JPS59127836A - Spin coating device - Google Patents
Spin coating deviceInfo
- Publication number
- JPS59127836A JPS59127836A JP269383A JP269383A JPS59127836A JP S59127836 A JPS59127836 A JP S59127836A JP 269383 A JP269383 A JP 269383A JP 269383 A JP269383 A JP 269383A JP S59127836 A JPS59127836 A JP S59127836A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- coating liquid
- coating
- spin head
- spin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】 不発明はスピン塗布装置の構造に関するものである。[Detailed description of the invention] The invention relates to the structure of the spin coating device.
従来のスピン塗布装置は第１図にその断面図模式図で示
すように、ウェハー５を吸着固定し、回転するスピンヘ
ッド３を内蔵し、該スピンヘッド３の上方に塗布液を滴
下供給するノズル４を備え、スピンヘッド３の上方に当
る中央部に吸気口６を有するカバー１と塗布液の周囲へ
の飛散を防ぎ、かつ塗布液及び気体を排気ロアを備えた
カバー２が設けられている。As shown in a schematic cross-sectional view in FIG. 1, a conventional spin coating device has a built-in spin head 3 that suctions and fixes a wafer 5 and rotates, and a nozzle that drips a coating liquid onto the top of the spin head 3. 4, a cover 1 having an air intake port 6 in the center above the spin head 3, and a cover 2 having a lower part that prevents the coating liquid from scattering around and exhausts the coating liquid and gas. .
このスピン塗布装置は、スピンヘッド３の上にウェハー
５を載置して、塗布液を前記スピンヘッド３の上方に設
けられているノズル４より滴下供給して、前記スピンヘ
ッド３と共にウエノ・−５を回転させ該ウェハー５の表
面に塗布膜を形成させるものである。In this spin coating apparatus, a wafer 5 is placed on a spin head 3, a coating liquid is dripped from a nozzle 4 provided above the spin head 3, and the wafer 5 is coated with the spin head 3. 5 is rotated to form a coating film on the surface of the wafer 5.
この時、第１図の破線で示すように塗布液の大部分はカ
バー２排気ロアから排出される。しかしながらカバー１
とカバー２に飛散した塗布液の一部はウェハー５に向っ
てはね返り、ウエノ１−５の表面及び裏面に付着する。At this time, most of the coating liquid is discharged from the exhaust lower part of the cover 2, as shown by the broken line in FIG. However, cover 1
A part of the coating liquid splashed onto the cover 2 bounces toward the wafer 5 and adheres to the front and back surfaces of the wafer 1-5.
これは、ウエノ・−５の外周においてウェハー５とカバ
ー１及びカバー２との隙間が広くカバー１の吸気口６か
ら流入した気体の流速が遅いために、はね返った塗布液
が、その１−１戻るためである。その結果、塗布斑及び
必要以外への塗布液の付着によシ塗布不良を生ずる欠点
をもっていた。又従来、前記塗布不良を改善する方法と
してウェハー５の端とウェハー５の水平方向のカバー１
の側壁との間隔を広くし、はね返った塗布液がウェハー
５に達しないようにして塗布不良を防止する方法がとら
れている。この方法は、カバーを大形化することになり
装置を大形化するという問題を有していた。This is because the gap between the wafer 5 and the covers 1 and 2 is wide on the outer periphery of Ueno-5, and the flow rate of the gas flowing in from the intake port 6 of the cover 1 is slow, so that the coating liquid that has been splashed away from the 1-1 It's to go back. As a result, the coating has the disadvantage of causing coating defects due to uneven coating and adhesion of the coating liquid to areas other than necessary. Conventionally, as a method for improving the coating defects, the cover 1 is placed between the edge of the wafer 5 and the horizontal direction of the wafer 5.
A method is used to prevent defective coating by widening the distance between the wafer 5 and the side wall of the wafer 5 to prevent the splashed coating liquid from reaching the wafer 5. This method has the problem of increasing the size of the cover and thus increasing the size of the device.
不発明の目的はこのような点に鑑みてなされたもので、
ウェハーへの塗布液のはね返シを防止し塗布斑及び必要
以外への塗布液の付着を防止し、均一な塗布膜を形成さ
せることのできるスピン塗布装置を提供するものである
。The purpose of non-invention was made with these points in mind.
