JPS59129636A - Controller of stage with freedom of six - Google Patents
Controller of stage with freedom of sixInfo
- Publication number
- JPS59129636A JPS59129636A JP113383A JP113383A JPS59129636A JP S59129636 A JPS59129636 A JP S59129636A JP 113383 A JP113383 A JP 113383A JP 113383 A JP113383 A JP 113383A JP S59129636 A JPS59129636 A JP S59129636A
- Authority
- JP
- Japan
- Prior art keywords
- stage
- wafer
- feeding
- sets
- feeding mechanisms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/18—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for positioning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/44—Movable or adjustable work or tool supports using particular mechanisms
- B23Q1/50—Movable or adjustable work or tool supports using particular mechanisms with rotating pairs only, the rotating pairs being the first two elements of the mechanism
- B23Q1/54—Movable or adjustable work or tool supports using particular mechanisms with rotating pairs only, the rotating pairs being the first two elements of the mechanism two rotating pairs only
- B23Q1/545—Movable or adjustable work or tool supports using particular mechanisms with rotating pairs only, the rotating pairs being the first two elements of the mechanism two rotating pairs only comprising spherical surfaces
- B23Q1/5462—Movable or adjustable work or tool supports using particular mechanisms with rotating pairs only, the rotating pairs being the first two elements of the mechanism two rotating pairs only comprising spherical surfaces with one supplementary sliding pair
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Details Of Measuring And Other Instruments (AREA)
- Jigs For Machine Tools (AREA)
- Machine Tool Units (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、精密な位置制御および姿勢制御を行なうステ
ージの制御装置に関するもので、立体的に設定した３軸
方向の平行移動と、該３軸回ジの回動との６自由度ン有
する制御装置に関するものである。この発明は、特、に
投洋式つェハ蕗元装置のウェハ搭載位置ぎめ機構として
好適であるが、その他に広く精密加工、精密測定等に適
用し得る。Detailed Description of the Invention [Field of Application of the Invention] The present invention relates to a stage control device that performs precise position control and posture control, and includes parallel movement in three-dimensionally set three-axis directions, and The present invention relates to a control device having six degrees of freedom in relation to the rotation of a rotor. The present invention is particularly suitable as a wafer mounting positioning mechanism for a pitcher-type wafer processing apparatus, but can also be widely applied to precision processing, precision measurement, etc.
上に述べた６自由度を有する制御装置は、ウェハ表面に
マ゛°スク・ぞターンを焼付ける投影式露光装置にも用
いられる。同装置の操作手順においては、まず、マスク
パターンを投影光学系によってウェハ表面に投影結像さ
せる必要がある。投影光学系に要求される高解像度のマ
スクパターン乞結像する範囲は投影光学系の焦点面近傍
の範囲で、焦点面から離れるに従い急速に結像状態は劣
化する。The above-mentioned control device having six degrees of freedom is also used in a projection exposure device that prints a mask pattern on a wafer surface. In the operating procedure of the apparatus, first, it is necessary to project and image a mask pattern onto the wafer surface using a projection optical system. The range in which a high-resolution mask pattern is imaged, which is required of a projection optical system, is a range near the focal plane of the projection optical system, and the imaging condition deteriorates rapidly as the distance from the focal plane increases.
実用上、ウェハ表面の投影光学系の焦点面からのずれ量
の許容値は±６μｍであり、安定した解像度乞得るには
、ウェハ表面乞投影光学系の焦点面に高精度に位置決め
することが要求される。上記の位置ぎめ（°焦点合わせ
）の後、マスクパターンとウェハ表面に形成されている
パターンとを、ウェハを移動して高精度（±０．２５μ
ｍ）に１ね合せることが要求される。したがって、ウェ
ハ搭載装置には総計して６自由度となる位置制御機能が
必要である。In practice, the allowable amount of deviation of the wafer surface from the focal plane of the projection optical system is ±6 μm, and in order to obtain stable resolution, it is necessary to position the wafer surface with high precision at the focal plane of the projection optical system. required. After the above positioning (°focusing), the mask pattern and the pattern formed on the wafer surface are moved to a high precision (±0.25μ).
m) is required. Therefore, the wafer mounting device requires a position control function that provides a total of six degrees of freedom.
上記の６自由度の制御は、通常の場合、水平な直交２軸
Ｘ、Ｙと、垂直軸Ｚとを設定し、これら３軸方向の平行
動と３軸回りの回動とについて行なわれ、これによって
３次元空間内における剛体の位置と姿勢とが確定される
。しかし、上記の３軸は水平、垂直な直交３軸に限定さ
れるものではなく、斜交する３軸を設定して６自由度制
御を行なうことも可能である。The above six degrees of freedom control is usually performed by setting two horizontal orthogonal axes X, Y and a vertical axis Z, and performing parallel movements in these three axes directions and rotations around the three axes. As a result, the position and orientation of the rigid body in the three-dimensional space are determined. However, the above three axes are not limited to the horizontal, vertical, orthogonal three axes, and it is also possible to set three oblique axes to perform six degrees of freedom control.
第１図に、従来の１：１反射投影式露光装置の概要的な
正面図を示す。FIG. 1 shows a schematic front view of a conventional 1:1 reflection projection exposure apparatus.
石定盤１は高精度に仕上げられていて、スレッド２は石
定盤１上を左右に高精度（±０．０８μｍ）の直線運動
を行う。スレッド２上にはウエノ１搭載装置３およびマ
スク搭載装置５が設けられ、それぞれウェハ４およびマ
スク６を搭載できるようになっている。石定盤１上には
、さらに、反射投影光学系７およびアライメントスコー
プ８が固定され、反射投影光学系７下部には高さ基準板
９が固定されている。石定盤１下方に低置している照明
光学系（図省略）により円弧スリット状に照明されるマ
スク６のマスクツやターンは、反射投影光学系７によっ
てウェハ４表面に投影結像され、スレッド２欠左右に走
行させることで、ウェハ４表面全面にマスクツヤ°ター
ン？走査露光できるようになっている。アライメントス
コープ８はウェハ４上の合せマークとマスクパターン内
の合せマークの重ね合せ状態を検出できる機能がある。The stone surface plate 1 is finished with high precision, and the thread 2 performs linear movement left and right on the stone surface plate 1 with high precision (±0.08 μm). A wafer 1 mounting device 3 and a mask mounting device 5 are provided on the sled 2, and are capable of mounting a wafer 4 and a mask 6, respectively. Further, a reflection projection optical system 7 and an alignment scope 8 are fixed on the stone surface plate 1, and a height reference plate 9 is fixed below the reflection projection optical system 7. The masks and turns of the mask 6, which are illuminated in an arcuate slit shape by an illumination optical system (not shown) placed below the stone surface plate 1, are projected and imaged onto the surface of the wafer 4 by the reflection projection optical system 7, and the threads are projected onto the surface of the wafer 4. By running the wafer from side to side, the entire surface of the wafer 4 can be covered with a glossy turn. Scanning exposure is possible. The alignment scope 8 has a function of detecting the overlapping state of the alignment mark on the wafer 4 and the alignment mark in the mask pattern.
