JPS59136484A - Roughening treatment for metal foil - Google Patents
Roughening treatment for metal foilInfo
- Publication number
- JPS59136484A JPS59136484A JP1178683A JP1178683A JPS59136484A JP S59136484 A JPS59136484 A JP S59136484A JP 1178683 A JP1178683 A JP 1178683A JP 1178683 A JP1178683 A JP 1178683A JP S59136484 A JPS59136484 A JP S59136484A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- roughened
- roughening treatment
- copper foil
- rolling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Landscapes
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Metal Rolling (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は金属箔の表面に均一な粗面を形成する方法に関
するもので、特に印刷配線用の金属箔に適用するに好適
な金属箔の粗面化処理方法に関する発明である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for forming a uniform roughened surface on the surface of metal foil, and in particular to a method for roughening a metal foil suitable for application to metal foil for printed wiring. It is.
一般に印刷配線用の金属箔は電解銅箔が多く用いられる
が、高い抗張力、抗折力等が要求される場合には圧延銅
箔が用いられる。Generally, electrolytic copper foil is often used as the metal foil for printed wiring, but rolled copper foil is used when high tensile strength, transverse rupture strength, etc. are required.
電解銅箔の場合は、その製造時にある程度の粗面が形成
され、基板との接着力があまり要求されない場合にはそ
の粗面側を基板と接着せしめて、用いる場合もあるが、
通常はさらに高度な粗面化を電気化学的に施す場合が多
い。In the case of electrolytic copper foil, a certain degree of roughness is formed during its manufacture, and if strong adhesion to the substrate is not required, the rough side may be used by bonding it to the substrate.
Usually, even more advanced surface roughening is often performed electrochemically.
一方、圧延鋼箔を用いる場合は、そのままでは基板との
接着力が低いので、エツチング又はメッキ等の電気化学
的な粗面化処理を施す場合が一般的である。On the other hand, when using rolled steel foil, its adhesive strength with the substrate is low if it is used as is, so it is generally subjected to electrochemical surface roughening treatment such as etching or plating.
しかし、電解銅箔製造時に生じる粗面及び、エツチング
により生じる粗面ば比較的均一な粗面ではあるが基板と
の接着力が弱い欠点があり、一方電気化学的な粗面化処
理を施せば、基板との接着力は向上するが、粗面の厚さ
が不均一となり易く時には部分的に突起を発生し、印刷
配線板となったときに接着力のばらつき、エツチング残
等の重大な欠陥を発生させる欠点がある。However, although the rough surface that occurs during the production of electrolytic copper foil and the rough surface that occurs due to etching are relatively uniform, they have the disadvantage of weak adhesion to the substrate. , the adhesive strength with the substrate is improved, but the thickness of the rough surface tends to be uneven, and sometimes protrusions occur locally, resulting in serious defects such as uneven adhesive strength and etching residue when printed wiring boards are formed. It has the disadvantage of causing
本発明者等は従来の粗面化処理の欠点をｔズ梗すべく種
々検利しｆコ結果、本発明を完成し１こものである。即
ち、本発明は
連速の方法で粗面化された金属箔を、その粗面の形状が
完全には消滅しない程度に圧延加工を施すか、若しくは
連速の方法で粗面化されｔコ金属箔をその粗面の形状が
完全には消滅しない程度に圧延加工を施し、さらに電気
化学的な粗面化処理を施こすことを特徴とする金属箔の
粗面化処理方法である。The inventors of the present invention have conducted various investigations to eliminate the drawbacks of conventional surface roughening treatments, and as a result, have completed the present invention. That is, the present invention involves rolling a metal foil roughened by a continuous speed method to such an extent that the shape of the rough surface does not completely disappear, or rolling a metal foil that has been roughened by a continuous speed method. A method for roughening a metal foil, which is characterized by rolling the metal foil to such an extent that the shape of the rough surface does not completely disappear, and further performing an electrochemical surface roughening treatment.
本発明に於て、連速の方法で粗面化されｔコ金属箔とは
、電解銅箔の場合にあっては、その製造時に生じる析出
側の粗面そのものであっても本発明の適用が可能である
が、より強い接着力を必要とする場合には、予め電気化
学的な粗面化処理を施すことが好ましい。In the present invention, a metal foil whose surface is roughened by a continuous speed method refers to, in the case of an electrolytic copper foil, even the rough surface itself on the deposition side that occurs during its manufacture. However, if stronger adhesive force is required, it is preferable to perform electrochemical surface roughening treatment in advance.
