JPS59144147A - Attracting device - Google Patents

Attracting device

Info

Publication number
JPS59144147A
JPS59144147A JP1735983A JP1735983A JPS59144147A JP S59144147 A JPS59144147 A JP S59144147A JP 1735983 A JP1735983 A JP 1735983A JP 1735983 A JP1735983 A JP 1735983A JP S59144147 A JPS59144147 A JP S59144147A
Authority
JP
Japan
Prior art keywords
pellet
suction
collet
attracted
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1735983A
Other languages
Japanese (ja)
Inventor
Ken Okuya
謙 奥谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1735983A priority Critical patent/JPS59144147A/en
Publication of JPS59144147A publication Critical patent/JPS59144147A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)

Abstract

PURPOSE:To prevent the damage of a pellet by mounting an attracting collet through a buffer mechanism for escaping the collect in a noncontacting direction when contacting the collet with an article to be attracted. CONSTITUTION:When a pellet 2 is disposed directly under an attracting collet 4, a feed screw shaft 6 is rotated by an elevating motor 5, an elevating member 7 is moved downward, and a turning member 8 and a moving member 12 are moved down. A suction pipe 18 which is supported to an arm 16 is moved down by the down movements of the members, and an attracting nozzle 19 of the lower end is contacted to be covered on the pellet 2. The impact force at the contacting time can be attracted by the fine movement that the nozzle 19 is escaped upward. When the nozzle 19 is closely contacted with the pellet 2, a hose 20 and the pipe 18 are attracted, and the nozzle 19 is attracted to the pellet 2 by the negative pressure. Then, the collect 4 is integrated with the member 7 and raised.

Description

【発明の詳細な説明】 本発明は吸着装置に関する。[Detailed description of the invention] The present invention relates to an adsorption device.

一般に、半導体装置の製造工程におけるペレヅトボンダ
等においては、ペレット皿に収納さi″したペレッl取
出しボンディングヌテージのリードフレーム上に載置さ
せるために吸着装置が使用されることがある。
Generally, in a pellet bonder or the like used in the manufacturing process of semiconductor devices, a suction device is sometimes used to take out pellets stored in a pellet tray and place them on a bonding nutage lead frame.

従来のこの種の吸着装置として、例えば第1図に示すよ
うなものが提案されている。
As a conventional adsorption device of this type, one shown in FIG. 1, for example, has been proposed.

この吸着装置は、ペレ・ソト皿lに収納されたペレット
2の川まで移動手段3により吸着コレ・ソ14が移動さ
れてペレノ[2の上面に当接され、この状態において吸
着コレフト4がペレ・、11”k真空吸引力により吸着
し、吸着後、コレット4は移動手段3によりボンデイン
グヌテージ等に移動さするように構成されている。
In this suction device, the suction collet 14 is moved by the moving means 3 to the river of pellets 2 stored in the pellet soot tray l, and is brought into contact with the upper surface of the pellet [2], and in this state, the suction collet 4 picks up the pellets. ., 11''k The collet 4 is configured to be adsorbed by vacuum suction force, and after adsorption, the collet 4 is moved to a bonding nutage or the like by the moving means 3.

しかしながら、このような吸着装置にあっては、移動手
段に吸猜コレ・ソトが固定的に散り付けられているため
、吸着コレ・7トがペレットに当接されるときに、ペレ
・ソトに衝撃力が加えられペレットが破損される危険が
あるという欠点があった。
However, in such a suction device, since the sucking pellets are fixedly scattered on the moving means, when the suction pellets come into contact with the pellets, the pellets are There was a drawback that there was a risk that the pellets would be damaged due to the impact force applied.

本発明の目的は、前記従来技術の欠点全解決し、吸着コ
レットを非衝撃的に当接させることができる吸着装置を
提供するにある。
SUMMARY OF THE INVENTION An object of the present invention is to solve all the drawbacks of the prior art and to provide a suction device that can bring a suction collet into contact with the suction collet without impact.

以下、本発明を図面に示す実旋しく1にしたがって説明
する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be explained in accordance with the actual flowchart 1 shown in the drawings.

第2図は本発明による吸着装置の一実旅fll′に示す
一部切断正面図である。
FIG. 2 is a partially cutaway front view showing an actual journey of the adsorption device according to the present invention.