上に述べたウェハ搭載装置３の拡大断面図を第２図に示
−ｊｏ ウェハ搭載装置のペース１１は前述のスレッド
２に固定されていて、このウェハ搭載装置ペース１１の
上に鋼球１６ヲ介してＸＹステージ１２が置かれている
。上記のＸＹステージ１２はペース１］の上面に沿った
水平面内で自由に動くことができ、２自由度を有してい
る。そしてこのＸＹステージ１２は送゛り機構（図示省
略）に、ｌ：り±３ｍｍの範囲でその位置をスレッド走
行方向（Ｙ方向）と、水平面内でこれと直交する方向（
Ｘ方向）に制御 ・されるようになっている。このＸ
Ｙステージ１２には玉軸受１７Ｙ介してθステージ１３
が回転可能に設けられ、さらにこのθステージＢに上下
軸１４が設けられている。この上下軸１４は、ナツト１
９．送りネジ１８．及ｉ、ｔ”ルスモータ加により上下
に駆動される構造で、２ステージとして作用する部材で
ある。この２ステージである上下軸１４はθステージ１
３に対して回動じないように係止され、上下摺動自在に
支承されている。An enlarged cross-sectional view of the wafer mounting device 3 described above is shown in FIG. An XY stage 12 is placed therebetween. The XY stage 12 described above can freely move within a horizontal plane along the upper surface of the pace 1 and has two degrees of freedom. Then, this XY stage 12 is attached to a feeding mechanism (not shown) so that its position is adjusted within a range of ±3 mm in the sled running direction (Y direction) and in the direction perpendicular to this in the horizontal plane (
It is designed to be controlled in the X direction). This X
The θ stage 13 is connected to the Y stage 12 via a ball bearing 17Y.
is rotatably provided, and this θ stage B is further provided with a vertical shaft 14. This vertical shaft 14 is connected to the nut 1
9. Feed screw 18. It has a structure that is driven up and down by the application of the θ stage 1 and
3 so as not to rotate, and is supported so as to be slidable up and down.
この上下軸１４の上部には、ウニ／１搭載台１５が置−
かれ、上下軸１４上端の円錐状のくぼみと、ウェハ搭載
台１５の下部球面座とをがん合させ、ウェハ搭載台１５
の傾斜が自由に行なえるようになっている。At the top of this vertical shaft 14, a sea urchin/1 mounting stand 15 is placed.
Then, the conical recess at the upper end of the vertical shaft 14 and the lower spherical seat of the wafer mounting table 15 are pressed together, and the wafer mounting table 15 is fixed.
The slope can be freely adjusted.
このように従来のウェハ搭載装置は、スレッド上に固定
されたウェハ搭載装置ペース１】上に、ＸＹステージ１
２を設け、このＸＹステージ１２によってθステー・ゾ
１３が支持され、θステージ１３によって上下軸１４お
よびウェハ搭載台１５ならひにウエノＡ４が支持された
三重構造となっていた。In this way, the conventional wafer mounting device has an XY stage 1 mounted on the wafer mounting device PACE 1 fixed on the thread
The XY stage 12 supported the θ stay 13, and the θ stage 13 supported the vertical shaft 14 and the wafer mounting table 15, which supported the Ueno A4.
つづいて、この従来のウエノ１搭載装置の動作について
説明する。まず、第２図の状態において、ウェハ４ケウ
工ハ搭載台λ５に吸着孔２２乞用いて真空吸着する。つ
づいて上下軸１４ケ上昇させ、高さ基準板９のパッド１
０にウェハ４表面を押し当てるＯスルト、ウェハ搭載台
１５はパッド１０からの反力テ傾斜を修正されて水平姿
勢になる。上記のノン゛ソド１０はウェハ４の中心を重
心とする正三角形の頂点に配置され、反射投影式光学系
７の焦点面に対して規定高さく０．５ｍｍ）だけ正確に
高Ｘ、）位置に設けられているので、ウニ／１４表面は
反射投影光学系７の焦点面よりも上記の規定高さだけ高
（・位置に高さと傾きが位置決めされる。この状態で真
空室２１ヲ真空としてウエノ１搭載台１５ケ上下軸１４
に吸着固定し、さらに上下軸１４ヲウエノＸ４およヒウ
エノ１搭載台１５とともに上記の規定高さだけ下降させ
、ウェハ表面を反射投影光学系７の焦点深度内に平行移
動させていた。Next, the operation of this conventional Ueno 1 loading device will be explained. First, in the state shown in FIG. 2, a 4-wafer wafer is vacuum-suctioned to the wafer mounting table λ5 using the suction holes 22. Next, raise the 14 vertical axes and pad 1 of the height reference plate 9.
When the surface of the wafer 4 is pressed against the surface of the wafer 4, the wafer mounting table 15 has its inclination corrected by the reaction force from the pad 10 and assumes a horizontal position. The above-mentioned non-plane 10 is placed at the apex of an equilateral triangle whose center of gravity is the center of the wafer 4, and is precisely positioned at a height of 0.5 mm) relative to the focal plane of the catoptric optical system 7. Since the surface of the sea urchin 14 is higher than the focal plane of the reflection projection optical system 7 by the above-mentioned specified height, the height and inclination are set at the position. In this state, the vacuum chamber 21 is set as a vacuum. Ueno 1 mounting table 15 vertical axes 14
The wafer surface was moved in parallel to the depth of focus of the reflection projection optical system 7 by suctioning and fixing the wafer to the vertical axis 14 and lowering it together with the wafer X4 and the wafer 1 mounting table 15 by the above specified height.
上述の操作の後、ＸＹステージ１２を移動させたりθス
テージ１３を回動させたすして、ウエノ１４上に設けた
合わせマークとマスクツ２ターンの合わせマークと乞一
致させる。この状態で、スレ゛ソド２娑一旦往き側に移
動させ、その後復路を一定速度で戻る間にウェハ４の表
面全体にマスクツぞターン乞露光させ、マスクパターン
をウェハ４表面上に焼付けていた。このため以下に示す
欠点が有った。After the above-described operation, the XY stage 12 is moved and the θ stage 13 is rotated to ensure that the alignment mark provided on the wafer 14 and the alignment mark of the mask 2 turns are aligned. In this state, the thread 2 was once moved to the forward side, and then the mask pattern was printed on the surface of the wafer 4 by exposing the entire surface of the wafer 4 one after another while returning at a constant speed. For this reason, there were the following drawbacks.
