JPS59129261A - Electrically conductive synthetic resin molding - Google Patents
Electrically conductive synthetic resin moldingInfo
- Publication number
- JPS59129261A JPS59129261A JP324483A JP324483A JPS59129261A JP S59129261 A JPS59129261 A JP S59129261A JP 324483 A JP324483 A JP 324483A JP 324483 A JP324483 A JP 324483A JP S59129261 A JPS59129261 A JP S59129261A
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- conductive
- electrically conductive
- molecular
- resin molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
本苑明【よ電磁シールドを口約とりる／９電利金成樹脂
成形品に関づる。[Detailed Description of the Invention] This invention relates to electromagnetic shielding/9 electricity molded plastic products.
従来の電磁シールｊ〜を「１的どした電−１’ 菰ｉｉ
”ｉの合成樹脂性の枠体には次のものが知られている、
７第１に枠体の母４Ａを） ｌｉ’ｉ成りるプラスチッ
クスの表面に金１ｊｌＲ製のｊ１９膜を被覆したもの、
９′）２にプラスチックスのパルツク内に導電性を右り
る累（Ａ、例えば金属、カー小ン繊庁１１等を充ｊ眞し
Ｉこ１つのが知られている。どころか上述の第１のしの
【３１グノス１ツクス表面に金属被膜を形成するために
必然的に二次加工をづる必要があり、量産性か悪く、／
ラス升ツクスの低コス１へ畠吊産月という利点を没７ｉ
１１ Ｌ）でいる。又、表面の金属伝導層被膜は剥１ハ
１１の恐れもある。一方、第２のものは電磁シールド効
果を高める必２２性から電気伝導麿を、：ｈめる］１的
の／＝め、金属やカーボン繊維の導電性物′？′ｆの充
ｊ眞１１を多くＪ−ると、１：ｉ１祠物質であるプラス
チックスの有するΦＹ ’、ｎ”、 ’ｌ’、ｌ、高成
形性、ｉ！′！ｌｎ械的強ｅ 性ヲＪｆ）失ｉ−ルトい
う欠点がある。又、導電性フイーラ自体の製造１＋ｌｌ
ｉ焔が高く吊Ｉｑ性にも問題がある。Conventional electromagnetic shield
``I's known synthetic resin frames include the following:
7 First, frame mother 4A) The surface of the plastic made of li'i is coated with a j19 film made of gold 1jlR,
9') 2) It is known that a conductive material (A, for example, a metal, carbon fiber, etc.) is added to the inside of the plastic pulp. 1. [31 Gnos] In order to form a metal film on the surface of the 1stx, secondary processing is inevitably required, which makes it difficult to mass produce.
Lose the advantage of Hatatsuri's birth month to the low cost 1 of Lasho Tsukusu 7i
11 L). Furthermore, there is a risk that the metal conductive layer coating on the surface may peel off. On the other hand, the second one uses electrically conductive materials to enhance the electromagnetic shielding effect. When the amount of 'f' is increased, ΦY ', n'', 'l', l, high formability, i!'!ln mechanical strength e of the plastic material is 1:i1. There is a drawback that the conductivity is lost.Also, the production of the conductive filler itself is
There is also a problem with high flame and hanging power.
本発明は、以上の従来の欠点を改良づるために成された
しの−（ｄｊす、合成樹脂成形品の母体物ｖ１で゛ある
プラスチックスに母体プラスチックスの利Ｌ＋ｊ ４ｊ
Ｊ性を劣化さけることのない導電性イｊ賎に五分子物ｖ
′（等を〕、ｒ−ラ又（Ｊ、パウダー状に充填させでて
さ″る導電性合成樹脂成形品を提供リ−ることを目的と
づる３、
即し、本発明はグラスデックススから成る母体’、Ａ
′Ａ’ｉｌ に 、
尋電性付別高分子物質、導電性無機高分子物質、又（，
１低分子電ｉ’ｓｊ移動錯体のうら１又は２以上を充填
々Ａどし−Ｃ含イ１さＵたことを特徴とする導電性合成
樹脂成形品から成る。The present invention has been made to improve the above-mentioned conventional drawbacks.
A pentamolecular substance is used as a conductive material without deteriorating the J property.
The object of the present invention is to provide a conductive synthetic resin molded product that can be filled with powder and released. A matrix consisting of ',A
'A'il also includes polymeric substances with electrical properties, conductive inorganic polymeric substances, and (,
The conductive synthetic resin molded article is characterized in that one or more of the backs of a low molecular weight electron transfer complex are filled with A and C.