本実施例において、この吸着装置の移動手段3はサーボ
モータ5に駆動される送りねじ軸6を備えており、この
ねじ軸6には昇降部材7が昇降可能に螺合さr〜でいる
。この昇降部材7には旋回部材8が回動自在に嵌合さn
ておシ、この旋回部材8の外周の一部には扇面M9が形
成されている。
In this embodiment, the moving means 3 of this suction device is equipped with a feed screw shaft 6 driven by a servo motor 5, and an elevating member 7 is screwed into this screw shaft 6 so as to be movable up and down. A rotating member 8 is rotatably fitted into this elevating member 7.
A fan surface M9 is formed on a part of the outer periphery of the rotating member 8.

この扇歯車9には歯止IOが噛合され、この歯止10は
サーボモータ11により駆動されるようになっている。
A pawl IO is meshed with this fan gear 9, and this pawl 10 is driven by a servo motor 11.

捷た、旋回部材8の外周の他部には移動部材12がその
一端部を固着されて水平に突設されて(ハる。移動部材
12の先端部にはガイド孔13が穿設さ九、中間部の上
面には上端部にストッパ14ケ突設された支柱15が乎
直に立設されている。支柱15の上端部にはアーム16
がその中間部を上下方向に回動自在に枢支されてをり付
けられておシ、このアーム16は一端が前記ヌトツパ1
4に当接されることによシ反時計回り方向の回動を阻止
され、かつ圧縮スプリング17によりヌトッパ14に押
接される方向に常時付勢されている。
A movable member 12 is fixed to one end of the other part of the outer periphery of the pivoting member 8 and protrudes horizontally. , a support 15 with 14 stoppers protruding from its upper end is provided vertically on the upper surface of the intermediate portion.An arm 16 is provided at the upper end of the support 15.
The arm 16 has one end attached to the arm 16 so as to be rotatable in the vertical direction.
4, it is prevented from rotating in the counterclockwise direction, and is always urged by the compression spring 17 in the direction of being pressed against the nutopper 14.

一方、吸着コレット4は、吸引)くイブ18と、吸引パ
イプ18の下端に設けられた吸着ノズル19と、吸引パ
イプ18の上端に接続され、真空ポンプ(不図示)に連
通される吸引ホース20と會備λている。吸引パイプ1
8は前記移動部材12の先端部のガイド孔13に摺動自
在に挿通され、その上端部が前記アーム16の自由端部
に回動自在に枢着されて支持されている。
On the other hand, the suction collet 4 includes a suction tube 18, a suction nozzle 19 provided at the lower end of the suction pipe 18, and a suction hose 20 connected to the upper end of the suction pipe 18 and communicated with a vacuum pump (not shown). I have a meeting with you. Suction pipe 1
8 is slidably inserted into the guide hole 13 at the distal end of the movable member 12, and its upper end is rotatably supported by the free end of the arm 16.

次に作用全訝明する。Next, let's understand the entire effect.

吸着すべきペレット2が吸着コレット4の真下に位置さ
れると、昇降用モータ5により送りねじ軸6が回転され
、これに螺合された昇降部材7が下降されて旋回部材8
および移動部材12が下降される。この下降により、ア
ーム16に支持された吸引パイプ18が下降され、下端
の吸着ノズル19がペレット2に被されるように当接さ
れる。
When the pellet 2 to be adsorbed is located directly below the adsorption collet 4, the elevating motor 5 rotates the feed screw shaft 6, and the elevating member 7 screwed thereon is lowered to rotate the rotating member 8.
Then, the moving member 12 is lowered. By this lowering, the suction pipe 18 supported by the arm 16 is lowered, and the suction nozzle 19 at the lower end is brought into contact with the pellet 2 so as to cover it.

