JPS59171948A - Photosensitive resin composition - Google Patents
Photosensitive resin compositionInfo
- Publication number
- JPS59171948A JPS59171948A JP4575883A JP4575883A JPS59171948A JP S59171948 A JPS59171948 A JP S59171948A JP 4575883 A JP4575883 A JP 4575883A JP 4575883 A JP4575883 A JP 4575883A JP S59171948 A JPS59171948 A JP S59171948A
- Authority
- JP
- Japan
- Prior art keywords
- oligomer
- photosensitive resin
- resin composition
- alkali
- monomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C1/00—Photosensitive materials
- G03C1/005—Silver halide emulsions; Preparation thereof; Physical treatment thereof; Incorporation of additives therein
- G03C1/06—Silver halide emulsions; Preparation thereof; Physical treatment thereof; Incorporation of additives therein with non-macromolecular additives
- G03C1/08—Sensitivity-increasing substances
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は光によって重合する感光性樹脂組成物に関する
ものであり、特にパターン露光によりエソチンク時のフ
ォｊ・レジメ１−として用いられる感光性樹脂組成物に
関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photosensitive resin composition that is polymerized by light, and more particularly to a photosensitive resin composition that can be used as a photoregimen during esotinction by pattern exposure.
−・般にプリント配線板を製造する場合、銅箔等の導電
体箔上に感光性樹脂組成物いわゆるフォ］・レジスＩ・
を塗布し、該フ第１・レジスト層を露光。- Generally, when manufacturing printed wiring boards, a photosensitive resin composition is coated on a conductive foil such as copper foil.
and exposed the first resist layer.
現像してソ第１・し／ストパターンを得、該パターンを
エノチンクマスクとし微細な導電パターンを作成してい
る。This is developed to obtain a first and second pattern, and this pattern is used as an etching mask to create a fine conductive pattern.
そして、上記の様な用途に用いられるフオｌ−レノスト
としては、従来からエン−チオール系感光材料、アジド
−フチ７一ル樹脂混合系感光材料、環化ゴ弘−ビ・スア
ジド樹脂混合系感光材相、α〜ジアゾケトン系悪感光材
料アクリル樹脂系感゛光材料等が知られている。The fluorenosts used in the above applications have conventionally been made of ene-thiol-based photosensitive materials, azide-thiol resin mixed-based photosensitive materials, and cyclized rubber-subazide resin mixed-based photosensitive materials. Material phases, α-diazoketone based photosensitive materials, acrylic resin based photosensitive materials, etc. are known.
ところで、上記エン−チオール系感光材料を上記フ第１
・レジストに用いた場合ζこは、塗１１Ａ ’物性の意
力）ら露光前、現像後にセミキュア、ボストキュアとい
う加熱工程を必要としたり、また一般に２５ ｍ Ｊ
／（：＋ｊ以」二、の高照度を必要とするためパターン
露光に長時間を要する等、製造工程の短縮化や簡略化の
要望に対応することができない。更に感光材料が高粘度
なためコーチインクの際フォトレンλ１・層、（こビン
ポールが生じゃずいという欠点も消する。By the way, the ene-thiol-based photosensitive material is
・When used as a resist, it requires heating processes such as semi-cure and post-cure before exposure and after development, and generally requires 25 m J
／（：＋j＜） 2. Because it requires high illuminance, pattern exposure takes a long time, and it cannot meet the demands for shortening and simplifying the manufacturing process.Furthermore, the photosensitive material has a high viscosity. When applying coach ink, use Photoren λ1 layer (which also eliminates the drawback that the pores are raw).
またアシド−フェノール樹脂混合系感光材料、環化ゴム
−ビスアジド樹脂混合系感光制料、α−ジアゾケトン系
感光材料を用いた場合には、これら各感光材料が溶媒に
溶解した所謂溶剤タイプであるために、塗膜形成後肢溶
剤を揮散させるためノヘーキンク工程が必要となって先
のエンーチオ−ル系感光材第１と同様に製造工程の゛短
縮化や簡略化か困難上なる。またパターン露光により硬
化し、エソチンクマスクとして用いられる硬化物を最終
的に剥削する場ａ、アルカリ溶液で剥離できない。In addition, when using an acid-phenol resin mixed light-sensitive material, a cyclized rubber-bisazide resin mixed light-sensitive material, or an α-diazoketone light-sensitive material, each of these light-sensitive materials is of the so-called solvent type dissolved in a solvent. In addition, a no-heakening process is required to volatilize the solvent used to form the coating film, making it difficult to shorten or simplify the manufacturing process, as in the case of the first enthiol-based photosensitive material. Furthermore, when a cured product that is cured by pattern exposure and used as an ethotink mask is to be finally removed, it cannot be removed with an alkaline solution.
