JPS59185600A - Multistage type hot press - Google Patents

Multistage type hot press

Info

Publication number
JPS59185600A
JPS59185600A JP58060728A JP6072883A JPS59185600A JP S59185600 A JPS59185600 A JP S59185600A JP 58060728 A JP58060728 A JP 58060728A JP 6072883 A JP6072883 A JP 6072883A JP S59185600 A JPS59185600 A JP S59185600A
Authority
JP
Japan
Prior art keywords
materials
hot
plates
hot plate
pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58060728A
Other languages
Japanese (ja)
Inventor
Akemi Miyashita
宮下 明己
Motohiro Ohashi
大橋 基宏
Takeshi Shimazaki
嶋崎 威
Kaoru Ono
薫 小野
Hideyasu Murooka
室岡 秀保
Osamu Yamada
収 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58060728A priority Critical patent/JPS59185600A/en
Publication of JPS59185600A publication Critical patent/JPS59185600A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
    • B30BPRESSES IN GENERAL
    • B30B7/00Presses characterised by a particular arrangement of the pressing members
    • B30B7/02Presses characterised by a particular arrangement of the pressing members having several platens arranged one above the other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Press Drives And Press Lines (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To decrease the variance in the size of materials to be formed by providing fitting parts which position the materials to be formed to plural hot plates, and positioning the materials between the hot plates then grasping and forming the materials. CONSTITUTION:Materials 15 to be formed and prepregs 16 are alternately inserted onto guide pins 22 for positioning provided with tapered parts 22a to constitute said materials and prepregs in multiple layers. The guide pins 22 are inserted into the tapered holes of bushings 23 fitted onto intermediate hot plates 8 and the materials 15 are successively grasped between the plates 8. A lower hot plate 6 is then hydraulically moved upward to bring the uppermost material 15 into contact with the upper hot plate, thereby pressing the materials 15. The pins 22 are correctly positioned to meet the accuracy of the bushings 23 on the hot plates by the spring forces of the pressing mechanisms of the pins 22 consisting of springs 25 and pistons 24 provided in the hot plate right above the pins 22. The materials 15 are then formed.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明はコンピュータなど各種電子機器の多層プリント
配線板の被成形物を成形する際に好適な多段形ホットプ
レスに関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a multi-stage hot press suitable for molding objects such as multilayer printed wiring boards for various electronic devices such as computers.

〔発明の背景〕[Background of the invention]

従来の多段形ホットプレスは、第1図に示す如く、主と
してプレス本体1に固定されたラムシリンダー2のラム
3上に、下ボルスタ4が載せられ、下ボルスタ4上には
下断熱板5を介し、下熱板6が、締付ボルト7で固定さ
れ、さらに被成形物搬入搬出用翔口部を設けた上部に中
間熱板8がカウンターシリンダー9で支持され、最上部
は上熱板10が上断熱板11で熱的に絶縁されプレス本
体1と支柱12で連結された上ボルスタ13に締付ポル
ト14で固定されている。このホットプレスは下熱板6
と中間熱板8および中間熱板8と上熱板10間に、第2
図に示す如く被成形物15のプリント配線基板間にプリ
プレグ16を挾み込み、上、下治具板17.18及び複
数のガイドピン19で多層形成された多層プリント配線
基板の被成形物が挿入され、各々の熱板6,8.11に
加熱装置20よシ成形熱エネルギーを与えると同時に、
ラムシリンダー2およびカウンターシリンダ−9に油圧
装置21よシ所定の油圧を供給し、被成形物15を加圧
接着するものである。
As shown in FIG. 1, in a conventional multi-stage hot press, a lower bolster 4 is mainly placed on a ram 3 of a ram cylinder 2 fixed to a press body 1, and a lower heat insulating plate 5 is placed on the lower bolster 4. A lower hot plate 6 is fixed with tightening bolts 7, and an intermediate hot plate 8 is supported by a counter cylinder 9 at the upper part provided with a port for carrying in and out of the molded material, and an upper hot plate 10 is attached to the uppermost part. is fixed by a tightening port 14 to an upper bolster 13 which is thermally insulated by an upper heat insulating plate 11 and connected to the press body 1 by a column 12. This hot press has lower heating plate 6
and intermediate hot plate 8 and between intermediate hot plate 8 and upper hot plate 10, a second
As shown in the figure, a prepreg 16 is sandwiched between printed wiring boards of a molded object 15, and a multilayer printed wiring board formed by upper and lower jig plates 17 and 18 and a plurality of guide pins 19 is formed. At the same time, the heating device 20 applies forming heat energy to each hot plate 6, 8, and 11.
A predetermined hydraulic pressure is supplied to the ram cylinder 2 and the counter cylinder 9 by a hydraulic device 21, and the molded object 15 is bonded under pressure.