この当接時、ペレット2には相対的に衝撃力が加わるが
、この衝撃力は吸着ノズル19が上方に逃げるように微
動することによシ吸収さnる。すなわち、罰記邑接時、
吸着ノズル19にペレット2から相対的に押し上げ力が
加えられると、吸引ノくイブ18がアーム16により上
方に遊動自在に支持すれているので、吸着ノズル19お
よび吸引ノ(イブ18はアーム16を反時計回り方向に
付勢している圧縮スプリング17に抗してアーム16ケ
時計回り方向に回動させ上方に微動し、前記当接に追従
して衝撃全吸収する。
At this time of contact, a relative impact force is applied to the pellet 2, but this impact force is absorbed by the suction nozzle 19 slightly moving upward to escape. In other words, when approaching Punishi-eup,
When a relative upward force is applied to the suction nozzle 19 from the pellet 2, the suction nozzle 19 and the suction nozzle (eve 18 move upwardly from the arm 16) because the suction nozzle eve 18 is supported by the arm 16 so as to be freely movable upward. The arm 16 is rotated clockwise against the compression spring 17 biased in the counterclockwise direction and slightly moved upward, following the contact and absorbing the entire impact.

ペレット2にノズル19が密着されると、吸引ホース2
0およびパイプ18が真空吸引されこの9圧によシノズ
ル19にペレ・ノド2が吸着される。
When the nozzle 19 is brought into close contact with the pellet 2, the suction hose 2
0 and the pipe 18 are vacuum-suctioned, and the pellet nod 2 is adsorbed to the nozzle 19 by this 9 pressure.

続いて、昇降用モータ5により送りなし軸6が回転され
昇降部材7が上昇され、これと一体になった吸着コレッ
ト4が上昇される。同時に、旋回用モータ11によシ歯
重10および扇歯車9を介して旋回部制8が回動され、
こ4と一部になった吸着コレット4も旋回される。これ
によシ、吸着コレット4の吸着ノズル19に吸着された
ペレ・ソト2はボンデイングヌテージ等のような所定の
位置に移送される。
Subsequently, the non-feeding shaft 6 is rotated by the lifting motor 5 to raise the lifting member 7, and the suction collet 4 integrated therewith is lifted. At the same time, the rotating part control 8 is rotated by the rotating motor 11 via the gear tooth 10 and the fan gear 9.
The suction collet 4, which is now a part of the collet 4, is also rotated. As a result, the Pelle Soto 2 adsorbed by the suction nozzle 19 of the suction collet 4 is transferred to a predetermined position such as a bonding nutage.

ペレット2が所定の位置に移送されると、吸着コレット
4が前述のようにして下降され置かれるが、このときも
吸着コ1)・ノド4が上方に逃げて衝撃が吸収される。
When the pellet 2 is transferred to a predetermined position, the suction collet 4 is lowered and placed as described above, but at this time as well, the suction collet 1) and throat 4 escape upward and the impact is absorbed.

本実施例1によれば、吸着コ1/ットとペレ・ソトとの
相対的当接時における衝撃が緩和さjるので、ペレット
が被損さnることは回避される。したがって、半導体製
造工程における歩留り、は向上される。
According to the first embodiment, since the shock generated when the suction unit and the pellet/socket come into relative contact with each other is alleviated, damage to the pellet can be avoided. Therefore, the yield in the semiconductor manufacturing process is improved.

なお、前記実施例1では、緩衝機構が支柱に回動自在に
枢支されたアームと圧縮ヌプリングとにより構成されて
いるが、緩衝機構はこれに限らず、例1えば、吸引パイ
プが上方移動自在に支持されるとともに、引張スプリン
グによシ下方に常時付勢さ扛てなる構造等であってもよ
い。
In the first embodiment, the shock absorbing mechanism is composed of an arm rotatably supported on a column and a compression ring, but the shock absorbing mechanism is not limited to this, and for example, if the suction pipe moves upward. It may have a structure in which it is supported freely and is constantly urged downward by a tension spring.

また、本発明1はペレットボンダにおいてペレ・ント皿
からペレツl吸着して取り出しボンディング位置に移送
する場合に使用するに限らず、例Iえばダイシング装置
等において切断分割されたべしットをピックアップする
場合等、その細小型電子部品等々を吸着する吸着装置全
般に適用することができる。
In addition, the present invention 1 is not limited to being used when a pellet bonder adsorbs pellets from a pellet tray and transports the pellets to a bonding position; for example, it can be used to pick up pellets that have been cut into pieces using a dicing device, etc. The present invention can be applied to all suction devices that suction small and small electronic components, etc., in various cases.

