JPS59164649A - Glass composition for sealing - Google Patents
Glass composition for sealingInfo
- Publication number
- JPS59164649A JPS59164649A JP4120983A JP4120983A JPS59164649A JP S59164649 A JPS59164649 A JP S59164649A JP 4120983 A JP4120983 A JP 4120983A JP 4120983 A JP4120983 A JP 4120983A JP S59164649 A JPS59164649 A JP S59164649A
- Authority
- JP
- Japan
- Prior art keywords
- sealing
- glass
- powder
- refractory filler
- compsn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
- C03C8/245—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders containing more than 50% lead oxide, by weight
Abstract
Description
【発明の詳細な説明】
本発明は、低い屈伏点を有し、低温度の熱処理により非
失透状態の封着を達成する低融点ガラス粉末とこれに混
合される耐火物フィラー粉末とからなり、特にＩＣ用の
アルミナセラミックパッケージの封着に適した封着用ガ
ラス組成物に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention comprises a low melting point glass powder that has a low yield point and achieves non-devitrification sealing through low temperature heat treatment, and a refractory filler powder mixed therein. In particular, the present invention relates to a sealing glass composition suitable for sealing alumina ceramic packages for ICs.
従来、ＩＣのアルミナセラミックパッケージの気密封着
には、ＰｂＯ−Ｂ！０ｌ−ＺｎＯ−８ｉｎ、系の熱失透
性ガラス粉末が用いられ、これは４８０〜５００℃の熱
処理によりガラス化した後、失透化（結晶化）した封着
部を形成する。しかしながら、この従来ガラスは、前記
のように高温度の熱処理を要し、ために熱敏感性工Ｃチ
ップのように、４００℃以下の熱処理で封着することが
要請されるものには使用できないという制約があるとと
もに、結晶化のための熱処理条件の許容幅が狭いという
点がある。Conventionally, PbO-B! is used for hermetic sealing of alumina ceramic packages for ICs. A thermally devitrified glass powder of the 0l-ZnO-8in type is used, and after being vitrified by heat treatment at 480 to 500° C., a devitrified (crystallized) sealed portion is formed. However, this conventional glass requires high-temperature heat treatment as mentioned above, and therefore cannot be used for products that require sealing with heat treatment below 400°C, such as heat-sensitive C chips. In addition to these limitations, there is also the point that the allowable range of heat treatment conditions for crystallization is narrow.
本発明の目的は、４００°Ｃ以下の熱処理により流動し
てアルミナセラミックに対して気密な封ｙ９を形成する
こと、アルミナセラミック及び電極の４２合金などから
成るリード線に適合する熱膨張特性を有すること、封着
後のリード線のメッキ工程において、酸処理により封着
ガラスがおかされないように耐酸性が良いことと共にメ
ッキされた配列リード線の相互間が導通するメッキブリ
ッジを１発生しないこと等要求される諸条件を充分満足
する封着用ガラス組成物を提供することである。The purpose of the present invention is to form an airtight seal on alumina ceramic by flowing through heat treatment at 400°C or less, and to have thermal expansion characteristics suitable for lead wires made of alumina ceramic and electrode 42 alloy. In addition, in the plating process of the lead wires after sealing, the sealing glass should not be damaged by acid treatment, and should have good acid resistance, and should not generate plating bridges that conduct between the plated array lead wires. An object of the present invention is to provide a sealing glass composition that fully satisfies required conditions.
本発明者は、ＰｂＯ−Ｂ！０ｓ−ＺｎＯ−３ｉ０１系に
°ｒｌ、０を含有させ、これによりガラスの屈伏点を下
げ、低遥度での熱処理による封着を可能にした特定範囲
の低融点ガラス粉末に、特定範囲量の耐火物フィラーを
混入することにより、前記目的を達成することを見い出
した。The present inventor has discovered that PbO-B! The 0s-ZnO-3i01 system contains °rl, 0, which lowers the yield point of the glass and enables sealing by heat treatment at low temperatures. It has been found that the above object can be achieved by incorporating a refractory filler.