本発明で使用されるプラスヂックス母体４Ａ料に光１眞
される導電性物質は、導電性有機高分子物質、導電性Ｑ
ｇ（ｌ幾高分子物質、低分子電荷移１ＦＩＩ（４ｉ体、
のうちの１種又は２種以上が用いられる。ここで、導電
性有機高分子物質には、ポリアセチレン、ポリピロール
、ボリパラフ、ｒニレン、ボリヂ丁二１ノン、ポリバラ
フェニレンビニレン、ポリアセチレン、等の物質に臭素
（Ｂｒ）、＝＋つ崇（１）”７のハロゲン原素、又は５
フツ化砒素（ＡＳＦｓ＞、等の電子受容体をドープして
１−）クイｆの゛ト導１ホシリ電性を示すもの、又はナ
トリウム（Ｎ、ｌｌ ） 、リチウム（Ｌ、ｉ＞等のア
ルｈり金属の電子供！ｊ体をドープしてＮタイプの半導
体導電性を示Ｊものを使用づることかできる。The conductive material used in the present invention, which is exposed to light on the 4A matrix material, is a conductive organic polymer material, a conductive Q
g (l geometric polymer substance, low molecular charge transfer 1 FII (4i body,
One or more of these may be used. Here, conductive organic polymer substances include substances such as polyacetylene, polypyrrole, polyparafine, r-nylene, polyvinylene vinylene, polyacetylene, and bromine (Br), “7 halogen elements, or 5
Those doped with electron acceptors such as arsenic fluoride (ASFs), which exhibit 1- It is also possible to use metals that exhibit N-type semiconductor conductivity by doping them with electrons.
これらの有機高分子物質の電気伝導率は、上述のビーパ
ン１〜濃度を変化ざＵることにより絶縁体伝導率から金
属伝導率まで任意に制御づることが可能である。The electrical conductivity of these organic polymer substances can be arbitrarily controlled from insulator conductivity to metal conductivity by changing the concentration of the above-mentioned bean.
従って、これらの導電性物質を充填されてでさた合成樹
脂成形品は導電性を有し、電磁シールド部品となり１ｑ
る。又、導電性物Ｙ！［にはツタ【１シアニン類似４７
ｉ造のポリマーから成る金属配位高分子、ポリ−４−ビ
ニルピリジン−ヨウ素１１１体の電６１１移動１１冒Δ
Ｃ１−（ＳＮ）Ｘ−型の無機高分子、テトラジノ′ノニ
１−ノジメタン（ＴＣＮＱ’）−テトラチアフルバレン
（ｉ−Ｔ １〜）１１１体から成る低分子電荷移動１１
１休弯を用いることができる。これらの導電性物７′１
の光暎吊を制御り゛れは合成樹脂成形品の導電率を広い
範囲で変えられる。この導電性物質はフイー−ノ状ｄす
るいはパウダー状、任意の形で混合りることが可能であ
る。Therefore, synthetic resin molded products filled with these conductive substances have conductivity and become electromagnetic shielding parts.
Ru. Also, conductive material Y! [Ivy [1 Cyanine Similarity 47]
Electron 611 migration 11 influence Δ of metal coordination polymer consisting of i-structured polymer, poly-4-vinylpyridine-iodine 111 substance
C1-(SN)X-type inorganic polymer, low molecule charge transfer 11 consisting of 111 tetrazino'noni-1-nodimethane (TCNQ')-tetrathiafulvalene (i-T1~) bodies
One rest can be used. These conductive substances 7'1
By controlling the light susceptibility, the conductivity of synthetic resin molded products can be changed over a wide range. This electrically conductive material can be mixed in any desired form, such as fin-like or powder-like.
以下、４（発明を実施例に基づいて更に詳しく説明覆る
。Hereinafter, the invention will be explained in more detail based on 4 (Examples).
第１図は容器型の導電性合成樹脂成形品の一１Ｍ１ｉ１
１Ｉｔ面斜視図である。１０はポリエチレンから成るＡ
＼光１１１Ｊ成形品のノラスヂックスス母体で゛ある。Figure 1 shows a container-shaped conductive synthetic resin molded product.
1It is a perspective view of the plane. 10 is A made of polyethylene
＼It is the parent material of Norasudix for the Hikari 111J molded product.
