JPS59158337U - Cooling device for power semiconductors - Google Patents

Cooling device for power semiconductors

Info

Publication number
JPS59158337U
JPS59158337U JP5218783U JP5218783U JPS59158337U JP S59158337 U JPS59158337 U JP S59158337U JP 5218783 U JP5218783 U JP 5218783U JP 5218783 U JP5218783 U JP 5218783U JP S59158337 U JPS59158337 U JP S59158337U
Authority
JP
Japan
Prior art keywords
cooling device
power semiconductors
cooling
power semiconductor
recorded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5218783U
Other languages
Japanese (ja)
Inventor
飯沼　日出雄
杉島　栄一
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP5218783U priority Critical patent/JPS59158337U/en
Publication of JPS59158337U publication Critical patent/JPS59158337U/en
Pending legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の冷却方法を示す構成図、第２図は従来の
冷却方法の風の流れを示す説明図、第３図はこの考案の
一実施例による冷却方法を示す構成図、第４図はこの考
案の一実施例による冷却方法の風の流れを示す説明図で
ある。 図中、１は冷却体、２は電力半導体、３は風源である。 なお、図中同一符号は同−又は相当部分を示す。Fig. 1 is a block diagram showing a conventional cooling method, Fig. 2 is an explanatory diagram showing the flow of air in the conventional cooling method, Fig. 3 is a block diagram showing a cooling method according to an embodiment of this invention, and Fig. 4 The figure is an explanatory diagram showing the flow of air in a cooling method according to an embodiment of this invention. In the figure, 1 is a cooling body, 2 is a power semiconductor, and 3 is a wind source. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電力半導体を強制冷却する冷却装置において、上記冷却
装置の表面に風源に対して放射状のフィンを備えたこと
を特徴とする電力半導体の冷却装置。A cooling device for forcedly cooling a power semiconductor, characterized in that a surface of the cooling device is provided with fins radiating toward a wind source.
JP5218783U 1983-04-08 1983-04-08 Cooling device for power semiconductors Pending JPS59158337U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5218783U JPS59158337U (en) 1983-04-08 1983-04-08 Cooling device for power semiconductors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5218783U JPS59158337U (en) 1983-04-08 1983-04-08 Cooling device for power semiconductors

Publications (1)

Publication Number Publication Date
JPS59158337U true JPS59158337U (en) 1984-10-24

Family

ID=30182556

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5218783U Pending JPS59158337U (en) 1983-04-08 1983-04-08 Cooling device for power semiconductors

Country Status (1)

Country Link
JP (1) JPS59158337U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54130881A (en) * 1978-03-21 1979-10-11 Siemens Ag Cooler for electric device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54130881A (en) * 1978-03-21 1979-10-11 Siemens Ag Cooler for electric device

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