また圧延銅箔の場合には、エツチングにより粗面を形成
してもよいが、より強い接着力を必要とする場合には、
予め電解メッキにより２〜３μｍのメッキ層を形成した
後、１〜ｌＯμＩＩ＋の大きさの突起状析出物を均二に
析出させる粗面化を施すことが好ましい。In the case of rolled copper foil, a rough surface may be formed by etching, but if stronger adhesion is required,
After forming a plating layer of 2 to 3 μm in advance by electrolytic plating, it is preferable to roughen the surface so that protruding precipitates having a size of 1 to 10 μII+ are uniformly deposited.
本発明に於て最も重要な点は、粗面の形状が完全には消
滅しない程度に圧延加工を施す点である。The most important point in the present invention is that rolling is performed to such an extent that the rough surface shape does not completely disappear.
第１図は電解銀箔の断面を拡大、模写したものであるが
、本発明の圧延加工は第１図の粗面側を第２図に示す如
く、粗面の形状が完全には消滅しない程度に圧延加工を
施すものであり、この時のロール間隔、圧力は金属箔の
材質、及びその製造条件等により選択すればよい。Fig. 1 is an enlarged copy of the cross section of the electrolytic silver foil, and the rolling process of the present invention is performed to the extent that the rough surface shape does not completely disappear, as shown in Fig. 2 for the rough side of Fig. 1. The roll spacing and pressure at this time may be selected depending on the material of the metal foil, its manufacturing conditions, etc.
この圧延加工により、こぶ状の粗面が、きのこ状に変形
され、基板との接着力がより強固となる。This rolling process transforms the bump-like rough surface into a mushroom shape, and the adhesive force with the substrate becomes stronger.
しかしながら、粗面の形状によっては目的とするきのこ
状には変形されない場合があり、この場合には予め電気
化学的な粗面化処理が必要である。However, depending on the shape of the rough surface, it may not be transformed into the desired mushroom shape, and in this case, electrochemical surface roughening treatment is required in advance.
即ち、第３図に示す如く、こぶ状突起の部分に、１〜１
０μｎ・程度の突起状析出物を析出させる電気化学的な
粗面化処理を施し、次いで圧延加工を行うと第４図に示
す如ききのこ状の粗面を形成することができる。That is, as shown in FIG. 3, 1 to 1
By performing an electrochemical surface roughening treatment to deposit protruding precipitates of about 0 μm, and then rolling, a mushroom-like rough surface as shown in FIG. 4 can be formed.
本発明の圧延加工によって、基板との接着力がより強固
となると同時に、粗面の異常な突起等は押圧され大きな
ものは脱落する等して全体が均一となり、印刷配線板と
なった場合のエツチング残がなくなる。By the rolling process of the present invention, the adhesive force with the substrate becomes stronger, and at the same time, abnormal protrusions on the rough surface are pressed down, large ones fall off, etc., and the whole becomes uniform, and when it becomes a printed wiring board, No etching residue left.
なお、圧延ロールは平滑ロールを用いる場合の他、エン
ボスロール、グラビアメツシュロール等を用いることに
より、表面の形状を任意に選定することが可能である。In addition to the case where a smooth roll is used as the rolling roll, the shape of the surface can be arbitrarily selected by using an embossing roll, a gravure mesh roll, or the like.
本発明に於て、圧延加工を施した後さらに電気化学的粗
面化処理を行うとより強固な基板との接着力が得られる
が、これは第５図に示すように圧延加工によって得られ
るきのこ状突起にさらに１〜１０訓の突起状析出物を形
成し、基板との接着面積を増すと同時に投びょう効果を
増大させるｔコめである。しかし、圧延加工の後に行う
電気化学的な粗面化処理は圧延加工の前に行う粗面化処
理より、その析出物が小さなものであることが好ましく
、特に、異常な突起を生ずることのないようにするべき
である。In the present invention, stronger adhesion to the substrate can be obtained by further performing electrochemical surface roughening treatment after rolling, but this can be achieved by rolling as shown in Figure 5. 1 to 10 protrusive precipitates are further formed on the mushroom-shaped protrusions to increase the adhesion area with the substrate and at the same time to increase the bolting effect. However, it is preferable that the electrochemical surface roughening treatment performed after rolling has smaller precipitates than the surface roughening treatment performed before rolling. It should be done as follows.
