JPS59154728A - Manufacture of television picture tube - Google Patents

Manufacture of television picture tube

Info

Publication number
JPS59154728A
JPS59154728A JP2972683A JP2972683A JPS59154728A JP S59154728 A JPS59154728 A JP S59154728A JP 2972683 A JP2972683 A JP 2972683A JP 2972683 A JP2972683 A JP 2972683A JP S59154728 A JPS59154728 A JP S59154728A
Authority
JP
Japan
Prior art keywords
corrosion
resistant film
photoresist
copper
conductive metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2972683A
Other languages
Japanese (ja)
Inventor
Mitsuteru Kakino
垣野　光照
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP2972683A priority Critical patent/JPS59154728A/en
Priority to US06/520,815 priority patent/US4618801A/en
Publication of JPS59154728A publication Critical patent/JPS59154728A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/14—Manufacture of electrodes or electrode systems of non-emitting electrodes
    • H01J9/148—Manufacture of electrodes or electrode systems of non-emitting electrodes of electron emission flat panels, e.g. gate electrodes, focusing electrodes or anode electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
    • H01J29/46—Arrangements of electrodes and associated parts for generating or controlling the ray or beam, e.g. electron-optical arrangement
    • H01J29/467—Control electrodes for flat display tubes, e.g. of the type covered by group H01J31/123
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J31/00—Cathode ray tubes; Electron beam tubes
    • H01J31/08—Cathode ray tubes; Electron beam tubes having a screen on or from which an image or pattern is formed, picked up, converted, or stored
    • H01J31/10—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes
    • H01J31/12—Image or pattern display tubes, i.e. having electrical input and optical output; Flying-spot tubes for scanning purposes with luminescent screen
    • H01J31/123—Flat display tubes
    • H01J31/125—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection
    • H01J31/127—Flat display tubes provided with control means permitting the electron beam to reach selected parts of the screen, e.g. digital selection using large area or array sources, i.e. essentially a source for each pixel group

Abstract

PURPOSE:To obtain a picture tube with bulb thickness as thin as 1-30mm., even in the type of CRT, by forming a metal layer on a substrate, applying a photo resist, exposing and printing a circuit and element pattern, developing the photo resist after forming a corrosion resistance film and thereafter combining the etching process. CONSTITUTION:The through holes 52 for respective elements are bored on an insulating substrate 51, a copper layer 53 is formed on a single surface, and a photo resist is applied thereon. An original plate 55 for baking is placed close ly on the surface of photo resist 54, and a corrosion resistance film is formed by exposing and printing a circuit pattern. Next, the photo resist is developed and unexposed part not forming a film 56 is eliminated. Thereafter, the film 56 is separated by the etching and a copper layer 53 is exposed. Moreover, a Ni layer 57 other than the copper layer is formed on the copper layer 53 by the same procedures as explained above and the printingmechanical process technology and the photoetching method are applied. Thereby, a television picture tube having the bulb thickness as thin as 1-30mm. and having the same picture area can be obtained.

Description

【発明の詳細な説明】 （イ）産業上の利用分野 この発明は、（’Ｒ，Ｔ形式のテレビ受像管。[Detailed description of the invention] (b) Industrial application fields This invention is a ('R,T type television picture tube).

とりわけその管球の厚みが１Ｍないし３０Ｍで、かつ画
像面の面積は従来と変わらない大きさのテレビ受像管の
製作方法に関する。In particular, the present invention relates to a method of manufacturing a television picture tube whose tube thickness is 1M to 30M and whose image plane area is the same size as conventional ones.

（ロ）従来技術 テレビ受１象管としてＣＩＥｔＴ形式をとりながら、そ
の管球の厚みをｌａないし３０１Ｂの薄厚のものとし、
かつ画像面の面積は従来と変わらない大きさのものとす
るテレビ受像管については１本願出願人によって先に出
願された特願昭５８−００２５８８に詳述されている。(b) Conventional technology The CIEtT format is used as the TV receiver's one-quadrant tube, but the thickness of the tube is as thin as 1A to 301B,
A television picture tube in which the area of the image plane is the same as that of conventional TV picture tubes is detailed in Japanese Patent Application No. 58-002588 previously filed by the same applicant.