ずち゛わぢ、これら硬化物の剥離にはトリクロルエチレ
ンやメチレンクｌコライト等の有機溶剤を用いさるを得
す、したがって作業者の健康状態に悪影響を及はしたり
、−上記溶剤の取い扱いか面倒なものとなる等の間：ノ
（が生ずる。さらに、これら感光桐料は非常にｍ ｌ１
ｌｉｉαものであるため、製造コストか増大するという
欠点も不している。However, it is necessary to use organic solvents such as trichlorethylene and methylene chloride to peel off these cured products, which may adversely affect the health of the workers. During the process, it becomes troublesome, etc. Furthermore, these photosensitive paulownia materials are very m l1
Since it is a liiα product, it also has the disadvantage of increased manufacturing costs.
またアクリル樹脂系感光材ｃ日も溶剤タイプのために、
塗１模形ｒｊｊ’４−後該溶剤を揮散さぜるためのへ一
キンク工程を必要とし、更に現１象後のアフターへ−り
も心間である等の欠点を翁する。Also, since the acrylic resin photosensitive material is solvent type,
After painting one model, a kink step is required to evaporate the solvent, and furthermore, the after-kink process after the first appearance is also slow.
そこで、外発明η等は、従来技術の前記欠点をｊ竹消ぜ
んとして鋭意研究の結果、感光性樹脂組成物の主成分に
アルカリ可溶性多官能ポリエステルつ′クリレートのモ
ノマー又はオリゴマーを用いることにより、この組成物
、が優れた塗膜物性や硬化特性を有するとともに露光に
よる未硬化部分及び硬化部分をアルカリ水溶液を用いて
簡単に剥離することかできることを見出し、本発明を完
成したものである。Therefore, as a result of intensive research to eliminate the above-mentioned drawbacks of the prior art, the outside invention η et al. has developed a method using an alkali-soluble polyfunctional polyester or acrylate monomer or oligomer as the main component of the photosensitive resin composition. The present invention was completed based on the discovery that this composition has excellent coating film properties and curing properties, and that the uncured portions and hardened portions caused by exposure to light can be easily peeled off using an aqueous alkaline solution.
すなわち、本発明による感光性樹脂組成物は、アルカリ
可溶性多官能ポリニスデルアクｌｊレートのモノマー又
はオリコマ−と、光重合開始剤と、増感剤とを含有して
なるものである。なお、ここで多官能ポリエ、ステルア
クリレートとは複数のアンｊ１ロイルオキシ基（Ｃｌ−
１２＝ＣＨＣＯＯ）を有する化合物を表すものである。That is, the photosensitive resin composition according to the present invention contains an alkali-soluble polyfunctional polynitride acrylate monomer or olicomer, a photopolymerization initiator, and a sensitizer. Note that the polyfunctional polyester and steracrylate herein refer to a plurality of anj1 royloxy groups (Cl-
12=CHCOO).
本発明に用いられるアルカリ可溶性多酒能ポリエステル
アクリレートとしては次テ（に示す化合物か享けられる
。As the alkali-soluble polyalcoholic polyester acrylate used in the present invention, the following compounds can be used.
