JPS59154515A - Thermal louver - Google Patents
Thermal louverInfo
- Publication number
- JPS59154515A JPS59154515A JP58028501A JP2850183A JPS59154515A JP S59154515 A JPS59154515 A JP S59154515A JP 58028501 A JP58028501 A JP 58028501A JP 2850183 A JP2850183 A JP 2850183A JP S59154515 A JPS59154515 A JP S59154515A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- blade
- shape memory
- memory alloy
- blades
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/01—Control of temperature without auxiliary power
- G05D23/02—Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature
- G05D23/024—Control of temperature without auxiliary power with sensing element expanding and contracting in response to changes of temperature the sensing element being of the rod type, tube type, or of a similar type
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Air-Flow Control Members (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Control Of Temperature (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の属する分野〕
この発明は５人工’ｒＱｔ−ｊ星宿の宇ｉｎ飛行体の放
熱制御機器であるサーマルルーバーに関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to a thermal louver which is a heat radiation control device for a 5-artificial 'rQt-j spacecraft.
〔従来技術とその問題点り
人工衛星等の宇宙飛行体は一般にその表面の大半を真空
断熱材で包み他の部分を放熱面と゛する。[Prior art and its problems] Space vehicles such as artificial satellites generally have most of their surfaces covered with vacuum heat insulating material, and the rest of the space serves as a heat dissipation surface.
放熱面の一部又は全部には内部の発熱量によってその放
熱量を増減することの出来る放熱制御機器を招載し、内
部温度を−・定に保つようになっている。A heat radiation control device that can increase or decrease the amount of heat radiation depending on the amount of internal heat generation is installed on part or all of the heat radiation surface to maintain the internal temperature at a constant level.
と９１７だ熱制御機器のひとつに→ノーマルルーバーが
ある。And 917 One of the heat control devices is → normal louver.
第１図に従来のザーマ、７Ｌルーバーの断面図と動作状
態図を示す。放熱面１の温度で動作するバイメタル２の
駆動力で１抽かされる翼列３が、ブラインドのように放
熱面１を宇宙空間に向かって現われている面積を増減す
ることにより放熱面１の裏面にはｌＩＬ子機器４や他の
位置の市−ｆｌｌ’を器の発熱を伝える伝熱素子５など
が設にイされる。放熱ｉ＋ニア １ ｆ□てはシルバー
テフロンなどの太陽光の吸収率は低く放射率は大きいと
いった表ｍｌ特性をもつ材質で作られ、ブレード３の全
面は放射率が大変小さなアルミ鏡面なとで作られる。ブ
レード３全閉時（第１図（ｂ））では、放熱面１はプレ
ート３でおおわれ両鋭簡の金属板１板でおおわれた断熱
状、軸である。FIG. 1 shows a sectional view and an operating state diagram of a conventional thermar, a 7L louver. The blade row 3, which is drawn by the driving force of the bimetal 2 that operates at the temperature of the heat dissipation surface 1, changes the heat dissipation surface 1 by increasing or decreasing the area of the heat dissipation surface 1 exposed toward outer space like a blind. On the back side, there are installed a heat transfer element 5 for transmitting the heat of the device to the IL child device 4 and other locations. Heat dissipation i + near 1 f □ is made of a material such as silver Teflon, which has a low solar absorption rate and a high emissivity, and the entire surface of the blade 3 is made of an aluminum mirror surface with a very low emissivity. It will be done. When the blade 3 is fully closed (FIG. 1(b)), the heat dissipation surface 1 is a heat-insulating shaft covered with the plate 3 and covered with a double-sided metal plate.
グレード３全開時（第１図（ｄ））では放熱面１はほぼ
むき出しの状態で大きな放熱量をもっことになる。When grade 3 is fully opened (FIG. 1(d)), the heat radiation surface 1 is almost exposed and has a large amount of heat radiation.
中間状態（第１図（Ｃ））では放熱量も中間の値を示す
が、この間の制御性はバイメタル写に負っている。In the intermediate state (FIG. 1(C)), the amount of heat radiation also shows an intermediate value, but the controllability during this period is dependent on the bimetallic structure.
しかしながら、温度感応装置としてのバイメタルは材質
の選ひ方とその温度感応調節ががなり難しく誤動作の原
因となっている。However, when using a bimetal as a temperature-sensitive device, it is difficult to select the material and adjust its temperature sensitivity, causing malfunctions.
この発明は、」二連したバイメタルの欠点を改良してよ
り容易でかつ信頼性の高い制御を有するザーマルルーバ
ーを提供するものである。The present invention improves upon the drawbacks of bimetallic bimetals and provides a thermal louver that is easier and more reliable to control.