The present invention provides a spin coating device that can prevent a coating liquid from splashing back onto a wafer, prevent coating spots and adhesion of the coating liquid to areas other than necessary, and form a uniform coating film.
不発明のスピン塗布装置はウエノ・−を吸着固定し、回
転するスピンヘッドと該スピンヘッドの上方よシ塗布液
を滴下供給するノズルと、前記スピンヘッドの周囲を囲
むような上下２個のカバーから構成されている・上カバ
ーは中央部に吸気口金下カバーは中央部に吸気口及びス
ピンヘッド外周に排気口を有し、更に該上下カバーのス
ピンヘッド外周部位詳しくはスピンヘッド上に載置され
たウェハーの外周に相当する部位に円筒形遮へい板を垂
直に、かつカバー内側に取付は該遮へい板はウェハーの
上下面よシ一定の隙間を保ち取付けられている構造を有
することを特徴とする。The uninvented spin coating device has a rotating spin head that suctions and fixes Ueno, a nozzle that drips the coating liquid upward from the spin head, and two upper and lower covers that surround the spin head. - The upper cover has an intake port in the center, and the lower cover has an intake port in the center and an exhaust port on the outer periphery of the spin head, and the outer periphery of the spin head on the upper and lower covers is placed on the spin head. A cylindrical shielding plate is attached vertically to a portion corresponding to the outer periphery of the wafer and inside the cover, and the shielding plate is attached with a constant gap between the top and bottom surfaces of the wafer. do.
次に不発明を実施例によシ説明する。Next, the invention will be explained with reference to examples.
第２図は、本発明による１実施例のスピン塗布装置の構
造を説明する断面図である。FIG. 2 is a sectional view illustrating the structure of a spin coating apparatus according to an embodiment of the present invention.
第２図に示すように、ウェハー１５を吸着固定し、回転
するスピンヘッド１３を内蔵し、該スピンヘッド１３の
上方に塗布液を滴下供給するノズル１４と前記スピンヘ
ッド１３の周囲を囲むような上カバー１１と下カバー１
２から構成されている。該上カバーは中央部に吸気口１
６を、下カバー１２は中央部に吸気口１６及びスピンヘ
ッド１３の外周に排気口１７を有している。更に該上カ
バー１１と下カバー１２のスピンヘッド外周部に相当す
る位置、詳しくはウェハー１５の外周に相当する部位に
円筒形遮へい板１８を垂直に取付は該遮へい板１８の一
端はウエノ・−１５の上下面よシ一定の間隔を保つよう
に取付けられている。As shown in FIG. 2, a wafer 15 is fixed by suction, a rotating spin head 13 is built in, a nozzle 14 for dripping a coating liquid onto the top of the spin head 13, and a nozzle 14 surrounding the spin head 13. Upper cover 11 and lower cover 1
It is composed of 2. The upper cover has an air intake port 1 in the center.
6, the lower cover 12 has an intake port 16 at the center and an exhaust port 17 at the outer periphery of the spin head 13. Further, a cylindrical shielding plate 18 is vertically attached to the upper cover 11 and lower cover 12 at positions corresponding to the outer periphery of the spin head, more specifically, at a position corresponding to the outer periphery of the wafer 15. 15 so as to maintain a constant distance from the top and bottom surfaces.
不発明によるスピン塗布装置のスピンヘッド１３の上に
ウェハー１５を戦渦し該ウエノ１−１５の上方に設けら
れているノズル１４より塗布液を滴下供給し、前記スピ
ンヘッド１３と共にウエノ・−１５を回転させた場合、
塗布液はウニ”−１５の水平方向の上カバー及び下カバ
ー１２に飛散する。その結果第２図の破線で示すように
ウエノ・−１５に向ってはね返る。しかし寿から、はね
返った塗布液は遮へい板１８によシウェノ・−１５に付
着することはなくウェハー１５と遮へい！１８との隙間
においては、上カバー１１と下カバー１２の吸気口１６
から流入した気体の流速が速いためこの隙間をこえてウ
ェハー１５に付着することはない０以上、詳細に説明し
たように不発明のスピン塗布膜ｙ！を用いることによシ
、塗布液のはね返シによる塗布不良を防止し、塗布斑の
ない均一な塗布膜を形成し、必要以外への塗布液の付着
もなく、５−
歩留シを向上させることができ、かつ装置を小形化でき
る。A wafer 15 is placed on a spin head 13 of a spin coating device according to the invention, and a coating liquid is dripped from a nozzle 14 provided above the wafer 1-15, and the wafer 1-15 is coated with the spin head 13. When rotated,
The coating liquid scatters on the horizontal upper cover and lower cover 12 of the Ueno-15.As a result, it bounces back toward the Ueno-15 as shown by the broken line in Fig. 2.However, from Kotobuki, the splashed coating liquid In the gap between the wafer 15 and the shield 18, the air inlet 16 of the upper cover 11 and the lower cover 12 is prevented from adhering to the shield plate 18.