（１） ＣＨｚ＝ＣＩ−ＩＣＯＯ（ＣＨ２）ｎＯｃＯ
ｃＨ＝ｃＨｚ（但しＩ］は１〜６までの整数）
（２，１（Ｃ）（ｚ＝ＣＨＣＯＯＣＨ２）ｚＣ（ＣＨ３
）２（３） （ＣＨ２＝ ＣＨＣＯＯＣＨ２） ３ Ｃ
−Ｃ２ｌ−１ｓ（４，Ｉ Ｃｌ−１２＝ＣＨＣＯＯ−
（ＣＨｚＣＨＯ）３−ｃＯｃＩ−Ｊ＝ＣＨｚ品３
（７） Ｃｌ−ｌ２＝ＣＨＣＯ（Ｊ（ＣＨ１２）ｓｏ
−０（Ｊ
（ａ〕 ＣＨ２＝Ｃ００（ＣＨ，Ｃ１−１２０）ｒＬ
ＣＯＣＨ＝ＣＨ２（但しルは４又は１４）
上記に示したアルカリ可溶性多官能ポリエステルアクリ
レートの七ツマ−又はオリコマ−の分子量は１５０〜１
０００であるのが好ましい。分子量が１５０未満である
と感光性樹脂組成物の重合度が下がり、塗膜物性が低下
してしまう。また分子量が１０００を越えると感光性樹
脂組成物のアルカリ剥離が困難となる。(1) CHz=CI-ICOO(CH2)nOcO
cH=cHz (I] is an integer from 1 to 6) (2,1(C)(z=CHCOOCH2)zC(CH3
)2(3) (CH2= CHCOOCH2) 3C
-C2l-1s(4,I Cl-12=CHCOO-
(CHzCHO)3-cOcI-J=CHz product 3 (7) Cl-l2=CHCO(J(CH12)so
-0(J (a) CH2=C00(CH,C1-120)rL
COCH=CH2 (however, the number is 4 or 14) The molecular weight of the alkali-soluble polyfunctional polyester acrylate hexamer or oricomer shown above is 150 to 1.
Preferably, it is 000. If the molecular weight is less than 150, the degree of polymerization of the photosensitive resin composition will decrease, and the physical properties of the coating film will deteriorate. Moreover, when the molecular weight exceeds 1000, it becomes difficult to remove the photosensitive resin composition with alkali.
本発明に用いられる重合開始剤としては、紫外線を照射
したときに光励起されて容易に光重合反応を開始させる
ものであれは全て用いることがでキ、例エハヘンゾイン
、ベンゾインメチルエーブル、ベンゾインエチルエーテ
ル、ヘンヅインイノブロビルエーエル、ヘンゾインイソ
フチルエーテル、テシルフロマイド及びα−メチルヘン
ゾイン等のアシロイン並ひにその誘導体；２−メチルア
ンＩ・ラキノン、シクロヘキサノン及び９−フルオレノ
ン等のカルホニル化合物；ヘンンル及びジアセチル等の
ジケートン類；ジフェニルモノサルファイド、ジフェニ
ルジサルファイト、テンルフェニルサルファイト及びテ
トラメチル十つラムモノサルファイ１〜等の有機サルフ
ァイド類；アセＩ・フエノン、ヘンソフェノン、フェニ
ル−２−千エニルケトン、Ｐ−ンメチルアミノヘノゾフ
エノン及。・Ｐ 、 Ｐ’−テトラメチルジアミノソン
フェノン等のフェノンｍ：Ｐ−ｈルエンスルポニルクロ
ライ１、］−ナフタレンスルホニルクロライｌ−１２−
ナフタレンスルホニルクロライド、１，３−ヘンセンジ
スルホニルクロライド、’ ２ 、４−ノニトロベンセ
ンスルホニルブロマイト及びＰ−アセトアミトヘンゼン
スルホニルクロライド等のスルホニルハライド沖などを
挙げることかて−きる力Ｓ、芳香族ノＪルポニル化合物
が特に好ましし）。As the polymerization initiator used in the present invention, any initiator that is photoexcited when irradiated with ultraviolet rays and easily initiates a photopolymerization reaction can be used. Examples include ehachenzoin, benzoin methyl able, benzoin ethyl ether, Acilloin and its derivatives, such as henzoin inobrobil ether, henzoin isofthyl ether, tesylfuromide, and α-methylhenzoin; carbonyl compounds, such as 2-methylan I-laquinone, cyclohexanone, and 9-fluorenone; henlu and diacetyl Diketones such as diphenyl monosulfide, diphenyl disulfite, tenruphenyl sulfite, and organic sulfides such as tetramethyl ten ram monosulfide 1 to 1; -methylaminohenozophenone and.・Phenone m such as P, P'-tetramethyldiaminosonphenone: P-h luenesulfonylchloride 1,]-naphthalenesulfonylchloride 1-12-
Examples include sulfonyl halides such as naphthalenesulfonyl chloride, 1,3-hensendisulfonyl chloride, '2,4-nonitrobenzenesulfonyl bromite, and P-acetamitohensensulfonyl chloride. Particularly preferred are Group J luponyl compounds).