ポリエチレンでて゛きたプラスチックススＩ′ｉ１体１
０に（、ｊ４、と９電ｔｌｊ物：？’ｉ −１２がフィ
ーラ状に充填されていイ）、１該導電性物Ｖ″（は、ポ
リアセチレンに過塩素酸イオン（Ｃ１０４）をドーピン
グして、その電気１人ン、ワ・ぐを制使ＩＩ ｔ、−’
Ｃいる。Plastic soot I'i made of polyethylene 1 body 1
0 (, j4, and 9 conductive material: ?'i -12 is filled in the form of a filler), 1. The conductive material V'' (is polyacetylene doped with perchlorate ions (C104) , that electric one, wa-guwo-seishi II t,-'
There is C.
第２図【、１、ポリアセチレンに過ｊｎ素酸イΔン（Ｃ
ＩＯ４’）をドープしノζ揚合の電気化学的ドーピング
時間に対する電気伝導度の変化を示しｌ〔グラフである
。このグラフによれは、電気伝尋達・は半導体として１
．５Ｘ１０３Ω−）ｃｍ−’が＋ｒｖられることか分る
。又、第３図は、不純物を１〜−ブした導電性を有する
ポリアセチレンを母体物質のポリエチレンに混合づる混
合割合と、混合し、で（゛きた導電性合成樹脂の電気伝
導度とのｊｙｊ係を示し７．： （ｉ＋のである。ここ
でパラメータはポリアセチレンの電気伝導度である。こ
の様に〕ｒ−ラ状のポリアセチレンの混合割合を制御覆
れば、ぞれを混合した合成樹脂の電気伝導度が容易に制
御し得ることかわかる。グラフから、ン９電・十′を１
０−”２（ン−’ Ｃｌｌｌ−７から１Ω−”ｃｍ”−
’程度まで変化ざけ１ｑることが分る。Figure 2 [, 1. Polyacetylene with peroxide (C
This is a graph showing the change in electrical conductivity with respect to the electrochemical doping time in the case of doping with IO4'). According to this graph, electrical conduction is 1 as a semiconductor.
．． It can be seen that 5X103Ω-)cm-' is +rv. Figure 3 also shows the jyj relationship between the mixing ratio of conductive polyacetylene containing 1 to -5 impurities and the base material polyethylene, and the electrical conductivity of the conductive synthetic resin obtained by mixing. 7.: (i+) Here, the parameter is the electrical conductivity of polyacetylene. In this way, if the mixing ratio of r-ra-shaped polyacetylene is controlled, the electrical conductivity of the synthetic resin mixed with each It can be seen that the conductivity can be easily controlled.
0-"2(n-' Clll-7 to 1Ω-"cm"-
It can be seen that there is a change of 1q to the extent of '.
叉、シ！）電性物？・１を充填した合成樹脂から成る枠
体の外側に（，１保護層１４が設（Ｊられている。イＡ
＋ ＩＩ等層は機械的強度を賄持覆−る任意の合成任１
１１ｔ’ｉ物７４ｉから構成される。叉, shi! )Electric material?・A protective layer 14 is provided on the outside of the frame made of synthetic resin filled with A.
+ II layers are optional composite layers that provide mechanical strength.
11t'i object 74i.
以上の実施例で用いられた心電・１（１物Ｖ″１てあイ
）ポリアセチレンは、特に酸素と反応して酸化し易いど
い′）欠点がある。このために、合成樹脂成形品の１８
ｊ体物υ゛ｒ ｃａｌ、酸素や水分を透過しにくいもの
が望ましい。又、１月体物質は、導電性高分子どは反１
＋ｉ＞ Ｌ／ではイ１らイ「い。ざらにう９電性高分子
の熱劣化４、防止づ−るために射出成形温度が低いもの
が望ましい、具体的には３００℃以下のものが良い。こ
のことを元えれば母体物質は上記のポリエチレンの他に
ポリプロピレン、ポリ塩化ごニリレン等を用いることが
できる。又、保品隻層１／１は母体物′？′（と同一て
あっても、異なる物質であってもがよりない。保護層の
物質は、ポリプロピレン、−フッ素ｉ；°ｉ脂等の）乏
水率が低い樹脂が望ましい。保護層１／１． ＬＪｌ、
プラスチックス母体１０が、外部の空気雰囲気どｊと触
し７ない（〕１に、プラスチックスｆり体１０を両側面
から完１〉に覆うのが望ましい。しかし、保１１μ層１
＜ ｔ；Ｉ必り゛しも必要なものではない。。The electrocardiogram polyacetylene used in the above examples has the disadvantage that it is particularly susceptible to oxidation by reacting with oxygen.For this reason, synthetic resin molded products are 18
It is preferable to use a material that is difficult for oxygen and moisture to pass through. In addition, the January body material is a conductive polymer, etc.