本発明は、モル％表示で本質的に
Ｐｂ０ ４５〜６０％Ｐ
ｂＦ、 Ｏ〜 ８％Ｂｔ
ｕｓ ２５〜３２％Ｚｎ
０ ６〜１１％ＢａＯＯ
〜 ５％
Ｓコ０！１．＋５％
Ａ／、０． ０〜４％Ｔ７
２０ １〜１３％の組成を有
する低融点ガラス粉末５０〜６５容量％と、耐火物フィ
ラー粉末３５〜５０容量％とからなる封着用ガラス組成
物である。The present invention essentially contains Pb0 45-60% P in mol%
bF, O~8%Bt
us 25~32%Zn
0 6-11%BaOO
~ 5% Sko0!1. +5% A/, 0. 0-4%T7
20 A sealing glass composition comprising 50 to 65 volume % of a low melting point glass powder having a composition of 1 to 13% and 35 to 50 volume % of a refractory filler powder.
前記低融点ガラス粉末の組成限定の理由を次に説明する
。The reason for limiting the composition of the low melting point glass powder will be explained below.
ＰｂＯが４５％より少ないとガラスの屈伏点が高くなり
すぎるため封着温度が４００°Ｃ以上になり、６０％よ
り多いとガラスが失透し易くなって充分に流動しなくな
る。ＰｂＦ、はガラスの屈伏点を下げる作用があるが、
８％以上ではガラスが失透し易くなる。Ｂ、０３が２５
％以下ではガラスの屈伏点が高くなって低温での封着に
適さなくなり、３２％以上ではガラスが失透し易くなる
。ＺｎＯが７％以下ではガラスが失透し易くなると共に
耐酸性が劣化し、またメッキブリッジが発生し易くなり
、１１％以上ではガラスの屈伏点が高くなり低温での封
着に適さない。ＢａＯはガラスの耐酸性を向１−させる
が、５％以」二ではガラスの屈伏点が高くなり、低湿封
着に適さない。Ｓ１０．が１％以下ではガラスが不安定
となって失透し易くなると共に耐酸性が劣ることになり
、５％以上ではガラスの屈伏点が高くなって低温封着に
適さないばかりでなく、耐酸性が劣化し、またメッキブ
リッジが発生し易くなる。Ａｌｘ Ｏｓはガラスの耐酸
性を向」ニし、またメッキブリッジの発生を抑制する効
果があるが、４％以上になると屈伏点が高くなり好まし
くない。If the PbO content is less than 45%, the deformation point of the glass becomes too high, resulting in a sealing temperature of 400° C. or higher, and if it exceeds 60%, the glass tends to devitrify and will not flow sufficiently. PbF has the effect of lowering the yield point of glass, but
If it exceeds 8%, the glass tends to devitrify. B, 03 is 25
If it is less than 32%, the glass will have a high yield point, making it unsuitable for sealing at low temperatures, and if it is more than 32%, the glass will tend to devitrify. When the ZnO content is less than 7%, the glass tends to devitrify, the acid resistance deteriorates, and plating bridges are more likely to occur, and when it is more than 11%, the yield point of the glass becomes high, making it unsuitable for sealing at low temperatures. BaO improves the acid resistance of glass, but if it exceeds 5%, the yield point of the glass becomes high, making it unsuitable for low-humidity sealing. S10. If it is less than 1%, the glass will become unstable and prone to devitrification, and its acid resistance will be poor. If it is more than 5%, the glass will not only have a high yield point and be unsuitable for low-temperature sealing, but also have poor acid resistance. deteriorates, and plating bridges are more likely to occur. AlxOs improves the acid resistance of glass and has the effect of suppressing the occurrence of plating bridges, but if it exceeds 4%, the yield point increases, which is undesirable.
Ｔｌ、Ｏが１％以下では、ガラスの屈伏点を下げて低温
で封着できる作用効果が実際上発揮されず、１３％以上
ではガラスの耐酸性が劣り、またメッキブリッジが発生
する。If Tl and O are less than 1%, the effect of lowering the deformation point of the glass and sealing at low temperatures is not actually achieved, and if it is more than 13%, the acid resistance of the glass is poor and plating bridges occur.
上記成分以外に、更にガラスの耐酸性の向上に効果のあ
るＦｅｚ Ｏ＠ 、 ＮｉＯ、ＯｕＯ等の成分を４“艦
まで加えることができる。In addition to the above components, up to 4" of components such as Fez O@, NiO, OuO, etc., which are effective in improving the acid resistance of the glass, can be added.