重合開始剤の添加量は、アルカリ可溶性多官會旨ポ■ｊ
エステルアクリレートのモノマー又（まオリゴマー１０
０重量部に対して１〜２０重景１重石１ｂのが好ましい
。添加量が１重量部未満で（ま感光性樹脂組成物が光に
より硬化しにくく、また添カロ山１゛が２０重量部を越
えると感光性樹脂組成物の塗＋＋ｑ物性が低下してしま
う。The amount of polymerization initiator added depends on the alkali-soluble polyfunctional group.
Ester acrylate monomer (or oligomer 10)
It is preferable that 1 to 20 parts by weight per part by weight of 1b to 20 parts by weight. If the amount added is less than 1 part by weight, the photosensitive resin composition will not be easily cured by light, and if the added amount exceeds 20 parts by weight, the coating properties of the photosensitive resin composition will deteriorate.
本発明に用いられる増感剤としてはトＩＪエチルアミン
等のアルチルアミン類、トリエチレンテトラアミン、テ
トラエチレンペンタアミン、ペンクエチレンヘキサアミ
ン、ジエチレンテトラミン等のエチレンアミン類が挙け
られる。上呂己した増Ｉ音剤は、空気中の酸素力（紫外
線照射による感光性枝」脂組成物の表面硬化を遅らせる
のを防止するイ／「月」をするものである。増感剤の添
加量は、アルソＪ’］町Ｍ性多官能ポリエステルアクリ
レ−Ｉ・のモノマー又はオリゴマー１００重量部に対し
て１〜２重量部であるのが奸才しい。添加量が１重量部
未満では上述した作用を発揮できず、また添加量が２重
量部を越えると感光性樹脂組成物が凝縮してし才う。Examples of the sensitizer used in the present invention include alkylamines such as ethylamine, and ethyleneamines such as triethylenetetraamine, tetraethylenepentamine, penkethylenehexamine, and diethylenetetramine. The I sound sensitizer used by Jiro is one that prevents the oxygen force in the air (photosensitive branch due to ultraviolet irradiation) from delaying the surface hardening of the resin composition.The sensitizer's The amount added is preferably 1 to 2 parts by weight per 100 parts by weight of the monomer or oligomer of the polyfunctional polyester acrylate I.If the amount added is less than 1 part by weight, The above effects cannot be achieved, and if the amount added exceeds 2 parts by weight, the photosensitive resin composition will condense.
また本発明ｌこよる感光性樹脂組成物にポリビニルフェ
ノール誘導体を添加してもよい。ポリビニルフェノール
誘導体はアルカリ剥蹄促進補助剤として作用する。ポリ
ビニルフェノール誘導体としては
一般式
（式中、Ｒｏは−Ｈ，、−ＣＨ２および−Ｃ２Ｈ５より
なる群から選択された置換基を表す。）
で示される繰り返し単位を有する化合物あるいは一般式
選択された置換基を表す。）
で示されする繰り返し単位を有する化合物等が挙げられ
る。そして、このポリビニルフェノール誘導体の分子量
は５０００〜１１０００であるのが好ましい。Further, a polyvinylphenol derivative may be added to the photosensitive resin composition according to the present invention. Polyvinylphenol derivatives act as alkaline hoof stripping accelerators. Examples of polyvinylphenol derivatives include compounds having repeating units represented by the general formula (wherein Ro represents a substituent selected from the group consisting of -H, -CH2 and -C2H5) or substituted compounds selected from the general formula. represents a group. ) Compounds having a repeating unit shown in the following are mentioned. The molecular weight of this polyvinylphenol derivative is preferably 5,000 to 11,000.