その構成の要旨とするところは、第１図にそのテレビ受
像管の模式的拡大断面図を示すように。The gist of its configuration is shown in FIG. 1, which is a schematic enlarged sectional view of the television picture tube.

画像表示面（８）に対して平行な面上において均等な距
離間隔をもって対称的に酉己設される多数の熱電子放射
陰極装置（１）と、これらの陰極装置（１）に対応する
同数のグリッド装置（２１と。A large number of thermionic emitting cathode devices (1) arranged symmetrically at equal distance intervals on a plane parallel to the image display surface (8), and the same number of cathode devices (1) corresponding to these cathode devices (1). grid device (21 and.

各グリッド装置（２）から放射された被制御電子線（６
）を隣接する他の被制御電子線（６）と干渉しない程度
の角度範囲において３角度位置Ｉ？ｒ偏向せしめる電子
線偏向装置（３）と、これらによって放射制御された被
制御電子線（６）を受は発光する螢光陽極装置（４）と
を９画像表示面（８）が透明とされた高真空容器（５）
内に封入してなることにある（ただし、白黒テレビの場
合は。Controlled electron beam (6) emitted from each grid device (2)
) at three angular positions I? within an angular range that does not interfere with other adjacent controlled electron beams (6). An electron beam deflector (3) that deflects the electron beam, and a fluorescent anode device (4) that receives and emits the controlled electron beam (6) whose radiation is controlled by these devices.The image display surface (8) is transparent. High vacuum container (5)
(However, in the case of black and white TVs.

電子線偏向装置（３）は不要である）。すなりち本願出
願人の先の出願に係るテレビ受像管において従来のテレ
ビ受像管と大きく相違するのは、陰極装置（１）が１ｉ
ｉｌｌ像表示面（８）と平行な面上において多数、たと
えばタテに５２５列、ヨコに７００列６合計３６７，５
００個電気絶縁性基板１１１面上に排列設置さね　教射
熱百１子束を平行集束させるグリッド装置（２）も所定
必要空間間隔を置いて平行に設置される有孔電気に已縁
性基板四に排列設置され、カラーテレビの場合はさらに
６螢光陽極装置（４）の赤、青、緑の螢光光体に対して
の切換え偏向を行わしめる電子線偏向装置（３）を全体
として１つ、あるいは個々の陰極装置（１）に対応する
数だけ設ｆｆｆｆ１する点である。なお図中、（７１は
透明ガラス管、０２）はカソード電位回路、　１１３１
は金属構体、　（１４＋は発熱体、　＋１５１はプリン
ト配線、　＋２１１は第１グリ・ノド。The electron beam deflector (3) is not required). The main difference between the TV picture tube related to the earlier application filed by the applicant of the present application and the conventional TV picture tube is that the cathode device (1) is 1i.
A large number of columns on a plane parallel to the ill image display surface (8), for example, 525 columns vertically and 700 columns horizontally 6 A total of 367,5
00 pieces are arranged in a row on the surface of the electrically insulating substrate 111.The grid device (2) for converging the radiated heat beam in parallel is also connected to the perforated electricity, which is installed in parallel with a predetermined necessary space interval. The electron beam deflection device (3) is arranged in a row on the fourth board, and in the case of a color TV, it also includes an electron beam deflection device (3) that switches and deflects the red, blue, and green phosphors of the six fluorescent anode devices (4). The point is that one or the number corresponding to each cathode device (1) is installedffff1. In the figure, (71 is a transparent glass tube, 02) is a cathode potential circuit, 1131
is the metal structure, (14+ is the heating element, +151 is the printed wiring, +211 is the first grill nod.