１、 ウェハ４の表面ヲノセツド１０に押し当てて反射
投影光学系７の焦点面に対して平行度ケ出した後、上下
軸１４（ｚステージ）、θステージ１３およびＸＹステ
ージ１２の３ケ所において移動もしくは回転が行なわれ
るため、この３ケ所のステージの機械的な狂いによる上
下動ならびに傾きが重畳してウェハ４表面の、反射投影
光学系７の焦点面に対する平行度および高さの位置決め
精度を損ねやすい。1. After pressing the surface of the wafer 4 against the set 10 to achieve parallelism with the focal plane of the reflection projection optical system 7, move it at three locations: the vertical axis 14 (z stage), the θ stage 13, and the XY stage 12. Otherwise, since the stage is rotated, the vertical movement and inclination due to mechanical errors in these three stages are superimposed, impairing the positioning accuracy of the parallelism and height of the wafer 4 surface with respect to the focal plane of the catoptric projection optical system 7. Cheap.
２、ウェハ搭載装置ベース１１上に、ＸＹステージ１２
、θステージ１３および２ステージ１４を設け、その上
にウェハ搭載台１５ヲ置いているため、ウェハ搭載装置
ベース１】からウェハ搭載台１５に対する総合的な位置
決め剛性が低く、ウェハ搭載台１５の位置安定性が悪い
。2. On the wafer mounting equipment base 11, the XY stage 12
, the θ stage 13 and the second stage 14 are provided, and the wafer mounting stage 15 is placed on top of them, so the overall positioning rigidity from the wafer mounting device base 1 to the wafer mounting stage 15 is low, and the position of the wafer mounting stage 15 is low. Poor stability.
３、ＸＹステージ１２はθステージ１３、上下軸１４、
及びこれらの駆動手段ビ搭載しているので、このＸＹス
テージ１２の全体重量が大きい。従ってＸＹステージ１
２の全体重量が大きい。従ってＸＹステージの送り機構
はこれ、らの全体重量を担持したＸＹステージ１２を駆
動制御しなければならす、微動送りの制御性７低下させ
ている。3. The XY stage 12 has a θ stage 13, a vertical axis 14,
Since the XY stage 12 is equipped with these driving means, the overall weight of the XY stage 12 is large. Therefore, XY stage 1
2 has a large overall weight. Therefore, the XY stage feeding mechanism must drive and control the XY stage 12 that carries the entire weight of the XY stage 12, which reduces the controllability of fine movement feeding.
本発明の目的は、ステージの６自由度をそれぞれ高精度
で制御することができ、位置ぎめ剛性が高く、しかも制
御性のよいステージ制御装置を提供するにある。An object of the present invention is to provide a stage control device that can control each of the six degrees of freedom of the stage with high precision, has high positioning rigidity, and has good controllability.
本発明においては、前述した従来装置の不具合及びその
原因解析に基づき、ステージを駆動制御する６組の送り
装置を設け、これら６組の送り装置がそれぞれ互いに干
渉することなく、直接的にステージを制御し得る構成を
創作したものである。In the present invention, based on the above-mentioned problems with the conventional device and analysis of their causes, six sets of feeding devices are provided to drive and control the stage, and these six sets of feeding devices directly drive the stage without interfering with each other. This is a creation of a configuration that can be controlled.
本発明は上記の原理に基づいて前記の目的を達成するた
め、Ｘ方向に設けた１組の送り機構と、 ゛Ｙ方
向に設けた２組の送り機構と、Ｚ方向に設けた３組の送
り機構とを有し、かつ、上記６組の送ジ機構のそれぞれ
とステージとの間に、轟該送り機構の送り方向の力のみ
を伝達して送り方向以外の動きを許容する伝動部材を介
装し、前記６組の送り機構がそれぞれ独立してステージ
奢直接的に駆動し得るように構成したことを特徴とする
。In order to achieve the above object based on the above principle, the present invention has three sets of feeding mechanisms: one set of feeding mechanisms provided in the X direction, two sets of feeding mechanisms provided in the Y direction, and three sets of feeding mechanisms provided in the Z direction. and a transmission member that transmits only the force of the feeding mechanism in the feeding direction and allows movement in directions other than the feeding direction, between each of the six sets of feeding mechanisms and the stage. The stage is interposed so that each of the six sets of feeding mechanisms can independently drive the stage directly.
次に、本発明の一実施例の概要を第３図及び第４図につ
いて説明する。Next, an outline of an embodiment of the present invention will be explained with reference to FIGS. 3 and 4.
第３図は本発明のステージ制御装置の垂直断面図、第４
図は同平面図である。FIG. 3 is a vertical sectional view of the stage control device of the present invention, and FIG.
The figure is a plan view of the same.
本実施例は、ウェハ４を吸着保持したステージ４２につ
いて水平な直交２軸Ｘ、Ｙおよび垂直軸２方向の位置制
御、並びに上記３軸回りの回動姿勢制御を行なうように
構成したものであるが、本発明を実施する場合、直交３
軸に限らず任意方向の３軸に関する制御を行なうように
構成することもできる。In this embodiment, the stage 42 holding the wafer 4 by suction is configured to perform positional control in two horizontal orthogonal axes X and Y and two vertical axes, as well as rotational posture control around the three axes. However, when implementing the present invention, the orthogonal 3
It is also possible to control not only one axis but also three axes in arbitrary directions.
４］ハウエバ搭載装置のベースである。このベース４】
に１組のＸ方向送り機構を構成するための１個のパルス
モータ４６．２組のＹ方向送ジ機構を構成するための２
個のパルスモータ６０（第４図）、及び３組の２方向送
り機構を構成するための３個のパルスモータ５２（第３
図）ｙ！′固定する。これらのパルスモータ４６ 、６
０ 、５２の軸に、それぞれ送９ネジ４５．５９ 、５
１ヲ置着する。上記の送すネ−）４５゜５９ 、５１に
それぞれ螺合するナツト部材４４ 、５８ 、５０を、
ウェハ搭載装置ベース４１ Ｋ対する回動を係止して軸
方向摺動自在に嵌合する。4] This is the base of the Haueva-mounted device. This base 4]
1 pulse motor 46 for configuring one set of X-direction feed mechanisms; 2 pulse motors 46 for configuring two sets of Y-direction feed mechanisms
three pulse motors 60 (Fig. 4), and three pulse motors 52 (a third
Figure) y! 'Fix. These pulse motors 46, 6
0 and 52 shafts, feed screws 45.59 and 5, respectively
Place 1. Nut members 44, 58, 50 which are screwed into the above-mentioned feed nuts 45° 59, 51, respectively,
The wafer mounting device base 41 K is locked against rotation and is fitted to be slidable in the axial direction.