ところで前記プリント配線基板15間にプリプレグ16
を挾み込んだ被成形物15を固定する上8下治具板17
.18は、被成形物15と直接接触するため精度の面か
ら長さ500ミリメートルに対し0.03ミ17メート
ル以下の平行度及び平面度が要求される。しかしながら
上、下治具板17゜18は成形時の熱サイクルや運搬時
のすり摩耗や成形後の解体作業等で、そシや局部摩耗を
生じ、その結果成形時の圧力分布の不均一、局部伸び等
により、被成形物15の多層プリント配線基板のプリン
ト基板の寸法変化のばらつきが大きくなる。
By the way, there is a prepreg 16 between the printed wiring boards 15.
upper and lower jig plates 17 for fixing the molded object 15 sandwiched between the upper and lower jig plates 17;
.. 18 is required to have parallelism and flatness of 0.03 x 17 m or less for a length of 500 mm from the viewpoint of accuracy since it directly contacts the molded object 15. However, the upper and lower jig plates 17 and 18 are subject to warping and local wear due to heat cycles during molding, abrasion during transportation, and disassembly work after molding, resulting in uneven pressure distribution during molding, Due to local elongation and the like, variations in the dimensions of the printed circuit board of the multilayer printed wiring board of the molded object 15 become large.

そこでこの品質低下防止対策として上、下治具板17.
18の定期的な精度測定の実施によシ、精度的に管理レ
ベルを外ずれたものはそシ修正もしくは再研摩を実施し
ている。しかしこの管埋費用、治具板の新製費用等が被
成形物の製造原価に占める割合が高くなり、これらの問
題解決が望まれていた。
Therefore, as a measure to prevent this quality deterioration, the upper and lower jig plates 17.
18 periodic accuracy measurements are carried out, and if the accuracy falls outside the control level, it is corrected or re-sharpened. However, the cost of sinking pipes, the cost of manufacturing new jig plates, etc. account for a high proportion of the manufacturing cost of the molded product, and a solution to these problems has been desired.

〔発明の目的〕[Purpose of the invention]

本発明の目的は上記の点に鑑み原価低域を図るようにし
た多段形ホットプレスを提供することを目的とする。
SUMMARY OF THE INVENTION In view of the above points, it is an object of the present invention to provide a multi-stage hot press which is designed to reduce the cost.

〔発明の概要〕[Summary of the invention]

本発明の特徴とするところは、被成形物を挾持する治具
板と、被成形物を加熱する複数の熱板と、前記熱板およ
び治具板を介して被成形物を加圧する加圧機構などを備
える多段形ホットプレスにお−いて、前記値数の熱板に
、被成形物の位置合わせを行なう嵌合部を設け、前記熱
板間で被成形物の位置合わせを行なった後挾持して成形
するように構成したものである。
The features of the present invention include: a jig plate that clamps a workpiece, a plurality of hot plates that heat the workpiece, and a pressurizer that pressurizes the workpiece through the hot plates and jig plates. In a multi-stage hot press equipped with a mechanism, etc., a fitting part for positioning the molded object is provided on the hot plates of the above number, and after the molded object is aligned between the hot plates. It is configured to be held and molded.

実施例 以下本発明の一実施例を図面により説明する。Example An embodiment of the present invention will be described below with reference to the drawings.

第3図および第4図において、第1図および第2図と四
−符号のものは同一部分を示す。
In FIGS. 3 and 4, the same parts as in FIGS. 1 and 2 are denoted by 4-.