＋i＞L/ is not suitable for 9. Thermal deterioration of electrically conductive polymers 4. In order to prevent thermal deterioration of electrolytic polymers, low injection molding temperatures are desirable, specifically 300℃ or less. Good.Based on this, the base material can be polypropylene, polychlorinated nylylene, etc. in addition to the above-mentioned polyethylene.Also, the warranty layer 1/1 is the same as the base material '?' It doesn't matter if it is made of a different substance.The material of the protective layer is preferably a resin with a low water depletion rate (such as polypropylene, -fluorine fat, etc.).Protective layer 1/1.LJl,
It is desirable that the plastic matrix 10 completely cover the plastic matrix 10 from both sides so that it does not come in contact with the external air atmosphere.
<t;I is not necessarily necessary. .
以−［、要１）るに本発明はプラスチックスからなる母
体（２３′＋１に導電性有機高分子物質、又は導電性ブ
ＨＢ４１．ｊｉ Ｉ！′″！１分子物Ｙ′■、又（Ｊ、
低分子電荷移動錯体のうちの１不・ｌ”ｌ、たは２Ｊス
１を充填）ＩＡとして金石ざけてなる導電性合成樹脂成
形品である１゜
従って、導電性物質の電気伝導度（二Ｊ、不純物の１−
一ビング債を適当に制御覆ることにＪ、り変化さぼるこ
とができる。又その導電性物質の１１体への）■ｚ人割
合を制御リ−ることにＪ、って成形晶白体の４電率を任
意に制御することができる。従って電磁シールド容器ど
して任意の導電キーを右りる青電Ｉ１１合成樹脂成形品
が得られる。又、母体物質かプラスチックスからなり、
それに混合りる導電１（１物″？′（が右１幾高分子物
質等からなるためにｆ７） １本とイ【じみが良く、加
工性が向上する。又、ｌ匂４Ｊ ＋か１１指のｌＩｌ：
！５：ｔ ’ｔｒ屓イ１うことかなく、軽く安１＋Ｉ
ｌｉで、かつ、製ｊ告が容易であるという効果を有して
いる。In summary, the present invention comprises a matrix made of plastics (23'+1) containing a conductive organic polymer substance or a conductive block HB41.ji I!'''!1 molecular substance Y'■, and ( J.
It is a conductive synthetic resin molded product made of gold powder as IA filled with low molecular weight charge transfer complexes such as 1"l"l or 2J. Therefore, the electrical conductivity of the conductive material (2) J, impurity 1-
J, you can skip the changes to properly control the Bing bonds. Furthermore, by controlling the proportion of the conductive substance to the 11 bodies, the 4-electricity of the formed crystalline body can be arbitrarily controlled. Therefore, it is possible to obtain a Seiden I11 synthetic resin molded product that can be used as an electromagnetic shield container to hold any conductive key. It also consists of a matrix material or plastics,
The conductive material mixed with it (1 substance"?' (right 1) is f7 because it consists of a polymeric substance, etc.) 1 and I [bleeds well and improves workability. Also, l odor 4J + or 11 Finger lIl:
! 5: It's easy to get 1 + I without any trouble.
It has the advantage of being easy to manufacture and to make a report.
第１図は本発明の一実施例に係る導電性合成樹脂成形品
の４？Ｉｒ成を示した一部断面斜視図である。
０′！２図は１ｉ″Ｉｊ実Ｍｑ例に８５いで使用しｌ（
−導電１１１物Ｙ′＋のドーピング時間に対づる電気伝
導度の変化９ｈ竹を示したグラフである。第３図は同実
施例にａ３い（使用した導電性物質ボリア（２ヂレンの
ポリ−１−ルン１４１体に夕・ｊづる混入割合を変化さ
けて電気伝導度の変化りる（、１２子を調べたグラフで
ある。
１・・・導電性合成樹脂成形品
１０・・・ダンスブーツクス／（＋ （ホ′１２・・・
導電１り物質
１／Ｉ・・・１尿Ａ層
待１狛出願人 口木電装株式会社
代］Ｉ１１人 ；ｉｆ ｖｌ、！ −、Ｊ−、入用７
１同 弁理士 ｊ添合 修
同 弁理士 丸山明夫FIG. 1 shows a conductive synthetic resin molded product according to an embodiment of the present invention. FIG. 3 is a partially cross-sectional perspective view showing an Ir structure. 0'! Figure 2 is used at 85 for the 1i''Ij real Mq example.