本実施例は以上のようにしてＸ方向に設けた１組の送り
機構と、Ｙ方向に設けた２組の送り機構と、２方向に設
けた３組の送り機構とを構成しである。As described above, this embodiment includes one set of feeding mechanisms provided in the X direction, two sets of feeding mechanisms provided in the Y direction, and three sets of feeding mechanisms provided in two directions.
ステージ４２の上面に真空吸着用の空洞部５５を設けて
ウェハ搭載機能を持たせる。このステージ４２の自重は
、第５図について後述する浮遊パッド４９及び鋼球４８
ヲ介して３個のナツト部材（資）で支承する。５３は上
記の自重を付勢しているバネである。A cavity 55 for vacuum suction is provided on the upper surface of the stage 42 to provide a wafer mounting function. The weight of this stage 42 is due to the weight of the floating pad 49 and steel balls 48, which will be described later with reference to FIG.
It is supported by three nut members (materials) through it. 53 is a spring that biases the above-mentioned own weight.
上記のステージ４２Ｙ、Ｘ方向に設けたバネ４７に、Ｊ
：＃）、第５図について後に詳述する浮遊ｉ９ツド４３
を介してナツト部材４４に押しつけて、Ｘ方向の位置ぎ
めがなされる。同様に、Ｙ方向に設けたバネ６１により
後述の浮遊・ぐラド５７を介してナツト部材５８に押し
つけてＹ方向の位置ぎめがなされる。On the stage 42Y, the spring 47 provided in the X direction is
:#), Floating i9td 43, which will be detailed later with reference to FIG.
It is pressed against the nut member 44 via , and positioned in the X direction. Similarly, a spring 61 provided in the Y direction presses against the nut member 58 via a floating pad 57, which will be described later, to position the nut member 58 in the Y direction.
反射投影式光学系７の底面に９個の静電容量型近接セン
サ５４を固定してウェハ４の表面位置を検出し、該ウェ
ハ４の上面と上記光学系７の焦点面との偏差を高精度（
±０．２μｍ）で非接触的に検出できるように構成する
。第４図においてウェハ４の面上に示した９個のＸ印５
６は上記センサ５４の検出点を表わしている。Nine capacitive proximity sensors 54 are fixed to the bottom surface of the reflective projection optical system 7 to detect the surface position of the wafer 4 and increase the deviation between the top surface of the wafer 4 and the focal plane of the optical system 7. accuracy(
±0.2 μm) so that it can be detected in a non-contact manner. Nine X marks 5 shown on the surface of the wafer 4 in FIG.
6 represents a detection point of the sensor 54.
前述の浮遊パッド４９ 、４３の詳細を第５図について
説明する。このＷ［面にはＹ方向の送り装置に設けた浮
遊パッド５７が現われていないが、本図に示したＸ方向
の送り装置の浮遊パッド４３と同様の構成部材である。Details of the aforementioned floating pads 49 and 43 will be explained with reference to FIG. Although the floating pad 57 provided in the Y-direction feeding device does not appear on this W[ surface, it is a component similar to the floating pad 43 of the X-direction feeding device shown in this figure.
この浮遊・やラド４３は、その左端の球面をナツト４４
の球面座に保持され、右端の平面をステージ４２の側面
に当接せしめて送り機構の送ジ量をステージ４２に伝達
している。さらに、浮動ノソツド４３の両端の球面と平
面は空気軸受となっているので、ステージ４２の上下動
、前後進、Ｘ、Ｙ。This floating Yarad 43 has its leftmost spherical surface as a nut 44.
The right end flat surface is brought into contact with the side surface of the stage 42 to transmit the feed amount of the feed mechanism to the stage 42. Furthermore, since the spherical and flat surfaces at both ends of the floating node 43 serve as air bearings, the stage 42 can move vertically, forward and backward, and in X and Y directions.
ｚ＃１回りの傾きの抵抗とならない。したがって、浮動
）七ツド４３は、他の送り機構によるステージの移動の
抵抗とはならない自由度を有すると同時に、対応するＸ
軸方向の送り量を伝達プ゛ることかできる。There is no resistance to the slope around z#1. Therefore, the floating seven-stage 43 has a degree of freedom that does not resist the movement of the stage by other feeding mechanisms, and at the same time has a corresponding
It is possible to transmit the feed amount in the axial direction.
Ｚ方向送り機構のナツト部材５０の上面は反射投影光学
系７の焦点面に対し精密に平行となるように作られてい
る。このナツト部材５０の上面に当接する浮遊パッド４
９の下面は空気軸受となっていて、該浮遊パッド４９は
ナット５０上面上をほとんど抵抗なく水平運動できる上
に、鋼球４８の径は十分に小さく、鋼球４８とステージ
４２あるいは浮遊パッド４９０円すい面との摩擦力はほ
とんど無視できる。したがって、鋼球４８と浮遊パッド
４９は、２方向の送り量をステージ４２に伝達すると同
時に、他の送り機構によるステージ４２の水平面内の動
きおよび傾斜の抵抗とならない。６２は浮遊・七ツド４
３ 、４９に空気乞供給するチューブである。The upper surface of the nut member 50 of the Z direction feeding mechanism is made to be precisely parallel to the focal plane of the reflection projection optical system 7. Floating pad 4 that comes into contact with the upper surface of this nut member 50
The lower surface of the floating pad 49 is an air bearing, and the floating pad 49 can move horizontally on the upper surface of the nut 50 with almost no resistance. The frictional force with the conical surface can be almost ignored. Therefore, the steel ball 48 and the floating pad 49 transmit the feed amount in two directions to the stage 42, and at the same time do not resist the movement and tilting of the stage 42 in the horizontal plane by other feeding mechanisms. 62 is floating/nanatsudo 4
This is a tube that supplies air to 3 and 49.
本実施例は以上のようにして、６組の送り機構のナツト
部材のそれぞれと、ステージ４２との間に、各送り機構
の送り方向の力のみを伝達し、送り方向以外の１ＩｉＩ
Ｉき乞許容する伝動部拐を介装して、前記６組の送り機
構がそれぞれ独立してステージ４２を駆動し得るように
構成しである。In this embodiment, as described above, only the force in the feeding direction of each feeding mechanism is transmitted between each of the nut members of the six feeding mechanisms and the stage 42, and
The six sets of feed mechanisms are configured to be able to drive the stage 42 independently, by interposing a transmission section that allows the transmission.