22はプリント配線基板などの複数枚の被成形物15に
挿入される複数の位置合わせ用ガイドピンで、このカイ
トピン22の先端側にはテーパ部22aが形成されてい
る。23は前記位置決6用カイトピン22のテーバ部2
2af嵌入する嵌合部の例えばブツシュで、このブツシ
ュ23は前記下熱板6および中間熱板8の上部側に設け
られている。241″i前記ラムシリンダ2のラム3の
ストロークで下熱板6および中間熱板8が上昇したとき
、ばね25の反力でカイトピン22の後端側を押え込む
ピストンで、このピストン24は抜ケ止めリング26に
より中間熱板8および前記上熱板10の下部側に形成し
た穴27に嵌入されてbる。
Reference numeral 22 denotes a plurality of positioning guide pins inserted into a plurality of molded objects 15 such as printed wiring boards, and a tapered portion 22a is formed on the tip side of this kite pin 22. 23 is the tapered portion 2 of the kite pin 22 for positioning 6;
This bushing 23 is provided on the upper side of the lower heating plate 6 and the intermediate heating plate 8, for example, as a bushing of the fitting portion 2af. 241''i When the lower hot plate 6 and intermediate hot plate 8 rise due to the stroke of the ram 3 of the ram cylinder 2, this piston 24 presses down the rear end side of the kite pin 22 by the reaction force of the spring 25, and the piston 24 is pulled out. The retaining ring 26 is fitted into a hole 27 formed at the lower side of the intermediate hot plate 8 and the upper hot plate 10.

次に本発明の詳細な説明する。Next, the present invention will be explained in detail.

まず接着準備作業として、被成形物15及びプリプレグ
16に明けられた同径同数で熱板挿入側にテーパ部22
aを設けた位置合わせ用ガイドピン22に、被成形物1
5とプリプレグ16を交互に多Jfii化構成し、これ
を熱板8上に嵌入されたブツシュ23のテーパ穴に挿入
する。このようにして被成形物15を中間熱板8.8の
間に挾持する。
First, as a bonding preparation work, taper portions 22 with the same diameter and the same number of holes on the hot plate insertion side are made in the molded object 15 and the prepreg 16.
The molded object 1 is placed on the positioning guide pin 22 provided with a.
5 and the prepreg 16 are alternately made into a multi-Jfii structure, and this is inserted into the tapered hole of the bushing 23 fitted on the hot plate 8. In this way, the object to be formed 15 is held between the intermediate hot plates 8.8.

次に油圧装置16を駆動し、シリンダー2に油圧を供給
しラム3により下ボルスタ−4及び下ボルタスター4上
の断熱板5で熱的にシールされた下熱板6を上昇させる
。下熱板6上の被成形物15が上熱板10に接し更に上
熱板10を上昇させるという上昇動作の繰返しで最上部
被成形物15が最上熱板10に接触する時点より、被成
形物15が加圧される。
Next, the hydraulic device 16 is driven to supply hydraulic pressure to the cylinder 2, and the ram 3 raises the lower bolster 4 and the lower heating plate 6, which is thermally sealed by the heat insulating plate 5 on the lower bolter star 4. The object to be formed 15 on the lower hot plate 6 comes into contact with the upper hot plate 10 and the upper hot plate 10 is further raised. The object 15 is pressurized.

この加圧と開時にガイドピン22の真上の熱板内に設け
られた、ばね25及びピストン24よりなるガイドピン
22の加圧機構のばね力によりカイトピン22を熱板上
のブツシュ23の精度に倣い正しく位置決めされる。
When this pressure is applied and when the guide pin 22 is opened, the spring force of the pressure mechanism of the guide pin 22, which is provided in the heat plate directly above the guide pin 22 and is made up of a spring 25 and a piston 24, moves the kite pin 22 to the precision of the bush 23 on the heat plate. It will be positioned correctly according to the following.

その後加熱冷却制御装置20の接着条件に従い油圧、温
度が制御され、被成形物15は成形される。
Thereafter, the oil pressure and temperature are controlled according to the bonding conditions of the heating/cooling control device 20, and the molded object 15 is molded.

このように、高剛性のため積度低下しにくい熱板6,8
上で直接成形すれば、均一な圧力分布及び温度分布が得
られ、又被成形物15の7+I)正位置が必ずホットプ
レスの中心に来るため、熱板6゜8の傾き等による横荷
1の発生がなく、被成形′吻15の寸法変化のばらつき
が小さい、高精度のものが得られる。
In this way, the hot plates 6 and 8 have high rigidity and are difficult to reduce.
If molding is performed directly on the hot press, a uniform pressure distribution and temperature distribution can be obtained, and since the correct position of the molded object 15 is always at the center of the hot press, side loads 1 due to the inclination of the hot plate 6°8 etc. It is possible to obtain a high-precision product in which there is no occurrence of dimensional changes in the proboscis 15 to be formed, and the variation in dimensional changes is small.