上記の低融点ガラスは、屈伏点が２６０・−３００℃で
あり、低温度での熱処理により充分流動化し、非結晶化
のガラス状態で気密な封着を達成できるけれども、平均
熱膨張係数が約１２０〜１４０ Ｘ Ｉ Ｆ’７’Ｃ，
と高く、アルミナセラミックのような平均熱膨ｆｆＪ＃
係数が約７０×１０−ｒ／″′Ｃの材料ニハ封着部に応
力が生じて整合的に封着することができない。The above-mentioned low melting point glass has a yield point of 260°C to -300°C, and although it can be sufficiently fluidized by heat treatment at a low temperature and achieve airtight sealing in an amorphous glass state, the average coefficient of thermal expansion is approximately 120-140 X I F'7'C,
and high average thermal expansion ffJ# like alumina ceramics.
The material having a coefficient of about 70 x 10-r/'''C causes stress in the sealing portion and cannot be properly sealed.
本発明の封着用ガラス組成物においては、上記説明の低
融点ガラス粉末に対して低膨張の無機財物の添加剤、い
わゆるフィラーを３５〜５０容量％加える。従って低融
点ガラス粉末の含有量は５０−６５容咀％の範囲にある
。フィラーとしては１−４−＃’Ｊブタイト （ｌＬｉ
！ｏ ・ＡｌｌＯｓ ・２ＳｉＯｔ ）、珪酸ジルコニ
ウム（ＺＴＯ！ ” Ｓｉｎｇ ） 、チタン酸鉛（Ｐ
ｂＯ−Ｔｉｅ、 ） 、ウイレマイト （２ＺｎＯ−Ｓ
ｉｎ、 ）、酸化スズ（ＳｎＯ）の中から牛なくとも一
者以上が選択される・二とが特に好ましいが、他にβ−
スボジュメン（Ｌ１１０ｓ書Ａｌ４０．・４ｓ１ｏ、）
、石英ガラス（５ｊ−０１） 、コージェライト （
２Ｍｇ０・２Ａ７，０．・５ＳｉＯ，）等のフィラーも
使用できる。In the sealing glass composition of the present invention, 35 to 50% by volume of a low expansion inorganic additive, a so-called filler, is added to the low melting point glass powder described above. The content of low melting point glass powder is therefore in the range of 50-65% by volume. As a filler, 1-4-#'Jbutite (lLi
! o ・AllOs ・2SiOt), zirconium silicate (ZTO! “Sing), lead titanate (P
bO-Tie, ), Willemite (2ZnO-S
β-
Subojumen (L110s book Al40.・4s1o,)
, quartz glass (5j-01), cordierite (
2Mg0・2A7,0.・Fillers such as 5SiO, ) can also be used.
一ヒ記の耐火物フィラー中、特に好ましいとされるフィ
ラーは、例えば下記のようにして製造される。Among the refractory fillers listed above, a particularly preferred filler is produced, for example, as follows.
β−ユークリプタイトは、化学量論的に１モルの■□ｊ
ｔＯ１１モルＡｔ！Ｏ，および：２モルＳ」０．になる
」二うに混合した原料を１２００〜］３００°Ｃで焼成
するこぶにより合成し、それを粉砕して製造される。β-eucryptite is stoichiometrically 1 mole of ■□j
tO11 moles At! O, and: 2 mol S'0. It is produced by baking the mixed raw materials at 1200 to 300°C, and then pulverizing the mixture.
珪酸ジルコニウムは、通常入手可能な天然品が使用され
、る。チタン酸鉛は、ＰｂＯ粉末とＴ］０．粉末の等モ
ル比の混合物を１１００〜１２００°Ｃで焼成し、得ら
れた焼結体を粉砕して製造される。ウィレマイトは２モ
ルのＺｎＯ粉末と１モルのＳ］０！粉末σ粉末台物を１
３５０〜１４５０℃で焼成し、得られた焼結体を粉砕し
て製造される。酸化スズは、ｊ９ｎｏ粉末を１３５０〜
１４１５０”Ｃ，で焼成した後、これを粉砕して製造さ
れる。As zirconium silicate, commonly available natural products are used. Lead titanate is made of PbO powder and T]0. It is manufactured by firing a mixture of powders in an equimolar ratio at 1100 to 1200°C and pulverizing the obtained sintered body. Willemite consists of 2 moles of ZnO powder and 1 mole of S]0! Powder σ powder stand 1
It is manufactured by firing at 350 to 1450°C and pulverizing the obtained sintered body. For tin oxide, j9no powder is 1350~
It is produced by firing at 14150"C and then pulverizing it.
