JPS59180466U - wiring board - Google Patents
wiring boardInfo
- Publication number
- JPS59180466U JPS59180466U JP7577983U JP7577983U JPS59180466U JP S59180466 U JPS59180466 U JP S59180466U JP 7577983 U JP7577983 U JP 7577983U JP 7577983 U JP7577983 U JP 7577983U JP S59180466 U JPS59180466 U JP S59180466U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- reinforcing frame
- abstract
- board
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案をコンピュータ等に使用される高密度実装
の配線基板に適用した一実施例を示したものであって、
第1図は配線基板と補強枠との分解斜視図、第2図は補
強枠を配線基板に固定した状態の斜視図、第3図は基板
収納ラック坂の配線基板の収納状態を示した斜視図、第
4図は配線基板のコネクター接続状況と延長基板の使用
状況とを示した第3図の側面図である。
また図面に用いられた符号において、1・・・・・・配
線基板、2・・・・・・マウント面、3・・・・・・電
子部品、4・・・・・・マルチコネクター、6・・・・
・・補強枠、6a。
5b、 6C,5d・・・・・・補強枠の立上り片、
1(1)・・・・・・通風孔、12・・・・・・基板収
納ラック、13.14・・・・・・レール、15,16
.17・・・・・・マルチコネクター、18・・・・・
・延長基板、19.20・・・・・・開口、21・・・
・・・送風機、である。The drawing shows an embodiment in which the present invention is applied to a high-density mounting wiring board used in computers, etc.
Figure 1 is an exploded perspective view of the wiring board and reinforcing frame, Figure 2 is a perspective view of the reinforcing frame fixed to the wiring board, and Figure 3 is a perspective view showing how the wiring board is stored on the board storage rack slope. FIG. 4 is a side view of FIG. 3 showing how the wiring board is connected to the connector and how the extension board is used. In addition, in the symbols used in the drawings, 1... wiring board, 2... mount surface, 3... electronic component, 4... multi-connector, 6...・・・・・・
...Reinforcement frame, 6a. 5b, 6C, 5d... Rising piece of reinforcing frame,
1 (1)... Ventilation hole, 12... Board storage rack, 13.14... Rail, 15, 16
.. 17...Multi connector, 18...
・Extension board, 19.20...Opening, 21...
...A blower.
Claims (1)
れた配線基板の周辺部に固定してその配線基板全体を補
強させ、この補強枠の少なくとも相対向する2辺には複
数個の通風孔を設けた配線基板。A reinforcing frame integrated into a rectangular shape is fixed to the periphery of a wiring board on which many electronic components are mounted to reinforce the entire wiring board. A wiring board with ventilation holes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7577983U JPS59180466U (en) | 1983-05-20 | 1983-05-20 | wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7577983U JPS59180466U (en) | 1983-05-20 | 1983-05-20 | wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59180466U true JPS59180466U (en) | 1984-12-01 |
Family
ID=30205839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7577983U Pending JPS59180466U (en) | 1983-05-20 | 1983-05-20 | wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59180466U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009206168A (en) * | 2008-02-26 | 2009-09-10 | Nec Corp | Cooling structure of electronic apparatus, its manufacturing method and cooling method of electronic apparatus |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5350466A (en) * | 1976-10-18 | 1978-05-08 | Singer Co | Printed circuit card frame |
-
1983
- 1983-05-20 JP JP7577983U patent/JPS59180466U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5350466A (en) * | 1976-10-18 | 1978-05-08 | Singer Co | Printed circuit card frame |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009206168A (en) * | 2008-02-26 | 2009-09-10 | Nec Corp | Cooling structure of electronic apparatus, its manufacturing method and cooling method of electronic apparatus |
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