ちなみに1、本発明の熱板6.8は、従来の治具板に比
較して約3〜5倍の寿命向上が図れる。
Incidentally, 1. The hot plate 6.8 of the present invention can improve the lifespan by about 3 to 5 times compared to the conventional jig plate.

〔発明の効果〕〔Effect of the invention〕

本発明の多段形ホットプレスによれば、被成形物の寸法
変化のばらつきは約30%低減可能であると共に治工具
費の低減は約60%に達成可能であるため、大幅な原価
低減が大幅に図れる。
According to the multistage hot press of the present invention, it is possible to reduce the variation in dimensional changes of the molded object by about 30%, and it is also possible to reduce jig costs by about 60%, resulting in a significant cost reduction. can be achieved.

したがって、被成形物として多層プリント配線基板など
を用いた場合、被成形物の液溜作業の原価低減に大きな
効果を発揮する。
Therefore, when a multilayer printed wiring board or the like is used as the object to be molded, it is highly effective in reducing the cost of liquid collection work for the object to be molded.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の多段形ホットプレスの概略正面図、第2
図は従来のホットプレスにおける被成形物の成形治具板
挿入状態を示す断面図、第3図は本発明の多段形ホット
プレスの要部断面図、第4図は第3図の4−4m断面図
である。 1・・・プレス本体、2・・・ラムシリンダー、4.1
3・・・上下ボルスタ、15・・・プリント配線基板、
16・・・プリプレグ、17.18・・・治具板、19
・・・カイトビン、20・・・加熱装置、21・・・油
圧装置、22・・・カイトピン、23・・・ブツシュ、
24・・・シリンダー、25・・・ばね。 第1頁の続き 0発 明 者 山田数 横浜市戸塚区吉田町292番地株 式会社日立製作所生産技術研究 所内
Figure 1 is a schematic front view of a conventional multi-stage hot press;
The figure is a cross-sectional view showing the insertion state of a forming jig plate for a molded object in a conventional hot press, Figure 3 is a cross-sectional view of the main part of the multi-stage hot press of the present invention, and Figure 4 is 4-4m in Figure 3. FIG. 1... Press body, 2... Ram cylinder, 4.1
3... Upper and lower bolsters, 15... Printed wiring board,
16...Prepreg, 17.18...Jig plate, 19
... Kite bin, 20... Heating device, 21... Hydraulic device, 22... Kite pin, 23... Bush,
24...Cylinder, 25...Spring. Continued from page 1 0 Inventor: Kazu Yamada, Hitachi, Ltd. Production Technology Laboratory, 292 Yoshida-cho, Totsuka-ku, Yokohama

Claims (1)

【特許請求の範囲】 1、被成形物を挾持する治具板と、被成形物を加熱する
複数の熱板と、前記熱板おムび治具板を介して被成形物
を加圧する加圧機構などを備える多段形ホットプレスに
おいて、前記複数の熱板に、被成形物の位置合わせを行
なう嵌合部を設け、前記熱板間で被成形物の位置合わせ
を行なった後挟持して成形するように構成したことを特
徴とする多段形ホットプレス。 2、前記嵌合部は、被成形物に取外し自在に挿入される
位置合わせ用ガイドピンのテーバ部が嵌入されるブツシ
ュから構成したことを特徴とする特許請求の範囲第1項
記載の多段形ホットプレス。
[Scope of Claims] 1. A jig plate that clamps the object to be formed, a plurality of hot plates that heat the object to be formed, and a pressurizer that pressurizes the object through the hot plates and jig plates. In a multi-stage hot press equipped with a pressing mechanism, the plurality of hot plates are provided with fitting portions for positioning the to-be-molded object, and the to-be-molded object is clamped after being aligned between the hot plates. A multistage hot press characterized by being configured to perform molding. 2. The multi-stage type according to claim 1, wherein the fitting part is constituted by a bush into which a tapered part of a positioning guide pin that is removably inserted into the molded object is fitted. hot press.
JP58060728A 1983-04-08 1983-04-08 Multistage type hot press Pending JPS59185600A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58060728A JPS59185600A (en) 1983-04-08 1983-04-08 Multistage type hot press

