JPS59173904A - Method of producing conductive wire material - Google Patents
Method of producing conductive wire materialInfo
- Publication number
- JPS59173904A JPS59173904A JP4820483A JP4820483A JPS59173904A JP S59173904 A JPS59173904 A JP S59173904A JP 4820483 A JP4820483 A JP 4820483A JP 4820483 A JP4820483 A JP 4820483A JP S59173904 A JPS59173904 A JP S59173904A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- electron beam
- silver powder
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Conductive Materials (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は導電性を有する組成物をガラス繊維、アラミド
繊維、カーボン繊維の束に塗布し、該組成物を照射硬化
せしめることにより導電性線状体を製造する方法に関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention applies a conductive composition to a bundle of glass fibers, aramid fibers, or carbon fibers, and cures the composition by irradiation to form a conductive linear shape. The present invention relates to a method of manufacturing a body.
最近各種の電子機器や電気機器は小型軽量化が進められ
、導体も細線化、軽量化が求められるようになってきた
。Recently, various electronic and electrical devices have been made smaller and lighter, and conductors have also been required to be thinner and lighter.
従来より基材となる樹脂に銀粉の如き導電性粒子を添加
したものを導電性組成物として用いることは、よく知ら
れている。しかし、十分な導電性を有する組成物を得る
ためには基材となる樹脂１００重量部に対して、銀粉を
４００〜５００重量部程度も添加する必要があったため
に、導電性組成物の価格が比較的高価になり、また、特
に可撓性線状体として使用しようとする場合に於いては
、銀粉の配合量が増えると可撓性が極端に悪くなり、銀
粉が４・００〜５００重量部にもなると、線状体の可撓
性か損なわれて、線状体を折り曲げると導電性塗料部分
が折れて切れてしまうようになり、目的とする可撓性線
状体を作ることができなかった。It has been well known to use a conductive composition prepared by adding conductive particles such as silver powder to a resin serving as a base material. However, in order to obtain a composition with sufficient conductivity, it was necessary to add about 400 to 500 parts by weight of silver powder to 100 parts by weight of the base resin. is relatively expensive, and especially when it is intended to be used as a flexible linear body, the flexibility becomes extremely poor when the amount of silver powder added is 4.00 to 500. When it becomes too heavy, the flexibility of the linear body is lost, and when the linear body is bent, the conductive paint part breaks and breaks, making it difficult to create the desired flexible linear body. I couldn't do it.
又、カーボンブラックを配合した導電性塗料をプラスチ
ックの紐に塗布して、加熱硬化させてなる半導電性線状
体は、文字通り半導電性であり、導電性の回路用には適
さない。Furthermore, a semiconductive linear body obtained by coating a plastic string with a conductive paint containing carbon black and curing it by heating is literally semiconductive and is not suitable for use in conductive circuits.
本発明は、導電性組成物を繊維束に直接塗布して導電性
線状体を製造する方法に於ける如上の問題点について検
討を進めた結果、達成されたものであって、導電性組成
物を直接塗布する方法の長所である、工程の簡便さを損
なうことなく、如上の種々の問題点を解決した新規な製
造方法を提供したものである。The present invention was achieved as a result of studying the above-mentioned problems in the method of manufacturing a conductive linear body by directly applying a conductive composition to a fiber bundle. The present invention provides a new manufacturing method that solves the various problems mentioned above without sacrificing the simplicity of the process, which is an advantage of the method of directly coating a material.
即ち、本発明は導電性組成物を繊維束に直接塗布して導
電性線状体を製造する方法に於いて、基材となる電子線
硬化型樹脂１００重量部に銀粉を８０〜３００重量部添
加して成る組成物を繊維束ρ外側に塗布し、これらに電
子線を照射して塗料を硬化せしめた後、加熱処理するこ
とを特徴とする導電性線状体の製造方法に関するもので
ある。That is, the present invention provides a method for producing a conductive linear body by directly applying a conductive composition to a fiber bundle, in which 80 to 300 parts by weight of silver powder is added to 100 parts by weight of an electron beam curable resin serving as a base material. The present invention relates to a method for producing a conductive linear body, which comprises applying a composition containing the above-mentioned additives to the outside of a fiber bundle ρ, irradiating the composition with an electron beam to cure the coating material, and then heat-treating the composition. .