- is a graph showing the change in electrical conductivity of 9h bamboo with respect to the doping time of the conductive material Y'+. Figure 3 shows the change in electrical conductivity of the conductive material Boria (2Dylene poly-1-141) in the same Example by changing the proportion of mixture (141, 12D). This is a graph obtained by examining 1... Conductive synthetic resin molded product 10... Dance boots/(+ (Ho'12...
Conductive 1 substance 1/I...1 Urine A layer Wait 1 Koma Applicant Kuchiki Denso Co., Ltd.] I11 people; if vl,! -, J-, necessary 7
1 Patent Attorney J Soai Shudo Patent Attorney Akio Maruyama
Claims (3)
ｉ＋に、ｉ７孕主１イ１石（；丈１１°７１分子物質、
導電性無機高分子物質、又（Ｊ低分子電荷移動ｆｆｉ体
のうち１又は２以上を充填４Ａとして含有させｌここと
を特徴とする導電（Ｊ１合成ｉｉ１’ｌ脂成形品、。(1) One body consisting of Zonos Books (,'I)l'
i+, i7 fertile husband 1 i 1 stone (; length 11° 71 molecular substance,
A conductive (J1 synthetic ii1'l resin molded product) characterized by containing one or more of a conductive inorganic polymer substance, or (J low molecular charge transfer ffi body) as a filling 4A.
ン、ボリビ［ｊ−ル、ポリバラフェニレン、ポツプ−［
ニレン、ポリバラフェニレンビニ［ノン、ポリシアレヂ
レンのうち１種に、不純物をｉ〜−ブしく： （ｉ／
Ｂ ４ｉル物’、ｌ′ｆｆ Ｃ＋％ ルコト’ｔｉ ’
Ｉ、ｒ徴と１− ルミルミ性合成（ｂ・１脂成形品。(2) The above-mentioned cyanoelectronic polymeric substance includes polyalrothylene, polyvinylene, polyparaphenylene, poppy
Add impurities to one of Nilene, Polybara Phenylene Vinyl [Non, Polysia Redylene]: (i/
B 4ilthing', l'ff C+% Rukoto'ti'
I, r sign and 1-luminescent synthesis (b・1 resin molded product.
ニ）−ノジメクン（丁ＣＮＱ）−デトラチアフルバＩノ
ン（”ｌ−’ｌ−１）ｔｊｊ体て゛あることを特徴とす
る特許晶求の範囲第１偵記載の導電性合成樹脂成形品。 （’ｌ ） ｊ’ｌ’ｊ ｊｊｌ！ブ°ラスヂックスＩ
」体）ｒ３ ａｌｌは、ポリ゛Ｙ−チレン、ポリプロピ
ｌノン、ポリ塩化ビニリｊ゛ンのう’５１種であること
を特徴とする特許品求の範囲第１項記載の導電性合成樹
脂成形品、。(3) The scope of the patent application characterized in that the low-molecular charge transfer 11i isomer is a de1~lacyanoni)-nodimecune (CNQ)-detrathiafulvanone ("l-'l-1)tjj" Conductive synthetic resin molded product described in the first investigation.
Conductive synthetic resin molding according to item 1 of the scope of the patent, characterized in that r3 all is one of poly(Y-ethylene), polypropylene, and polyvinylene chloride. Goods.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP324483A JPS59129261A (en) | 1983-01-12 | 1983-01-12 | Electrically conductive synthetic resin molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP324483A JPS59129261A (en) | 1983-01-12 | 1983-01-12 | Electrically conductive synthetic resin molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59129261A true JPS59129261A (en) | 1984-07-25 |
Family
ID=11552040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP324483A Pending JPS59129261A (en) | 1983-01-12 | 1983-01-12 | Electrically conductive synthetic resin molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59129261A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013058744A1 (en) * | 2011-10-18 | 2013-04-25 | Empire Technology Development Llc | Barriers and films |
-
1983
- 1983-01-12 JP JP324483A patent/JPS59129261A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013058744A1 (en) * | 2011-10-18 | 2013-04-25 | Empire Technology Development Llc | Barriers and films |
| CN103827189A (en) * | 2011-10-18 | 2014-05-28 | 英派尔科技开发有限公司 | Barriers and films |
| JP2014528510A (en) * | 2011-10-18 | 2014-10-27 | エンパイア テクノロジー ディベロップメント エルエルシー | Barrier and film |
| US9260574B2 (en) | 2011-10-18 | 2016-02-16 | Empire Technology Development Llc | Barriers and films |
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