次に、上述のように構成したステージ制御装置の使用方
法について説明する。本実施例は自動制御装置（図示せ
ず）を設けてセンサや作動機器を電気的に自動操作して
次のように作動せしめる。Next, a method of using the stage control device configured as described above will be explained. In this embodiment, an automatic control device (not shown) is provided to electrically and automatically operate the sensors and actuating devices as follows.
まず、ウェハ４はステージ４２上面に真空吸着される。First, the wafer 4 is vacuum-adsorbed onto the upper surface of the stage 42.
つついて、静電容量型近接センサー５４によジウエハ４
表面に非接触で該表面の、反射投影光学系７の焦点面か
らのずれ量が、格子状に配された９点の検出点５６につ
いて検出される。その後、この９点のずれ量から、ウエ
ノ１４の表面の近似平面と、反射投影光学系７０伴点面
との間のずれと傾キを求める。つづいて、３個の７ヤル
スモーク５２を回転させてナツト部材５０ヲ適宜上下さ
ぞ、ステージ４２馨上下動および傾斜させて前記のずれ
と傾きを補正する。このとき、浮動・七゛ソド４３，５
’Ｎま前述のように、その両端の、球面および平面を空
気軸受面としているので、ステージ４２の上下動および
傾きの抵抗とならず、また、鋼球４８も径が十分小さい
ため、ステージ４２の傾きの抵抗とはならない。The capacitive proximity sensor 54 detects the wafer 4.
The amount of deviation of the surface from the focal plane of the reflection projection optical system 7 is detected at nine detection points 56 arranged in a grid without contacting the surface. Thereafter, the deviation and inclination between the approximate plane of the surface of the Ueno 14 and the node plane of the catoptric projection optical system 70 are determined from the deviation amounts of these nine points. Subsequently, the three 7-bar smokes 52 are rotated to move the nut member 50 up and down as appropriate, and to move the stage 42 up and down and tilt it to correct the above-mentioned deviation and inclination. At this time, floating 7゛ Sodo 43,5
As mentioned above, since the spherical and flat surfaces at both ends serve as air bearing surfaces, there is no resistance to the vertical movement and tilting of the stage 42, and since the steel ball 48 has a sufficiently small diameter, the stage 42 It is not the resistance of the slope.
その後、再度センサー５４によりウェハ４表面の、焦点
面からのずれ量が検出され、ウェハ４表面の近似平面が
十分高精度に該焦点面に一致していることを確認する動
作が行なわれる。ここで、もしウェハ４表面の近似平面
が該焦点面に一致していない場合、再度ステージ４２の
高さおよび傾きの補正ならびにずれ量検出が繰返される
。以上のように、ウェハ４は、その近似平面が反射投影
式光学系７の焦点面に一致するように、高さ及び傾きを
位置ぎめされる。即ち、Ｚ軸方向の平行移動の位置と、
Ｘ、Ｙ軸回りの回動姿勢との３自由度が位置ぎめされる
。このとき、３個の鋼球４８の中心点によって決められ
る平面はウェハ４表面の傾きを補正する補正平面となる
。Thereafter, the sensor 54 again detects the amount of deviation of the surface of the wafer 4 from the focal plane, and an operation is performed to confirm that the approximate plane of the surface of the wafer 4 coincides with the focal plane with sufficiently high accuracy. Here, if the approximate plane of the surface of the wafer 4 does not match the focal plane, the correction of the height and inclination of the stage 42 and the detection of the amount of deviation are repeated again. As described above, the height and inclination of the wafer 4 are positioned so that its approximate plane coincides with the focal plane of the catoptric optical system 7. That is, the position of parallel movement in the Z-axis direction,
Three degrees of freedom including rotational posture around the X and Y axes are positioned. At this time, the plane determined by the center points of the three steel balls 48 becomes a correction plane for correcting the inclination of the surface of the wafer 4.
つづいて、ウェハ４上に設けた合せマークとマスクツ９
ターン内の合せマークラ、ハルスモータ４６゜６０によ
りナツト部材４４ 、５８ ’Ｙ適宜送って一致させる
動作が行なわれる。このとき、浮動パッド４９はその下
面乞空気軸受面としているのでステージ４２移動の抵抗
とはならず、浮遊ノ９ツド４３ 、５７も両端の球面お
まひ平面ケ空気軸受面としているためステージ４２の移
動１回転の抵抗とはならない。また、ステージ４２を支
えている鋼球４８ば、浮遊パッド４９あるいはステージ
４２０円錐面と揺動、或いは回転することなく、固定の
状態でステージ４２と共に浮遊・ゼット４９に支持され
て、反射投影光学系７の焦点面と精密に平行なナット部
材５０上面を移動する。Next, the alignment mark provided on the wafer 4 and the mask 9
The alignment mark cra in the turn and the Hals motor 46.degree. 60 move the nut members 44, 58'Y appropriately to bring them into alignment. At this time, the floating pad 49 does not act as a resistance to the movement of the stage 42 because its lower surface is an air bearing surface, and the floating pads 43 and 57 are also spherical and flat at both ends, so the stage 42 It does not provide resistance for one rotation of movement. In addition, the steel ball 48 supporting the stage 42 does not swing or rotate with the floating pad 49 or the conical surface of the stage 420, but is supported by the floating jet 49 together with the stage 42 in a fixed state, and the reflected projection optical The upper surface of the nut member 50 is moved precisely parallel to the focal plane of the system 7.
この場合、１！ｉ密に負えばナツト部材５０の上面と焦
点面との平行度の狂いによって上下方向の狂いを生じる
が、本実施例のようにナツト部材刃の上面ケ高精度で焦
点面と平行に仕上げてふ−くと、サブミクロンオーダー
の位置ぎめについても上記の上下方向の狂いは無視する
ことができる程度に微小である。In this case, 1! If the nut member 50 is loaded tightly, the top surface of the nut member 50 and the focal plane will be out of parallel with each other, resulting in vertical deviation, but as in this embodiment, the top surface of the nut member blade is finished with high precision to be parallel to the focal plane. As a matter of fact, even for positioning on the order of submicrons, the above-mentioned deviation in the vertical direction is so small that it can be ignored.
このようにして、１組の送り機構を構成しているパルス
モータ４６によるステージ４２のＸ方向の位置ぎめと、
２組の送り機構乞構成しギいる２個のノ４ルスモータ６
０の同期回転によるステージ４２のＹ方向位置ぎめとが
行なわれる。そして、この操作と併行して上記２個のパ
ルスモータ６０の差動によジステージ乾の２軸回りの回
動が行なわれる。In this way, the stage 42 is positioned in the X direction by the pulse motor 46 that constitutes one set of feeding mechanisms, and
Two sets of four-wheel motors 6 constitute two sets of feed mechanisms.