次に本発明の粗面化処理方法の代表的な実施例を比較例
と供にｔ（明する。Next, typical examples of the surface roughening treatment method of the present invention will be explained along with comparative examples.
通常の方法で得られた厚さ３５μ・・・、幅１ｍの電解
銅箔を用い
（５）前記電解銅箔の幅方向５ ｃｓｎ毎に電子マイク
ロメータで厚さを測定し、最大値と最小値の差を最大値
で除し、厚さの均一性を求め１こ。Using an electrolytic copper foil with a thickness of 35 μm and a width of 1 m obtained by a conventional method, (5) Measure the thickness with an electronic micrometer every 5 csn in the width direction of the electrolytic copper foil, and measure the maximum and minimum thicknesses. Divide the difference in values by the maximum value to find the uniformity of the thickness.
次いで、粗面側を接着剤によりフェノール基板に接着し
ｔコ後、その接着力を測定した。Next, the rough side was adhered to a phenol substrate with an adhesive, and after a while, the adhesive force was measured.
（１３） 前記電解銅箔を保持ロールと押圧ロール（
ロール直径２０−、ロール幅１．３ｍ）の間に線圧ｌ〜
ｌＱ ｋｑ／６ｎｆかけながら通過させ、得られｔコ銅
箔を前記（５）と同じ方法で厚さの均一性と接着力を測
定し１こ。(13) The electrolytic copper foil is placed between a holding roll and a pressing roll (
Linear pressure l~ between roll diameter 20m and roll width 1.3m)
The uniformity of thickness and adhesive strength of the resulting copper foil were measured in the same manner as in (5) above.
（Ｃ） 前記電解銅箔を次の条件で電気化学的な粗面
化処理を行った。(C) The electrolytic copper foil was subjected to electrochemical roughening treatment under the following conditions.
ＣｕＳＯ４，５Ｈ２０１２０１／（１
１−１２８０４、８０９／（Ｉ
ＨＮＯ３３０ｆ／β
電流密度 ２０Ａ／ｄ５？処理時間
６０秒
陽極 銅板
得られｔコ銅箔を前記（５）と同じ方法で厚さの均一性
と接着力の測定を行ツｔコ。CuSO4,5H201201/(1 1-12804,809/(I HNO330f/β Current density 20A/d5? Processing time
Anode for 60 seconds The copper foil obtained from the copper plate was measured for thickness uniformity and adhesive strength in the same manner as in (5) above.
（■））前記（Ｃ）で得られた銅箔を、前記（Ｂ）と同
じ条件でロール間を通過させ、得られた銅箔を前記（Ｎ
と同じ方法で厚さの均一性と接着力を測定した。(■)) The copper foil obtained in the above (C) is passed between the rolls under the same conditions as in the above (B), and the obtained copper foil is passed through the above (N
Thickness uniformity and adhesion strength were measured using the same method.
（Ｅ） 前記中）により得られた銅箔を次の条件でさ
らに電気化学的な粗面化処理を行った。(E) The copper foil obtained in (a) above was further subjected to electrochemical roughening treatment under the following conditions.
ＣＬＩ ８０４−５１−１２０ １２０ ｙ／
１１Ｈ２ＳＯ４８０ｆ／／１１
ＨＮＯａ ３０ ｙ／（１電流密度
２０ Ａ／ｄｍ２処理時間
３０秒
陽極 銅板
得られた銅箔を前記（５）と同じ方法で厚さの均一性と
接着力を測定しｔコ。CLI 804-51-120 120 y/
11H2SO480f//11 HNOa 30 y/(1 current density 20 A/dm2 processing time
30 seconds anode copper plate The resulting copper foil was measured for thickness uniformity and adhesive strength using the same method as in (5) above.
以上、Ａ−Ｅの各測定値を第１表に示す。The above measured values of A-E are shown in Table 1.
第 １ 表
第１表より明らかなように本発明の方法により得られる
銅箔は厚さの均一性が良好で、また従来品に比べ接着力
が向上していることが認められる。Table 1 As is clear from Table 1, the copper foil obtained by the method of the present invention has good thickness uniformity, and it is recognized that the adhesive strength is improved compared to conventional products.