Since the flow rate of the gas flowing in from the wafer 15 is high, it does not cross this gap and adhere to the wafer 15.As explained in detail, the uninvented spin-coated film y! By using this, coating defects due to splashing of the coating solution can be prevented, a uniform coating film with no coating spots is formed, and the coating solution does not adhere to areas other than necessary, and 5- Yield is improved. and the device can be made smaller.
第１図は従来のスピン塗布装置の１例の断面図・第２図
は不発明の実施例のスピン塗布装置を説明する断面図で
ある。
同図において、１．１１・・・・・・十カバー、２．１
２・・・・・下刃／＜−，３，１３・・・・・・スピン
ヘッド、４．１４・・・ノズル、５．１５・・・・・・
ウェハー、６，１６・・・・・・吸気口、７．１７・・
・・・・排気口、１８・・・・・遮へい板。
６−
第２図
−１６９−FIG. 1 is a cross-sectional view of an example of a conventional spin coating apparatus, and FIG. 2 is a cross-sectional view illustrating a spin coating apparatus of an uninvented embodiment. In the same figure, 1.11...10 covers, 2.1
2... Lower blade/<-, 3, 13... Spin head, 4.14... Nozzle, 5.15...
Wafer, 6, 16...Intake port, 7.17...
...exhaust port, 18...shielding plate. 6- Figure 2-169-
Claims (1)
ハー上に塗布液を供給するノズルと、前記スピンヘッド
の周囲を囲むように設けられた上下２個のカバーによっ
て構成されるスピン塗布装置において、前記上下カバー
は中央部に吸気口を有し、かつ上下釜カバーの前記スピ
ンヘット上載置されたウェハーの外周近傍に当る位置に
カバー内側に向って円筒形遮へい板を設けたことを特徴
とするスピン塗布装置。In a spin coating apparatus, the spin coating device is composed of a spin head that suctions and fixes a wafer and rotates it, a nozzle that supplies a coating liquid onto the wafer, and two upper and lower covers that are provided to surround the spin head. A spin coating apparatus characterized in that the cover has an intake port in the center, and a cylindrical shielding plate is provided toward the inside of the cover at a position near the outer periphery of the wafer placed on the spin head of the upper and lower hook covers. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP269383A JPS59127836A (en) | 1983-01-11 | 1983-01-11 | Spin coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP269383A JPS59127836A (en) | 1983-01-11 | 1983-01-11 | Spin coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59127836A true JPS59127836A (en) | 1984-07-23 |
Family
ID=11536353
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP269383A Pending JPS59127836A (en) | 1983-01-11 | 1983-01-11 | Spin coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59127836A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5993547A (en) * | 1997-01-09 | 1999-11-30 | Nec Corporation | Edge rinse mechanism for removing a peripheral portion of a resist film formed on a wafer |
| KR20100100640A (en) | 2009-03-04 | 2010-09-15 | 도쿄엘렉트론가부시키가이샤 | Liquid processing apparatus, liquid processing method, and resist coating method |
-
1983
- 1983-01-11 JP JP269383A patent/JPS59127836A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5993547A (en) * | 1997-01-09 | 1999-11-30 | Nec Corporation | Edge rinse mechanism for removing a peripheral portion of a resist film formed on a wafer |
| KR20100100640A (en) | 2009-03-04 | 2010-09-15 | 도쿄엘렉트론가부시키가이샤 | Liquid processing apparatus, liquid processing method, and resist coating method |
| JP2010206019A (en) * | 2009-03-04 | 2010-09-16 | Tokyo Electron Ltd | Liquid processing apparatus, and liquid processing method |
| US8375887B2 (en) | 2009-03-04 | 2013-02-19 | Tokyo Electron Limited | Solution treatment apparatus, solution treatment method and resist coating method |
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