JPS59149602U - Sealed structure of electronic components - Google Patents
Sealed structure of electronic componentsInfo
- Publication number
- JPS59149602U JPS59149602U JP4400483U JP4400483U JPS59149602U JP S59149602 U JPS59149602 U JP S59149602U JP 4400483 U JP4400483 U JP 4400483U JP 4400483 U JP4400483 U JP 4400483U JP S59149602 U JPS59149602 U JP S59149602U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- sealed structure
- sealing resin
- sealed
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図、第2図は従来例を示し、第1図は密封構造の断
面図、第2図は第1図の■−■線に沿う断面図、第3図
〜第5図は本考案の各実施例を示す図である。
10・・・ケース、11・・・封止用樹脂、12・・・
接合面、13.14.15.17.18・・・突起、1
6・・・へこみ。Figures 1 and 2 show the conventional example, Figure 1 is a sectional view of the sealed structure, Figure 2 is a sectional view taken along the line ■-■ in Figure 1, and Figures 3 to 5 are the present invention. It is a figure which shows each Example. 10... Case, 11... Sealing resin, 12...
Joint surface, 13.14.15.17.18...Protrusion, 1
6...dent.
Claims (1)
て、封止用樹脂が接合されるケースの接合面に、突起、
へこみ、あるいは穴等を形成することにより封止用樹脂
との接合面積を広くしてなる電子部品の密封構造。In a structure in which electronic components inside a case are sealed with a sealing resin, there are protrusions,
A sealing structure for electronic components that increases the bonding area with the sealing resin by forming dents or holes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4400483U JPS59149602U (en) | 1983-03-24 | 1983-03-24 | Sealed structure of electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4400483U JPS59149602U (en) | 1983-03-24 | 1983-03-24 | Sealed structure of electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59149602U true JPS59149602U (en) | 1984-10-06 |
Family
ID=30174534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4400483U Pending JPS59149602U (en) | 1983-03-24 | 1983-03-24 | Sealed structure of electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59149602U (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6181101U (en) * | 1984-11-01 | 1986-05-29 | ||
JPS6358725A (en) * | 1986-08-29 | 1988-03-14 | Hitachi Ltd | Heater for electron tube cathode |
JPH01206700A (en) * | 1988-02-13 | 1989-08-18 | Yamaha Motor Co Ltd | Mold structure of electric component |
WO2014167820A1 (en) * | 2013-04-11 | 2014-10-16 | アンデン株式会社 | Electrical equipment device |
WO2014171101A1 (en) * | 2013-04-15 | 2014-10-23 | アンデン株式会社 | Electrical device |
JP2015162649A (en) * | 2014-02-28 | 2015-09-07 | 三菱電機株式会社 | semiconductor device |
JP2016029694A (en) * | 2014-07-25 | 2016-03-03 | 株式会社デンソー | Electronic device |
JP2020188040A (en) * | 2019-05-09 | 2020-11-19 | 株式会社デンソー | Ignition coil and manufacturing method of the same |
US10959333B2 (en) | 2018-12-19 | 2021-03-23 | Fuji Electric Co., Ltd. | Semiconductor device |
JP2021111669A (en) * | 2020-01-08 | 2021-08-02 | 三菱電機株式会社 | Semiconductor device and electric power conversion system |
-
1983
- 1983-03-24 JP JP4400483U patent/JPS59149602U/en active Pending
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6181101U (en) * | 1984-11-01 | 1986-05-29 | ||
JPS6358725A (en) * | 1986-08-29 | 1988-03-14 | Hitachi Ltd | Heater for electron tube cathode |
JPH01206700A (en) * | 1988-02-13 | 1989-08-18 | Yamaha Motor Co Ltd | Mold structure of electric component |
WO2014167820A1 (en) * | 2013-04-11 | 2014-10-16 | アンデン株式会社 | Electrical equipment device |
JP2014207278A (en) * | 2013-04-11 | 2014-10-30 | アンデン株式会社 | Electric apparatus device |
WO2014171101A1 (en) * | 2013-04-15 | 2014-10-23 | アンデン株式会社 | Electrical device |
JP2014207360A (en) * | 2013-04-15 | 2014-10-30 | アンデン株式会社 | Electric apparatus device |
JP2015162649A (en) * | 2014-02-28 | 2015-09-07 | 三菱電機株式会社 | semiconductor device |
JP2016029694A (en) * | 2014-07-25 | 2016-03-03 | 株式会社デンソー | Electronic device |
US10959333B2 (en) | 2018-12-19 | 2021-03-23 | Fuji Electric Co., Ltd. | Semiconductor device |
JP2020188040A (en) * | 2019-05-09 | 2020-11-19 | 株式会社デンソー | Ignition coil and manufacturing method of the same |
JP2021111669A (en) * | 2020-01-08 | 2021-08-02 | 三菱電機株式会社 | Semiconductor device and electric power conversion system |
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