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58060728A JPS59185600A (en) 1983-04-08 1983-04-08 Multistage type hot press

Publications (1)

Publication Number Publication Date
JPS59185600A true JPS59185600A (en) 1984-10-22

Family

ID=13150625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58060728A Pending JPS59185600A (en) 1983-04-08 1983-04-08 Multistage type hot press

Country Status (1)

Country Link
JP (1) JPS59185600A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226478A (en) * 1985-07-26 1987-02-04 株式会社太平製作所 Method of drying veneer
JPS62140811A (en) * 1985-12-14 1987-06-24 Meiki Co Ltd Multi-step hot press
WO1994017976A1 (en) * 1993-02-10 1994-08-18 Cedal S.R.L. Process for the production of plastic laminates with metal laminae especially for printed circuits made from endless bands
WO1994017975A1 (en) * 1993-02-10 1994-08-18 Cedal S.R.L. Process for making plastic laminates with metal laminae for printed circuits especially, with endothermic heating
EP0619778A1 (en) * 1991-12-17 1994-10-19 E.I. Du Pont De Nemours And Company Multi-plate lamination fixture
CN1052188C (en) * 1994-03-10 2000-05-10 塞达尔公司 Process for producing plastic laminates from continuously fed bands
CN1056559C (en) * 1993-04-09 2000-09-20 塞达尔公司 Automatic machine for assembling piles of packages, including copper laminae, to make plastic laminates from bands arranged serpentinewise
WO2004028775A1 (en) * 2002-09-25 2004-04-08 Matsushita Electric Works, Ltd. Method for producing laminated board and misregistration-preventing system for laminated board production
JP2012134203A (en) * 2010-12-20 2012-07-12 Hitachi Ltd Hot-press device and method for pressing multilayer printed board
US11148384B2 (en) 2015-12-28 2021-10-19 Cedal Equipment Co., Ltd. Thermo induction press for welding printed circuits and method carried out thereof

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0557515B2 (en) * 1985-07-26 1993-08-24 Taihei Seisakusho Kk
JPS6226478A (en) * 1985-07-26 1987-02-04 株式会社太平製作所 Method of drying veneer
JPS62140811A (en) * 1985-12-14 1987-06-24 Meiki Co Ltd Multi-step hot press
EP0619778A1 (en) * 1991-12-17 1994-10-19 E.I. Du Pont De Nemours And Company Multi-plate lamination fixture
EP0619778A4 (en) * 1991-12-17 1995-03-01 Du Pont Multi-plate lamination fixture.
WO1994017976A1 (en) * 1993-02-10 1994-08-18 Cedal S.R.L. Process for the production of plastic laminates with metal laminae especially for printed circuits made from endless bands
WO1994017975A1 (en) * 1993-02-10 1994-08-18 Cedal S.R.L. Process for making plastic laminates with metal laminae for printed circuits especially, with endothermic heating
CN1051280C (en) * 1993-02-10 2000-04-12 塞达尔公司 Process for the production of plastic laminates with metal laminae, especiall for printed circuits using double-band laminae
CN1077038C (en) * 1993-02-10 2002-01-02 塞达尔公司 Process for making plastic laminates with metal laminae for printed circuits especially, with endoth ermic heating
CN1056559C (en) * 1993-04-09 2000-09-20 塞达尔公司 Automatic machine for assembling piles of packages, including copper laminae, to make plastic laminates from bands arranged serpentinewise
CN1052188C (en) * 1994-03-10 2000-05-10 塞达尔公司 Process for producing plastic laminates from continuously fed bands
WO2004028775A1 (en) * 2002-09-25 2004-04-08 Matsushita Electric Works, Ltd. Method for producing laminated board and misregistration-preventing system for laminated board production
JP2012134203A (en) * 2010-12-20 2012-07-12 Hitachi Ltd Hot-press device and method for pressing multilayer printed board
US11148384B2 (en) 2015-12-28 2021-10-19 Cedal Equipment Co., Ltd. Thermo induction press for welding printed circuits and method carried out thereof

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