（２２）は第２グリ・ノド、啜は第３ダリ・ノド、　ｆ
２６＋は孔、　＋３１１は第１仏１向器、Ｓ２）は第２
偏向器、（３（至）は有孔電気絶縁性基板、　１３！ｉ
）は偏向体、　＋３６１はプリント導線、　＋３７１は
マスク、　［４１）は螢光体層、　＋４２１はアノード
電極板である。(22) is the second gri-nod, 啜 is the third dari-nod, f
26+ is the hole, +311 is the first Buddhist vessel, S2) is the second
Deflector, (3 (to) is a perforated electrically insulating substrate, 13!i
) is a deflector, +361 is a printed conductor, +371 is a mask, [41) is a phosphor layer, and +421 is an anode electrode plate.

ところで、このような構成のテレビ受像管を製作するに
は、従来ＣＲ’１’形成のテレビ受像管−を製作してい
るような方法を用いることはできない。By the way, in order to manufacture a television picture tube having such a configuration, it is not possible to use the method used to manufacture conventional television picture tubes having a CR'1' formation.

（ハ）　　目　　　　的 この光明は、ＣＩ（、Ｔ形成をと９ながら管球厚みが１
ｍｔないし３ＱＩｉ１７１の薄ｊ学で、１包像面の面積
は従来のものと父わらないテレビ受像管を現実に世に送
り出すため、その製作方法を提供することを目的として
なされた。(C) Purpose: This light has CI (, T formation and tube thickness of 1).
The purpose of this project was to provide a method for producing a television picture tube with a thickness of mt to 3QIi171, and an area of one envelope image plane that was no different from conventional ones.

に）（イｎ成 つぎに、この発明の構成の要旨について述べる。(in) Next, the gist of the configuration of this invention will be described.

この発明では上記課題を解決するため、フォトエヅチン
グ法を応用した。すなわち、テレビ受像管の熱電子放射
陰極装置およびグリッド装置を、カラーテレビの場合は
さらに電子線偏向装置を、基板等の上面に金属層を形成
する工程、その金属層の上面にフォトレジストを塗布す
る工程、フォ）　ｌ／シストに回路パターン、素子パタ
ーンを露光焼付けし、耐食性皮膜を形成させる工程、フ
ォトレジストを現１家し、耐食性皮膜を形成していない
未露光部または露光部を除去する工程、金属層のうち耐
食性皮膜に被覆されていない部分をエツチング液を用い
て溶解させる工程、ならびに前記耐食性皮膜を剥離する
工程を適宜組み合わせることによって製作することを特
徴とするものである。In this invention, in order to solve the above problems, a photoetching method is applied. That is, the process of forming a thermionic emission cathode device and grid device of a television picture tube, and an electron beam deflection device in the case of a color television, a metal layer on the top surface of a substrate, etc., and coating the top surface of the metal layer with photoresist. (4) Step of exposing and baking the circuit pattern and element pattern on the cyst to form a corrosion-resistant film; removing the photoresist and removing the unexposed or exposed parts where the corrosion-resistant film is not formed; The method is characterized in that it is manufactured by appropriately combining the following steps: a step of dissolving the part of the metal layer that is not covered with the corrosion-resistant film using an etching solution, and a step of peeling off the corrosion-resistant film.

０り）実施例 以下、この発明の実施例について説明する。0ri) Example Examples of the present invention will be described below.

第２図はグリッド装置の製作工程を説明するだめの模式
的拡大断面図である。熱電子放射陰極装置および電子線
偏向装置の製作工程についても、グリ・ノド装置の製作
工程とその多くを共通にしているので、以下グリッド装
置の製作工程を例にとうて説明する。FIG. 2 is a schematic enlarged sectional view illustrating the manufacturing process of the grid device. Since many of the manufacturing steps for the thermionic emission cathode device and the electron beam deflection device are the same as those for the grid-node device, the manufacturing steps for the grid device will be described below as an example.

■、■　電気絶縁性基板（５１）に素子ごとの通孔（５
２）を穿設する。ただし、熱電子放射陰極装置について
は、この工程は不要である。■、■ A through hole (5
2). However, this step is not necessary for thermionic emission cathode devices.