The stage 42 is positioned in the Y direction by synchronous rotation of zero. In parallel with this operation, the stage roller is rotated about two axes by differential operation of the two pulse motors 60.
以上説明゛したように、６組の送！ｌ１機構がそれぞれ
独立に、かつ直接的にステージ４２ヲ押動して６自由度
の制御を行なうので位置ぎめ剛性が高い。As explained above, 6 sets of shipping! Since the l1 mechanisms independently and directly push the stage 42 to control six degrees of freedom, positioning rigidity is high.
！＊、スｙ−シ４２は送ジ機構を担持していないので軽
量であり、従って制御性を妨げない。! *Since the slider 42 does not carry a feeding mechanism, it is lightweight and therefore does not hinder controllability.
その上、本実施例はウェハ表面に対して非接触的に位置
検出を行１でうので、ウェハ表面を傷っけたり汚損した
りする虞れが無い。Moreover, since this embodiment performs position detection on the wafer surface in a non-contact manner in step 1, there is no risk of damaging or staining the wafer surface.
第５図の実施例１において、水平方向の位置決めに鋼球
４８と浮遊パッド４９から成る伝達機構を用い、垂直方
向に浮遊パッド４３から成る伝達機構を用いでも前述の
効果と全く同じ効果が得られる。In the first embodiment shown in FIG. 5, the same effect as described above can be obtained by using a transmission mechanism consisting of a steel ball 48 and a floating pad 49 for positioning in the horizontal direction, and using a transmission mechanism consisting of a floating pad 43 in the vertical direction. It will be done.
第６図は上記と異なる実施例を示す垂直断面図で、ステ
ージ４２に固定された軸６３をガイドとして、 ゛
ボールブツシュ６４は該軸方向に転勤可能となっている
。さらに、ボールブツシュ６４には外周を球面としたフ
ォロアー６５が組合され、ナツト部材刃らの送り量を伝
達すると共に、上下動２前後進。FIG. 6 is a vertical sectional view showing a different embodiment from the above, in which a ball bush 64 is movable in the direction of the shaft 63 fixed to the stage 42 as a guide. Furthermore, a follower 65 having a spherical outer periphery is combined with the ball bush 64, and transmits the amount of feed from the nut member blades, as well as vertically moving back and forth two times.
回動、傾斜（２方向）の５つのステージ４２の動きの抵
抗とならない自由度を有する伝達機構夕構成している。The transmission mechanism is configured to have a degree of freedom that does not create resistance to the movement of the five stages 42, including rotation and tilting (in two directions).
マタ、ボールブツシュ６４とフォロアー６５の組合せを
用いる代りに、軸方向の直接運動と軸の回りの回転運動
が可能な軸受構成のフォロアー７用いても同一の効果が
得られる。Instead of using the combination of the ball bush 64 and the follower 65, the same effect can be obtained by using the follower 7 having a bearing structure that allows direct movement in the axial direction and rotational movement around the axis.
またｉｅラッド７および環状のボール列６８ならひに傾
斜パッド６９は、前記実施例における空気軸受付きの浮
遊パッド４９を環状のビール列手段６８で置き換えたも
ので、上記の空気軸受付浮遊・ぐラドと同様の自由度を
有する伝達機構を構成するのは明白であり、前例と同様
の作用、効果がある。In addition, the ie rad 7 and the annular ball row 68 and the tilted pad 69 are obtained by replacing the floating pad 49 with an air bearing in the above embodiment with an annular beer row means 68. It is obvious that it constitutes a transmission mechanism having the same degree of freedom as the RAD, and has the same functions and effects as the previous example.
第７図は更に異なる実施例を示す。本実施例はステージ
４２に同定した軸７２の中央部に球面座７２ａを形成し
てフォロアー７３を傾動２回動自在に支承して、上側に
おけるボールブツシュ６４と同様に上下方向の相対運動
をフリーにしである。本例においても７オロアー７３の
外周を球面に形成する。FIG. 7 shows a further different embodiment. In this embodiment, a spherical seat 72a is formed in the center of the shaft 72 identified on the stage 42, and the follower 73 is supported so as to be tiltable and rotatable twice, thereby freeing relative movement in the vertical direction like the ball bush 64 on the upper side. It is. Also in this example, the outer periphery of the 7-orer 73 is formed into a spherical surface.
また、本実施例は２方向の送り機構として柱状ピエゾ素
子７５ヲ用い、両端の金具７４を介してステージ４２と
調整ネジ７６との間に介装しである。このように構成°
しても、柱状ピエゾ素子７５ば、２方向以外の動きを許
容し、かつ、その印字電圧に比例した伸縮をして２方向
の送り機能を果たすので、前記の実施例と同様に作用す
る。Further, in this embodiment, a columnar piezo element 75 is used as a two-direction feeding mechanism, and is interposed between the stage 42 and the adjustment screw 76 via metal fittings 74 at both ends. Configure like this °
However, since the columnar piezo element 75 allows movement in directions other than two directions, expands and contracts in proportion to the printing voltage, and performs the two-direction feeding function, it functions in the same manner as in the previous embodiment.
以上詳述した如く、本発明のステージ制御装置は、Ｘ方
向に設けた１組の送り機構と、Ｙ方向に設けた２組の送
り機構と、２方向に設けた３組の送９機構と乞有し、か
つ、上記６組の送り機構のそれぞれとステージとの間に
、轟該送り機構の送り方向の力のみを伝達して送り方向
以外の動きを許容する徂動部材を介装し、前記６絹の送
り機構がそれぞれ独立してステージを直接的に駆動し得
るように構成することにより、ステージの６自由度をそ
れぞれ高精度で制御することができ、位置ぎめの剛性が
高く、しかも制御性が良いという優れた実用的効果を奏
する。As detailed above, the stage control device of the present invention includes one set of feed mechanisms provided in the X direction, two sets of feed mechanisms provided in the Y direction, and three sets of feed mechanisms provided in the two directions. A moving member is interposed between each of the six sets of feeding mechanisms and the stage to transmit only the force of the feeding mechanism in the feeding direction and to allow movement in directions other than the feeding direction. By configuring each of the six silk feeding mechanisms to be able to directly drive the stage independently, each of the six degrees of freedom of the stage can be controlled with high precision, and the rigidity of positioning is high. Moreover, it has an excellent practical effect of good controllability.