本発明に於いては基材となる電子線硬化型樹脂１００重
量部に対し、銀粉を８０〜３００ 重量部より好まし
くは１００〜２５０重量部だけ添加して成る組成物を用
いる。先に述べた如く、従来開示されている技術に於い
ては、十分な導電性を有する組成物を得るためには、銀
粉を４・００〜５００重量部程度も添加する必要があっ
た。ところが、本発明者らは理由は明らかではないが、
電子線硬化型樹脂１００重量部に銀粉を８０〜３００
重量部添加して成る組成物を用いて、繊維束に゛塗布
し、これらに電子線を照射して硬化せしめ”た後、加熱
処理を行なうことによって、不思議なことに、銀粉の添
加量が８０〜３００ 重量部と少ないのにもかかわら
ず、実用上十分な導電性を有することを形成しうろこと
を見出し、本発明を完成するに至った。In the present invention, a composition is used in which 80 to 300 parts by weight, preferably 100 to 250 parts by weight of silver powder is added to 100 parts by weight of an electron beam curable resin serving as a base material. As mentioned above, in the conventionally disclosed technology, in order to obtain a composition having sufficient conductivity, it was necessary to add about 4.00 to 500 parts by weight of silver powder. However, although the reason is not clear, the inventors
Add 80 to 300 parts of silver powder to 100 parts by weight of electron beam curable resin.
The amount of silver powder added was mysteriously reduced by applying the composition to fiber bundles and curing them by irradiating them with electron beams, followed by heat treatment. The present inventors have discovered that the scales have sufficient conductivity for practical use despite the small amount of 80 to 300 parts by weight, and have completed the present invention.
本発明に用いる銀粉は、金属銀を主体とし、フレーク状
或は塊状の形状を有する平均粒度が０．１〜１０μｍ程
度の微細粒子である。銀粉の形状や粒度は特に限定され
ないが、導電性や塗布作業性或は経済性などを考えると
、形状がフレーク状で、比表面積の大きい粒子を利用し
た方が良い。The silver powder used in the present invention is mainly composed of metallic silver, and is fine particles having a flake-like or lump-like shape and an average particle size of about 0.1 to 10 μm. Although the shape and particle size of the silver powder are not particularly limited, in consideration of conductivity, coating workability, economic efficiency, etc., it is better to use particles that are flaky in shape and have a large specific surface area.
本発明に於いては、基材となる電子線硬化型樹脂１００
重量部に対して、銀粉を８０〜３００ 重量部添加す
る。添加量が８０重量部に満たないと、十分導電性を有
する線状体を得ることができず、また、添加量が８００
重量部を越えると、導電性については比較的良好となる
が、先に述べた如く、導電性組成物の価格が高＜ナリ、
塗布作業性が低下して出来上がり状況がやや悪くなる傾
向にあり、また特に可撓性が損なわれて線状体を折り曲
げると折れてしまうといった問題が生じる。特をζ好ま
しくは、添加量が１００−２５０重量部の場合であり、
上に述べたような問題を生じることなく、十分な導電性
を有する線状体を形成することができる。In the present invention, an electron beam curable resin 100 serving as a base material is used.
80 to 300 parts by weight of silver powder is added to each part by weight. If the amount added is less than 80 parts by weight, a linear body having sufficient conductivity cannot be obtained;
If it exceeds 1 part by weight, the conductivity will be relatively good, but as mentioned earlier, the price of the conductive composition will be high,
There is a tendency for the coating workability to deteriorate and the finished product to be somewhat poor.Furthermore, there is a problem in that the flexibility is particularly impaired and the linear body breaks when bent. Particularly, ζ is preferably added in an amount of 100 to 250 parts by weight,
A linear body having sufficient conductivity can be formed without causing the problems described above.
