JPS59149632U - Collection - Google Patents

Collection

Info

Publication number
JPS59149632U
JPS59149632U JP4366983U JP4366983U JPS59149632U JP S59149632 U JPS59149632 U JP S59149632U JP 4366983 U JP4366983 U JP 4366983U JP 4366983 U JP4366983 U JP 4366983U JP S59149632 U JPS59149632 U JP S59149632U
Authority
JP
Japan
Prior art keywords
collection
semiconductor chips
collet
recorded
elastic member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4366983U
Other languages
Japanese (ja)
Inventor
横田　栄二
武広　正雄
川島　豊茂
昭弘 窪田
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP4366983U priority Critical patent/JPS59149632U/en
Publication of JPS59149632U publication Critical patent/JPS59149632U/en
Pending legal-status Critical Current

Links

Landscapes

  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来コレットの要部断面図、第２図は本考案の
一実施例の要部断面図である。−図において１１はコレ
ット、１２は弾性部材を示す。FIG. 1 is a sectional view of a main part of a conventional collet, and FIG. 2 is a sectional view of a main part of an embodiment of the present invention. - In the figure, 11 indicates a collet, and 12 indicates an elastic member.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップを真空吸着し、移送するコレットであって
、該半導体チップを吸着する面が弾性部材で形成されて
いることを特徴とするコレット。A collet for vacuum suction and transfer of semiconductor chips, characterized in that a surface for suctioning the semiconductor chips is formed of an elastic member.
JP4366983U 1983-03-26 1983-03-26 Collection Pending JPS59149632U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4366983U JPS59149632U (en) 1983-03-26 1983-03-26 Collection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4366983U JPS59149632U (en) 1983-03-26 1983-03-26 Collection

Publications (1)

Publication Number Publication Date
JPS59149632U true JPS59149632U (en) 1984-10-06

Family

ID=30174206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4366983U Pending JPS59149632U (en) 1983-03-26 1983-03-26 Collection

Country Status (1)

Country Link
JP (1) JPS59149632U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753946A (en) * 1980-09-17 1982-03-31 Toshiba Corp Collet for die bonding

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753946A (en) * 1980-09-17 1982-03-31 Toshiba Corp Collet for die bonding

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