JPS59177943A - Wafer fixing adhesive thin plate - Google Patents
Wafer fixing adhesive thin plateInfo
- Publication number
- JPS59177943A JPS59177943A JP58053037A JP5303783A JPS59177943A JP S59177943 A JPS59177943 A JP S59177943A JP 58053037 A JP58053037 A JP 58053037A JP 5303783 A JP5303783 A JP 5303783A JP S59177943 A JPS59177943 A JP S59177943A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plate
- cut
- thin plate
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は電子部品用ウェハを素子小片に切断分離する際
のウェハ固定用のウェハ固定用接着薄板に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thin adhesive plate for fixing a wafer when a wafer for electronic parts is cut and separated into small element pieces.
電子部品用ウェハを素子小片に切断分離する方法として
、ガラス板、プラスチック板などから平板に加熱溶融し
たワックスを塗設し、この上にウェハを配置して冷却固
定後火刃にてワックス層まで切り込んでウェハを切断分
離する方法が知られている。As a method of cutting and separating wafers for electronic components into small element pieces, heated and melted wax is applied to a flat plate made from a glass plate, plastic plate, etc., the wafer is placed on top of this, and after cooling and fixing, a hot blade is used to cut the wax layer. A method of cutting and separating wafers by cutting is known.
このように切断された素子は、平板共々トリクレンの如
き溶剤の浴槽に浸漬してワックス層を除去し、浴槽の下
方に沈んでいる素子小片をあみですくい、さらにトリク
レンの如き溶剤で洗浄して、ワックスを完全に除去する
ものである。The thus cut elements are immersed together with the flat plate in a bath of a solvent such as Tri-Clene to remove the wax layer, the small pieces of the element that have sunk below the bath are scooped up with a net, and then washed with a solvent such as Tri-Clene. , which completely removes wax.
しかし、前記塗設ワックス面へのウェハの固定時、ウェ
ハと平板とを平行することがむつかしく、そのために切
断された素子小片の切断面が斜めになったり、未切断部
分が残るという欠点がある。However, when fixing the wafer to the coated wax surface, it is difficult to align the wafer and the flat plate in parallel, which has the drawback that the cut surfaces of the cut element pieces may be slanted or uncut portions may remain. .
本発明はかかる欠点を解決した新規なウェハ固定用接着
薄板を提供するもので、その要旨とするところは、プレ
ート上で電子部品用ウェハを素子小片に切断分離する際
に該ウェハを接着固定するのに用いられるウェハ固定用
接着薄板であって、該薄板は自己支持性を有するフィル
ム状物と該フィルム状物の表面に形成された接着剤層と
から構成され、且つ該層はブロック共重合体ゴムと該共
重合体ゴムとの相溶性にすぐれる他のゴム成分及び粘着
性付与樹脂とを含むことである。The present invention provides a novel thin adhesive plate for fixing wafers that solves these drawbacks, and its gist is to adhesively fix a wafer for electronic components when the wafer is cut into small element pieces on the plate. A thin adhesive plate for fixing wafers used in It includes other rubber components and a tackifying resin that are highly compatible with the copolymer rubber and the copolymer rubber.
本発明によれば、プレート上に釉面を上にして吸引固定
された均一な厚みの接着薄板の接着層面にウェハを固定
して切断するので切断面が斜めになったり、未切断部分
が残存するといったことがなく、シかも接着層はトリク
レンの如き溶剤で完全に除去できるという特徴を有する
。According to the present invention, since the wafer is fixed on the adhesive layer surface of a thin adhesive plate of uniform thickness that is suction-fixed onto the plate with the glazed side facing up, the cut surface may be slanted or uncut portions may remain. It has the characteristic that the adhesive layer can be completely removed with a solvent such as trichlene.
本発明の実施に当って用いられるフィルム状物としては
、プレートに設けられた吸引孔を介してプレート下部か
ら吸引固定されたときに変形することがない程度の硬度
或いは厚さを有する自己支持性のものであれば殊に制限
されないが、例えば厚さ３０μｍ以上のポリエステルフ
ィルム、厚さ１００μｍ以上のポリ塩化ビニル又はポリ
オレフィンフィルムが使用される。The film-like material used in carrying out the present invention is self-supporting and has enough hardness or thickness that it will not deform when it is suctioned and fixed from the bottom of the plate through suction holes provided in the plate. There is no particular restriction as long as it is a polyester film, but for example, a polyester film with a thickness of 30 μm or more, a polyvinyl chloride or polyolefin film with a thickness of 100 μm or more is used.
かかるフィルム状物の片面に形成される接着層は、ウェ
ハを固定する能力にすぐれ、しかもトリクレンの如き溶
剤で簡単且つ短時間に溶解することができるものであり
、かかる接着層としてはブロック共重合体ゴムと、該共
重合体ゴムとの相溶性にすぐれる他のゴム成分及び粘着
性付与樹脂との３成分を必須成分する感圧接着性物質が
用いられるものである。The adhesive layer formed on one side of such a film has excellent ability to fix the wafer, and can be easily and quickly dissolved with a solvent such as trichloride. A pressure-sensitive adhesive material is used which essentially contains three components: a composite rubber, another rubber component that is highly compatible with the copolymer rubber, and a tackifier resin.
