JPS5914375U - Solder dip type printed circuit board - Google Patents
Solder dip type printed circuit boardInfo
- Publication number
- JPS5914375U JPS5914375U JP10912982U JP10912982U JPS5914375U JP S5914375 U JPS5914375 U JP S5914375U JP 10912982 U JP10912982 U JP 10912982U JP 10912982 U JP10912982 U JP 10912982U JP S5914375 U JPS5914375 U JP S5914375U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- dip type
- solder dip
- type printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図および第２図は従来の基本パッケージとこれに取
付けられる拡張パッケージとの位置関係を説明する取付
分解斜視図、第３図は本考案の実施例の２つのプリント
回路基板の位置関係を説明 −する取付分解斜視図で
ある。
１・・・・・・支持具、２・・・・・・基本パッケージ
、３・・・・・・拡張パッケージ、４・・・・・・ネジ
、５・・・・・・リード線、−６・・・・・・基本パッ
ケージ、７・・・・・・プラグ、８・・・・・・拡張パ
ッケージ、９・・・・・・ジャック、１０・・・・・・
拡張パッケージ、１１・・・・・・突起、１２・・・・
・・基本パッケージ、１３・・・・・・スルーホール。Figures 1 and 2 are exploded perspective views showing the positional relationship between a conventional basic package and an expansion package attached to it, and Figure 3 shows the positional relationship between two printed circuit boards according to an embodiment of the present invention. DESCRIPTION - It is an exploded perspective view of the installation. 1...Support, 2...Basic package, 3...Expansion package, 4...Screw, 5...Lead wire, - 6... Basic package, 7... Plug, 8... Expansion package, 9... Jack, 10...
Expansion package, 11... Protrusion, 12...
...Basic package, 13...Through hole.
Claims (1)
た第１のプリント回路基板と、それぞれ前記延出部に対
応して複数のスルーホールが設けられた第２のプリント
回路基板とを備え、前記延出部に対応する前記スルーホ
ールに前記延出部を挿入した後半口デイツプエ法によっ
て前記第１のプリント回路基板と前記第２のプリント回
路基板とを接続固定することを特徴とする半田デイツプ
型プリント回路基板。A first printed circuit board having a plurality of extensions at its ends, each having a metal foil, and a second printed circuit board having a plurality of through holes, each of which has a plurality of through holes corresponding to the extensions. and the first printed circuit board and the second printed circuit board are connected and fixed by a rear-end insertion method in which the extending part is inserted into the through hole corresponding to the extending part. Solder dip type printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10912982U JPS5914375U (en) | 1982-07-19 | 1982-07-19 | Solder dip type printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10912982U JPS5914375U (en) | 1982-07-19 | 1982-07-19 | Solder dip type printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5914375U true JPS5914375U (en) | 1984-01-28 |
Family
ID=30254335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10912982U Pending JPS5914375U (en) | 1982-07-19 | 1982-07-19 | Solder dip type printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5914375U (en) |
-
1982
- 1982-07-19 JP JP10912982U patent/JPS5914375U/en active Pending
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