JPS59140467U - circuit board connection device - Google Patents

circuit board connection device

Info

Publication number
JPS59140467U
JPS59140467U JP3405983U JP3405983U JPS59140467U JP S59140467 U JPS59140467 U JP S59140467U JP 3405983 U JP3405983 U JP 3405983U JP 3405983 U JP3405983 U JP 3405983U JP S59140467 U JPS59140467 U JP S59140467U
Authority
JP
Japan
Prior art keywords
connection device
board connection
circuit board
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3405983U
Other languages
Japanese (ja)
Inventor
進 斉藤
荒井　建伸
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP3405983U priority Critical patent/JPS59140467U/en
Publication of JPS59140467U publication Critical patent/JPS59140467U/en
Pending legal-status Critical Current

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  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ及びｂは従来のハンダ付は接続方法を示す図、
第２図ａ及びｂは本考案の一実施例の構造を示す図であ
る。 １・・・セラミック基板、２・・・積層基板、４・・・
基板１のプリントパターン、５・・・基板２のプリント
パターン、７・・・可撓性を有する印刷配線基板、８．
−、９・・・ハンダ接続部。Figures 1a and b are diagrams showing the conventional soldering connection method;
FIGS. 2a and 2b are diagrams showing the structure of an embodiment of the present invention. 1... Ceramic substrate, 2... Laminated substrate, 4...
Printed pattern on board 1, 5... Printed pattern on board 2, 7... Flexible printed wiring board, 8.
-, 9...Solder connection part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 熱膨張係数又は吸湿膨張係数が互いに異なる印刷配線基
板のそれぞれの電極に対応する数のハンダ付は用電極を
、可撓性を有する印刷配線基板の両側端部に形成したこ
とを特徴とする回路基板接続装置。A circuit characterized in that a number of soldering electrodes corresponding to the respective electrodes of the printed wiring board having different thermal expansion coefficients or hygroscopic expansion coefficients are formed on both ends of a flexible printed wiring board. Board connection device.
JP3405983U 1983-03-11 1983-03-11 circuit board connection device Pending JPS59140467U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3405983U JPS59140467U (en) 1983-03-11 1983-03-11 circuit board connection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3405983U JPS59140467U (en) 1983-03-11 1983-03-11 circuit board connection device

Publications (1)

Publication Number Publication Date
JPS59140467U true JPS59140467U (en) 1984-09-19

Family

ID=30164828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3405983U Pending JPS59140467U (en) 1983-03-11 1983-03-11 circuit board connection device

Country Status (1)

Country Link
JP (1) JPS59140467U (en)

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