本発明による感光性樹脂組成物は溶剤を必要としないい
わゆる無溶剤タイプで高い塗膜物性を准するため、ブレ
ベーク、アフターベーク等の加熱ユニ程を必要とせす、
製造工程の簡略化を計ることができ、また無溶剤タイプ
の感光性樹脂組成物にもかかわらず、１０ （１＝３０
００ＣＰ８という低粘度なために、塗膜ζこピンホール
等が生ずる虞れもなく塗膜形成のコーティング方法とし
てスピナーコーディング、ロールコーチインク、アイソ
ピンク等の種々の方法により塗布可能である。The photosensitive resin composition according to the present invention is a so-called solvent-free type that does not require a solvent, and in order to achieve high physical properties of the coating film, it requires heating processes such as bre-bake and after-bake.
10 (1=30
Since it has a low viscosity of 00CP8, it can be applied by various coating methods such as spinner coating, roll coach ink, isopink, etc., without the risk of pinholes or the like occurring in the coating film.
また本発明による感光性樹脂組成物は８〜１０ｍＪ／ｃ
ｎｔ という低照度で硬化する非常に高感度な感光材
料であり、これにより露光時間か１〜２秒と短縮され、
製造効率を著しく向上させることがてきる。Moreover, the photosensitive resin composition according to the present invention has a power of 8 to 10 mJ/c.
It is an extremely sensitive photosensitive material that cures at low illuminances of .
Manufacturing efficiency can be significantly improved.
更に本発明による感光性樹脂組成物は、希アルカリ水溶
液で現像することができ、高濃度アルカリ水溶液で硬化
物を剥離することができる。Further, the photosensitive resin composition according to the present invention can be developed with a dilute aqueous alkaline solution, and the cured product can be peeled off with a highly concentrated aqueous alkaline solution.
この現像及び剥離に用いられるアルカリとしては、例え
ば水酸化ナトリウムや水酸化カリウム等が挙けられるが
、特にこれらに限定されるものではなくアルカリ全般を
用いることかできる・。そして、例えは上記アルカリと
して水酸化すトリウムを用いた場合には、上記現像を行
なうために０５〜１ｗ／ｖ％の濃度の水溶液を用いるこ
とが好ましく、また硬化物を剥離するために４１■／Ｖ
係以上の濃度゛め水溶液を用いることが好ましい。ここ
で、現像に０５Ｗ／ｖ％以下の濃度の水酸化すトリウム
溶液を用いると未硬化部分の樹脂を除去することが困難
となり、またＩＷ／ｖ％以上の濃度のものを用いると露
光により硬化した部分の樹脂も除去してしまう虞れがあ
る。一方、硬化物の剥離には４Ｗ／ｖ％以上の濃度の水
酸化すトリウム溶液を用いれはよく、それ以下であると
剥離が不充分なものとなる。Examples of the alkali used for this development and stripping include sodium hydroxide and potassium hydroxide, but the alkali is not particularly limited to these, and any alkali can be used. For example, when thorium hydroxide is used as the alkali, it is preferable to use an aqueous solution with a concentration of 0.5 to 1 w/v% for the development, and 41% for peeling off the cured product. /V
It is preferable to use an aqueous solution with a concentration higher than 50%. Here, if a thorium hydroxide solution with a concentration of 05 W/v% or less is used for development, it will be difficult to remove the uncured resin, and if a solution with a concentration of IW/v% or more is used, it will harden by exposure. There is a risk that the resin in the exposed areas may also be removed. On the other hand, a thorium hydroxide solution having a concentration of 4 W/v% or more may be used to peel off the cured product; if it is less than that, the peeling will be insufficient.
このように、上記感光性樹脂組成物の露光による未硬化
部分及び硬化部分をアルカリ水溶液の濃度を変えること
により順次除去することができるので、治機溶剤を用い
る必要か全くなくなり作業者の健康上非常に好ましいも
のとなる。In this way, the uncured portions and hardened portions of the photosensitive resin composition due to exposure to light can be sequentially removed by changing the concentration of the alkaline aqueous solution, eliminating the need to use a curing solvent at all and improving the health of workers. It becomes very desirable.
また感光性樹脂組成物の主成分としてポリニスデルアク
リレートモノマー又はオリゴマーを用いているため、非
常に安い感光材料となる。Furthermore, since polynisdel acrylate monomer or oligomer is used as the main component of the photosensitive resin composition, the photosensitive material is extremely cheap.