これら３成分の配合割合は、共重合体ゴムとゴム成分と
が１：９〜９：１（重量比）の範囲で、樹脂は全ゴム成
分１００重量部に対して３０〜１００重量部の範囲とす
るのが好ましいものである。The blending ratio of these three components is 1:9 to 9:1 (weight ratio) of copolymer rubber and rubber component, and 30 to 100 parts by weight of resin to 100 parts by weight of the total rubber component. It is preferable that
前記ブロック共重合体ゴムとしては、Ａ−Ｂ−Ａ型構造
のエラストマーであり、Ａはスチレン、メチルスチレン
の如きビニル化合物で約１０００〜５００００の平均分
子量を有するもので、Ｂはイソプレン、ブタジェンの如
き共役ジエン化合物で約４５００〜１００００００の平
均分子量を有するもので、Ａを約１０〜６５重量％含む
ものである。The block copolymer rubber is an elastomer with an A-B-A type structure, where A is a vinyl compound such as styrene or methylstyrene and has an average molecular weight of about 1,000 to 50,000, and B is a vinyl compound such as isoprene or butadiene. The conjugated diene compound has an average molecular weight of about 4,500 to 1,000,000 and contains A in an amount of about 10 to 65% by weight.
該共重合体ゴムとしては上記のテレブロック型以外に、
例えばテレラジアルブロック型のものも使用できる。In addition to the above-mentioned teleblock type, the copolymer rubber includes
For example, a teleradial block type can also be used.
かかるブロック共重合体ゴムとの相溶性にすぐれるゴム
成分としては、天然ゴム、合成イソプレンゴム、スチレ
ンブタジェンゴムなどが、まり粘着性付与樹脂としては
、石油系樹脂、ポリテルペン系樹脂、ロジンなどが挙げ
られる。Rubber components that are highly compatible with such block copolymer rubber include natural rubber, synthetic isoprene rubber, styrene-butadiene rubber, etc., and tackifying resins include petroleum-based resins, polyterpene-based resins, rosin, etc. can be mentioned.
前記共重合体ゴム、該ゴムとの相溶性にすぐれるゴム成
分及び粘着性付与樹脂からなる配合系には、必要に応じ
て老化防止剤、軟化剤の如き配合剤が適量添加される。If necessary, appropriate amounts of compounding agents such as anti-aging agents and softeners are added to the compounding system consisting of the copolymer rubber, a rubber component having excellent compatibility with the rubber, and a tackifying resin.
配合物は、前記自己支持性を有するフィルム状物の表面
に、厚さ５〜１００μｍの範囲で均一に塗設又は転写さ
れ、ウェハ固定用接着薄板とされる。The compound is uniformly coated or transferred onto the surface of the self-supporting film-like material to a thickness of 5 to 100 μm to form a thin adhesive plate for fixing a wafer.
本発明のウェハ固定用接着薄板が、ウェハを確実に固定
し、しかもプレートと平行に固定しうるので切断分離さ
れた素子小片の断面が斜めになったりすることがないこ
と、及び切断後の洗浄作業が簡単であることなどの特徴
は以下の実施例にて例証される。The thin adhesive plate for fixing wafers of the present invention securely fixes the wafer and can fix the wafer parallel to the plate, so that the cross section of the cut and separated element pieces will not be oblique, and the wafer can be cleaned after cutting. Features such as ease of operation are illustrated in the following examples.
実施例１
スチレン−イソプレン−スチレンブロック共重合体ゴム
（スチレン／イソプレン＝１４／８６：重量比）５０重
量部（以下部という）、天然ゴム５０部、石油系樹脂７
０部及び老化防止剤１部からなる感圧接着性物質を、厚
さ１５０μｍのポリエステルフィルムに厚さ１０μｍで
塗設して、本発明のウェハ固定用接着薄板を得た。Example 1 Styrene-isoprene-styrene block copolymer rubber (styrene/isoprene = 14/86: weight ratio) 50 parts by weight (hereinafter referred to as parts), 50 parts of natural rubber, 7 parts of petroleum resin
A pressure sensitive adhesive material consisting of 0 parts and 1 part of anti-aging agent was coated on a 150 μm thick polyester film to a thickness of 10 μm to obtain a thin adhesive plate for fixing a wafer of the present invention.
かかる薄板の特性を評価するために、該薄板の接着層面
中央に電子部品用ウェハを接着固定し、これを吸引孔を
有するプレート上にウェハを上面側にして配置し、プレ
ートの裏面から吸引して薄板を固定した。In order to evaluate the characteristics of such a thin plate, an electronic component wafer was adhesively fixed to the center of the adhesive layer surface of the thin plate, and this was placed on a plate with suction holes with the wafer facing upward, and suction was applied from the back side of the plate. to fix the thin plate.
