JPS5917320B2 - flow control device - Google Patents
flow control deviceInfo
- Publication number
- JPS5917320B2 JPS5917320B2 JP50027828A JP2782875A JPS5917320B2 JP S5917320 B2 JPS5917320 B2 JP S5917320B2 JP 50027828 A JP50027828 A JP 50027828A JP 2782875 A JP2782875 A JP 2782875A JP S5917320 B2 JPS5917320 B2 JP S5917320B2
- Authority
- JP
- Japan
- Prior art keywords
- tube
- resin
- flow rate
- cooling
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Pipeline Systems (AREA)
- Coating Apparatus (AREA)
- Flow Control (AREA)
Description
【発明の詳細な説明】
本発明は、例えば常温で固体、１００℃で溶融、２００
℃で粘度約２０００ｃｐｓ（センチポアズ）のエナメル
樹脂を供給する流量調節方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention provides, for example, solid at room temperature, melting at 100°C,
The present invention relates to a flow rate adjustment method for supplying an enamel resin having a viscosity of about 2000 cps (centipoise) at °C.
従来、導体に絶縁樹脂を塗布するに、多分に溶剤分を含
んだ絶縁ワニスの入つた塗布液槽内を通過させて、ダイ
スを経て焼付炉に入わ焼付けされていた。Conventionally, in order to apply an insulating resin to a conductor, the conductor was passed through a coating liquid tank containing an insulating varnish containing a large amount of solvent, passed through a die, and then entered a baking furnace where it was baked.
前記溶剤は、導体に絶縁樹脂塗布時に必要な粘性低下お
よび導体への濡れ性を良好にするために用いられて（・
たが、最終的には被膜形成には不要な成分であり、従つ
て経済的でなく且つ臭０ 気のあるフユームを発生する
という問題もあり、近時、常温で固体もしくは高粘度液
状の樹脂を無溶剤もしくは少量の溶剤を添加した状態で
用いこれを加熱溶融して導体に塗布焼付けする方法が使
用されるようになつてきた。従つて前記樹脂を５ 塗布
液槽に供給することが重要な課題となつたが、常温では
固体もしくは高粘度液状のため、従来の一般の液体流量
制御のようにバルブを使用することは困難であつた。本
発明は、上記の点に鑑み上記樹脂等を導体のθ 通過す
る塗布液槽へ、円滑に補給することを目的としてなされ
たもので、傾斜金属筒または二重筒に加熱用ヒータ、ま
たはパイプおよび、冷却用フィンまたは冷媒による冷却
部等を設け、傾斜させて使用することを特徴とする流量
調節方法を提供■５ するものであろ。The solvent is used to reduce the viscosity required when applying insulating resin to the conductor and improve wettability to the conductor.
However, in the end, it is an unnecessary component for film formation, and therefore it is not economical and has the problem of generating odorless fumes.Recently, resins that are solid or highly viscous liquid at room temperature have been A method has come to be used in which the conductor is heated and melted without a solvent or with a small amount of solvent added, and then applied and baked onto the conductor. Therefore, supplying the resin to the coating liquid tank became an important issue, but since it is solid or a highly viscous liquid at room temperature, it is difficult to use a valve as in conventional general liquid flow control. It was hot. In view of the above points, the present invention has been made for the purpose of smoothly replenishing the resin etc. to the coating liquid tank which the conductor passes through. It also provides a flow rate adjustment method (5) characterized in that cooling fins or a cooling section using a refrigerant are provided and used in an inclined manner.
本発明に係る流量調節装置を図面によつて説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A flow rate regulating device according to the present invention will be explained with reference to the drawings.
第１図、第２図はそれぞれ傾斜金属筒、二重筒の長さ方
向の断面図で、ある程度溶融された樹脂ｉ０が溶融槽（
図示せず）から塗布液槽（図示せず）へ筒内を矢印の方
向へ傾斜に流れることを示している。Figures 1 and 2 are longitudinal cross-sectional views of the inclined metal cylinder and the double cylinder, respectively, where the resin i0, which has been melted to some extent, is in the melting tank (
It shows that the liquid flows obliquely in the direction of the arrow in the cylinder from the coating liquid tank (not shown) to the coating liquid tank (not shown).
第１図に於て、１は加熱用ヒータ、２は冷却用フィン、
３は冷却用ファンである。In Figure 1, 1 is a heating heater, 2 is a cooling fin,
3 is a cooling fan.