これらのフィラーは下記の平均熱膨張係数士有する。These fillers have the following average coefficient of thermal expansion:
β−ユークリプタイト −８６×１０７℃（２０〜
７００℃）
珪酸ジルコニウム ４・５・・−５０Ｘ １０−’
７Ｃ（３０〜５００℃ン
チタン酸鉛 −５３Ｘ １０−’ ／Ｃ
（３０〜４９０’Ｃ）
ライｌ”？（ｌ・’ １６ Ｘ １０−’ ／Ｃ（
３０〜３５０℃）
酸化スズ ３８ Ｘ １０−’ ／
Ｃ（２２〜６５０℃ン
かかる耐火物ライ）−の含有により低融点ガラス粉、（
ミをアルミナセラミ、りに整合する熱膨張係数に下げる
ことができると共に組成物の耐熱衝撃性、機械的強度、
化学的耐久性等の向上を図ることができる。β-eucryptite -86 x 107℃ (20~
700℃) Zirconium silicate 4, 5...-50X 10-'
7C (30~500℃ Lead titanate -53X 10-'/C
(30~490'C) Li"?(l・' 16 X 10-' /C(
30-350℃) Tin oxide 38 X 10-' /
Low melting point glass powder, (
The thermal shock resistance, mechanical strength, and
It is possible to improve chemical durability and the like.
本発明では、既述の如く、上記耐火物フィラーを低融点
ガシス粉木に対して３５〜５０容量％用いるものである
。３５％より少ないと組成物の平均熱膨張係数が大きす
ぎアルミナセラミックとの整合封着ができないと共に組
成物の機械的強度が弱くなり、一方５０％を超えると組
成物が４００℃以下では１−分に流動せず、強固な気密
封着ができないので好ましくない。In the present invention, as described above, the refractory filler is used in an amount of 35 to 50% by volume based on the low melting point gaseous powder. If it is less than 35%, the average coefficient of thermal expansion of the composition will be too large, making it impossible to achieve consistent sealing with alumina ceramic, and the mechanical strength of the composition will become weak. On the other hand, if it exceeds 50%, the composition will have a 1- It is not preferred because it does not flow easily and cannot form a strong airtight seal.
また、耐火物ライ）−粉末の平均粒径は３〜３０μｍに
するのが好ましく、３μｍ以下では組成物の平均熱膨張
係数が十分に小さくならないのでアルミナセラミックと
適合しないばかりでなく、封着時に耐火物フィラー粉末
がガラス中にとけこみ組成物の特性が劣化し、一方３０
μｍ以上では封着後年酸物にクラックが発生し、封着部
の気密が保てない。In addition, it is preferable that the average particle size of the refractory powder is 3 to 30 μm; if it is less than 3 μm, the average coefficient of thermal expansion of the composition will not be sufficiently small, so it will not only be incompatible with alumina ceramics, but also cause problems during sealing. The refractory filler powder dissolves into the glass and deteriorates the properties of the composition, while the
If the thickness is more than μm, cracks will occur in the acid after sealing, and the airtightness of the sealed portion cannot be maintained.
本発明の封着用ガラス組成物は、例えば次の方法により
製造される。The sealing glass composition of the present invention is produced, for example, by the following method.