■　電気絶縁性基板（５１）の片面に銅層（５３）を形
成する。■ Form a copper layer (53) on one side of the electrically insulating substrate (51).

■　銅層＜Ｓ３）の上面にフォトレジスト（感光液）　
（５４）を塗布する。フォトレジストにはアーク燈、キ
セノンランプ等に照射された部分が硬化し、現像液に不
溶となって耐食性皮膜を形成するネガ型と、逆に未露光
部が皮膜として残存するポジ型とがあるが。■ Photoresist (photosensitive liquid) on the top surface of the copper layer <S3)
Apply (54). There are two types of photoresists: negative-type photoresists, in which the areas exposed to arc lights, xenon lamps, etc. harden and become insoluble in developing solutions, forming a corrosion-resistant film, and positive-type photoresists, in which the unexposed areas remain as a film. but.

ここではネガ型のものを用いた場合について　説明する
。Here we will explain the case where a negative type is used.

■　フォトレジスト（５４）のｂ面に、別途写真複製技
術等によって作成した焼付は用原板（５５）を密着させ
９回路パターンを露光焼付けし、耐食性皮膜を形成させ
る。図中、矢印は光線を示す。(2) On the b-side of the photoresist (54), a printing plate (55) prepared separately using a photo duplication technique or the like is brought into close contact and a 9-circuit pattern is exposed and baked to form a corrosion-resistant film. In the figure, arrows indicate light rays.

■　フォトレジストを現像し、耐食性皮膜（５６）を形
成していない未露光部（ポジ型のフォトレジストを使用
した場合は露光部）を除去する。ここで用いる現像液と
しては、たとえばフォトレジストとしてシップレイ社製
ＡＺ−１１１を用いたときはＡ、Ｚ−３０３を。(2) Develop the photoresist and remove the unexposed areas (exposed areas if a positive type photoresist is used) where the corrosion-resistant film (56) is not formed. As the developer used here, for example, when AZ-111 manufactured by Shipley Co., Ltd. is used as a photoresist, A or Z-303 is used.

コダック社製コダックマイクロレジスト７４７を用いた
ときはコダブクマイクロレジヌトデベロパーを用いると
いうように適宜選択する。When Kodak Microresist 747 manufactured by Kodak Co., Ltd. is used, Kodabuku Microresin Developer is selected as appropriate.

■　銅層（５３）のうち耐食性皮膜（５６）に被覆され
ていない部分をエツチング液Ｘを用いて・溶解させる。(2) Etching liquid X is used to dissolve the portion of the copper layer (53) that is not covered with the corrosion-resistant film (56).

エツチング液Ｘとしては、たとえば蒸留水１００ｍｅ＋
塩酸（比重１．１９）６＝ｎｅ十塩化鉄２０５’の割合
で混合したものを使用する。As the etching solution X, for example, distilled water 100me+
A mixture of hydrochloric acid (specific gravity 1.19) at a ratio of 6=ne iron decachloride 205' is used.

■　耐食性皮膜を剥離し７て銅層（５３）を露出させる
。ここで用いる剥離液としては、ｆことエバフォトレジ
ストとして前記Ａ、Ｚ−１１１を用いたときはアセトン
を、コダ・ノクマイクロレジストマ４７を用いたときは
コダ・ノクマイクロレジヌトリムーハーを用いるという
ように適宜選択する。■ Peel off the corrosion-resistant film 7 to expose the copper layer (53). The stripping solution used here is acetone when the above A and Z-111 are used as the evaporative photoresist, and Koda Noku Micro Resin Remover is used when Koda Noku Microresist Ma 47 is used. Select as appropriate.

（戸　銅層（５３）の上面に銅基外の導電金属屑。(Door: Conductive metal debris other than the copper layer on the top surface of the copper layer (53).

たとえば二・ノケル層（５７）を、メッキ技術。For example, plating technology for the second Nokel layer (57).