金属円筒内の３５温度はヒータ１の制御で例えば塗布液
槽部の液面計からの信号と結合させることができ、この
湿度制御によつて樹脂の状態が変り、’流量を制御する
［、ハことができる。The temperature inside the metal cylinder can be controlled by the heater 1 and combined with, for example, a signal from a liquid level gauge in the coating liquid tank, and this humidity control changes the state of the resin and controls the flow rate. Ha can do it.
また流れを早く止めようと思うときは冷却フアン３をま
わせば冷却フイン２の作用を充分に活用して速やかに冷
却させればよい。第２図は二重筒式のもので、外筒には
オイル４が封人され、筒の温度を上昇させるには外部の
加熱パイプを用いる。また流れを早く止めるためには冷
却部６に冷却媒体を流して冷却すればよい。なお７０６
以下の傾斜で完全に流れを止めることができることを付
言已する。上記のことにより、本発明の流量調節方法は
温度の上昇、冷却が速やかに実施され塗布液槽への樹脂
の補給量調節が円滑に行える効果は誠に大きいものがあ
る。Also, if you want to stop the flow quickly, you can turn the cooling fan 3 to make full use of the action of the cooling fins 2 to quickly cool down. Fig. 2 shows a double-tube type, in which oil 4 is filled in the outer tube, and an external heating pipe is used to raise the temperature of the tube. In addition, in order to quickly stop the flow, a cooling medium may be allowed to flow through the cooling section 6 for cooling. Furthermore, 706
Please note that the flow can be completely stopped at the following slopes. As a result of the above, the flow rate adjustment method of the present invention has a very large effect in that the temperature can be raised and cooled quickly, and the amount of resin replenished into the coating liquid tank can be smoothly adjusted.
第１図，第２図はいずれも本発明に係る流量調節装置の
説明図である。
１は加熱用ヒータ、２は冷却用フイン、３は冷却用フア
ン、４はオイル、５は加熱用ヒータ、６は冷却部、Ｔは
保温材。FIG. 1 and FIG. 2 are both explanatory diagrams of a flow rate regulating device according to the present invention. 1 is a heating heater, 2 is a cooling fin, 3 is a cooling fan, 4 is oil, 5 is a heating heater, 6 is a cooling section, and T is a heat insulating material.
Claims (1)
流す筒を、傾斜金属筒または二重筒とし、これに加熱用
ヒーターまたはパイプおよび冷却用フィンまたは冷媒に
よる冷却部を設け、加熱、冷却により、常温で固体もし
くは高粘度液状の樹脂の流量を調節すること特徴とする
流量調節方法。1. The tube through which the resin, which is solid or highly viscous liquid at room temperature, is allowed to flow is made into an inclined metal tube or double tube, and a heating heater or pipe and a cooling section using cooling fins or refrigerant are installed in the tube, and the tube is heated and cooled. , a flow rate adjustment method characterized by adjusting the flow rate of a solid or highly viscous liquid resin at room temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50027828A JPS5917320B2 (en) | 1975-03-06 | 1975-03-06 | flow control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50027828A JPS5917320B2 (en) | 1975-03-06 | 1975-03-06 | flow control device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51102226A JPS51102226A (en) | 1976-09-09 |
| JPS5917320B2 true JPS5917320B2 (en) | 1984-04-20 |
Family
ID=12231799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50027828A Expired JPS5917320B2 (en) | 1975-03-06 | 1975-03-06 | flow control device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5917320B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536648B2 (en) * | 1984-06-12 | 1993-05-31 | Nippon Seiko Kk |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2732538B2 (en) * | 1989-08-29 | 1998-03-30 | 日本原子力研究所 | Flow control valve for cryogenic helium |
| JP3628611B2 (en) | 2000-11-29 | 2005-03-16 | 独立行政法人科学技術振興機構 | Flow control method in micro system |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS419828Y1 (en) * | 1964-10-05 | 1966-05-11 | ||
| JPS4976123A (en) * | 1972-11-22 | 1974-07-23 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5337004Y2 (en) * | 1971-05-04 | 1978-09-08 |
-
1975
- 1975-03-06 JP JP50027828A patent/JPS5917320B2/en not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS419828Y1 (en) * | 1964-10-05 | 1966-05-11 | ||
| JPS4976123A (en) * | 1972-11-22 | 1974-07-23 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0536648B2 (en) * | 1984-06-12 | 1993-05-31 | Nippon Seiko Kk |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51102226A (en) | 1976-09-09 |
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