reliability of the scale, and promote the miniaturization of electronic circuits. There are many myths in the field of circuits.
添イ′Ｎ１図面【よレラミック基板上にＲＬｌ ０２
、 Ａ （１１）ｄに（回路形成を行なった厚膜回路の
平面図である。
１・・・レラミック基板 ２・・・ＲＬＩＯ２抵抗体３
・・・ガラス被覆部 ４・・・Ａｃｔ−Ｐｄ電極部特許
出願人 松下電器産業株式会ネ１代理人弁理士 吉
村 悟Attached is the N1 drawing.
, A (11) d is a plan view of a thick film circuit in which a circuit is formed. 1... Reramic substrate 2... RLIO2 resistor 3
...Glass coating part 4...Act-Pd electrode part Patent applicant Matsushita Electric Industrial Co., Ltd. Ne1 Representative Patent Attorney Yoshi
Satoru Mura
Claims (4)
巾間％、ＰｂＯを６５〜７５重量％、ＡＱ２０３を３へ
・８重量％、Ｃｒ２Ｏ３を５重量％以下含む組成よりな
る被覆用ガラス組成物。(1) 3-7% by weight of Si02, 15-25% of B2O3
% width, 65 to 75% by weight of PbO, 3 to 8% by weight of AQ203, and 5% by weight or less of Cr2O3.
重ｆｉ％、ＰｂＯを６５〜７５重量％、ＡＩ！２０３を
３〜８重量％、Ｃｒ２Ｏ３を５重量％以下含む組成より
なる粉末状ガラス組成物を、有機溶剤と有機結合剤にＣ
練り合わせてなる被覆用ガラスペースト。(2) S! (h is 3 to 7 times the heaviest B203 is 15 to 25
weight fi%, 65-75 weight% PbO, AI! A powdered glass composition containing 3 to 8% by weight of 203 and 5% by weight or less of Cr2O3 is added to an organic solvent and an organic binder using carbon.
Glass paste for coating made by kneading together.
３０μｍ′ｃある特許請求の範囲第（２）項に記載の被
覆用ガラスペースト。(3) The average particle size of the powdered glass composition is 5 to 5.
A glass paste for coating according to claim (2) having a thickness of 30 μm'c.
たは、アクリル系樹脂とセルロース系樹脂との混合結合
剤である特許請求の範囲第り２）項に記載の被覆用ガラ
スペースト。(4) The glass paste for coating according to claim 2), wherein the organic binder is an acrylic resin alone or a mixed binder of an acrylic resin and a cellulose resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6826783A JPS59195552A (en) | 1983-04-20 | 1983-04-20 | Glass composition for coating and glass paste for coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6826783A JPS59195552A (en) | 1983-04-20 | 1983-04-20 | Glass composition for coating and glass paste for coating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59195552A true JPS59195552A (en) | 1984-11-06 |
| JPS6310104B2 JPS6310104B2 (en) | 1988-03-03 |
Family
ID=13368799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6826783A Granted JPS59195552A (en) | 1983-04-20 | 1983-04-20 | Glass composition for coating and glass paste for coating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59195552A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61227940A (en) * | 1985-03-29 | 1986-10-11 | Sumitomo Metal Mining Co Ltd | Glass paste |
| US4717690A (en) * | 1986-02-12 | 1988-01-05 | Heraeus, Inc. Cermalloy Division | Overglaze inks |
| US5224001A (en) * | 1989-11-29 | 1993-06-29 | Matsushita Electric Industrial Co., Ltd. | Magnetic head |
| JP2011176188A (en) * | 2010-02-25 | 2011-09-08 | Kyocera Corp | Glass ceramic wiring board |
| JP2013189372A (en) * | 2013-04-23 | 2013-09-26 | Central Glass Co Ltd | Conductive paste material |
| CN109093289A (en) * | 2018-10-11 | 2018-12-28 | 南京恩瑞科技有限公司 | A kind of cryogenic vacuum sealing-in solder and preparation method thereof |
-
1983
- 1983-04-20 JP JP6826783A patent/JPS59195552A/en active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61227940A (en) * | 1985-03-29 | 1986-10-11 | Sumitomo Metal Mining Co Ltd | Glass paste |
| JPH0149654B2 (en) * | 1985-03-29 | 1989-10-25 | Sumitomo Metal Mining Co | |
| US4717690A (en) * | 1986-02-12 | 1988-01-05 | Heraeus, Inc. Cermalloy Division | Overglaze inks |
| US5224001A (en) * | 1989-11-29 | 1993-06-29 | Matsushita Electric Industrial Co., Ltd. | Magnetic head |
| JP2011176188A (en) * | 2010-02-25 | 2011-09-08 | Kyocera Corp | Glass ceramic wiring board |
| JP2013189372A (en) * | 2013-04-23 | 2013-09-26 | Central Glass Co Ltd | Conductive paste material |
| CN109093289A (en) * | 2018-10-11 | 2018-12-28 | 南京恩瑞科技有限公司 | A kind of cryogenic vacuum sealing-in solder and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6310104B2 (en) | 1988-03-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR890000725B1 (en) | Improved overglaze inks | |
| KR890001785B1 (en) | Improved low value resistor ink | |
| US4060663A (en) | Electrical resistor glaze composition and resistor | |
| US4209764A (en) | Resistor material, resistor made therefrom and method of making the same | |
| JP2006193385A (en) | Glass for coating electrode and front and back substrates of plasma display panel | |
| JPH0337281B2 (en) | ||
| US4397915A (en) | Electrical resistor material, resistor made therefrom and method of making the same | |
| JPS59195552A (en) | Glass composition for coating and glass paste for coating | |
| JPH05175005A (en) | Thick-film resistor composition | |
| US4205298A (en) | Resistor material, resistor made therefrom and method of making the same | |
| JPS5931841B2 (en) | Resistance materials and resistors made from them | |
| JPH0277485A (en) | Encapsulating composition | |
| JPS6054721B2 (en) | Paste composition for forming insulators | |
| JPH06239646A (en) | Coating glass composition and paste prepared by using the same | |
| JPS6177637A (en) | Glass composition for glaze | |
| JP2001322831A (en) | Over-coat glass and thick film printed circuit board | |
| JPS59131540A (en) | Glass composition for insulation layer | |
| JPH04206602A (en) | Thick-film resistance composition | |
| JPH0416420B2 (en) | ||
| JPH0438121B2 (en) | ||
| JPH02212336A (en) | Glass-ceramic composition and its use | |
| JPH0656461A (en) | Glass paste composition | |
| JP3094683B2 (en) | Composition for forming thick film resistor | |
| JPS62265144A (en) | Glass for covering resistor | |
| JP3105979B2 (en) | Crystalline low melting point glass for cover coating of thick film electronic circuits |