JPS59185769A - Method for plating strip - Google Patents
Method for plating stripInfo
- Publication number
- JPS59185769A JPS59185769A JP6037183A JP6037183A JPS59185769A JP S59185769 A JPS59185769 A JP S59185769A JP 6037183 A JP6037183 A JP 6037183A JP 6037183 A JP6037183 A JP 6037183A JP S59185769 A JPS59185769 A JP S59185769A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- plating
- grooves
- strips
- rolls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims description 18
- 238000002203 pretreatment Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 4
- 238000012805 post-processing Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/40—Plates; Strips
- C23C2/405—Plates of specific length
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Heat Treatments In General, Especially Conveying And Cooling (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- Tunnel Furnaces (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Rollers For Roller Conveyors For Transfer (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
Description
【発明の詳細な説明】 この発明は短冊状メッキ物のメッキ処理方法に関する。[Detailed description of the invention] The present invention relates to a method for plating plated strips.
メッキ処理は、従来より多種多様の処理方法が提案され
且つ実施化されているが、第１図〜第６図で示すように
例えば工Ｃリードフレームの如き短冊状メッキ物１〔以
下単に［メッキ匍と称す］を噴射メッキ装置２にてメッ
キ処理する場合、能率向上のためにパスライン上に多数
枚のメッキ物１を置きいわば並列的に移送させながら処
理槽３内で処理液に接触させて前処理ゾーンＡ及び後処
理ゾーンＢで各々意図する前処理、後処理を施しメッキ
ゾーンＣの噴射メッキ装置（図示せず）上で多数枚同時
にメッキする方法が提案されている。このようなメッキ
処理方法にあっては、通常水平ロール４がパスラインに
沿って複数配置されその上を並列的に複 。A wide variety of plating methods have been proposed and implemented in the past, but as shown in Figs. When plating a plated material (referred to as a plating material) using the spray plating apparatus 2, a large number of plated materials 1 are placed on a pass line and transferred in parallel, so to speak, in order to improve efficiency, and brought into contact with the processing solution in the processing tank 3. A method has been proposed in which a pretreatment zone A and a posttreatment zone B perform intended pretreatment and posttreatment, respectively, and a large number of sheets are simultaneously plated on a spray plating apparatus (not shown) in a plating zone C. In such a plating method, a plurality of horizontal rolls 4 are usually arranged along the pass line, and the rolls are rolled in parallel on the horizontal rolls 4.
数枚のメッキ物１を通すもの７．ｓる。従って、かかる
メッキ処理方法にあっては、メッキ物１を各々水平状態
にして移送するため複数枚のメッキ物の幅に応じたパス
ライン幅Ｗ１が要求されロードゾーンＤ１前処理ゾーン
Ａ１メッキゾーンＣ１後処理ゾーンＢ１及びアンロード
ゾーンＥを問わず多数枚のメッキ物１を通すためにはそ
れに応じた広幅に全体を構成せねばならず各処理槽３の
幅Ｗ２は同様に大幅であるととが必要とされ、逆に云え
ば成る幅サイズに限定されている処理槽があるとすれば
その幅サイズ内で通せるメッキ物の枚数〔換言すればメ
ッキ物の並列数〕が限定されてしまい、それを多くでき
ないという不具合がある。7. Passing through several plated objects 1. Sru. Therefore, in such a plating method, in order to transfer the plated articles 1 in a horizontal state, a pass line width W1 corresponding to the width of the plurality of plated articles is required.Load zone D1 Pretreatment zone A1 Plating zone C1 In order to pass a large number of plated objects 1 through both the post-processing zone B1 and the unloading zone E, the overall width must be made correspondingly wide, and the width W2 of each processing tank 3 must be similarly large. In other words, if there is a processing tank whose width is limited, the number of plated objects that can be passed through that width (in other words, the number of plated objects in parallel) is limited. , there is a problem that it is not possible to do many of them.
