JPS5918466U - printed circuit board - Google Patents

printed circuit board

Info

Publication number
JPS5918466U
JPS5918466U JP11190082U JP11190082U JPS5918466U JP S5918466 U JPS5918466 U JP S5918466U JP 11190082 U JP11190082 U JP 11190082U JP 11190082 U JP11190082 U JP 11190082U JP S5918466 U JPS5918466 U JP S5918466U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
hole
printed
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11190082U
Other languages
Japanese (ja)
Inventor
望月　勇郎
Original Assignee
ジエコ−株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ジエコ−株式会社 filed Critical ジエコ−株式会社
Priority to JP11190082U priority Critical patent/JPS5918466U/en
Publication of JPS5918466U publication Critical patent/JPS5918466U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図Ａ、Ｂは従来のフラットパック型ＩＣを装着した
プリント回路基板の各側の断面図、第２図は本考案にな
るプリント回路基板の一実施例の断面図、第３図は貫通
孔の大きさを説明するための図である。 ９・・・・・・モールドパッケージ、１０．１１・・・
・・・リード線、１２．１３・・・・・・プリント配線
、１４・・・・・・絶縁材、１６・・・・・・プリント
回路基板。Figures 1A and B are cross-sectional views of each side of a printed circuit board on which a conventional flat-pack IC is mounted, Figure 2 is a cross-sectional view of an embodiment of the printed circuit board of the present invention, and Figure 3 is a through-hole. It is a figure for explaining the size of a hole. 9...Mold package, 10.11...
... Lead wire, 12.13 ... Printed wiring, 14 ... Insulating material, 16 ... Printed circuit board.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 両面にプリント配線をなされており、−面にフォーミン
グ型のフラットパック型集積回路を装着された後他面を
半田液に侵して半田付けされるプリント回路基板におい
て、該集積回路の装着部に最大径がその厚さの３倍以下
とされた貫通孔を設けてなるプリント回路基板。In a printed circuit board that has printed wiring on both sides, and after mounting a forming type flat pack integrated circuit on the negative side, the other side is soaked in solder liquid and soldered. A printed circuit board with a through hole whose diameter is three times or less the thickness of the through hole.
JP11190082U 1982-07-23 1982-07-23 printed circuit board Pending JPS5918466U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11190082U JPS5918466U (en) 1982-07-23 1982-07-23 printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11190082U JPS5918466U (en) 1982-07-23 1982-07-23 printed circuit board

Publications (1)

Publication Number Publication Date
JPS5918466U true JPS5918466U (en) 1984-02-04

Family

ID=30259615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11190082U Pending JPS5918466U (en) 1982-07-23 1982-07-23 printed circuit board

Country Status (1)

Country Link
JP (1) JPS5918466U (en)

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