本発明を実施例（（もとづいて説明する。第２図が本発
明の実施例である。第１図の従来例と違うところは、放
熱面１の温度で１７作する制御用機器として、バネ状の
形状記憶合金６、ひも７とバイアススフリング８を用い
ている。The present invention will be explained based on an example. Fig. 2 shows an example of the present invention. The difference from the conventional example shown in Fig. 1 is that a spring A shaped memory alloy 6, a string 7 and a bias string 8 are used.
ある設定温度（例えば３３０Ｋ）であらかじめ形状記憶
合金６を第１図（ａ）のようにグレードが全開となるよ
うに縮めておく。低温状態では第１図（ｂ）のように全
閉にしておく。放熱面１の温度が上昇するにつれて形状
記憶合金６が徐々に変形していき、３３０Ｋに達すると
第１図（ｄ）の状態になりそれ以上の温度では第１図（
ｄ）の状態のま−ま放熱を続ける。まだ放熱面］の温度
が下がりにじめ３３０に以下になると形状記憶合金６が
軟かくなりバイアススプリング８の力が勝ってひも７を
引張りブレードは第１図（ｃ）から第１図（ｂ）の状態
に移１−コする。そのため形状記憶合金６が温度ｒＭ
ＫＬ、装置として作動している。The shape memory alloy 6 is contracted in advance at a certain set temperature (for example, 330K) so that the grade becomes fully open as shown in FIG. 1(a). In low temperature conditions, it is fully closed as shown in Figure 1(b). As the temperature of the heat dissipation surface 1 rises, the shape memory alloy 6 gradually deforms, and when it reaches 330K, it becomes the state shown in Fig. 1(d), and at higher temperatures, the shape memory alloy 6 deforms as shown in Fig. 1(d).
Continue heat dissipation in the state of d). When the temperature of the heat dissipating surface drops below 330°C, the shape memory alloy 6 becomes soft and the force of the bias spring 8 overcomes the force of the bias spring 8 and pulls the string 7, causing the blade to move from Figure 1(c) to Figure 1(b). ) to state 1-co. Therefore, the temperature of the shape memory alloy 6 is rM
KL, operating as a device.
あらかじめ設定温度で変形しておくだけで鋭い温度感応
装置として動作するという形状記憶合金の特長を生かし
ているため従来のバイメタルによる動作駆動とくらべ製
作が容易で信頼性の高い制御数（４となり誤動作がなく
なる。Because it takes advantage of the feature of shape memory alloys that it operates as a sharp temperature-sensitive device simply by deforming it at a preset temperature, it is easier to manufacture and more reliable than conventional bimetal motion drives. disappears.
第２図が本発明の実施例である。 FIG. 2 shows an embodiment of the present invention.
放熱面１の温度で動作する形状記憶合金６とひも７とバ
イアススプリング８の１１駆動力でイ・Ｉ、かされるブ
レード３がブラインドのように放熱面１を宇宙空間に同
かって現わｉｔでいる面積をＪＹ、ｌ滅することにより
放熱面１の裏面には１ｄ子機器４や他の位置の電子機器
の発熱を伝える伝熱素子５なとが設置される。放熱面１
にはシルバーテフロンなどの太陽光の吸収率（ｄ低く放
射率は大きいといった表１Ｂ）特性をもつ材質で作られ
ブレード３の全面は放射率が大変小さなアルミ鏡面など
で作られる。The blade 3, which is driven by the driving force of the shape memory alloy 6, string 7, and bias spring 8 that operates at the temperature of the heat dissipation surface 1, causes the heat dissipation surface 1 to appear in space like a blind. By reducing the area of the heat dissipating surface 1, a heat transfer element 5 is installed on the back surface of the heat dissipation surface 1, which transmits heat from the 1d child device 4 and other electronic devices. Heat radiation surface 1
The blade 3 is made of a material such as silver Teflon, which has a characteristic of solar absorption rate (low d and high emissivity, as shown in Table 1B), and the entire surface of the blade 3 is made of an aluminum mirror surface with very low emissivity.
ある設定温度（例えは３３０Ｋ）であらかじめの形状記
憶合金６をブレード３が全開となるように縮めておく。The shape memory alloy 6 is contracted in advance at a certain set temperature (for example, 330K) so that the blade 3 is fully opened.