この・発明はこのような点に注目して為されたもので、
短冊状メッキ物を複数枚高密度にして能率よく処理する
ために、水平（横形）Ｋ換えて縦形にして移送すること
を特徴としてお９、具体的にはこの発明に係る短冊状メ
ッキ物のメッキ処理方法は、複数の短冊状メッキ物の各
々がパスラインに沿って複数配置した複数の溝付きロー
ルの各溝内で縦形にして支持されつつ移送されてメッキ
処理を受けることを要旨としている。This invention was made with attention to these points,
In order to efficiently process a plurality of plated strips at a high density, the plated strips are transported vertically instead of horizontally.9 Specifically, the plated strips according to the present invention are The gist of the plating method is that each of a plurality of strip-shaped plated objects is vertically supported in each groove of a plurality of grooved rolls arranged along a pass line, and then transported and subjected to the plating treatment. .
以下この発明の詳細を、図面を参照して説明する。周板
下では従来と共通する部分につき同一符号を用いること
にし重複説明は省略する。The details of this invention will be explained below with reference to the drawings. Below the circumferential plate, the same reference numerals will be used for parts common to the conventional one, and redundant explanation will be omitted.
先ず、この発明ではメッキ物１を水平（横形）に換えて
縦形にして移送するものであり、このため複数の溝付き
ロール１０が従来の水平ロール４Ｖｃ換えて使用される
。こ−れらの溝付きロール１０の複数の溝１１はメッキ
物１を縦形にして十分支持できるサイズと形状のものに
され、第５図（イ）で示すようにメッキ物１を受入れ易
いように広開口１２で、底１３及び斜面１４にてメッキ
物１を倒れぬよう支持し、全体としてメッキ物１を若干
「傾斜状態」で縦形にして支持することも、又第５図（
ロ）で示すようにメッキ物１の厚さ１［相応させて底１
５及びその近辺部位を凹設し、全体としてメッキ物１を
「垂直に近い状態」で縦形にして支持することも可能で
あシ、種々の形状、サイズの溝１１が採用できるもので
ある。勿論、多数枚のメッキ物１を同時に移送するため
にはその枚数に見合う数の溝１１をロール１ｏに形成し
ておくことになシ、メッキ物１が通常の工Ｃリードフレ
ームであれば、溝１１の開口は０．２５〜１０ｍｍ、底
１３．１５のサイズはｏ、１５〜２．０１＋１１１１．
深さは３〜２５価、溝１１同士のピッチは５〜４０ｍｍ
程度にすることができる。各ロール゛１ｏ′は、このよ
うな溝１１を複数周面に備えておシ、パスラインに沿っ
て複数配置されることになる。配置［ｆｉっては、種々
の形状、サイズの溝１１付きロール１０を組合わせるこ
とも可能であυ、第６図の例では、前処理ゾーンＡと後
処理ゾーンＢの各々中央区間でピッチの比較的小なる溝
付きロール１０を用いその前後の区間ではピッチの比較
的太なるそして開口の比較的広い溝付きロール１０を組
合わせて用い、前処理ゾーンＡと後処理ゾーンＢではロ
ード、メッキ及びアンロードの各ゾーンＤ、Ｃ，Ｅの処
理能力が和尚高くなってもそれに合わせて多数枚のメッ
キ物１を縦形にして高密度にして支持しつつ移送できる
ようにしである。First, in the present invention, the plated object 1 is transferred vertically instead of horizontally, and therefore a plurality of grooved rolls 10 are used in place of the conventional horizontal roll 4Vc. The plurality of grooves 11 of these grooved rolls 10 are of a size and shape that can sufficiently support the plated object 1 in a vertical manner, so that it can easily receive the plated object 1, as shown in FIG. 5(a). It is also possible to support the plated object 1 with the wide opening 12, the bottom 13 and the slope 14 so that it does not fall down, and to support the plated object 1 as a whole in a slightly "inclined" vertical position.