本発明に用いる基材となる電子線硬化型樹脂とは、電子
線を照射することによって硬化反応を起こす官能性を有
する樹脂のことをいい、例えばエポキシ樹脂、ポリウレ
タン樹脂、シリコン樹脂等のポリマーを官能基で変性し
て官能性をもたせたもの、或は不飽和ポリエステル樹脂
、ポリプタジエ／樹脂、スピロアセクール樹脂等の如く
分子内に官能性を有するポリマー等の官能性樹脂を用い
る。これらの官能性樹脂は単独或は必要に応じて混合し
て用いる他、官能性を有するモノマーやオリゴマー等も
添加することもできる。特に所要量の銀粉を添加して適
正な塗布作業性を現出するためには、比較的粘度の低い
官能性モノマーやオリゴマーを併用することが効果的で
ある。この他、塗料形態を整えるために粘度調節材料や
着色料などを添加することも可能である。これらの官能
性を有する基材となる樹脂に銀粉を添加して組成物を作
るには、通常塗料を調整する方法により、例えば、ロー
ル混合により均一に十分混練することによって得ること
ができる。The electron beam curable resin that is the base material used in the present invention refers to a resin that has functionality that causes a curing reaction when irradiated with an electron beam, and includes polymers such as epoxy resins, polyurethane resins, and silicone resins. A functional resin modified with a functional group to have functionality, or a polymer having functionality in the molecule such as unsaturated polyester resin, polyptadier/resin, spiroacecool resin, etc. is used. These functional resins may be used alone or in combination if necessary, and functional monomers, oligomers, etc. may also be added. In particular, in order to achieve appropriate coating workability by adding the required amount of silver powder, it is effective to use a functional monomer or oligomer with relatively low viscosity. In addition, it is also possible to add viscosity adjusting materials, colorants, etc. to adjust the paint form. A composition can be prepared by adding silver powder to a resin that serves as a base material having these functionalities, by a method for preparing a coating material, for example, by uniformly and thoroughly kneading it by roll mixing.
繊維束の外側に塗料を塗布する方法は特に限定されるも
のではないが、通常用いられるダイスによる塗布方法が
望ましい。特に、本発明に於いては従来開示されている
技術に於ける場合と比べ、銀粉の添加量が少ないので、
塗布作業性が良好である。The method of applying the paint to the outside of the fiber bundle is not particularly limited, but a commonly used application method using a die is preferred. In particular, in the present invention, the amount of silver powder added is smaller than in the conventionally disclosed technology, so
Good coating workability.
繊維束の外側に形成された塗膜は電子線を照射して硬化
せしめる。The coating film formed on the outside of the fiber bundle is cured by irradiating it with electron beams.
電子線照射条件は使用する樹脂に応じて適宜決めるが、
通常５〜３０ Ｍｒａｄ 程度の線量が好ましい。The electron beam irradiation conditions are determined as appropriate depending on the resin used.
A dose of about 5 to 30 Mrad is usually preferred.
本発明に於いては、線状体を電子線照射により硬化せし
めた後、加熱処理を行なう。本発明に於いては基材とな
る電子線硬化型樹脂１００重量部に対して銀粉を８０〜
３００ 重量部添加して成る組成物を塗布するので、
電子線照射によって塗料が硬化した時点では塗膜の導電
性は十分ではない。しかし、電子線照射による硬化稜線
状体を加熱処理することによって、実用上十分な導電性
を有するようになる。加熱処理の条件は８０℃以上であ
る。In the present invention, after the linear body is hardened by electron beam irradiation, heat treatment is performed. In the present invention, 80 to 80 parts by weight of silver powder is added to 100 parts by weight of the electron beam curable resin as the base material.
Since a composition containing 300 parts by weight is applied,
At the time when the paint is cured by electron beam irradiation, the conductivity of the paint film is not sufficient. However, by heat-treating the cured ridge-like body by electron beam irradiation, it becomes capable of having sufficient conductivity for practical use. The conditions for the heat treatment are 80°C or higher.
