JPS59185306A

JPS59185306A - Method for mounting optical integrated circuit

Info

Publication number: JPS59185306A
Application number: JP5994883A
Authority: JP
Inventors: Tetsuo Horimatsu; 哲夫堀松
Original assignee: Agency of Industrial Science and Technology
Current assignee: National Institute of Advanced Industrial Science and Technology AIST
Priority date: 1983-04-07
Filing date: 1983-04-07
Publication date: 1984-10-20

Abstract

PURPOSE:To reduce the number of assembling processes sharply by forming an optical integrated circuit provided with optical elements, an optical guide guiding light to the optical elements and an electrode on one surface and a substrate forming a V groove for mounting optical fibers and an electrode. CONSTITUTION:The optical integrated circuit OIC forms the optical guide OG and light emitting and photodetecting elements (not shown in the drawing) photocoupled with the optical guide and the electrode on one surface of a GaAs substrate or the like and is arranged so that these light emitting and photodetecting elements are opposed to the recessed part S11 of the silicon substrate SI and both of the electrodes contact. On the other hand, the optical guide OG is opposed to the V groove VG and the optical fiber F is arranged on the V groove VG. The electrodes are connected by pressing the electrode on the optical integrated circuit OIC to that on the silicon substrate SI and irradiating light such as CO2 laser to the electrodes to solder them. Said constitution makes it possible to reduce the manhour of assembling processes sharply.

Description

【発明の詳細な説明】（ａ）　　発明の技術分野本発明は、光集積回路内の光素子と外部回路との接続の
ための配線の接続を容易にしたものである。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention facilitates the connection of wiring for connecting an optical element in an optical integrated circuit to an external circuit.

（ｂ）　　従来技術及び問題点セラミック基板１の凹部１ａに収容し、外部電気回路と
の接続のための配線Ｐ１〜Ｐ８とは、ワイヤーボンディ
ングＷにより接続している。(b) Prior Art and Problems The ceramic substrate 1 is housed in the recess 1a and is connected to the wirings P1 to P8 for connection to an external electric circuit by wire bonding W.

又、光ファイバと光集積回路ＯＩＣとは、光フアイバア
レイＦＡを予め作成しておき、凹部１ａ内にセットする
ことにより、直接光結合を行っている。Further, the optical fiber and the optical integrated circuit OIC are directly optically coupled by preparing an optical fiber array FA in advance and setting it in the recess 1a.

ところが、この方法によれは、光集積回路と光フアイバ
アレイの光結合と、光＃！−積回路を外部電気回路へ接
続するための配線への接続は、別々に行っているため、
組立工数が多い欠点があった。However, this method has problems with the optical coupling between the optical integrated circuit and the optical fiber array, and the optical coupling between the optical integrated circuit and the optical fiber array. -The connection to the wiring for connecting the product circuit to the external electric circuit is done separately, so
The drawback was that it required a lot of assembly man-hours.

（Ｃ）　　発明の目的本発明は、この様な欠点を除去し、組立工数の少ない実
装法を提供することを目的とするものである。(C) Object of the Invention The object of the present invention is to eliminate such drawbacks and provide a mounting method that requires fewer assembly steps.

（ｄ）　　発明の効果上記目的は、本発明によれば一方の表面に光素子と該光
素子への光又は該光素子からの光をガイドする光ガイド
と電極を備えた光集積回路と、該■溝と電極を形成した
基板とを有し、該光集積回路の該光素子が、該基板と対
面して、両電極が接続される様に該光集積回路を配設し
、該■溝に光ファイバを配置して、該光ガイドと光結合
させる様にしたことを特徴とする光集積回路の実装法に
よって達成される。(d) Effects of the Invention The above objects according to the present invention include an optical integrated circuit having an optical element on one surface and a light guide and an electrode for guiding light to or from the optical element; (1) has a substrate on which grooves and electrodes are formed, the optical integrated circuit is arranged so that the optical element of the optical integrated circuit faces the substrate, and both electrodes are connected; This is achieved by an optical integrated circuit mounting method characterized in that an optical fiber is placed in a groove and optically coupled to the light guide.

（ｅ）　　発明の実施例以下本発明を実施例に従って説明する。(e) Examples of the invention The present invention will be explained below according to examples.

第２図は、本発明に用いるシリコン基板ＳＩで、光ファ
イバＦをセットするためのＶ溝ＶＣと、発光素子、受光
素子がシリコン基板に接触しない様にするための凹部Ｓ
ＩＩと電極ＥＬ、〜ＥＬａが形成されている。Figure 2 shows a silicon substrate SI used in the present invention, with a V-groove VC for setting the optical fiber F and a recess S for preventing the light-emitting element and the light-receiving element from coming into contact with the silicon substrate.
II and electrodes EL, -ELa are formed.

第３図は、シリコン基板ＳＩへの光集積回路の実装状態
を示す図である。FIG. 3 is a diagram showing the mounting state of the optical integrated circuit on the silicon substrate SI.