低温状態では全閉にしておく。放熱面１の温度が上昇す
るにつれて形状Ｂ（２１’、は合金６が徐々に琴１鹸よ
り３ ：３０ Ｋに庇するとブレード３は全開となり３
３０に以上では全開の寸丑放熱をイーｊ１−ける。Keep it fully closed in low temperature conditions. As the temperature of the heat dissipating surface 1 rises, the shape B (21') gradually increases the temperature of the alloy 6 to 3:30 K, and the blade 3 opens fully.
Above 30, the heat dissipation at full throttle is possible.
また放熱面１の温度が下がりはじめ３３０ Ｋ以下にな
ると形状記憶合金６が軟かくなりバイアススプリング８
の力が勝ってひも７を引張り、ブレード３は１）−じは
じめる。Furthermore, when the temperature of the heat dissipation surface 1 begins to drop below 330 K, the shape memory alloy 6 becomes soft and the bias spring 8
The force overcomes and pulls the string 7, and the blade 3 begins to move 1).
このように形状記憶合金６が温度感応装置として動作す
るため容易でかつ信頼性の高いルーバーを構成している
。Since the shape memory alloy 6 thus operates as a temperature sensitive device, it constitutes a simple and highly reliable louver.
第１図は従来例のザーマルルーバーを示す概略図、第２
図は本発明の実施例を示す概略図である。
１・・・放熱面、２・・・バイメタル、；３・・・ブレ
ード、４・・・電子機器、５・・・伝熱素子、６・・形
状記憶合金、７・・・ひも、８・・・バイアススフリン
グ。
第１図
（ｃＬ）
（ｂ）（の
ｔｄ＞
＠２図Figure 1 is a schematic diagram showing a conventional thermal louver;
The figure is a schematic diagram showing an embodiment of the invention. DESCRIPTION OF SYMBOLS 1... Heat radiation surface, 2... Bimetal, 3... Blade, 4... Electronic device, 5... Heat transfer element, 6... Shape memory alloy, 7... String, 8... ...Bias Fring. Figure 1 (cL) (b) (td> @Figure 2)
Claims (3)
バー ｔｔζおいて、放熱面積を制御する要素としての
ブレー ドの５Ｆμ動装（市、を形状記憶合金とバイア
ススフリングとでＹ＋”ｉ成したことを特徴とするサー
マル ル − ）く −(1) Thermal loop, a heat radiation control device for spacecraft
In the bar ttζ, the thermal rule is characterized in that the blade's 5Fμ dynamic device (I) as an element for controlling the heat dissipation area is made of a shape memory alloy and a bias spring.
ー ドが全開となるように、あら力・じめうず巻き状に
変形せしめたのち、前記ブレード軸に巻きつけた形状記
憶合金と、バイアススフリングとからなることを特徴と
する特許請求の範囲第１項記載のリ −−マ ル ル
−７（−(2) After deforming the drive device of the blade into a spiral shape under force so that the blade opens fully at a certain temperature, the shape memory alloy wrapped around the blade shaft and the bias The legal ring according to claim 1, characterized in that it consists of a suffling.
-7(-
じるように前記ブレードの軸に巻きつけだひもと、前記
ひもを引張るバイアススプリングとから成ることを特徴
とする特許請求の範囲第１項記載のザーマル、／−バー
。(3) The blade driving device comprises a string that is wound around the shaft of the blade so that the blade closes when pulled, and a bias spring that pulls the string. Thermal, /- Bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58028501A JPS59154515A (en) | 1983-02-24 | 1983-02-24 | Thermal louver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58028501A JPS59154515A (en) | 1983-02-24 | 1983-02-24 | Thermal louver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59154515A true JPS59154515A (en) | 1984-09-03 |
Family
ID=12250417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58028501A Pending JPS59154515A (en) | 1983-02-24 | 1983-02-24 | Thermal louver |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59154515A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63249211A (en) * | 1987-04-06 | 1988-10-17 | Hitachi Ltd | Radiation control mechanism |
| JPH072196A (en) * | 1993-06-18 | 1995-01-06 | Nec Corp | Thermal louver |
| WO2007048161A1 (en) * | 2005-10-25 | 2007-05-03 | Magna Steyr Fahrzeugtechnik Ag & Co Kg | Blind for a spacecraft |
-
1983
- 1983-02-24 JP JP58028501A patent/JPS59154515A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63249211A (en) * | 1987-04-06 | 1988-10-17 | Hitachi Ltd | Radiation control mechanism |
| JPH072196A (en) * | 1993-06-18 | 1995-01-06 | Nec Corp | Thermal louver |
| WO2007048161A1 (en) * | 2005-10-25 | 2007-05-03 | Magna Steyr Fahrzeugtechnik Ag & Co Kg | Blind for a spacecraft |
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