加熱処理温度が８０℃以下では十分な導電性を現出する
ことができない。又、加熱時間は５分〜６０分程度が良
い。If the heat treatment temperature is 80° C. or lower, sufficient conductivity cannot be achieved. Moreover, the heating time is preferably about 5 minutes to 60 minutes.
本発明にいう繊維束とはガラス繊維、アラミド繊維、カ
ーボン繊維等の集束体である。The fiber bundle referred to in the present invention is a bundle of glass fibers, aramid fibers, carbon fibers, etc.
以下、本発明にもとづく導電性線状体の製造方法を実施
例によって具体的に説明する。EXAMPLES Hereinafter, the method for manufacturing a conductive linear body based on the present invention will be specifically explained with reference to Examples.
実施例１゜
アロニツクスオリゴマ−（東亜合成化学工業■オリゴエ
ステルアクリレート商品名）８０ｆｆｉｔ部及びリポキ
シ樹脂（昭和高分子■エポキシアクリレート樹脂商品名
）２０重量部から成る官能性を有する樹脂ベースに、表
１（ａ）〜（ｆ）に示した如く、金属銀を８０〜３００
重量部を添加して塗料を作り、１５００デニールのアラ
ミド繊維束に塗布して外径０．９−１．Ｑ ａｘｅに仕
上げ、これに′電子線を１５ Ｍｒａｄ照射して硬化せ
しめた。電子線照射硬化後、塗料の導電性を測定した結
果を表１に示したが、銀粉の添加量が少ない（ａ）〜（
Ｃ）では導電性は認められず、また銀粉の添加量がやや
多い（ｄ）〜（ｆ）では導電性にバラツキが認められた
。さらに、これらの材料を１、５０ ’Ｃで１５分間加
熱し、導電性を測定した結果も表１に合わせて示した。Example 1 A functional resin base consisting of 80 parts by weight of Aronix oligomer (Toagosei Kagaku Kogyo's brand name of oligoester acrylate) and 20 parts by weight of lipoxy resin (trade name of Showa Kobunshi's epoxy acrylate resin), As shown in Table 1(a) to (f), metallic silver was
Part by weight was added to make a paint, which was applied to a 1500 denier aramid fiber bundle to give an outer diameter of 0.9-1. It was finished into Q ax and cured by irradiating it with an electron beam of 15 Mrad. Table 1 shows the results of measuring the conductivity of the paint after curing with electron beam irradiation.
No conductivity was observed in C), and variations in conductivity were observed in (d) to (f) in which the amount of silver powder added was somewhat large. Furthermore, the results of heating these materials at 1,50'C for 15 minutes and measuring their conductivity are also shown in Table 1.
表１で認められる如く加熱処理を行なったものは（ａ）
は１０４０以下、（ｂ）〜（ｆ）はいずれも１０Ω以下
の抵抗値を示すことがわかった。又、可撓性も良好であ
り、キンクされても折れることはなく、導電性も低下す
るなどの異状がなかった。Those subjected to heat treatment as shown in Table 1 are (a)
was 1040 or less, and (b) to (f) were all found to have a resistance value of 10Ω or less. Further, the flexibility was good, and even if it was kinked, it did not break, and there were no abnormalities such as a decrease in conductivity.
比較例
実施例と同じ樹脂ベースにζ、表１（ｇ）〜（ｊ）に示
した如く、金属銀を５０〜７０重量部及び４００〜５０
０重量部添加して塗料を作り、実施例の場合と同じ条件
で塗布し、電子線照射硬化並びに加熱処理を行ない、線
状体の導電性を調べた。その結果を表１に示した。銀の
添加量が少ない（ｇ）、（ｈ）では電子表１゜
線照射硬化時及び加熱処理後とも導電性は認められず、
また、添加量が多い（ｉ）、（ｊ）では電子線照射硬化
時に実用上十分な導電性が得られ、更にこれらを加熱し
ても特性に顕著な変化は認められなかった。但し、（ｉ
）、（ｊ）は塗布性が悪く、表面等の仕上がり状況が悪
く゛なった。又、折り曲げると塗料が割れ、導電性が低
下した。Comparative Example The same resin base as in Example was used with ζ, and as shown in Tables 1(g) to (j), 50 to 70 parts by weight of metallic silver and 400 to 50 parts by weight of metallic silver were added.
