JPS59128751U - surface emitting device - Google Patents

surface emitting device

Info

Publication number
JPS59128751U
JPS59128751U JP2260183U JP2260183U JPS59128751U JP S59128751 U JPS59128751 U JP S59128751U JP 2260183 U JP2260183 U JP 2260183U JP 2260183 U JP2260183 U JP 2260183U JP S59128751 U JPS59128751 U JP S59128751U
Authority
JP
Japan
Prior art keywords
base
emitting device
peripheral wall
light emitting
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2260183U
Other languages
Japanese (ja)
Inventor
榊野　隆弘
数阪　昭二
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP2260183U priority Critical patent/JPS59128751U/en
Publication of JPS59128751U publication Critical patent/JPS59128751U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Switch Cases, Indication, And Locking (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図Ａ、　Ｂはそれぞれこの考案に係る面発光装置の
一例を示す平面図および断面図、第２図は同装置の分解
斜視図である。 １１・・・反射皿、１２・・・ベース、１３・・・周壁
、１３ａ・・・内面、１５．．１５□・・・発光素子、
１６ｊ。 １６２・・・素子設定用フレーム片、１７．１７□・・
・リード線接続用フレーム片、２２・・・透光性物質、
２３・・・光散乱材。FIGS. 1A and 1B are a plan view and a sectional view showing an example of a surface emitting device according to this invention, respectively, and FIG. 2 is an exploded perspective view of the same device. DESCRIPTION OF SYMBOLS 11... Reflection plate, 12... Base, 13... Peripheral wall, 13a... Inner surface, 15. ．． 15□...Light emitting element,
16j. 162...Frame piece for element setting, 17.17□...
・Frame piece for lead wire connection, 22...transparent material,
23...Light scattering material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ベースならびにベースの主面に設けられて内面が末広が
り状の周壁からなる反射皿により複数個の発光素子から
の光を外部に放射させる面発光装置において、上記ベー
スと周壁とを別体に構成し、上記発光素子に対応する素
子設定用およびリード線接続用のフレーム片を上記ベー
ス主面に形成した嵌合溝に圧入して、上記ベース主面に
接合固定した上記周壁内に光散乱材を含んだ透光性物質
を充填した面発光装置。In a surface light emitting device that radiates light from a plurality of light emitting elements to the outside using a base and a reflecting plate that is provided on the main surface of the base and has a peripheral wall whose inner surface is flared toward the end, the base and the peripheral wall are configured separately. , a frame piece for element setting and lead wire connection corresponding to the light emitting element is press-fitted into a fitting groove formed on the main surface of the base, and a light scattering material is placed in the peripheral wall bonded and fixed to the main surface of the base. A surface-emitting device filled with a translucent material.
JP2260183U 1983-02-17 1983-02-17 surface emitting device Pending JPS59128751U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2260183U JPS59128751U (en) 1983-02-17 1983-02-17 surface emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2260183U JPS59128751U (en) 1983-02-17 1983-02-17 surface emitting device

Publications (1)

Publication Number Publication Date
JPS59128751U true JPS59128751U (en) 1984-08-30

Family

ID=30153694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2260183U Pending JPS59128751U (en) 1983-02-17 1983-02-17 surface emitting device

Country Status (1)

Country Link
JP (1) JPS59128751U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017022420A (en) * 2010-06-01 2017-01-26 エルジー イノテック カンパニー リミテッド Light emitting element package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017022420A (en) * 2010-06-01 2017-01-26 エルジー イノテック カンパニー リミテッド Light emitting element package

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