以上説明したように、本発明によれば、被吸着物を非衝
撃的に吸着することができる。
As explained above, according to the present invention, an object to be adsorbed can be adsorbed in a non-impact manner.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来例を示す一部切断正面図、第2図は本発明
の一実施例を示す一部切断正面図である。 1・・・ペレット皿、2・・・ペレット、3・・・移動
手段、4・・・吸着コレット、7・・・昇降部材、8・
・・旋回部材、12・・・移動部材、13・・ガイド孔
、14・・・ストッパ、16・・・アーム、17・・・
スプリング% 18・・・吸引パイプ。
FIG. 1 is a partially cutaway front view showing a conventional example, and FIG. 2 is a partially cutaway front view showing an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Pellet dish, 2... Pellet, 3... Moving means, 4... Adsorption collet, 7... Lifting member, 8...
... Rotating member, 12... Moving member, 13... Guide hole, 14... Stopper, 16... Arm, 17...
Spring% 18...Suction pipe.

Claims (1)

【特許請求の範囲】 1、被吸着物に当接して負圧によりこれ會吸着する吸着
コレットと、この吸着コレットを被吸着物に当接移動さ
せる移動手段とを備えた吸着装置にお(八て、前記吸着
コレラ)k前記移動手段に前記被吸着物への当接時に吸
着コレ・ソ[r反当接方向に逃がす緩揃機構ケ弁して耳
Vシ付けたことを特徴とする吸着装置。 2、緩衝機構が、吸着コレシト’に反当接方向に移動自
在に支持する手段と、吸着コレラミ当接方向に常時付勢
する付勢手段とを備えたことを%′徴とする特許請求の
範囲第1項記載の吸着装置。
[Scope of Claims] 1. A suction device (8) equipped with a suction collet that comes into contact with an object to be attracted and adsorbs it by negative pressure, and a moving means that moves this suction collet into contact with the object to be attracted. The suction device is characterized in that the moving means is provided with a lug V-shaped valve and a loose alignment mechanism for releasing the suction object in a direction opposite to the contact direction when it comes into contact with the object. Device. 2. The patent claim is characterized in that the buffering mechanism is provided with means for supporting the suction collector so as to be movable in the anti-contact direction, and urging means that constantly biases the suction collector in the direction of contact. The adsorption device according to scope 1.
JP1735983A 1983-02-07 1983-02-07 Attracting device Pending JPS59144147A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1735983A JPS59144147A (en) 1983-02-07 1983-02-07 Attracting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1735983A JPS59144147A (en) 1983-02-07 1983-02-07 Attracting device

Publications (1)

Publication Number Publication Date
JPS59144147A true JPS59144147A (en) 1984-08-18

Family

ID=11941842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1735983A Pending JPS59144147A (en) 1983-02-07 1983-02-07 Attracting device

Country Status (1)

Country Link
JP (1) JPS59144147A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009196080A (en) * 2008-02-21 2009-09-03 Gimatic Spa One-finger gripper device
CN107887316A (en) * 2017-11-29 2018-04-06 南通金泰科技有限公司 A kind of plastic packaging material feeder and application method
CN108789212A (en) * 2018-06-08 2018-11-13 广州立亿贸易有限公司 A kind of sheet molding compound equipment of conduction
CN108789211A (en) * 2018-06-08 2018-11-13 广州立亿贸易有限公司 A kind of sheet molding compound equipment of novel conduction
CN108789210A (en) * 2018-06-08 2018-11-13 广州立亿贸易有限公司 A kind of sheet molding compound equipment of novel conductive
CN108857968A (en) * 2018-06-08 2018-11-23 广州立亿贸易有限公司 A kind of conductive sheet molding compound equipment of improvement

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009196080A (en) * 2008-02-21 2009-09-03 Gimatic Spa One-finger gripper device
CN107887316A (en) * 2017-11-29 2018-04-06 南通金泰科技有限公司 A kind of plastic packaging material feeder and application method
CN108789212A (en) * 2018-06-08 2018-11-13 广州立亿贸易有限公司 A kind of sheet molding compound equipment of conduction
CN108789211A (en) * 2018-06-08 2018-11-13 广州立亿贸易有限公司 A kind of sheet molding compound equipment of novel conduction
CN108789210A (en) * 2018-06-08 2018-11-13 广州立亿贸易有限公司 A kind of sheet molding compound equipment of novel conductive
CN108857968A (en) * 2018-06-08 2018-11-23 广州立亿贸易有限公司 A kind of conductive sheet molding compound equipment of improvement

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