第１図は反射投影式ウェハ露光装置の概要的な正面図、
第２図は従来のウェハ搭載装置の垂直断面図、第３図乃
至第５図は本発明のステージ制御装置の一実格例乞示し
、第３図は垂直断面図、第４図は平面図、第５図は部分
拡大断面図である。
第６図及び第７図はそれぞれ上記と異なる実施例の部分
拡大断面図である。
４・・・ウェハ、７・・・反射投影式光学系、４］・・
・ウェハ搭載装置ベース、４２・・・ステージ、４３・
・・浮遊ノＪ’ツド、４４・・・ナツト部材、４５・・
・送ジネジ、４６・・・パルスモータ−１４７・・・バ
ネ、４８・・・鋼球、４９・・・浮遊パッド、５０・・
・ナツト部材、５１・・・送ジネジ、５２・・・パルス
モータ、５３・・・バネ、５４・・・静電容量型近接セ
ンサー、５５・・・空洞部、５６・・・検出点、５７・
・・浮遊パッド、５８・・・ナツト部材、５９・・・送
りネジ、６０・・・パルスモータ、６１・・・バネ、６
２・・・チューブ、６３・・・軸、６４・・・ポールブ
ツシコ、６５・・・フォロアー、６６・・・ナツト、６
７・・・パッド、６８・・・ビール列手段、６９・・・
傾ｇ＋パッド、７０・・・鋼球、７］・・・ナツト、７
２・・・軸、７３・・・フォロアー、７４・・・金具、
７５・・・柱状ピエゾ累子、７６・・・調整ネジ。
代理人弁理士 秋 本 正 実
第３図
第４図
怜５図
第６図
第７図Figure 1 is a schematic front view of a reflection projection type wafer exposure apparatus.
FIG. 2 is a vertical sectional view of a conventional wafer mounting device, FIGS. 3 to 5 show an actual example of the stage control device of the present invention, FIG. 3 is a vertical sectional view, and FIG. 4 is a plan view. , FIG. 5 is a partially enlarged sectional view. FIGS. 6 and 7 are partially enlarged cross-sectional views of embodiments different from those described above. 4...Wafer, 7...Reflection projection optical system, 4]...
・Wafer mounting equipment base, 42...stage, 43・
・・Floating J'd, 44・・Nut member, 45・・
・Feed screw, 46...Pulse motor-147...Spring, 48...Steel ball, 49...Floating pad, 50...
- Nut member, 51... Feed screw, 52... Pulse motor, 53... Spring, 54... Capacitive proximity sensor, 55... Cavity, 56... Detection point, 57・
...Floating pad, 58...Nut member, 59...Feed screw, 60...Pulse motor, 61...Spring, 6
2...Tube, 63...Shaft, 64...Pole pusher, 65...Follower, 66...Nut, 6
7... Pad, 68... Beer row means, 69...
Tilt g + pad, 70...Steel ball, 7]...Nut, 7
2...Axis, 73...Follower, 74...Metal fittings,
75... Column piezo resistor, 76... Adjustment screw. Representative Patent Attorney Tadashi Akimoto Figure 3, Figure 4, Rei, Figure 5, Figure 6, Figure 7
Claims (1)
の送り機構と、２方向に設けた３組の送り機構と乞有し
、かつ、上記６組の送り機構のそれぞれとステージとの
間に、各送り機構の送ジ方向の力のみを伝達して送り方
向以外の動きを許容する伝動部相乞介装し、前記６組の
送り機構がそれぞれ独立してステージを直接的に駆動し
得るように構成したこと乞特徴とする、６自由度を有す
るステージの制御装置。One set of feed mechanisms provided in the X direction, two sets of feed mechanisms provided in the Y direction, and three sets of feed mechanisms provided in two directions, and each of the six sets of feed mechanisms described above. A transmission unit is interposed between the stage and the feed mechanism that transmits only the force in the feed direction and allows movement in directions other than the feed direction, and each of the six sets of feed mechanisms independently directly connects the stage. A control device for a stage having six degrees of freedom, characterized in that it is configured so as to be able to be driven automatically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP113383A JPS59129636A (en) | 1983-01-10 | 1983-01-10 | Controller of stage with freedom of six |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP113383A JPS59129636A (en) | 1983-01-10 | 1983-01-10 | Controller of stage with freedom of six |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63320646A Division JPH029550A (en) | 1988-12-21 | 1988-12-21 | Driving device for six-degree-freedom fine moving stage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59129636A true JPS59129636A (en) | 1984-07-26 |
| JPH0134746B2 JPH0134746B2 (en) | 1989-07-20 |
Family
ID=11492940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP113383A Granted JPS59129636A (en) | 1983-01-10 | 1983-01-10 | Controller of stage with freedom of six |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59129636A (en) |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6299038A (en) * | 1985-10-25 | 1987-05-08 | Hitachi Ltd | Stage for positioning |
| JPS62288311A (en) * | 1986-06-05 | 1987-12-15 | Isuzu Motors Ltd | Pent roof type direct injection type internal combustion engine |
| JPS6335991U (en) * | 1986-08-25 | 1988-03-08 | ||
| JPS63193089A (en) * | 1987-02-06 | 1988-08-10 | 株式会社日立製作所 | Freedom-degree fine adjustment device |
| FR2614225A1 (en) * | 1987-04-27 | 1988-10-28 | Framatome Sa | DEVICE FOR ADJUSTING THE WORKING POSITION OF A MACHINE FOR MACHINING A CHAMFER AND USE OF THIS DEVICE. |
| JPS63166977U (en) * | 1987-04-18 | 1988-10-31 | ||
| JPS6471640A (en) * | 1987-09-14 | 1989-03-16 | Matsushita Electric Ind Co Ltd | One-stage six-degree of freedom accurate positioning table |
| JPH01250891A (en) * | 1988-03-31 | 1989-10-05 | Toshiba Corp | Plane positioning device |
| JPH02139146A (en) * | 1988-11-15 | 1990-05-29 | Matsushita Electric Ind Co Ltd | Positioning table of one step six degrees of freedom |
| WO1991006396A2 (en) * | 1989-10-24 | 1991-05-16 | Lk Limited | Determination of spacial relationships |
| JPH03224006A (en) * | 1990-01-30 | 1991-10-03 | Matsushita Electric Ind Co Ltd | Numerical controller |
| JPH03110399U (en) * | 1990-02-28 | 1991-11-12 | ||
| JPH05506959A (en) * | 1990-10-22 | 1993-10-07 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | Dual mode Z stage |
| JPH09317767A (en) * | 1996-05-28 | 1997-12-09 | Nippon Seiko Kk | Positioning device |
| JP2000271825A (en) * | 1999-03-25 | 2000-10-03 | Hirata Corp | Article carrying and assembling device and method therefor |
| JP2003062733A (en) * | 2001-08-27 | 2003-03-05 | Sumitomo Heavy Ind Ltd | Stage apparatus |