A coating material was prepared by adding 0 parts by weight, coated under the same conditions as in the example, cured by electron beam irradiation and heat treated, and the conductivity of the linear body was examined. The results are shown in Table 1. For (g) and (h) with a small amount of silver added, no electrical conductivity was observed during electronic table 1° ray irradiation curing and after heat treatment,
Further, in cases of (i) and (j) in which the addition amount was large, practically sufficient conductivity was obtained during electron beam irradiation curing, and no significant change in properties was observed even when these were further heated. However, (i
) and (j) had poor coating properties and poor surface finish. Also, when bent, the paint cracked and the conductivity decreased.
テンションメンバーとして、ガラス繊維、カーボン繊維
を用いて検討した結果も同様であった。Similar results were obtained when glass fiber and carbon fiber were used as tension members.
上述の如く、本発明にもとづく方法に於いては、銀粉を
基材となる樹脂１００重量部に８０〜．３００重量部添
加するだけで実用上十分な導電性を現出せしめるので、
導電性組成物の価格が比較的安価であり、塗布作業性が
良好で出来上がり状況が良好であり、また特に良好な可
撓性を得ることができる。As mentioned above, in the method based on the present invention, 80 to 100 parts by weight of silver powder is added to 100 parts by weight of the base resin. Just adding 300 parts by weight produces sufficient conductivity for practical use.
The price of the conductive composition is relatively low, the coating workability is good, the finished product is good, and particularly good flexibility can be obtained.
又、強度の強い繊維束と組み合わせることにより、軽量
で細くても強靭な導電性線状体を得ることが出来るので
、工業的な価値は高い。In addition, by combining it with a strong fiber bundle, it is possible to obtain a lightweight, thin but strong conductive linear body, which has high industrial value.
又、得られた導電性線状体を複数本よりあわせて、より
線の導体として使用することも可能であることは述べる
までもない。Needless to say, it is also possible to strand a plurality of the obtained conductive linear bodies and use them as a stranded conductor.
Claims (1)
００重量部添加して成る組成物を繊維束の外側に塗布し
、これらに電子線を照射して硬化せしめた後、加熱処理
することを特徴とする製造方法。(1) Add 80 to 3 parts of silver powder to 100 parts by weight of electron beam curable resin.
1. A manufacturing method comprising applying a composition containing 0.00 parts by weight to the outside of a fiber bundle, curing the composition by irradiating it with an electron beam, and then heat-treating the composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4820483A JPS59173904A (en) | 1983-03-22 | 1983-03-22 | Method of producing conductive wire material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4820483A JPS59173904A (en) | 1983-03-22 | 1983-03-22 | Method of producing conductive wire material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59173904A true JPS59173904A (en) | 1984-10-02 |
Family
ID=12796850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4820483A Pending JPS59173904A (en) | 1983-03-22 | 1983-03-22 | Method of producing conductive wire material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59173904A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7267926B2 (en) | 2000-02-21 | 2007-09-11 | Toray Engineering Co., Ltd. | Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof |
| US10156342B2 (en) | 2013-11-25 | 2018-12-18 | Philips Lighting Holding B.V. | Lighting device with elastic envelope |
-
1983
- 1983-03-22 JP JP4820483A patent/JPS59173904A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7267926B2 (en) | 2000-02-21 | 2007-09-11 | Toray Engineering Co., Ltd. | Active energy beam curing type conductive paste, production method and device for conductor circuit substrate and non-contact ID and production method thereof |
| US10156342B2 (en) | 2013-11-25 | 2018-12-18 | Philips Lighting Holding B.V. | Lighting device with elastic envelope |
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