蒸着技術↓１こはスバヴＪＩＪング技術等を利用して形
成する。Vapor deposition technology ↓1 This is formed using Subaru JIJ technology.

ｑφ　ニッケ）ｖ鳩（５７）の上面に・さらに銅層（５
３′）をメｑキ技術等を利用して形成する。qφ Nickel) v On the top surface of the pigeon (57), further copper layer (5
3') is formed using a metal coating technique or the like.

０　最上層の銅層（５３Ｑの上面にフォトレジスト（５
４つを塗布する。0 The top layer of copper layer (53Q is covered with photoresist (5
Apply 4 coats.

０　フォトレジスト（５４つの上面に、別途写真複製技
術等によ−て作成した焼付は用原版（５５りを密ノＮさ
せ、素子パグーンを露光焼付けし、耐危性皮嘆を形成さ
せる。0. On the upper surface of the photoresist (54), a printing master plate (55) prepared separately by photocopying technology or the like is densely etched, and the element pattern is exposed and printed to form a hazard-resistant layer.

０　フォトレジストを現像し、耐食性皮膜（５６／）を
形成していない未露光部を除去する。0 Develop the photoresist and remove the unexposed areas where the corrosion-resistant film (56/) is not formed.

■゛　銅層（５３／）のうち耐食性皮膜（５ｑ）に被覆
されていない部分をエツチング液Ｘを用いて溶用ｊ′さ
せる。(2) Etching liquid X is used to dissolve the portion of the copper layer (53/) that is not covered with the corrosion-resistant film (5q).

（ρ・　ニッケル層（５７）のうち耐食性皮１模（５６
／）。(ρ・ Corrosion-resistant skin 1 model (56) of the nickel layer (57)
/).

従−て銅層（５３′）に被覆されていない部分をニーｌ
チンク液Ｙを用いて溶解させる。エツチング液Ｙとして
は、たとえば蒸留水５０［４＋硝酸（比重１．４０　）
　５０ｔｎＪの割合で混合したものを使用する。Therefore, the portion not covered with the copper layer (53') is
Dissolve using tincture solution Y. As the etching solution Y, for example, distilled water 50 [4 + nitric acid (specific gravity 1.40)
A mixture of 50 tnJ is used.

その他、各種金１萬に対して用いられるニーＩチンダ液
の例を列記すれば次のとおりで。Other examples of Nee I Chinda liquid used for 10,000 yen of various types of gold are listed below.

ある。be.

クングヌテンーａ液：蒸留水１００ｒｒＬｅ十水酸化ナ
トリウム（０次 Ｍ＆：蒸留水１００ｒｎＪ＋フエリシアン化ナトリウム
１０ｙ− これらａ液とｂ液とを使用直前に等量ずつ混合する。Kungnutten - Liquid A: Distilled water 100rrLe Sodium decahydroxide (0th order M&: Distilled water 100rnJ + Sodium ferricyanide 10y- Mix equal amounts of these liquids A and B immediately before use.

鉄−工ｆ　／ｌ／アルコ　−ル９ｏｍ１３　　＋硝酸　
　（比ｇ　　１．４０　）１０ｒｎｅ クロム−ａ液：蒸留水１００ｒｎｅ＋水酸化カリウム１
０ｐ ｂ　液：　’＆留水］、０Ｏｍｅ＋フェリシアン化カリ
ウム１０グ これらａ液とｂ液とを使用直前に等量ずつ混合する。Iron work f/l/alcohol 9om13 + nitric acid
(ratio g 1.40) 10rne chromium-a liquid: distilled water 100rne + potassium hydroxide 1
0p B solution: '&distilled water], 0Ome+potassium ferricyanide 10 g Mix equal amounts of these solutions A and B immediately before use.

チタン−蒸留水５０り＋硝酸（比重１．４Ｃ１）４０口
を十弗酸（４０％）１０１祿を６０〜８０゛Ｃにて使用
。Titanium - 50 liters of distilled water + 40 mouths of nitric acid (specific gravity 1.4C1) and 101 yen of decafluoric acid (40%) were used at 60-80°C.