なお、厚さが均一となったことから印刷配線板とした場
合のエツチング残もなくなり、さらには圧延加工を施し
たことにより、その加工硬化により抗張力、抗折力とも
に向上する副次的な効果も認められる。In addition, since the thickness is now uniform, there is no etching residue when used as a printed wiring board, and furthermore, the rolling process has the secondary effect of improving both tensile strength and transverse rupture strength due to work hardening. is also accepted.
第１図は電解銅箔の断面を拡大、模写したもの。
第２図は電解銅箔の粗面が消滅しない程度に圧延加工を
施したものの断面を拡大模写したもの。第３図は電解銅
箔に電気化学的粗面化処理を施したものの拡大、模写し
たもの、第４図は第３図のものに圧延加工を施したもの
の拡大、模写したもの、第５図は第２図のものに更に電
気化学的粗面化処理を施したものの拡大、模写図である
。
特許出願人
福田金属箔粉工業株式会社Figure 1 is an enlarged copy of the cross section of electrolytic copper foil. Figure 2 is an enlarged copy of the cross section of electrolytic copper foil that has been rolled to the extent that the rough surface does not disappear. Figure 3 is an enlarged copy of electrolytic copper foil subjected to electrochemical roughening treatment, Figure 4 is an enlarged copy of the one in Figure 3 subjected to rolling processing, and Figure 5 2 is an enlarged copy of the one shown in FIG. 2 further subjected to electrochemical roughening treatment. Patent applicant: Fukuda Metal Foil and Powder Industry Co., Ltd.
Claims (1)
が完全には消滅しない程度に圧延加工を施すか、若しく
は、連速の方法で粗面化された金属箔をその粗面の形状
が完全には消滅しない程度に圧延加工を施し、さらに電
気化学的な粗面化処理を施すことを特徴とする金属箔の
粗面化処理方法。I Roll the metal foil that has been roughened using a suitable method to the extent that the rough surface shape does not completely disappear, or roll the metal foil that has been roughened using a continuous speed method. 1. A method for roughening a metal foil, which comprises rolling to an extent that the shape of the rough surface does not completely disappear, and further performing electrochemical roughening treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1178683A JPS59136484A (en) | 1983-01-26 | 1983-01-26 | Roughening treatment for metal foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1178683A JPS59136484A (en) | 1983-01-26 | 1983-01-26 | Roughening treatment for metal foil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59136484A true JPS59136484A (en) | 1984-08-06 |
| JPS6242022B2 JPS6242022B2 (en) | 1987-09-05 |
Family
ID=11787612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1178683A Granted JPS59136484A (en) | 1983-01-26 | 1983-01-26 | Roughening treatment for metal foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59136484A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5897761A (en) * | 1996-01-16 | 1999-04-27 | Mitsui Mining & Smleting Co., Ltd. | Electrodeposited copper foil for printed wiring board and method for manufacturing the same |
| JP2001234325A (en) * | 2000-02-28 | 2001-08-31 | Nikko Materials Co Ltd | High strength electrolytic copper foil for particle getter, thin film deposition system having the copper foil disposed inside, and method for manufacturing the electrolytic copper foil |
| JP2008086999A (en) * | 2006-09-29 | 2008-04-17 | Hitachi Cable Ltd | Rolled copper foil, its manufacturing method, and flexible printed board using the rolled copper foil |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58116717A (en) * | 1981-12-29 | 1983-07-12 | エルナ−株式会社 | Method of producing aluminum electrode foil |
-
1983
- 1983-01-26 JP JP1178683A patent/JPS59136484A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58116717A (en) * | 1981-12-29 | 1983-07-12 | エルナ−株式会社 | Method of producing aluminum electrode foil |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5897761A (en) * | 1996-01-16 | 1999-04-27 | Mitsui Mining & Smleting Co., Ltd. | Electrodeposited copper foil for printed wiring board and method for manufacturing the same |
| JP2001234325A (en) * | 2000-02-28 | 2001-08-31 | Nikko Materials Co Ltd | High strength electrolytic copper foil for particle getter, thin film deposition system having the copper foil disposed inside, and method for manufacturing the electrolytic copper foil |
| JP2008086999A (en) * | 2006-09-29 | 2008-04-17 | Hitachi Cable Ltd | Rolled copper foil, its manufacturing method, and flexible printed board using the rolled copper foil |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6242022B2 (en) | 1987-09-05 |
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