JPS59149602U - Sealed structure of electronic components - Google Patents

Sealed structure of electronic components

Info

Publication number
JPS59149602U
JPS59149602U JP4400483U JP4400483U JPS59149602U JP S59149602 U JPS59149602 U JP S59149602U JP 4400483 U JP4400483 U JP 4400483U JP 4400483 U JP4400483 U JP 4400483U JP S59149602 U JPS59149602 U JP S59149602U
Authority
JP
Japan
Prior art keywords
electronic components
sealed structure
sealing resin
sealed
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4400483U
Other languages
Japanese (ja)
Inventor
田中 康廣
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP4400483U priority Critical patent/JPS59149602U/en
Publication of JPS59149602U publication Critical patent/JPS59149602U/en
Pending legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は従来例を示し、第1図は密封構造の断
面図、第2図は第1図の■−■線に沿う断面図、第3図
〜第5図は本考案の各実施例を示す図である。 10・・・ケース、11・・・封止用樹脂、12・・・
接合面、13.14.15.17.18・・・突起、1
6・・・へこみ。
Figures 1 and 2 show the conventional example, Figure 1 is a sectional view of the sealed structure, Figure 2 is a sectional view taken along the line ■-■ in Figure 1, and Figures 3 to 5 are the present invention. It is a figure which shows each Example. 10... Case, 11... Sealing resin, 12...
Joint surface, 13.14.15.17.18...Protrusion, 1
6...dent.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ケース内の電子部品を封止用樹脂で密封する構造におい
て、封止用樹脂が接合されるケースの接合面に、突起、
へこみ、あるいは穴等を形成することにより封止用樹脂
との接合面積を広くしてなる電子部品の密封構造。
In a structure in which electronic components inside a case are sealed with a sealing resin, there are protrusions,
A sealing structure for electronic components that increases the bonding area with the sealing resin by forming dents or holes.
JP4400483U 1983-03-24 1983-03-24 Sealed structure of electronic components Pending JPS59149602U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4400483U JPS59149602U (en) 1983-03-24 1983-03-24 Sealed structure of electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4400483U JPS59149602U (en) 1983-03-24 1983-03-24 Sealed structure of electronic components

Publications (1)

Publication Number Publication Date
JPS59149602U true JPS59149602U (en) 1984-10-06

Family

ID=30174534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4400483U Pending JPS59149602U (en) 1983-03-24 1983-03-24 Sealed structure of electronic components

Country Status (1)

Country Link
JP (1) JPS59149602U (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181101U (en) * 1984-11-01 1986-05-29
JPS6358725A (en) * 1986-08-29 1988-03-14 Hitachi Ltd Heater for electron tube cathode
JPH01206700A (en) * 1988-02-13 1989-08-18 Yamaha Motor Co Ltd Mold structure of electric component
WO2014167820A1 (en) * 2013-04-11 2014-10-16 アンデン株式会社 Electrical equipment device
WO2014171101A1 (en) * 2013-04-15 2014-10-23 アンデン株式会社 Electrical device
JP2015162649A (en) * 2014-02-28 2015-09-07 三菱電機株式会社 semiconductor device
JP2016029694A (en) * 2014-07-25 2016-03-03 株式会社デンソー Electronic device
JP2020188040A (en) * 2019-05-09 2020-11-19 株式会社デンソー Ignition coil and manufacturing method of the same
US10959333B2 (en) 2018-12-19 2021-03-23 Fuji Electric Co., Ltd. Semiconductor device
JP2021111669A (en) * 2020-01-08 2021-08-02 三菱電機株式会社 Semiconductor device and electric power conversion system

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181101U (en) * 1984-11-01 1986-05-29
JPS6358725A (en) * 1986-08-29 1988-03-14 Hitachi Ltd Heater for electron tube cathode
JPH01206700A (en) * 1988-02-13 1989-08-18 Yamaha Motor Co Ltd Mold structure of electric component
WO2014167820A1 (en) * 2013-04-11 2014-10-16 アンデン株式会社 Electrical equipment device
JP2014207278A (en) * 2013-04-11 2014-10-30 アンデン株式会社 Electric apparatus device
WO2014171101A1 (en) * 2013-04-15 2014-10-23 アンデン株式会社 Electrical device
JP2014207360A (en) * 2013-04-15 2014-10-30 アンデン株式会社 Electric apparatus device
JP2015162649A (en) * 2014-02-28 2015-09-07 三菱電機株式会社 semiconductor device
JP2016029694A (en) * 2014-07-25 2016-03-03 株式会社デンソー Electronic device
US10959333B2 (en) 2018-12-19 2021-03-23 Fuji Electric Co., Ltd. Semiconductor device
JP2020188040A (en) * 2019-05-09 2020-11-19 株式会社デンソー Ignition coil and manufacturing method of the same
JP2021111669A (en) * 2020-01-08 2021-08-02 三菱電機株式会社 Semiconductor device and electric power conversion system

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