As shown in b), the thickness of the plated object 1 is 1 [correspondingly, the bottom 1
It is also possible to support the plated object 1 vertically in a "nearly vertical state" by recessing the grooves 5 and the vicinity thereof, and grooves 11 of various shapes and sizes can be employed. Of course, in order to transfer a large number of plated articles 1 at the same time, it is necessary to form grooves 11 in the roll 1o in a number corresponding to the number of plated articles 1.If the plated article 1 is a regular C lead frame, The opening of the groove 11 is 0.25 to 10 mm, and the size of the bottom 13.15 is o, 15 to 2.01+1111.
The depth is 3 to 25, and the pitch between grooves 11 is 5 to 40 mm.
It can be done to a certain extent. Each roll 1o' is provided with a plurality of such grooves 11 on its circumferential surface, and a plurality of such grooves 11 are arranged along the pass line. It is also possible to combine rolls 10 with grooves 11 of various shapes and sizes, and in the example shown in FIG. A relatively small grooved roll 10 is used, and grooved rolls 10 with a relatively thick pitch and a relatively wide opening are used in combination in the sections before and after the grooved roll 10, and in the pre-processing zone A and post-processing zone B, the load, Even if the throughput of the plating and unloading zones D, C, and E increases, a large number of plated products 1 can be arranged vertically in a high density manner, and can be transported while being supported.
伺、第５図（イ）（ロ）で示すような溝１１の斜面１４
の傾斜度を順次緩急又は急緩として用いることも可能で
あり、又例えばロードゾーンＤは水平送りとし前処理ゾ
ーンＡに入ってから徐々に斜面１４の傾斜度を暖よシ急
にした溝１１付きロール１０を組合わせてメッキ物１を
水平（横形）から縦形にして移送することも又、その逆
にすることも十分可能である。The slope 14 of the groove 11 as shown in Fig. 5 (a) and (b)
It is also possible to use the groove 11 with the inclination of the slope 14 gradually becoming steeper and steeper or steeper gradually. It is fully possible to transport the plated object 1 from horizontal to vertical by combining the attached rolls 10, and vice versa.
このようにして、複数の溝付きロールの各溝内で、メッ
キ物を縦形にして支持・移送するものとし、複数枚のメ
ッキ物を並列的に多数枚移送しては前処理、メッキ及び
後処理を施してメッキ処理するものである。In this way, the plated articles are vertically supported and transported within each groove of the plurality of grooved rolls, and a large number of plated articles are transferred in parallel for pretreatment, plating, and post-treatment. It is treated and plated.
この発明に係る短冊状メッキ物のメッキ処理方法は以上
の如き内容のものなので、従来の水平ロール使用のメッ
キ処理方法に比べて同じロール幅、処理槽幅であっても
溝付きロールにてメッキ物を縦形にして支持・移送する
ので、ロールの溝ピッチを小にして多数の溝をロールに
形成しておくことによシ格段と高密度にして移送能力を
高めることができ、短冊状メッキ物を並列的に移送して
は前処理、メッキ及び後処理を施すメッキ処理方法にと
ってメッキ処理能力の相当な向上が期待でき、特にメッ
キ処理条件の内短冊状メッキ物の移送枚数を相当多めに
設定できて、メッキ処理のライン設計がし易くなるとい
う利点もある。Since the method for plating plated strips according to the present invention is as described above, plating is performed using grooved rolls even if the roll width and processing tank width are the same compared to the conventional plating method using horizontal rolls. Since objects are supported and transported vertically, by reducing the pitch of the grooves on the roll and forming a large number of grooves on the roll, it is possible to achieve a much higher density and increase the transport capacity. For a plating method that transfers objects in parallel and performs pre-treatment, plating, and post-treatment, a considerable improvement in plating processing capacity can be expected, especially if the number of strip-shaped plated objects to be transferred is considerably increased in the plating processing conditions. There is also the advantage that it can be set easily, making it easier to design the plating process line.