σへ・　耐食性皮膜を剥離して銅層（５３’）を露出さ
せる。To σ: Peel off the corrosion-resistant film to expose the copper layer (53').

なお、熱電子放射陰惨装瞳、グ！Ｊ　、、、ド装置およ
び′電子線偏向装置の製作過程の１例を、第３図、第４
図および第５図にそれぞれ流れ図で示した。In addition, thermionic radiation dark and disastrous eyes, Gu! An example of the manufacturing process of the electron beam deflection device and the electron beam deflection device is shown in Figures 3 and 4.
Flowcharts are shown in FIG. 1 and FIG. 5, respectively.

（へ）効　果 以上説明したようなこの発明に係る製作方法によれば、
Ｃ’ＲＴ形式をとシながら管球厚みがＩＩｍないし３０
１ｍであるというテレビ受１象管を現実に製作すること
か可能となる。しかも、このように印刷製版技術を応用
することによ−て各素子の設（ｉ精度を高めることがで
き、　ｉｉ！ｉＩ質の向上に大いに寄与することができ
る。また量産化に適し、これがコストダクンにつながる
こととなる。(f) Effects According to the manufacturing method of this invention as explained above,
The tube thickness is IIm to 30 while using the C'RT format.
It becomes possible to actually produce a TV receiver with a length of 1 meter. Moreover, by applying printing plate making technology in this way, it is possible to improve the precision of each element's design (i!i), greatly contributing to improving the quality of the elements.It is also suitable for mass production, and this This will lead to cost reduction.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、ＣＲ，Ｔ形式をとりながら管球の厚みが１鷹
ないし３０朋であるテレビ受像管の模式的拡大断面図で
あり、第２図は１本発明の１実施例であるテレビ受像管
の製作方法を説明するための図であり、グリッド装置の
製作工程を模式的拡大断面図でｌｌ［次示したものであ
る。また第３図ないし第５図はそれぞれ、熱電子放射陰
惨装置、グリ−ノド装置ならびに電子線偏向装置の製作
過程の１例を示す流れ図である。 １・・・熱電子放射陰惨装置　　２・・・グリッド装置
３・・・電子線偏向装置　　４・・・螢光陽極装ｆｉテ
ｆｆ１５１・−・電気絶縁性基板　　５２・・・通孔５
３、５３’・・・銅層５４．５４／・・・フォトレジス
ト５５、５５’・・・焼付は用原板 ５６、５６’・・−耐食性皮膜 ５７・・・ニッケル層 第２図 ■ 当プ汐ｈヂ赫片 ￥しｌ渉＆％佃← テ？ｘｒｃ１．圧、ｍ 第４図 第５図 手続補正ｊノ（、（方式） 特許庁長官　　　　　　殿 １、事件の表示 昭和５８　　イＩ　　特許　にイ１第　２９７２６　　
弓２、発明の名称 テレビ受像管の製作方法 ３、補止をする者 事件との関係　　特許出願人 ４、代理　人 ８、補正の内容　　別紙の通り、第２図の図番を記入す
る。FIG. 1 is a schematic enlarged cross-sectional view of a television picture tube of CR, T type with a tube thickness of 1 mm to 30 mm, and FIG. 2 is a television set according to an embodiment of the present invention. FIG. 2 is a diagram for explaining a method of manufacturing a picture tube, and is a schematic enlarged cross-sectional view of the manufacturing process of a grid device [shown below]. 3 to 5 are flowcharts showing an example of the manufacturing process of a thermionic radiation device, a green-nod device, and an electron beam deflection device, respectively. DESCRIPTION OF SYMBOLS 1... Thermionic radiation disastrous device 2... Grid device 3... Electron beam deflection device 4... Fluorescent anode device fiteff151... Electrically insulating substrate 52... Through hole 5
3, 53'... Copper layer 54, 54/... Photoresist 55, 55'... Original plate 56, 56'... - Corrosion resistant film 57... Nickel layer Fig. 2 ■ This plate Shio hji Akira piece ¥ Shil Wataru &% Tsukuda ← Te? xrc1. Pressure, m Figure 4 Figure 5 Procedural Amendment J No.
Bow 2, Name of the invention Method for manufacturing television picture tubes 3, Relationship with the supplementary case Patent applicant 4, Agent 8, Contents of the amendment Enter the figure number in Figure 2 as shown in the attached sheet.