このように固定したウェハをタイシングツ−で前記ポリ
エステルフィルムの厚みの約半分まで切り込まれるよう
にウェハを切断分離して素子小片とした。The thus fixed wafer was cut and separated using a tying tool so that about half the thickness of the polyester film was cut into the wafer to obtain small element pieces.
切断時ウェハの移動、傾斜は全くみられなかったＯ
切断後、素子小片共々接着薄板をトリクレン溶剤槽に３
分間浸漬して接着層を溶解してポリエステルフィルムを
除去し、さらに槽の下方に沈んだ素子小片をすくいだし
、トリクレンで再度洗浄して乾燥し、５０倍の顕微鏡で
拡大して接着剤の有無を確認したところ全く付着はみら
れなかった。No movement or tilting of the wafer was observed during cutting.
The polyester film was removed by dipping for a minute to dissolve the adhesive layer, and the small pieces of the element that had sunk to the bottom of the tank were scooped out, washed again with Triclean, dried, and magnified with a 50x microscope to see if there was any adhesive. When I checked, no adhesion was observed.
実施例２
ブロック共重合体ゴム（実施例１と同一）２０部、天然
ゴム８０部、ポリテルペン系樹脂６０部からなる感圧接
着性物質（Ａ）、及びブロック共重合体ゴム８０部、天
然ゴム２０部、ポリテルペン系樹脂６０部からなる感圧
接着性物（Ｂ）を夫々用いて、実施例１と同様にウェハ
固定用接着薄板を得た。Example 2 Pressure-sensitive adhesive material (A) consisting of 20 parts of block copolymer rubber (same as Example 1), 80 parts of natural rubber, and 60 parts of polyterpene resin, and 80 parts of block copolymer rubber and natural rubber. A thin adhesive plate for fixing a wafer was obtained in the same manner as in Example 1 using the pressure-sensitive adhesive (B) consisting of 20 parts of polyterpene resin and 60 parts of polyterpene resin.
これらの薄板を用いて実施例１と同様に特定を評価した
ところ、ウェハの切断時の移動なども外く、またトリク
レンで洗浄後における接着剤の付着も全くみられガかっ
た。When the properties of these thin plates were evaluated in the same manner as in Example 1, there was no movement during cutting of the wafer, and no adhesion of adhesive was observed after cleaning with Triclean.
特゛許出願人 日東電気工業株式会社 代表者上方三部 ２３３−Patent applicant Nitto Electric Industry Co., Ltd. Representative Kamigata Sanbe 233-
Claims (1)
る際に該ウェハを接着固定するのに用いられるウェハ固
定用接着薄板でおって、該薄板は自己支持性を有するフ
ィルム状物と該フィルム状物の表面に形成された接着剤
層とから構成され、且つ該層はブロック共重合体ゴムと
該共重合体ゴムとの相溶性にすぐれる他のゴム成分及び
粘着性付与樹脂とを含むものであることを特徴とするウ
ェハ固定用接着薄板。A thin adhesive plate for fixing a wafer is used to adhesively fix a wafer for electronic components when the wafer is cut and separated into small element pieces on a plate, and the thin plate consists of a self-supporting film-like material and the film-like material. and an adhesive layer formed on the surface of the object, and the layer contains a block copolymer rubber, another rubber component having excellent compatibility with the copolymer rubber, and a tackifying resin. A thin adhesive plate for fixing wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58053037A JPS59177943A (en) | 1983-03-28 | 1983-03-28 | Wafer fixing adhesive thin plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58053037A JPS59177943A (en) | 1983-03-28 | 1983-03-28 | Wafer fixing adhesive thin plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59177943A true JPS59177943A (en) | 1984-10-08 |
Family
ID=12931681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58053037A Pending JPS59177943A (en) | 1983-03-28 | 1983-03-28 | Wafer fixing adhesive thin plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59177943A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63217642A (en) * | 1987-03-06 | 1988-09-09 | シエル・インターナシヨナル・リサーチ・マートスハツペイ・ベー・ヴエー | Surface protecting material for electronic device substrate |
| JPH06132397A (en) * | 1992-10-19 | 1994-05-13 | Rohm Co Ltd | Dicing method |
| JP2014185285A (en) * | 2013-03-25 | 2014-10-02 | Lintec Corp | Adhesive sheet for semiconductor processing |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626968A (en) * | 1979-07-13 | 1981-03-16 | Nichiban Co Ltd | Adhesive tape for bundling raw vegetable of flower |
-
1983
- 1983-03-28 JP JP58053037A patent/JPS59177943A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5626968A (en) * | 1979-07-13 | 1981-03-16 | Nichiban Co Ltd | Adhesive tape for bundling raw vegetable of flower |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63217642A (en) * | 1987-03-06 | 1988-09-09 | シエル・インターナシヨナル・リサーチ・マートスハツペイ・ベー・ヴエー | Surface protecting material for electronic device substrate |
| JPH06132397A (en) * | 1992-10-19 | 1994-05-13 | Rohm Co Ltd | Dicing method |
| JP2014185285A (en) * | 2013-03-25 | 2014-10-02 | Lintec Corp | Adhesive sheet for semiconductor processing |
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