| JP2006210659A (en) * | 2005-01-28 | 2006-08-10 | Psc Kk | Gas control rotary moving device and a gas control actuator |
| JP2006309654A (en) * | 2005-05-02 | 2006-11-09 | Psc Kk | Gas-controlled rotating and moving apparatus and gas-controlled actuator |
| JP2006334728A (en) * | 2005-06-02 | 2006-12-14 | Yaskawa Electric Corp | Substrate sucking device, substrate supporting body and substrate carrier device |
| JP2007054953A (en) * | 2006-11-21 | 2007-03-08 | Nsk Ltd | Positioning device |
| EP0908719B1 (en) * | 1997-10-07 | 2007-05-30 | Hitachi Construction Machinery Co., Ltd. | Stage unit used for sample positioning and scanning probe microscope with such a stage unit |
| CN108127452A (en) * | 2017-12-04 | 2018-06-08 | 广东开放大学（广东理工职业学院） | A kind of fixture for inclined-plane part processing |
| JP2018115904A (en) * | 2017-01-17 | 2018-07-26 | 株式会社エヌエステイー | Resolver characteristic measurement method, and measurement device |
| JPWO2019049233A1 (en) * | 2017-09-06 | 2020-08-20 | ホリゾン・インターナショナル株式会社 | Cutting machine |
| JP2020126126A (en) * | 2019-02-04 | 2020-08-20 | キヤノン株式会社 | Stage device and minute manipulation equipment |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0466895A (en) * | 1990-07-06 | 1992-03-03 | Sumitomo Heavy Ind Ltd | Fine adjustment stage with six degrees of freedom |
| JP2005028202A (en) * | 2003-07-07 | 2005-02-03 | Hitachi Industries Co Ltd | Table parallelism adjusting device and dispenser using the same |
-
1983
- 1983-01-10 JP JP113383A patent/JPS59129636A/en active Granted
Cited By (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0526618B2 (en) * | 1985-10-25 | 1993-04-16 | Hitachi Ltd | |
| JPS6299038A (en) * | 1985-10-25 | 1987-05-08 | Hitachi Ltd | Stage for positioning |
| JPS62288311A (en) * | 1986-06-05 | 1987-12-15 | Isuzu Motors Ltd | Pent roof type direct injection type internal combustion engine |
| JPS6335991U (en) * | 1986-08-25 | 1988-03-08 | ||
| JPS63193089A (en) * | 1987-02-06 | 1988-08-10 | 株式会社日立製作所 | Freedom-degree fine adjustment device |
| JPS63166977U (en) * | 1987-04-18 | 1988-10-31 | ||
| EP0289389A1 (en) * | 1987-04-27 | 1988-11-02 | Framatome | Position-adjusting apparatus for a chamfering device, and use of this apparatus |
| US4824301A (en) * | 1987-04-27 | 1989-04-25 | Framatome | Device for adjusting the working position of a machine for producing a chamfer |
| FR2614225A1 (en) * | 1987-04-27 | 1988-10-28 | Framatome Sa | DEVICE FOR ADJUSTING THE WORKING POSITION OF A MACHINE FOR MACHINING A CHAMFER AND USE OF THIS DEVICE. |
| JPS6471640A (en) * | 1987-09-14 | 1989-03-16 | Matsushita Electric Ind Co Ltd | One-stage six-degree of freedom accurate positioning table |
| JPH01250891A (en) * | 1988-03-31 | 1989-10-05 | Toshiba Corp | Plane positioning device |
| JPH02139146A (en) * | 1988-11-15 | 1990-05-29 | Matsushita Electric Ind Co Ltd | Positioning table of one step six degrees of freedom |
| WO1991006396A2 (en) * | 1989-10-24 | 1991-05-16 | Lk Limited | Determination of spacial relationships |
| WO1991006396A3 (en) * | 1989-10-24 | 1991-07-25 | Lk Ltd | Determination of spacial relationships |
| JPH03224006A (en) * | 1990-01-30 | 1991-10-03 | Matsushita Electric Ind Co Ltd | Numerical controller |
| JPH03110399U (en) * | 1990-02-28 | 1991-11-12 | ||
| JPH05506959A (en) * | 1990-10-22 | 1993-10-07 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | Dual mode Z stage |
| JPH09317767A (en) * | 1996-05-28 | 1997-12-09 | Nippon Seiko Kk | Positioning device |
| EP0908719B1 (en) * | 1997-10-07 | 2007-05-30 | Hitachi Construction Machinery Co., Ltd. | Stage unit used for sample positioning and scanning probe microscope with such a stage unit |
| JP2000271825A (en) * | 1999-03-25 | 2000-10-03 | Hirata Corp | Article carrying and assembling device and method therefor |
| JP2003062733A (en) * | 2001-08-27 | 2003-03-05 | Sumitomo Heavy Ind Ltd | Stage apparatus |
| JP2006210659A (en) * | 2005-01-28 | 2006-08-10 | Psc Kk | Gas control rotary moving device and a gas control actuator |
| JP2006309654A (en) * | 2005-05-02 | 2006-11-09 | Psc Kk | Gas-controlled rotating and moving apparatus and gas-controlled actuator |
| JP2006334728A (en) * | 2005-06-02 | 2006-12-14 | Yaskawa Electric Corp | Substrate sucking device, substrate supporting body and substrate carrier device |
| JP4574453B2 (en) * | 2005-06-02 | 2010-11-04 | 株式会社安川電機 | Substrate adsorption device, substrate support and substrate transfer device |
| JP2007054953A (en) * | 2006-11-21 | 2007-03-08 | Nsk Ltd | Positioning device |
| JP2018115904A (en) * | 2017-01-17 | 2018-07-26 | 株式会社エヌエステイー | Resolver characteristic measurement method, and measurement device |
| JPWO2019049233A1 (en) * | 2017-09-06 | 2020-08-20 | ホリゾン・インターナショナル株式会社 | Cutting machine |
| CN108127452A (en) * | 2017-12-04 | 2018-06-08 | 广东开放大学（广东理工职业学院） | A kind of fixture for inclined-plane part processing |
| CN108127452B (en) * | 2017-12-04 | 2023-12-12 | 广东开放大学（广东理工职业学院） | Clamp for machining inclined surface part |
| JP2020126126A (en) * | 2019-02-04 | 2020-08-20 | キヤノン株式会社 | Stage device and minute manipulation equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0134746B2 (en) | 1989-07-20 |
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