また本発明による感光性樹脂組成物は２００１１ｍ〜３
００．Ｌ−の知波長の紫外線に感光域を有するため、従
来用いらイ１．る紫外＃、ｉ！ （波長３００７．、ｎ
〜４００７ｚｍ）と比較して回折や干渉による像のボケ
が少なくなり、高解像度の露光パ可能となる。Moreover, the photosensitive resin composition according to the present invention is 20011m to 3
00. Since it is sensitive to ultraviolet rays with known wavelengths of L-, it has not been used conventionally.1. UV #, i! (Wavelength 3007., n
-4007zm), there is less blurring of the image due to diffraction and interference, making it possible to perform high-resolution exposure.
以下、本発明の具体的な実施例について説明する。Hereinafter, specific examples of the present invention will be described.
第１表に示すアルカリ可溶性多官能ポリエステルアクリ
レートのうちの一つの化合物のモノマーあるいはオリゴ
マーと、第２表に示す光重合開始剤のうちの一つの化合
物と、第３表に示す増感剤のうちの一つの化合物とをそ
れぞれ選択し、これら各化合物を第４表に示す組成比の
うちいずれかの割合で混合し、得られる混合物を充分攪
拌して液状の感光性樹脂組成物を作成した。A monomer or oligomer of one compound among the alkali-soluble polyfunctional polyester acrylates shown in Table 1, one compound among the photopolymerization initiators shown in Table 2, and one of the sensitizers shown in Table 3. These compounds were mixed at any of the composition ratios shown in Table 4, and the resulting mixture was sufficiently stirred to prepare a liquid photosensitive resin composition.
得られた液状の感光性樹脂組成物をフ第１・レジストと
して用い、銅箔付き基板上にバーコーターにより１０μ
ｍの厚さに塗布し、フォトレジスト膜を形成し矛怪力３
ＫＷ（７）超高圧水銀灯を光源に用い、カラス転成を介
して上記フォトレジスト膜を露光した。露光時間は１秒
（照度８ ｒｒＬＪ／ｃｆｆｌ ）である。The obtained liquid photosensitive resin composition was used as a first resist, and a 10 μm coating was applied onto a copper foil-coated substrate using a bar coater.
Coating to a thickness of m to form a photoresist film and
Using a KW (7) ultra-high pressure mercury lamp as a light source, the photoresist film was exposed to light through glass transfer. The exposure time was 1 second (illuminance 8 rrLJ/cffl).
露光剤のフォトレジスト膜を１％ＮａＯＨ水溶液で現像
し、塩化第二鉄溶液で銅箔をエツチングした後、４％Ｎ
ａ ＯＨ水溶液でフォトレジスト１１９λを剥離した。After developing the photoresist film of the exposure agent with 1% NaOH aqueous solution and etching the copper foil with ferric chloride solution, 4% N
a The photoresist 119λ was removed using an OH aqueous solution.
これにより線幅５０μｍのストライプ状の銅箔パターン
が得られた。As a result, a striped copper foil pattern with a line width of 50 μm was obtained.
なお、上記各化合物のいかなる組合せによっても同様の
効果を有する感光性樹脂組成物を得ることができた。Note that a photosensitive resin composition having similar effects could be obtained by any combination of the above-mentioned compounds.
このように、本発明による感光性樹脂組成物をプリント
配線板のフ第１・レジストに用いれは、こＱ）感光性樹
脂組成物が無溶剤タイプて扁い＠膜物性を弔するため従
来必要であった加熱工程を簡略化することができ、また
比較的低照度で硬化しうるためラインのスビーＩ・化が
計れその製造上のメリットは大きい。In this way, the photosensitive resin composition according to the present invention can be used as the first resist for printed wiring boards. It is possible to simplify the heating process, and since it can be cured at relatively low illuminance, the line can be made lighter, which is a great manufacturing advantage.
更に本発明による感光性樹脂組成物は無溶剤タイプにも
かかわらす、１００〜３０００ ＣＰ Ｓという低粘度
なため神々のコーティング方法により塗布可能であり、
また塗膜にピンホールが生じない。また本発明による感
光性樹脂組成物は希アルカリ溶液で未硬化部分を現像す
ることができ、更にこの組成物の硬化物を高濃度アルカ
リ溶液て剥離することができるので、これら現像や剥離
に有機溶剤を用いる必要がなくなり、作業者の健康に悪
影響を及ぼす虞れがなくなる。Furthermore, although the photosensitive resin composition of the present invention is a solvent-free type, it has a low viscosity of 100 to 3000 CP S, so it can be applied using a divine coating method.