光集積回路ＯＩＣは、ＧａＡｓ基板等の一方の表面に光
ガイドＯＧ及び光ガイドに光結合した発光素子、受光素
子（図示せず）、電極を形成しており、これら発光素子
、受光素子がシリコン基板ＳＩの凹部ＳＩＩに対向し、
両者の電極が接触する様に配置する。The optical integrated circuit OIC has a light guide OG, a light emitting element optically coupled to the light guide, a light receiving element (not shown), and an electrode formed on one surface of a GaAs substrate, etc., and these light emitting elements and light receiving elements are made of silicon. Opposing the recess SII of the substrate SI,
Arrange so that both electrodes are in contact with each other.

一方光ガイドＯＧは、Ｖ溝ＶＧに対向させる。On the other hand, the light guide OG is opposed to the V-groove VG.

更に、光ファイバＦを■溝ＶＧ上に配置する。Furthermore, the optical fiber F is placed on the groove VG.

■溝■Ｇの最上部の幅Ｗは、光ファイバＦのコアが、光
ガイドＯＧと対面する様に、光ファイバＦの外径より小
さくする。従って、光ファイバＦは、Ｖ溝ＶＧ上をスラ
イドさせながら、光ガイドＯＧと対向させることができ
る。■The width W at the top of the groove ■G is made smaller than the outer diameter of the optical fiber F so that the core of the optical fiber F faces the optical guide OG. Therefore, the optical fiber F can be opposed to the optical guide OG while sliding on the V-groove VG.

第４図により、電極の接続及び構造について説明する。The connection and structure of the electrodes will be explained with reference to FIG.

電極の接続は、シリコン基板ＳＩ上の電極に光集積回路
上の電極を押し付け、Ｃ０２レーザ等の光をあてて、ソ
ルダリングすることにより行う。The electrodes are connected by pressing the electrodes on the optical integrated circuit against the electrodes on the silicon substrate SI and soldering them by shining light from a C02 laser or the like.

この時シリコン基板ＳＩ上の電極は、中心部が突起した
形状にしておく。At this time, the electrodes on the silicon substrate SI are shaped so that their centers protrude.

以上、光ガイドが単一の場合について述べたが、光ガイ
ドが複数ある場合には、これに応じてＶ溝の数を増加さ
せる。The case where there is a single light guide has been described above, but if there are a plurality of light guides, the number of V-grooves is increased accordingly.

（ｆ）　　発明の効果以上の如く、本発明によれば、光集積回路を支３− 持板に配置した時に、電極間の接続がなされ、又光ガイ
ドと元ファイバの結合は、光ファイバを■溝上に配置す
るだけで行えるので、組立の工数を大幅に削減するこ吉
ができる。(f) Effects of the Invention As described above, according to the present invention, when the optical integrated circuit is placed on the supporting plate, the connection between the electrodes is made, and the connection between the light guide and the original fiber is achieved by connecting the optical fiber. ■As it can be done simply by placing it on the groove, it is possible to significantly reduce the number of assembly steps.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の実装法を示す図、第２図は本発明に用い
る基板を示す図、第３図は本発明による実装法を示す図
、第４図は電極間の接続及び構造について示す図である
。図中ＳＩはシリコン基板、０工Ｃは光集積回路、ＶＣは
Ｖ溝、８１１は凹部、ＥＬ、〜ＥＬ６は電極、Ｆは光フ
ァイバである。特許出願人　工業技術院長用田捺峠４− 第１渦第２図茶４図３７−Fig. 1 shows the conventional mounting method, Fig. 2 shows the substrate used in the present invention, Fig. 3 shows the mounting method according to the present invention, and Fig. 4 shows the connection and structure between electrodes. It is a diagram. In the figure, SI is a silicon substrate, C is an optical integrated circuit, VC is a V-groove, 811 is a recess, EL to EL6 are electrodes, and F is an optical fiber. Patent Applicant: Director of the Agency of Industrial Science and Technology, Yotaki Pass 4- 1st vortex, 2nd diagram, tea 4, 37-

Claims

【特許請求の範囲】[Claims]

一方の表面に光素子と該光素子への光又は該光素子から
の光をガイドする光ガイドと電極を備えた光集積回路と
、該光ガイドと結合する光ファイバを設置するためのＶ
溝と電極を形成した基板とを有し、該光集積回路の該光
素子が、該基板と対面して、両電極が接続される様に該
光集積回路を配置し、該Ｖ溝に光ファイバを配置して、
該光ガイドと光結合させる様にしたことを特徴とする光
集積回路の実装法。An optical integrated circuit equipped with an optical element, a light guide and electrodes for guiding light to or from the optical element on one surface, and a V for installing an optical fiber coupled to the light guide.
The optical integrated circuit has a substrate on which a groove and an electrode are formed, and the optical integrated circuit is arranged so that the optical element of the optical integrated circuit faces the substrate and both electrodes are connected. Place the fiber and
A method for mounting an optical integrated circuit, characterized in that the optical integrated circuit is optically coupled to the light guide.