低融点ガラス粉末は、それの各成分の原料である光明丹
、硼酸、亜鉛華、珪砂等を目標組成になるように調合し
、この調合したガラス原料を白金ルツボに入れ、電気炉
で６５０〜８００℃で３０〜１２０分間溶融する。この
溶融ガラスを薄い板状に成形した後、アルミナボールミ
ルで平均粒径３〜１０μｍ程度に粉砕する。この低融点
ガラス粉−〇−−−
末に、既述の耐火物フィラーを所定割合に調合し、これ
をミキサーで充分に混合する。Low-melting point glass powder is produced by mixing the raw materials of each component, such as Komyotan, boric acid, zinc white, and silica sand, to a target composition.The prepared glass raw material is then placed in a platinum crucible and heated to 650~650 ml in an electric furnace. Melt at 800°C for 30-120 minutes. This molten glass is formed into a thin plate shape, and then ground to an average particle size of about 3 to 10 μm using an alumina ball mill. The above-mentioned refractory filler is added to this low melting point glass powder in a predetermined proportion, and the mixture is thoroughly mixed with a mixer.
次に、本発明の詳細な説明する。Next, the present invention will be explained in detail.
下記り）第１表に低融点ガラス組成の試料を示す。(See below) Table 1 shows samples with low melting point glass compositions.
同表０下段には各試料ガラスの屈伏点、２０・〜２５０
°Ｃで・ハ平均熱膨張係数を示す。The lower row of the same table shows the yield point of each sample glass, 20.~250.
In °C, it shows the average coefficient of thermal expansion.
μ下 舎ｂ
−１＋）−
第１表
第１表（続き）
下記第２衷は、」―記第１表の低融点ガラスＢ１Ｄ、、
Ｅ、Ｇ、Ｊ、を用いてそれらに表に示す種類の耐火物フ
ィラーを表に示す容量％混合し７と実施例の試ｒ１であ
る。表には封着のための熱処理温度、２０〜２５０°Ｃ
の平均熱膨張係数、流動性試験結果を示す。流動性試験
、いわゆるフロー、・ボ・シン試験は、封着用ガ゛ラス
組成物の熱処理時の流動性を評価する試験で、これの測
定に当っては粉末試料７．２ｇを外径１７ｍｍのボタン
状の焼結体に調翳し、この焼結体を各々の熱処理温度で
１０分間熱処理［、た後のボタン径を測定した。アルミ
ナセラ・ミックとの封着に当ってはフローボタン径は２
０ｍｍ以」−であるのが好ましい。Table 1 Table 1 (Continued) The second section below is the low melting point glass B1D in Table 1.
Samples E, G, and J were mixed with refractory fillers of the type shown in the table in the volume percent shown in the table.7 and Example R1. The table shows the heat treatment temperature for sealing, 20 to 250°C.
The average thermal expansion coefficient and fluidity test results are shown. The fluidity test, so-called flow-boshin test, is a test to evaluate the fluidity of the sealing glass composition during heat treatment. A button-shaped sintered body was prepared, and the button diameter was measured after the sintered body was heat-treated at each heat treatment temperature for 10 minutes. When sealing with alumina ceramic, the diameter of the flow button is 2.
It is preferable that it is 0 mm or more.
ＰＺ下令ｂ
１１−
第２表
第２表（続き）
１２−
なお、第２表の試料で気密封着したＩＣパ、＋−ジを実
際σ）製造におけるメッキ工程に対応する条件で酸処理
、すなわち７５℃の５０％硫酸水溶液に１分間引き続い
て室温の１０％硫酸水溶液に１０分間ン；Ｊ清し、次い
で水洗し乾燥した後、実体顕微鏡で封着部のガラス組成
物表面を観察した結果、酸による侵食を受けていないこ
とが認められた。また、第２表の試料で封着しメッキ処
理したＩＣパッケージには、メッキブリッジの発生がな
いことが確認された。PZ Decree b 11- Table 2 Table 2 (Continued) 12- In addition, the IC pads, +-di hermetically sealed with the samples in Table 2 were acid-treated under conditions corresponding to the plating process in actual σ) manufacturing. That is, after soaking in a 50% sulfuric acid aqueous solution at 75°C for 1 minute, followed by rinsing in a 10% sulfuric acid aqueous solution at room temperature for 10 minutes, then washing with water and drying, the surface of the glass composition at the sealed part was observed using a stereomicroscope. , it was observed that there was no attack by acid. Furthermore, it was confirmed that there was no plating bridge in the IC packages sealed and plated using the samples shown in Table 2.