Also, there are no pinholes in the paint film. In addition, the photosensitive resin composition according to the present invention can develop the uncured portion with a dilute alkaline solution, and furthermore, the cured product of this composition can be peeled off with a highly concentrated alkaline solution. There is no need to use a solvent, and there is no risk of adverse effects on the health of workers.
第１表 第２表 第３表 第４表Table 1 Table 2 Table 3 Table 4
Claims (1)
モノマー又はオリゴマーと、光重合開始剤と、増感剤と
を含有してなる感光性樹脂組成物。A photosensitive resin composition comprising an alkali-soluble multifunctional polyester acrylate monomer or oligomer, a photopolymerization initiator, and a sensitizer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4575883A JPS59171948A (en) | 1983-03-18 | 1983-03-18 | Photosensitive resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4575883A JPS59171948A (en) | 1983-03-18 | 1983-03-18 | Photosensitive resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59171948A true JPS59171948A (en) | 1984-09-28 |
Family
ID=12728191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4575883A Pending JPS59171948A (en) | 1983-03-18 | 1983-03-18 | Photosensitive resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59171948A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4925913A (en) * | 1989-09-08 | 1990-05-15 | Nippon Steel Corporation | Heat-resistant unsaturated polyester |
| EP0570094A2 (en) * | 1992-05-15 | 1993-11-18 | Morton International, Inc. | Method of forming a multilayer printed circuit board and product thereof |
| US5523152A (en) * | 1993-10-27 | 1996-06-04 | Minnesota Mining And Manufacturing Company | Organic compounds suitable as reactive diluents, and binder precursor compositions including same |
| US5580647A (en) * | 1993-12-20 | 1996-12-03 | Minnesota Mining And Manufacturing Company | Abrasive articles incorporating addition polymerizable resins and reactive diluents |
| US5667842A (en) * | 1993-10-27 | 1997-09-16 | Minnesota Mining And Manufacturing Company | Abrasive articles incorporating addition polymerizable resins and reactive diluents, and methods of making said abrasive articles |
-
1983
- 1983-03-18 JP JP4575883A patent/JPS59171948A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4925913A (en) * | 1989-09-08 | 1990-05-15 | Nippon Steel Corporation | Heat-resistant unsaturated polyester |
| EP0570094A2 (en) * | 1992-05-15 | 1993-11-18 | Morton International, Inc. | Method of forming a multilayer printed circuit board and product thereof |
| EP0570094A3 (en) * | 1992-05-15 | 1995-06-14 | Morton Int Inc | Method of forming a multilayer printed circuit board and product thereof. |
| SG63569A1 (en) * | 1992-05-15 | 2001-12-19 | Morton Int Inc | Method of forming a multilayer printed circuit board and product thereof |
| US5523152A (en) * | 1993-10-27 | 1996-06-04 | Minnesota Mining And Manufacturing Company | Organic compounds suitable as reactive diluents, and binder precursor compositions including same |
| US5667842A (en) * | 1993-10-27 | 1997-09-16 | Minnesota Mining And Manufacturing Company | Abrasive articles incorporating addition polymerizable resins and reactive diluents, and methods of making said abrasive articles |
| US5710281A (en) * | 1993-10-27 | 1998-01-20 | Minnesota Mining And Manufacturing Company | Organic compounds suitable as reactive diluents and binder precursor compositions including same |
| US5709935A (en) * | 1993-10-27 | 1998-01-20 | Minnesota Mining And Manufacturing Company | Organic compounds suitable as reactive diluents, and binder precursor compositions including same |
| US5733648A (en) * | 1993-10-27 | 1998-03-31 | Minnesota Mining And Manufacturing Company | Organic compounds suitable as reactive diluents, and binder precursor compositions including same |
| US5736747A (en) * | 1993-10-27 | 1998-04-07 | Minnesota Mining And Manufacturing Company | Organic compounds suitable as reactive diluents, and binder precursor compositions including same |
| US5580647A (en) * | 1993-12-20 | 1996-12-03 | Minnesota Mining And Manufacturing Company | Abrasive articles incorporating addition polymerizable resins and reactive diluents |
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