Claims (1)

【特許請求の範囲】 １、　テレビ受像管の熱電子放射陰極装置およびグリッ
ド装装置を、少くとも以下に列記する工程を経ることに
よって製造することを特徴とするテレビ受像管の製作方
法。 （Ａ）　　’＆気軸絶縁性基板片面に銅層を形成する工
程。 （Ｂ）銅層の上面にフォトレジストを塗布する工程。 （Ｃ″）　フォトレジストに回路パターンを露光焼付け
し、耐食性皮膜を形成させる工程。 （Ｄ）　　フォトレジストを現像し、耐食性皮膜を形成
していない未露光部または露光部を除去する工程。 ■　銅層のうち耐食性皮膜に被覆されていない部分をエ
ツチング液Ｘを用いて溶解させる工程。 ［Ｆ］　耐食性皮膜を剥離する工程。 ０　銅層の上面に銅板外の導電金属層を形成する工程。 σｌ　銅板外の導電金属層、またはさらにその上に形成
された銅層または別の導電金属層の上面にフォトレジス
トを塗布する工程。 （Ｉ）　　フォトレジストに素子パターンを露光焼付け
し、耐食性皮膜を形成させる工程。 σ）　フォトレジストを現像し、耐食性皮膜を形成して
いない未露光部または露光部を除去する工程。 σ０　＠以外の導電金属層のうち耐食性皮膜に被覆され
ていない部分をエツチングｇＹを用いて、または銅板外
の導爾：金属層の上に形成された銅層または別の導電金
属層のうち耐食性皮膜に被覆されていない部分をエツチ
ング液Ｘまたは２を用い、＠以外の導電金属層のうち耐
食性皮膜に被覆されていない部分をエツチング液Ｙを用
いて溶解させろ工程。 ■　耐食性皮膜を剥離する工程。 ２４　　テレビ受像管の熱電子教射陰極装置、グリヅド
装置および電子線偏向装置を、少くとも以下に列記する
工程を経ることによ−て製造することを特徴とするテレ
ビ受１象管のり１２作方法。 （Ａ＞　　ｉｌｌ気絶注性基板片面に＠層を形成する工
程。 ［Ｆ］）銅層の上面にフォトレジストを塗布する工程。 Ｃ）　フォトレジストに回路パターンを露光焼イ」けし
、耐食性皮膜を形成させる工程。 （Ｄ）　　フォトレジストを現像し、耐食性成ｌ換を形
成していない未露光部または露光部を除去する工程。 ■〕）銅層のうち耐食性皮膜に被覆されていない部分を
エツチング液Ｘを用いて溶解させる工程。 ［Ｆ］　耐食性皮膜を剥離する工程。 ０　＠胸の上面に銅線外の導電金属層を形成する工程。 σΦ　銅線外の導電金属層、またはさらにその上に形成
された銅層または別の導電金属層の上面にフォトレジス
トを塗布する工程。 （Ｉｌ　　）オドレジストに素子パターンを露光焼付け
し、耐食性皮膜を形成させる工程。 σ）　フォトレジス１−を現像し、耐食性皮膜を形成し
ていない未露光部または露光部を除去する工程。 ■　銅線外の導電金属層のうち耐食性皮膜に被覆されて
いない部分をエツチング液Ｙを用いて、まｔコは銅線外
の導電金属層の上に形成された銅層または別の導電金ｌ
ＦＡ層のうち耐食性皮膜に被覆されていない部分をエツ
チング液ＸまたはＺを用い、銅線外の心”重金属層のう
ち耐食性皮膜に被覆されていない部分をエツチング液Ｙ
を用いて浴解させる工程。 （Ｌ）耐食性皮膜を剥離する工程。[Scope of Claims] 1. A method for manufacturing a television picture tube, which comprises manufacturing a thermionic emission cathode device and a grid mounting device of the television picture tube through at least the steps listed below. (A) '&A step of forming a copper layer on one side of an insulating substrate. (B) Applying photoresist on the top surface of the copper layer. (C″) A process of exposing and baking a circuit pattern on a photoresist to form a corrosion-resistant film. (D) A process of developing the photoresist and removing unexposed or exposed areas where a corrosion-resistant film is not formed. ■ Copper A process of dissolving the part of the layer that is not covered with the corrosion-resistant film using etching liquid X. [F] A process of peeling off the corrosion-resistant film. 0 A process of forming a conductive metal layer outside the copper plate on the upper surface of the copper layer. σl A process of applying a photoresist to the top surface of the conductive metal layer outside the copper plate, or the copper layer or another conductive metal layer formed thereon. (I) Exposing and baking an element pattern on the photoresist to form a corrosion-resistant film. σ) A process of developing the photoresist and removing the unexposed or exposed areas on which no corrosion-resistant film is formed. σ0 Etching the parts of the conductive metal layer other than @ that are not covered with the corrosion-resistant film. or conductive layer outside the copper plate: The part of the copper layer or another conductive metal layer formed