第１図は従来のメッキ処理方法に用いている水平ロール
の使用状態を示す斜視図、
第２図はロードよシアンロードゾーンに至るメッキ処理
の工程概略平面図、
第６図は第２図中の矢示腰部のメッキ物の移送状態を示
す平面図、
第４図はこの発明に係るメッキ処理方法に用いる溝付き
ロールの使用状態を示す第１図相当の斜視図、
第５図（イ）（ロ）は溝付きロールの実施例を各々示す
ロールの部分正面図、
第６図はこの発明の一実施例を示す第２図相当の工程概
略平面図、そして
第７図は第６図中の矢示■部のメッキ物の移送状態を示
す第５図相当の平面図である。
１ ・・・ 短冊状メッキ物
３ ・・・ 処理槽
４ ・・・ 水平ロール
Ａ ・・・ 前処理ゾーン
Ｂ ・・・ 後処理ゾーン
Ｃ・・・ メッキゾーン
Ｄ ・・・ ロードゾーン
Ｅ ・・・ アンロードゾーン７
１０ ・・・ 溝付きロール
１１・・・溝Figure 1 is a perspective view showing how the horizontal roll used in the conventional plating process is used, Figure 2 is a schematic plan view of the plating process from the load to cyan load zone, and Figure 6 is the middle of Figure 2. FIG. 4 is a perspective view corresponding to FIG. 1 showing the state of use of the grooved roll used in the plating method according to the present invention; FIG. 5 (A) (B) is a partial front view of a roll showing each embodiment of the grooved roll, FIG. 6 is a schematic plan view of a process corresponding to FIG. 2 showing an embodiment of the present invention, and FIG. FIG. 6 is a plan view corresponding to FIG. 5 showing the state of transfer of the plated material in the area indicated by the arrow . 1... Strip-shaped plated object 3... Processing tank 4... Horizontal roll A... Pre-treatment zone B... Post-treatment zone C... Plating zone D... Load zone E... Unload zone 7 10...Grooved roll 11...Groove
Claims (1)
メッキ及び後処理を施す短冊状メッキ物のメッキ処理方
法に於いて、 上記短冊状メッキ物は、各々がパスラインに沿って複数
配置した複数の溝付きロールの各溝内で縦形にして支持
されつつ移送されることを特徴とする短冊状メッキ物の
メッキ処理方法。[Claims] A plurality of plated strips are transported in parallel and subjected to pre-treatment,
In a method for plating plated strips that undergo plating and post-treatment, the plated strips are supported vertically within each groove of a plurality of grooved rolls, each of which is arranged along a pass line. A method for plating a strip-shaped plated object, characterized in that the plated object is transported while being transported.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6037183A JPS59185769A (en) | 1983-04-06 | 1983-04-06 | Method for plating strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6037183A JPS59185769A (en) | 1983-04-06 | 1983-04-06 | Method for plating strip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59185769A true JPS59185769A (en) | 1984-10-22 |
| JPH0259877B2 JPH0259877B2 (en) | 1990-12-13 |
Family
ID=13140203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6037183A Granted JPS59185769A (en) | 1983-04-06 | 1983-04-06 | Method for plating strip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59185769A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0260153A (en) * | 1988-08-26 | 1990-02-28 | Electroplating Eng Of Japan Co | Plating method and device therefor |
| US6802419B2 (en) | 2002-10-11 | 2004-10-12 | Bert Co Industries, Inc. | Package form and method of making a package |
| US6899223B2 (en) | 2002-05-09 | 2005-05-31 | Bert-Co Industries, Inc. | Form for a package and method of making same |
-
1983
- 1983-04-06 JP JP6037183A patent/JPS59185769A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0260153A (en) * | 1988-08-26 | 1990-02-28 | Electroplating Eng Of Japan Co | Plating method and device therefor |
| US6899223B2 (en) | 2002-05-09 | 2005-05-31 | Bert-Co Industries, Inc. | Form for a package and method of making same |
| US6802419B2 (en) | 2002-10-11 | 2004-10-12 | Bert Co Industries, Inc. | Package form and method of making a package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0259877B2 (en) | 1990-12-13 |
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