代Ｊ５者長崎準−Junior J5 player Nagasaki Jun
Claims (3)
１％ ＢａＯＯ〜５％ Ｓｉｎ、 １〜５％ ＡＩ、Ｏ，Ｏ−４％ Ｔｌ、０ １〜１３％ の組成を有する低融点ガラス粉末５０〜６５容［，１％
と、耐火物フィラー粉末３５〜５０容量％とからなる封
着用ガラス組成物。(1) In mol%, essentially PbO45-60% PbF, 0-8% B, 0. 25---32% ZnO6~1
50-65 volumes of low-melting glass powder with a composition of 1% BaOO~5% Sin, 1~5% AI, O, O-4% Tl, 0 1~13% [,1%
and 35 to 50% by volume of refractory filler powder.
ト、珪酸ジルコニウム、チタン酸鉛、ウイレマイト、酸
化スズの少なくとも一者である特許請求の範囲第１項に
記載の封着用ガラス組成物。(2) The sealing glass composition according to claim 1, wherein the refractory filler powder is at least one of β-eucryptite, zirconium silicate, lead titanate, willemite, and tin oxide.
ｍである特許請求の範囲第１項及び第２項に記載の封着
用ガラス組成物。(3) Refractory filler powder) Average particle size is 3 to 30μ
The glass composition for sealing according to claims 1 and 2, which is m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4120983A JPS59164649A (en) | 1983-03-11 | 1983-03-11 | Glass composition for sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4120983A JPS59164649A (en) | 1983-03-11 | 1983-03-11 | Glass composition for sealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59164649A true JPS59164649A (en) | 1984-09-17 |
| JPS638060B2 JPS638060B2 (en) | 1988-02-19 |
Family
ID=12602011
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4120983A Granted JPS59164649A (en) | 1983-03-11 | 1983-03-11 | Glass composition for sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59164649A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4857486A (en) * | 1986-09-22 | 1989-08-15 | Japan As Represented By Director General Of Agency Of Industrial Science And Technology | Adhesive for oxide ceramics and method of bonding oxide ceramics using it |
| US4883777A (en) * | 1988-04-07 | 1989-11-28 | Nippon Electric Glass Company, Limited | Sealing glass composition with filler containing Fe and W partially substituted for Ti in PbTiO3 filler |
| JPH02267137A (en) * | 1989-04-06 | 1990-10-31 | Hitachi Ltd | Sealing material |
| US5001087A (en) * | 1988-02-18 | 1991-03-19 | Sumitomo Metal Mining Company Limited | Insulating powder and compositions for resistant coating |
| JP2017197427A (en) * | 2016-04-21 | 2017-11-02 | 日本電気硝子株式会社 | Ceramic powder |
| JP2019214494A (en) * | 2018-06-13 | 2019-12-19 | 国立大学法人 鹿児島大学 | Glass, glass paste, and manufacturing method of glass |
| CN112299720A (en) * | 2020-11-16 | 2021-02-02 | 成都光明光电有限责任公司 | Low temperature sealing glass |
-
1983
- 1983-03-11 JP JP4120983A patent/JPS59164649A/en active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4857486A (en) * | 1986-09-22 | 1989-08-15 | Japan As Represented By Director General Of Agency Of Industrial Science And Technology | Adhesive for oxide ceramics and method of bonding oxide ceramics using it |
| US5001087A (en) * | 1988-02-18 | 1991-03-19 | Sumitomo Metal Mining Company Limited | Insulating powder and compositions for resistant coating |
| US4883777A (en) * | 1988-04-07 | 1989-11-28 | Nippon Electric Glass Company, Limited | Sealing glass composition with filler containing Fe and W partially substituted for Ti in PbTiO3 filler |
| JPH02267137A (en) * | 1989-04-06 | 1990-10-31 | Hitachi Ltd | Sealing material |
| JP2017197427A (en) * | 2016-04-21 | 2017-11-02 | 日本電気硝子株式会社 | Ceramic powder |
| JP2019214494A (en) * | 2018-06-13 | 2019-12-19 | 国立大学法人 鹿児島大学 | Glass, glass paste, and manufacturing method of glass |
| CN112299720A (en) * | 2020-11-16 | 2021-02-02 | 成都光明光电有限责任公司 | Low temperature sealing glass |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS638060B2 (en) | 1988-02-19 |
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