on the metal layer that is not covered with the corrosion-resistant film is etched using etching solution X or 2, and conductive metal other than @ Step of dissolving the portion of the layer that is not covered with the corrosion-resistant film using etching liquid Y. ■ Step of peeling off the corrosion-resistant film. 24 Thermionic emission cathode device, grid device, and electron beam deflection device of the television picture tube. A method for making a TV receiver 1-quadrant glue, characterized in that it is produced by at least the steps listed below. F]) A step of applying a photoresist on the top surface of the copper layer. C) A step of exposing and baking a circuit pattern on the photoresist to form a corrosion-resistant film. (D) A step of developing the photoresist and removing unexposed areas or exposed areas that do not form a corrosion-resistant compound. [2]) A step of dissolving the portion of the copper layer that is not covered with the corrosion-resistant film using etching solution X. [F] Step of peeling off the corrosion-resistant film. 0 @Process of forming a conductive metal layer other than the copper wire on the upper surface of the chest. σΦ The process of applying photoresist to the top surface of a conductive metal layer outside of the copper wire, or even a copper layer or another conductive metal layer formed thereon. (Il) A step of exposing and baking an element pattern on an odoresist to form a corrosion-resistant film. σ) A step of developing the photoresist 1- and removing unexposed areas or exposed areas where no corrosion-resistant film is formed. ■ Use etching solution Y to remove the parts of the conductive metal layer outside the copper wire that are not covered with the corrosion-resistant film, and then remove the copper layer or another conductive metal layer formed on the conductive metal layer outside the copper wire. l
The parts of the FA layer that are not covered with the corrosion-resistant film are etched with etching solution
The process of bath dissolution using (L) Step of peeling off the corrosion-resistant film.
JP2972683A 1983-01-10 1983-02-23 Manufacture of television picture tube Pending JPS59154728A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2972683A JPS59154728A (en) 1983-02-23 1983-02-23 Manufacture of television picture tube
US06/520,815 US4618801A (en) 1983-01-10 1983-08-05 Flat cathode ray tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2972683A JPS59154728A (en) 1983-02-23 1983-02-23 Manufacture of television picture tube

Publications (1)

Publication Number Publication Date
JPS59154728A true JPS59154728A (en) 1984-09-03

Family

ID=12284106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2972683A Pending JPS59154728A (en) 1983-01-10 1983-02-23 Manufacture of television picture tube

Country Status (1)

Country Link
JP (1) JPS59154728A (en)

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